SG11201509300PA - Method of peeling electronic member and laminate - Google Patents

Method of peeling electronic member and laminate

Info

Publication number
SG11201509300PA
SG11201509300PA SG11201509300PA SG11201509300PA SG11201509300PA SG 11201509300P A SG11201509300P A SG 11201509300PA SG 11201509300P A SG11201509300P A SG 11201509300PA SG 11201509300P A SG11201509300P A SG 11201509300PA SG 11201509300P A SG11201509300P A SG 11201509300PA
Authority
SG
Singapore
Prior art keywords
laminate
electronic member
peeling
peeling electronic
electronic
Prior art date
Application number
SG11201509300PA
Inventor
Shinichi Usugi
Kouji Igarashi
Akimitsu Morimoto
Original Assignee
Mitsui Chemicals Tohcello Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Tohcello Inc filed Critical Mitsui Chemicals Tohcello Inc
Publication of SG11201509300PA publication Critical patent/SG11201509300PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
SG11201509300PA 2013-05-31 2014-05-22 Method of peeling electronic member and laminate SG11201509300PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013115704 2013-05-31
PCT/JP2014/063578 WO2014192631A1 (en) 2013-05-31 2014-05-22 Electronic member peeling method and laminated body

Publications (1)

Publication Number Publication Date
SG11201509300PA true SG11201509300PA (en) 2015-12-30

Family

ID=51988664

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201509300PA SG11201509300PA (en) 2013-05-31 2014-05-22 Method of peeling electronic member and laminate

Country Status (8)

Country Link
US (1) US20160141197A1 (en)
EP (1) EP3007211A4 (en)
JP (1) JP6118404B2 (en)
KR (1) KR101772787B1 (en)
CN (1) CN105264645B (en)
SG (1) SG11201509300PA (en)
TW (1) TWI626152B (en)
WO (1) WO2014192631A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681232B (en) * 2017-09-26 2020-01-01 達邁科技股份有限公司 Transparent polyimide composite film for flexible display and manufacturing method thereof
TWI633816B (en) * 2017-11-08 2018-08-21 欣興電子股份有限公司 Method for manufacturing circuit board
CN108615700A (en) * 2018-04-26 2018-10-02 上海空间电源研究所 A kind of organic bonding shifting process method of slim solar cell rigid-flexible substrate
TWI714890B (en) * 2018-09-28 2021-01-01 景碩科技股份有限公司 Peeling device
TWI728915B (en) * 2018-09-28 2021-05-21 景碩科技股份有限公司 Peeling device
KR102552258B1 (en) * 2018-10-05 2023-07-06 미쓰이 가가쿠 토세로 가부시키가이샤 Manufacturing method of adhesive film and electronic device
EP3808435A1 (en) * 2019-10-16 2021-04-21 DWI - Leibniz-Institut für Interaktive Materialien e.V. Membrane system, spinneret for manufacturing the membrane system, device including the spinneret and method for forming the membrane system
CN113135436B (en) * 2020-01-20 2023-02-17 上海广矩自动化设备有限公司 Method for peeling adhesive sheet
JP2023101951A (en) * 2022-01-11 2023-07-24 トヨタ自動車株式会社 Method of manufacturing electrode, electrode current collector, and electrode
CN114639635B (en) * 2022-03-17 2023-03-21 电子科技大学 Method for peeling single crystal thin film, single crystal thin film and electronic component

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JP2970963B2 (en) 1991-08-14 1999-11-02 日東電工株式会社 Peelable pressure-sensitive adhesive and adhesive member thereof
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JP3438369B2 (en) * 1995-01-17 2003-08-18 ソニー株式会社 Manufacturing method of member
JP3810911B2 (en) 1997-12-01 2006-08-16 日東電工株式会社 Heat release type adhesive sheet
JP3526802B2 (en) 2000-01-21 2004-05-17 旭化成ケミカルズ株式会社 Adhesive for fixing semiconductor wafer and processing method
JP2003173989A (en) 2001-12-04 2003-06-20 Sekisui Chem Co Ltd Method for manufacturing ic chip
JP5006497B2 (en) 2001-08-03 2012-08-22 積水化学工業株式会社 Double-sided adhesive tape and method for peeling double-sided adhesive tape
JP4238037B2 (en) 2001-11-15 2009-03-11 積水化学工業株式会社 Adhesive substance, adhesive substance peeling method and adhesive tape
JP2003151940A (en) 2001-11-15 2003-05-23 Sekisui Chem Co Ltd Back grind tape and method of polishing semiconductor wafer
JP2003173993A (en) 2001-12-04 2003-06-20 Sekisui Chem Co Ltd Back grind tape and method for polishing semiconductor wafer
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JP4060641B2 (en) * 2002-05-22 2008-03-12 株式会社ディスコ Tape peeling method
JP4565804B2 (en) * 2002-06-03 2010-10-20 スリーエム イノベイティブ プロパティズ カンパニー Laminate including ground substrate, method for producing the same, method for producing ultrathin substrate using laminate, and apparatus therefor
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Also Published As

Publication number Publication date
KR20150140801A (en) 2015-12-16
TWI626152B (en) 2018-06-11
EP3007211A1 (en) 2016-04-13
CN105264645A (en) 2016-01-20
TW201444679A (en) 2014-12-01
EP3007211A4 (en) 2016-12-14
US20160141197A1 (en) 2016-05-19
KR101772787B1 (en) 2017-08-29
CN105264645B (en) 2018-05-01
JPWO2014192631A1 (en) 2017-02-23
JP6118404B2 (en) 2017-04-19
WO2014192631A1 (en) 2014-12-04

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