SG11201607004QA - Substrate processing system and substrate processing method - Google Patents
Substrate processing system and substrate processing methodInfo
- Publication number
- SG11201607004QA SG11201607004QA SG11201607004QA SG11201607004QA SG11201607004QA SG 11201607004Q A SG11201607004Q A SG 11201607004QA SG 11201607004Q A SG11201607004Q A SG 11201607004QA SG 11201607004Q A SG11201607004Q A SG 11201607004QA SG 11201607004Q A SG11201607004Q A SG 11201607004QA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate processing
- processing system
- processing method
- substrate
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/08—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving liquid or pneumatic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02035—Shaping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014045172A JP6295107B2 (en) | 2014-03-07 | 2014-03-07 | Substrate processing system and substrate processing method |
PCT/JP2015/056341 WO2015133516A1 (en) | 2014-03-07 | 2015-03-04 | Substrate processing system and substrate processing method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201607004QA true SG11201607004QA (en) | 2016-10-28 |
Family
ID=54055318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201607004QA SG11201607004QA (en) | 2014-03-07 | 2015-03-04 | Substrate processing system and substrate processing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US10618140B2 (en) |
JP (1) | JP6295107B2 (en) |
KR (1) | KR101852705B1 (en) |
CN (1) | CN106102996B (en) |
SG (1) | SG11201607004QA (en) |
TW (1) | TWI638706B (en) |
WO (1) | WO2015133516A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6935330B2 (en) * | 2015-09-30 | 2021-09-15 | 芝浦メカトロニクス株式会社 | Substrate processing equipment and substrate processing method |
JP6623032B2 (en) * | 2015-10-29 | 2019-12-18 | 株式会社Screenホールディングス | Filter coupling device and substrate processing apparatus provided with the same |
JP6654457B2 (en) * | 2016-02-10 | 2020-02-26 | 株式会社荏原製作所 | Drainage system for substrate processing device, drainage method, drainage control device, and recording medium |
US9865477B2 (en) * | 2016-02-24 | 2018-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Backside polisher with dry frontside design and method using the same |
JP6559087B2 (en) * | 2016-03-31 | 2019-08-14 | 東京エレクトロン株式会社 | Substrate processing equipment |
KR101900788B1 (en) * | 2017-01-03 | 2018-09-20 | 에스케이실트론 주식회사 | Wafer polishing system |
CN108857858A (en) * | 2017-05-15 | 2018-11-23 | 株式会社荏原制作所 | Device and method, Wafer Backside Cleaning device and the substrate board treatment at the back side of cleaning base plate |
CN107414682A (en) * | 2017-08-31 | 2017-12-01 | 苏州市永通不锈钢有限公司 | A kind of stainless sheet steel lapping device |
CN107363716A (en) * | 2017-08-31 | 2017-11-21 | 苏州市永通不锈钢有限公司 | Stainless sheet steel lapping device |
KR102591906B1 (en) * | 2017-10-31 | 2023-10-20 | 가부시키가이샤 에바라 세이사꾸쇼 | Polishing apparatus and polishing method |
JP7080766B2 (en) * | 2018-08-07 | 2022-06-06 | 株式会社荏原製作所 | Sensor target cover used in combination with liquid level detection sensor, and wet processing equipment |
KR102134432B1 (en) * | 2018-12-04 | 2020-07-16 | 세메스 주식회사 | Pipe cleaning jig, apparatus for processing substrate including the same, and cleaning method for pipe unit |
CN111326441B (en) * | 2018-12-17 | 2022-09-16 | 辛耘企业股份有限公司 | Substrate processing apparatus and method |
TWI693655B (en) * | 2018-12-17 | 2020-05-11 | 辛耘企業股份有限公司 | Apparatus and method for processing substrates |
CN114762089A (en) * | 2019-12-11 | 2022-07-15 | 株式会社荏原制作所 | Substrate cleaning system and substrate cleaning method |
US11752592B2 (en) * | 2021-07-16 | 2023-09-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry enhancement for polishing system |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0929637A (en) | 1995-07-13 | 1997-02-04 | Toshiba Mach Co Ltd | Slurry supplying device |
JP3663728B2 (en) * | 1996-03-28 | 2005-06-22 | 信越半導体株式会社 | Thin plate polishing machine |
JPH10163138A (en) * | 1996-11-29 | 1998-06-19 | Fujitsu Ltd | Manufacture of semiconductor device and polisher |
US5836805A (en) * | 1996-12-18 | 1998-11-17 | Lucent Technologies Inc. | Method of forming planarized layers in an integrated circuit |
US6024829A (en) | 1998-05-21 | 2000-02-15 | Lucent Technologies Inc. | Method of reducing agglomerate particles in a polishing slurry |
JP2000202765A (en) | 1999-01-12 | 2000-07-25 | Ebara Corp | Washing device for abrasive material flowmeter of polishing device, washing method and polishing device |
JP3748731B2 (en) | 1999-03-26 | 2006-02-22 | 株式会社荏原製作所 | Abrasive fluid supply device |
US6423638B1 (en) * | 1999-09-28 | 2002-07-23 | Motorola, Inc. | Filter apparatus and method therefor |
US6498571B2 (en) * | 1999-12-09 | 2002-12-24 | Luxxon Corporation | Multiple stream variable length encoder and decoder |
US6709313B2 (en) * | 2000-11-17 | 2004-03-23 | Rion Co., Ltd. | Apparatus for producing polishing solution and apparatus for feeding the same |
JP3789297B2 (en) * | 2000-11-17 | 2006-06-21 | リオン株式会社 | Polishing fluid supply device |
US6554467B2 (en) | 2000-12-28 | 2003-04-29 | L'air Liquide - Societe' Anonyme A'directoire Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude | Process and apparatus for blending and distributing a slurry solution |
JP2003142442A (en) * | 2001-11-02 | 2003-05-16 | Nec Kansai Ltd | Semiconductor substrate polishing apparatus |
US7487806B2 (en) | 2001-11-15 | 2009-02-10 | L'air Liquide, Societe Anonyme A Directorie Et Conseil De Surveillance Pour L'etude Et L'exploitation Des Procedes Georges Claude | Source liquid supply apparatus having a cleaning function |
US20030220708A1 (en) * | 2001-11-28 | 2003-11-27 | Applied Materials, Inc. | Integrated equipment set for forming shallow trench isolation regions |
TWI601199B (en) | 2002-11-15 | 2017-10-01 | 荏原製作所股份有限公司 | Apparatus for substrate processing and method for substrate processing |
JP4400096B2 (en) | 2003-06-03 | 2010-01-20 | パナソニック株式会社 | Slurry supply apparatus and slurry supply method |
JP2005011977A (en) * | 2003-06-18 | 2005-01-13 | Ebara Corp | Device and method for substrate polishing |
CN1713967B (en) | 2003-06-20 | 2011-10-19 | 富士通半导体股份有限公司 | Chemical-solution supplying apparatus |
JP2007229845A (en) * | 2006-02-28 | 2007-09-13 | Nikon Corp | Slurry supply device, polishing device using the same, and semiconductor device manufacturing method using the same |
JP2007290111A (en) * | 2006-03-29 | 2007-11-08 | Ebara Corp | Polishing method and polishing device |
KR100775060B1 (en) * | 2006-06-26 | 2007-11-08 | 삼성전자주식회사 | Appartus for manufacturing semiconductor and method for measuring quality of slurry |
JP2008036744A (en) * | 2006-08-03 | 2008-02-21 | Disco Abrasive Syst Ltd | Polishing device |
JP4841484B2 (en) | 2007-03-27 | 2011-12-21 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
JP5163078B2 (en) * | 2007-11-29 | 2013-03-13 | 株式会社Sumco | Polishing apparatus and method |
JP2012521896A (en) | 2009-03-25 | 2012-09-20 | アプライド マテリアルズ インコーポレイテッド | Point-of-use recycling system for CMP slurry |
US20110070811A1 (en) * | 2009-03-25 | 2011-03-24 | Applied Materials, Inc. | Point of use recycling system for cmp slurry |
US20120042575A1 (en) | 2010-08-18 | 2012-02-23 | Cabot Microelectronics Corporation | Cmp slurry recycling system and methods |
JP2013169620A (en) * | 2012-02-21 | 2013-09-02 | Tok Engineering Kk | Magnet strainer and polishing device using the same |
JP2013215409A (en) | 2012-04-09 | 2013-10-24 | Maruhon Industry Co Ltd | Pachinko game machine |
JP6027454B2 (en) * | 2013-02-05 | 2016-11-16 | 株式会社荏原製作所 | Polishing equipment |
-
2014
- 2014-03-07 JP JP2014045172A patent/JP6295107B2/en active Active
-
2015
- 2015-03-04 WO PCT/JP2015/056341 patent/WO2015133516A1/en active Application Filing
- 2015-03-04 US US15/122,975 patent/US10618140B2/en active Active
- 2015-03-04 KR KR1020167027178A patent/KR101852705B1/en active IP Right Grant
- 2015-03-04 SG SG11201607004QA patent/SG11201607004QA/en unknown
- 2015-03-04 TW TW104106792A patent/TWI638706B/en active
- 2015-03-04 CN CN201580012332.4A patent/CN106102996B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101852705B1 (en) | 2018-04-26 |
JP6295107B2 (en) | 2018-03-14 |
CN106102996A (en) | 2016-11-09 |
JP2015168035A (en) | 2015-09-28 |
US10618140B2 (en) | 2020-04-14 |
CN106102996B (en) | 2018-10-16 |
US20170066101A1 (en) | 2017-03-09 |
WO2015133516A1 (en) | 2015-09-11 |
KR20160132043A (en) | 2016-11-16 |
TW201538278A (en) | 2015-10-16 |
TWI638706B (en) | 2018-10-21 |
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