SG10202001145RA - Substrate patch reconstitution options - Google Patents

Substrate patch reconstitution options

Info

Publication number
SG10202001145RA
SG10202001145RA SG10202001145RA SG10202001145RA SG10202001145RA SG 10202001145R A SG10202001145R A SG 10202001145RA SG 10202001145R A SG10202001145R A SG 10202001145RA SG 10202001145R A SG10202001145R A SG 10202001145RA SG 10202001145R A SG10202001145R A SG 10202001145RA
Authority
SG
Singapore
Prior art keywords
reconstitution
options
substrate patch
patch
substrate
Prior art date
Application number
SG10202001145RA
Inventor
Hariri Haifa
P Alur Amruthavalli
K Jen Wei-Lun
A Salama Islam
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG10202001145RA publication Critical patent/SG10202001145RA/en

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    • H01L23/5386—Geometry or layout of the interconnection structure
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    • H01L23/5381—Crossover interconnections, e.g. bridge stepovers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
SG10202001145RA 2019-03-12 2020-02-07 Substrate patch reconstitution options SG10202001145RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16/299,415 US11552019B2 (en) 2019-03-12 2019-03-12 Substrate patch reconstitution options

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SG10202001145RA true SG10202001145RA (en) 2020-10-29

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US (1) US11552019B2 (en)
KR (1) KR20200109244A (en)
CN (1) CN111696978A (en)
DE (1) DE102020103364A1 (en)
SG (1) SG10202001145RA (en)

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US11296053B2 (en) 2019-06-26 2022-04-05 Invensas Bonding Technologies, Inc. Direct bonded stack structures for increased reliability and improved yield in microelectronics
US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11728273B2 (en) * 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11664315B2 (en) * 2021-03-11 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Structure with interconnection die and method of making same
US20230014450A1 (en) * 2021-07-16 2023-01-19 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of forming the same
US20230063304A1 (en) * 2021-08-31 2023-03-02 Taiwan Semiconductor Manufacturing Company Limited Hybrid organic and non-organic interposer with embedded component and methods for forming the same

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US6456502B1 (en) * 1998-09-21 2002-09-24 Compaq Computer Corporation Integrated circuit device/circuit board connection apparatus
US8389337B2 (en) * 2009-12-31 2013-03-05 Intel Corporation Patch on interposer assembly and structures formed thereby
US9275955B2 (en) * 2013-12-18 2016-03-01 Intel Corporation Integrated circuit package with embedded bridge

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DE102020103364A1 (en) 2020-09-17
US20200294920A1 (en) 2020-09-17
CN111696978A (en) 2020-09-22
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KR20200109244A (en) 2020-09-22

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