SG105541A1 - Method and apparatus for singulating semiconductor packages on a lead frame - Google Patents

Method and apparatus for singulating semiconductor packages on a lead frame

Info

Publication number
SG105541A1
SG105541A1 SG200201615A SG200201615A SG105541A1 SG 105541 A1 SG105541 A1 SG 105541A1 SG 200201615 A SG200201615 A SG 200201615A SG 200201615 A SG200201615 A SG 200201615A SG 105541 A1 SG105541 A1 SG 105541A1
Authority
SG
Singapore
Prior art keywords
lead frame
semiconductor packages
singulating semiconductor
singulating
packages
Prior art date
Application number
SG200201615A
Inventor
Praveen Srinivasan
Yong Mun Heng Jeffrey Ow
Fulin Liu
Kok Yeow Lim
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG200201615A priority Critical patent/SG105541A1/en
Publication of SG105541A1 publication Critical patent/SG105541A1/en

Links

SG200201615A 2001-07-31 2002-03-20 Method and apparatus for singulating semiconductor packages on a lead frame SG105541A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200201615A SG105541A1 (en) 2001-07-31 2002-03-20 Method and apparatus for singulating semiconductor packages on a lead frame

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200104858 2001-07-31
SG200201615A SG105541A1 (en) 2001-07-31 2002-03-20 Method and apparatus for singulating semiconductor packages on a lead frame

Publications (1)

Publication Number Publication Date
SG105541A1 true SG105541A1 (en) 2004-08-27

Family

ID=33455746

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200201615A SG105541A1 (en) 2001-07-31 2002-03-20 Method and apparatus for singulating semiconductor packages on a lead frame

Country Status (1)

Country Link
SG (1) SG105541A1 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
US4705016A (en) * 1985-05-17 1987-11-10 Disco Abrasive Systems, Ltd. Precision device for reducing errors attributed to temperature change reduced
US5749999A (en) * 1994-02-04 1998-05-12 Lsi Logic Corporation Method for making a surface-mount technology plastic-package ball-grid array integrated circuit
JP2002222853A (en) * 2001-01-29 2002-08-09 Tdk Corp Board carrier, carrier holder, and device and method for processing board using them
US6448151B2 (en) * 2000-04-04 2002-09-10 Disco Corporation Process for producing a large number of semiconductor chips from a semiconductor wafer
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors
US6568385B2 (en) * 2000-08-28 2003-05-27 Disco Corporation Cutting machine
JP2003163180A (en) * 2001-11-26 2003-06-06 Apic Yamada Corp Work conveying apparatus and dicing apparatus
JP2003168697A (en) * 2001-11-30 2003-06-13 Towa Corp Method for cutting substrate
US20030116152A1 (en) * 2001-12-26 2003-06-26 Asm Automation Assembly Ltd Chuck for holding a workpiece

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976288A (en) * 1975-11-24 1976-08-24 Ibm Corporation Semiconductor wafer dicing fixture
US4705016A (en) * 1985-05-17 1987-11-10 Disco Abrasive Systems, Ltd. Precision device for reducing errors attributed to temperature change reduced
US5749999A (en) * 1994-02-04 1998-05-12 Lsi Logic Corporation Method for making a surface-mount technology plastic-package ball-grid array integrated circuit
US6448151B2 (en) * 2000-04-04 2002-09-10 Disco Corporation Process for producing a large number of semiconductor chips from a semiconductor wafer
US6568385B2 (en) * 2000-08-28 2003-05-27 Disco Corporation Cutting machine
JP2002222853A (en) * 2001-01-29 2002-08-09 Tdk Corp Board carrier, carrier holder, and device and method for processing board using them
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors
JP2003163180A (en) * 2001-11-26 2003-06-06 Apic Yamada Corp Work conveying apparatus and dicing apparatus
JP2003168697A (en) * 2001-11-30 2003-06-13 Towa Corp Method for cutting substrate
US20030116152A1 (en) * 2001-12-26 2003-06-26 Asm Automation Assembly Ltd Chuck for holding a workpiece

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