SG10201501564WA - Article supporting device - Google Patents

Article supporting device

Info

Publication number
SG10201501564WA
SG10201501564WA SG10201501564WA SG10201501564WA SG10201501564WA SG 10201501564W A SG10201501564W A SG 10201501564WA SG 10201501564W A SG10201501564W A SG 10201501564WA SG 10201501564W A SG10201501564W A SG 10201501564WA SG 10201501564W A SG10201501564W A SG 10201501564WA
Authority
SG
Singapore
Prior art keywords
supporting device
article supporting
article
supporting
Prior art date
Application number
SG10201501564WA
Inventor
Wada Yoshinari
Kinugawa Tomotaka
Original Assignee
Daifuku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daifuku Kk filed Critical Daifuku Kk
Publication of SG10201501564WA publication Critical patent/SG10201501564WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C1/00—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles
    • B66C1/10—Load-engaging elements or devices attached to lifting or lowering gear of cranes or adapted for connection therewith for transmitting lifting forces to articles or groups of articles by mechanical means
    • B66C1/22—Rigid members, e.g. L-shaped members, with parts engaging the under surface of the loads; Crane hooks
    • B66C1/34—Crane hooks
    • B66C1/36—Crane hooks with means, e.g. spring-biased detents, for preventing inadvertent disengagement of loads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0033—Gripping heads and other end effectors with gripping surfaces having special shapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C13/00—Other constructional features or details
    • B66C13/18—Control systems or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C19/00—Cranes comprising trolleys or crabs running on fixed or movable bridges or gantries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B66—HOISTING; LIFTING; HAULING
    • B66C—CRANES; LOAD-ENGAGING ELEMENTS OR DEVICES FOR CRANES, CAPSTANS, WINCHES, OR TACKLES
    • B66C9/00—Travelling gear incorporated in or fitted to trolleys or cranes
    • B66C9/02—Travelling gear incorporated in or fitted to trolleys or cranes for underhung trolleys or cranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
SG10201501564WA 2014-03-07 2015-03-02 Article supporting device SG10201501564WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014045125A JP6171984B2 (en) 2014-03-07 2014-03-07 Article support device

Publications (1)

Publication Number Publication Date
SG10201501564WA true SG10201501564WA (en) 2015-10-29

Family

ID=54018078

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201501564WA SG10201501564WA (en) 2014-03-07 2015-03-02 Article supporting device

Country Status (6)

Country Link
US (1) US9362152B2 (en)
JP (1) JP6171984B2 (en)
KR (1) KR102432628B1 (en)
CN (1) CN104891081B (en)
SG (1) SG10201501564WA (en)
TW (1) TWI643805B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6136775B2 (en) * 2013-08-30 2017-05-31 株式会社ダイフク Transport device
JP6179406B2 (en) * 2014-01-10 2017-08-16 株式会社ダイフク Transport device
JP6064940B2 (en) * 2014-04-07 2017-01-25 株式会社ダイフク Goods transport vehicle
JP6617832B2 (en) * 2016-05-20 2019-12-11 村田機械株式会社 Transport vehicle and transport method
JP6819224B2 (en) * 2016-10-31 2021-01-27 株式会社ダイフク Transport vehicle
WO2018180969A1 (en) * 2017-03-31 2018-10-04 株式会社ニコン Object replacement device, object processing device, production method for flat panel display, device production method, object replacement method, and object processing method
DE102017206652A1 (en) * 2017-04-20 2018-10-25 Kuka Deutschland Gmbh Robot gripper for handling objects, in particular containers
EP3625572A4 (en) 2017-10-04 2021-02-24 Leica Biosystems Imaging, Inc. Slide inventory and reinsertion system
EP3625571B1 (en) 2017-11-30 2024-04-10 Leica Biosystems Imaging, Inc. Slide rack gripper apparatus
US11348816B2 (en) * 2018-07-31 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die container warehousing
KR20210091943A (en) * 2020-01-15 2021-07-23 세메스 주식회사 Transferring unit and chucking method
KR20220150968A (en) * 2020-03-13 2022-11-11 무라다기카이가부시끼가이샤 Gripper device, transport vehicle, and transport method
JP7318596B2 (en) * 2020-06-29 2023-08-01 株式会社ダイフク Goods carrier
US20230016251A1 (en) * 2021-07-15 2023-01-19 Taiwan Semiconductor Manufacturing Company, Ltd. Compound fork device and system including the same
CN113941996B (en) * 2021-11-10 2023-10-27 浦曼托(常州)智能装备有限公司 Telescopic handling manipulator capable of being positioned at multiple angles
CN115256356B (en) * 2022-09-27 2023-01-17 深圳市恒润鑫五金有限公司 Special sampling manipulator of industrial robot

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH085023B2 (en) * 1986-08-07 1996-01-24 三機工業株式会社 Grab unit
JPH03277487A (en) * 1990-03-26 1991-12-09 Kubota Corp Valve casing clamping device
JP2981531B2 (en) * 1990-08-28 1999-11-22 日本テキサス・インスツルメンツ株式会社 Method and apparatus for gripping object to be gripped
JP3219711B2 (en) * 1997-01-16 2001-10-15 三菱重工業株式会社 Container suspension spreader
DE19806231C1 (en) * 1998-02-16 1999-07-22 Jenoptik Jena Gmbh Device for gripping an object by a gripping component with interacting adjustable gripping components
JP4465795B2 (en) 2000-04-13 2010-05-19 ムラテックオートメーション株式会社 Gripper device for overhead conveyor
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
JP2003171081A (en) 2001-12-06 2003-06-17 Murata Mach Ltd Ceiling transporting system and transporting method therefor
JP2004238147A (en) * 2003-02-06 2004-08-26 Okura Yusoki Co Ltd Holding device and transfer machine
JP2006008355A (en) * 2004-06-28 2006-01-12 Murata Mach Ltd Overhead traveling vehicle
US8226140B1 (en) * 2009-03-30 2012-07-24 Honda Motor Co., Ltd. Article holding assembly
KR20120003368A (en) * 2010-07-02 2012-01-10 무라텍 오토메이션 가부시키가이샤 Gripper device of overhead transportation vehicle and overhead transportation vehicle
CN102371587B (en) * 2010-08-09 2014-03-05 深圳富泰宏精密工业有限公司 Positioning clamping device
DE102011110250B4 (en) * 2011-05-13 2019-05-16 Leica Biosystems Nussloch Gmbh Gripping device for transporting racks
EP3693990B1 (en) * 2011-06-23 2023-06-07 Brooks Automation (Germany) GmbH Semiconductor cleaner systems and methods
KR20130098688A (en) * 2012-02-28 2013-09-05 삼성전자주식회사 Hoist apparatus and its hoist system

Also Published As

Publication number Publication date
KR102432628B1 (en) 2022-08-12
CN104891081B (en) 2019-01-08
US9362152B2 (en) 2016-06-07
TW201538411A (en) 2015-10-16
JP2015168531A (en) 2015-09-28
KR20150105229A (en) 2015-09-16
CN104891081A (en) 2015-09-09
US20150255318A1 (en) 2015-09-10
JP6171984B2 (en) 2017-08-02
TWI643805B (en) 2018-12-11

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