SG10201906867RA - Method for manufacturing electronic device - Google Patents

Method for manufacturing electronic device

Info

Publication number
SG10201906867RA
SG10201906867RA SG10201906867RA SG10201906867RA SG10201906867RA SG 10201906867R A SG10201906867R A SG 10201906867RA SG 10201906867R A SG10201906867R A SG 10201906867RA SG 10201906867R A SG10201906867R A SG 10201906867RA SG 10201906867R A SG10201906867R A SG 10201906867RA
Authority
SG
Singapore
Prior art keywords
electronic device
manufacturing electronic
manufacturing
electronic
Prior art date
Application number
SG10201906867RA
Inventor
Handi Kartadihardja
Nelson Ranola
Chi Wei Yap
Stephen Conner
Original Assignee
Pci Private Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pci Private Ltd filed Critical Pci Private Ltd
Priority to SG10201906867RA priority Critical patent/SG10201906867RA/en
Priority to EP20183031.2A priority patent/EP3771032A1/en
Priority to US16/933,418 priority patent/US11464118B2/en
Publication of SG10201906867RA publication Critical patent/SG10201906867RA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
SG10201906867RA 2019-07-25 2019-07-25 Method for manufacturing electronic device SG10201906867RA (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG10201906867RA SG10201906867RA (en) 2019-07-25 2019-07-25 Method for manufacturing electronic device
EP20183031.2A EP3771032A1 (en) 2019-07-25 2020-06-30 Method for manufacturing electronic device
US16/933,418 US11464118B2 (en) 2019-07-25 2020-07-20 Method for manufacturing electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201906867RA SG10201906867RA (en) 2019-07-25 2019-07-25 Method for manufacturing electronic device

Publications (1)

Publication Number Publication Date
SG10201906867RA true SG10201906867RA (en) 2021-02-25

Family

ID=71401685

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201906867RA SG10201906867RA (en) 2019-07-25 2019-07-25 Method for manufacturing electronic device

Country Status (3)

Country Link
US (1) US11464118B2 (en)
EP (1) EP3771032A1 (en)
SG (1) SG10201906867RA (en)

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4414005C2 (en) 1993-04-22 2000-11-30 Micron Technology Inc N D Ges Process for encasing electronic components
JPH08276458A (en) 1995-04-06 1996-10-22 Dainippon Printing Co Ltd Manufacture of non-contact ic tag and the same tag
US6060342A (en) 1998-04-06 2000-05-09 P-Com, Incorporated Circuit packaging for millimeter-wave components
DE19848712A1 (en) 1998-10-22 2000-04-27 Henkel Kgaa Thermoplastics hot melt adhesive application for formation of smart card component layer or electronic transponder
JP3492533B2 (en) 1998-12-16 2004-02-03 Ｓｍｋ株式会社 Helical antenna molding method
EP1052595B1 (en) 1999-05-14 2001-09-19 Sokymat Sa Transponder and injection-moulded object and method for manufacturing the same
US6441741B1 (en) 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
EP1123792B1 (en) 2000-02-11 2003-05-14 Robert Virant Electric and/or electronic component encapsulated by an overmoulding shaped by injection and method for producing
DE10162450B4 (en) 2001-12-19 2008-06-05 Giesecke & Devrient Gmbh Portable data carrier and method and device for manufacturing
US6952046B2 (en) * 2002-06-19 2005-10-04 Foster-Miller, Inc. Electronic and optoelectronic component packaging technique
JP4141930B2 (en) * 2003-09-29 2008-08-27 株式会社ヨコオ Antenna structure
JP2008537215A (en) 2005-03-23 2008-09-11 カードエックスエックス インコーポレイテッド A method of manufacturing a modern smart card with integrated electronics using an isotropic thermoset adhesive material having a high quality outer surface.
US20070171076A1 (en) 2005-08-29 2007-07-26 Visible Assets, Inc. Low-frequency radio tag encapsulating system
US20080282540A1 (en) 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US7528790B2 (en) * 2007-06-12 2009-05-05 Ethertronics, Inc. System and method for preventing copying of electronic component designs
US8018343B2 (en) * 2008-05-27 2011-09-13 Auden Techno Corp. IC package antenna
US20100033400A1 (en) 2008-08-05 2010-02-11 Daniel Chang Spray non-contact cutting type antenna and its fabrication method
US8325047B2 (en) 2009-04-08 2012-12-04 Sabic Innovative Plastics Ip B.V. Encapsulated RFID tags and methods of making same
DE102011052501A1 (en) 2011-08-08 2013-02-14 Aesculap Ag RFID tag
FR2990314B1 (en) 2012-05-03 2014-06-06 Commissariat Energie Atomique MICROELECTRONIC DEVICE FOR WIRELESS TRANSMISSION
JP6314705B2 (en) 2014-07-04 2018-04-25 富士通株式会社 High frequency module and manufacturing method thereof
DE102014223653B4 (en) 2014-11-20 2023-08-03 Zf Friedrichshafen Ag Electrical circuit and method of making an electrical circuit for a vehicle
US10037951B2 (en) * 2016-11-29 2018-07-31 Cyntec Co., Ltd. Semiconductor package with antenna
TWI609329B (en) 2016-12-19 2017-12-21 韋僑科技股份有限公司 Rfid device and method for making the same

Also Published As

Publication number Publication date
US20210029833A1 (en) 2021-01-28
EP3771032A1 (en) 2021-01-27
US11464118B2 (en) 2022-10-04

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