SG10201501726PA - Container transport facility - Google Patents

Container transport facility

Info

Publication number
SG10201501726PA
SG10201501726PA SG10201501726PA SG10201501726PA SG10201501726PA SG 10201501726P A SG10201501726P A SG 10201501726PA SG 10201501726P A SG10201501726P A SG 10201501726PA SG 10201501726P A SG10201501726P A SG 10201501726PA SG 10201501726P A SG10201501726P A SG 10201501726PA
Authority
SG
Singapore
Prior art keywords
container transport
transport facility
facility
container
transport
Prior art date
Application number
SG10201501726PA
Inventor
yoshioka Hideo
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of SG10201501726PA publication Critical patent/SG10201501726PA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
SG10201501726PA 2014-03-11 2015-03-06 Container transport facility SG10201501726PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014047450A JP6052209B2 (en) 2014-03-11 2014-03-11 Container transfer equipment

Publications (1)

Publication Number Publication Date
SG10201501726PA true SG10201501726PA (en) 2015-10-29

Family

ID=54069652

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501726PA SG10201501726PA (en) 2014-03-11 2015-03-06 Container transport facility

Country Status (6)

Country Link
US (1) US9685361B2 (en)
JP (1) JP6052209B2 (en)
KR (1) KR102312786B1 (en)
CN (1) CN104909101B (en)
SG (1) SG10201501726PA (en)
TW (1) TWI634063B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6052209B2 (en) * 2014-03-11 2016-12-27 株式会社ダイフク Container transfer equipment
JP6233340B2 (en) * 2015-03-26 2017-11-22 村田機械株式会社 Stocker and article supporting method
JP6332133B2 (en) * 2015-05-14 2018-05-30 株式会社ダイフク Container transfer equipment
JP6531642B2 (en) * 2015-12-24 2019-06-19 株式会社ダイフク Goods transport equipment
KR102346764B1 (en) 2016-01-18 2022-01-04 (주)에이치티에스 Gripper for transfering of the instant boiledrice container
KR101774297B1 (en) * 2016-03-21 2017-09-20 주식회사 카스 Apparatus for measuring weight
CN107579029B (en) * 2016-07-05 2021-04-09 北京北方华创微电子装备有限公司 Cassette positioning device, cassette loading and unloading system and semiconductor processing equipment
JP6693356B2 (en) * 2016-09-09 2020-05-13 株式会社ダイフク Article carrier
JP6686914B2 (en) 2017-01-12 2020-04-22 株式会社ダイフク Goods storage facility
US10703563B2 (en) * 2017-11-10 2020-07-07 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker
JP6801640B2 (en) * 2017-12-21 2020-12-16 株式会社ダイフク Storage shelves and goods storage equipment
US20230016251A1 (en) * 2021-07-15 2023-01-19 Taiwan Semiconductor Manufacturing Company, Ltd. Compound fork device and system including the same
US20240047249A1 (en) * 2022-08-02 2024-02-08 Visera Technologies Company Ltd. Transfer system for wafer cassettes

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06115615A (en) * 1992-10-01 1994-04-26 Murata Mach Ltd Storage
US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
US6599075B2 (en) * 1994-04-28 2003-07-29 Semitool, Inc. Semiconductor wafer processing apparatus
US6799932B2 (en) * 1994-04-28 2004-10-05 Semitool, Inc. Semiconductor wafer processing apparatus
JPH0992708A (en) * 1995-09-27 1997-04-04 Shin Etsu Handotai Co Ltd Stopper for wafer carrier
TWI237305B (en) * 1998-02-04 2005-08-01 Nikon Corp Exposure apparatus and positioning apparatus of substrate receiving cassette
JP3832293B2 (en) * 2001-08-31 2006-10-11 株式会社ダイフク Load storage equipment
JP4474922B2 (en) * 2004-01-07 2010-06-09 シンフォニアテクノロジー株式会社 Load port device
CN100419988C (en) * 2004-05-17 2008-09-17 信越聚合物株式会社 Substrate storage container and method of positioning the container
US7409263B2 (en) * 2004-07-14 2008-08-05 Applied Materials, Inc. Methods and apparatus for repositioning support for a substrate carrier
CN100511630C (en) * 2005-03-08 2009-07-08 株式会社安川电机 Load port and load port control method
JP4591335B2 (en) * 2005-12-08 2010-12-01 ムラテックオートメーション株式会社 Device for preventing displacement of substrate storage container on shelf in stocker
JP4904995B2 (en) * 2006-08-28 2012-03-28 シンフォニアテクノロジー株式会社 Load port device
JP5003292B2 (en) * 2006-11-07 2012-08-15 シンフォニアテクノロジー株式会社 Transport system
JP4275184B2 (en) * 2007-04-02 2009-06-10 株式会社日立国際電気 Substrate processing apparatus, load port, semiconductor device manufacturing method, and storage container transport method
US8814488B2 (en) * 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
TWI435832B (en) * 2011-09-02 2014-05-01 Sparking Power Technology Co Ltd Loading mechanism capable of matching with different-size wafer boxes
JP6052209B2 (en) * 2014-03-11 2016-12-27 株式会社ダイフク Container transfer equipment

Also Published As

Publication number Publication date
CN104909101B (en) 2019-01-08
TWI634063B (en) 2018-09-01
JP2015171919A (en) 2015-10-01
US20150262855A1 (en) 2015-09-17
CN104909101A (en) 2015-09-16
US9685361B2 (en) 2017-06-20
TW201544422A (en) 2015-12-01
KR20150106360A (en) 2015-09-21
KR102312786B1 (en) 2021-10-13
JP6052209B2 (en) 2016-12-27

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