SG10201600443SA - Resin composition, and prepreg as well as laminate using the same - Google Patents
Resin composition, and prepreg as well as laminate using the sameInfo
- Publication number
- SG10201600443SA SG10201600443SA SG10201600443SA SG10201600443SA SG10201600443SA SG 10201600443S A SG10201600443S A SG 10201600443SA SG 10201600443S A SG10201600443S A SG 10201600443SA SG 10201600443S A SG10201600443S A SG 10201600443SA SG 10201600443S A SG10201600443S A SG 10201600443SA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- laminate
- well
- same
- resin composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011048505 | 2011-03-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201600443SA true SG10201600443SA (en) | 2016-02-26 |
Family
ID=46798182
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013053525A SG191950A1 (en) | 2011-03-07 | 2012-03-05 | Resin composition, and prepreg as well as laminate using the same |
SG10201600443SA SG10201600443SA (en) | 2011-03-07 | 2012-03-05 | Resin composition, and prepreg as well as laminate using the same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2013053525A SG191950A1 (en) | 2011-03-07 | 2012-03-05 | Resin composition, and prepreg as well as laminate using the same |
Country Status (8)
Country | Link |
---|---|
US (1) | US9629239B2 (en) |
EP (1) | EP2684904B1 (en) |
JP (1) | JP5999369B2 (en) |
KR (1) | KR101867118B1 (en) |
CN (1) | CN103429633A (en) |
SG (2) | SG191950A1 (en) |
TW (1) | TWI572656B (en) |
WO (1) | WO2012121224A1 (en) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5024205B2 (en) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
KR101945076B1 (en) * | 2011-11-07 | 2019-02-01 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, and prepreg and laminated sheet each produced using same |
US8946333B2 (en) * | 2012-09-19 | 2015-02-03 | Momentive Performance Materials Inc. | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
US10178767B2 (en) | 2012-11-28 | 2019-01-08 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board |
JP2015013949A (en) * | 2013-07-05 | 2015-01-22 | 株式会社トクヤマ | Resin composition, method for producing the same, and highly thermoconductive resin molded body |
EP3035778B1 (en) * | 2013-08-14 | 2018-10-03 | Denka Company Limited | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
SG11201600586XA (en) * | 2013-09-09 | 2016-02-26 | Mitsubishi Gas Chemical Co | Prepreg, metal foil-clad laminate, and printed wiring board |
US10373727B2 (en) | 2013-10-09 | 2019-08-06 | Hitachi Chemical Company, Ltd | Prepreg mica tape and coil using same |
TWI499627B (en) * | 2013-10-11 | 2015-09-11 | Nanya Plastics Corp | A surface-coated inorganic filler molybdenum compound and use thereof |
JP6349686B2 (en) * | 2013-11-14 | 2018-07-04 | 住友ベークライト株式会社 | Metal-clad laminate, printed wiring board, and semiconductor device |
JP2015207754A (en) | 2013-12-13 | 2015-11-19 | 日亜化学工業株式会社 | light-emitting device |
JP5854062B2 (en) * | 2014-02-03 | 2016-02-09 | 住友ベークライト株式会社 | Thermally conductive sheet and semiconductor device |
KR102172296B1 (en) * | 2014-04-30 | 2020-10-30 | 엘지이노텍 주식회사 | Epoxy resin composite and printed curcuit board comprising insulating layer using the same |
JP6481494B2 (en) * | 2014-05-15 | 2019-03-13 | Tdk株式会社 | Inorganic filler-containing cured epoxy resin and laminate using the same |
JP6578735B2 (en) | 2014-05-21 | 2019-09-25 | 日亜化学工業株式会社 | Semiconductor device mounting structure, backlight device, and mounting substrate |
CN106471035B (en) * | 2014-07-02 | 2019-04-16 | Dic株式会社 | Electronic material composition epoxy resin, its solidfied material and electronic component |
US9944766B2 (en) * | 2014-08-27 | 2018-04-17 | Panasonic Intellectual Property Management Co., Ltd. | Prepreg, metal-clad laminated board, and printed wiring board |
CN104212311B (en) * | 2014-09-11 | 2016-08-24 | 叶长青 | A kind of emulsion paint having capability of electromagnetic shielding |
KR102235501B1 (en) * | 2014-09-12 | 2021-04-05 | 엘지이노텍 주식회사 | Inorganic filler and epoxy resin composition comprising the same |
JP6090684B1 (en) * | 2015-03-31 | 2017-03-08 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, resin composite sheet and metal foil-clad laminate |
WO2017131007A1 (en) * | 2016-01-26 | 2017-08-03 | 富士フイルム株式会社 | Heat-conductive material, resin composition, and device |
JP6557739B2 (en) | 2016-01-26 | 2019-08-07 | 富士フイルム株式会社 | Resin composition, surface conducting inorganic material, heat conduction material, and device |
CN108431133B (en) | 2016-08-24 | 2019-06-14 | 三菱瓦斯化学株式会社 | Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board |
CN108779330B (en) * | 2017-02-07 | 2019-12-17 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board |
CN112585004B (en) * | 2018-07-17 | 2023-11-03 | 株式会社力森诺科 | Copper foil processing method, copper foil, laminate, copper-clad laminate, printed wiring board, and high-speed communication module |
CN115536982B (en) * | 2022-09-20 | 2023-07-18 | 华南理工大学 | Epoxy composite material with nonlinear conductivity and dielectric property, and preparation method and application thereof |
JP7478871B1 (en) | 2023-02-28 | 2024-05-07 | 太陽ホールディングス株式会社 | Thermosetting resin composition, cured product, and printed wiring board |
JP7478872B1 (en) | 2023-02-28 | 2024-05-07 | 太陽ホールディングス株式会社 | Thermosetting resin composition, cured product, and printed wiring board |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3685629B2 (en) | 1998-12-11 | 2005-08-24 | 電気化学工業株式会社 | Borate particles, method for producing inorganic powder containing the particles, and use thereof |
JP3559463B2 (en) * | 1998-12-25 | 2004-09-02 | 京セラ株式会社 | Semiconductor light emitting device and method of manufacturing the same |
JP2000223807A (en) | 1999-02-04 | 2000-08-11 | Denki Kagaku Kogyo Kk | Insulating substrate with high heat conductivity |
JP4392088B2 (en) * | 1999-10-27 | 2009-12-24 | 電気化学工業株式会社 | Boron nitride-coated spherical borate particles, mixed powder containing the same, and methods for producing them |
JP2001348488A (en) | 2000-06-06 | 2001-12-18 | Matsushita Electric Works Ltd | Heat-conductive resin composition, prepreg, radiating circuit board and radiating heating part |
JP4784198B2 (en) | 2005-08-11 | 2011-10-05 | 三菱瓦斯化学株式会社 | Thermosetting resin composition |
JP4997727B2 (en) | 2005-08-12 | 2012-08-08 | 三菱瓦斯化学株式会社 | Flame retardant resin composition, and prepreg and laminate using the same |
JP4843944B2 (en) * | 2005-01-13 | 2011-12-21 | 三菱瓦斯化学株式会社 | Resin composition and prepreg and laminate using the same |
JP2006348187A (en) | 2005-06-16 | 2006-12-28 | Mitsubishi Gas Chem Co Inc | Resin composition, and prepreg and copper-clad laminate using the same |
JP5263705B2 (en) * | 2007-02-07 | 2013-08-14 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
US7601429B2 (en) | 2007-02-07 | 2009-10-13 | Mitsubishi Gas Chemical Company, Inc. | Prepreg and laminate |
JP5024205B2 (en) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
JP5038257B2 (en) | 2008-08-22 | 2012-10-03 | 株式会社カネカ | Hexagonal boron nitride and method for producing the same |
JP5109882B2 (en) | 2008-09-05 | 2012-12-26 | 株式会社カネカ | Method for producing hexagonal boron nitride powder |
JP2010229368A (en) | 2009-03-30 | 2010-10-14 | Shin Kobe Electric Mach Co Ltd | Epoxy resin composition and prepreg, laminated board, and wiring board |
JP5330910B2 (en) | 2009-07-03 | 2013-10-30 | 電気化学工業株式会社 | Resin composition and use thereof |
EP2733177B1 (en) * | 2011-07-14 | 2017-08-30 | Mitsubishi Gas Chemical Company, Inc. | Resin composition for printed wiring boards |
-
2012
- 2012-03-05 CN CN2012800115428A patent/CN103429633A/en active Pending
- 2012-03-05 EP EP12754288.4A patent/EP2684904B1/en active Active
- 2012-03-05 SG SG2013053525A patent/SG191950A1/en unknown
- 2012-03-05 US US14/001,752 patent/US9629239B2/en active Active
- 2012-03-05 WO PCT/JP2012/055600 patent/WO2012121224A1/en active Application Filing
- 2012-03-05 SG SG10201600443SA patent/SG10201600443SA/en unknown
- 2012-03-05 KR KR1020137023260A patent/KR101867118B1/en active IP Right Grant
- 2012-03-05 JP JP2013503544A patent/JP5999369B2/en active Active
- 2012-03-07 TW TW101107703A patent/TWI572656B/en active
Also Published As
Publication number | Publication date |
---|---|
CN103429633A (en) | 2013-12-04 |
TW201302885A (en) | 2013-01-16 |
WO2012121224A1 (en) | 2012-09-13 |
KR101867118B1 (en) | 2018-06-12 |
JP5999369B2 (en) | 2016-09-28 |
EP2684904A4 (en) | 2014-08-27 |
KR20140047581A (en) | 2014-04-22 |
JPWO2012121224A1 (en) | 2014-07-17 |
SG191950A1 (en) | 2013-08-30 |
EP2684904B1 (en) | 2017-01-11 |
US20130337269A1 (en) | 2013-12-19 |
US9629239B2 (en) | 2017-04-18 |
TWI572656B (en) | 2017-03-01 |
EP2684904A1 (en) | 2014-01-15 |
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