SG10201404152UA - Grooved cmp polishing pad - Google Patents
Grooved cmp polishing padInfo
- Publication number
- SG10201404152UA SG10201404152UA SG10201404152UA SG10201404152UA SG10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA SG 10201404152U A SG10201404152U A SG 10201404152UA
- Authority
- SG
- Singapore
- Prior art keywords
- polishing pad
- cmp polishing
- grooved
- grooved cmp
- pad
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27106809P | 2009-07-16 | 2009-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201404152UA true SG10201404152UA (en) | 2014-09-26 |
Family
ID=43450188
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201404152UA SG10201404152UA (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
SG2012002234A SG177625A1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2012002234A SG177625A1 (en) | 2009-07-16 | 2010-07-15 | Grooved cmp polishing pad |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110014858A1 (en) |
JP (1) | JP2012533888A (en) |
KR (1) | KR101478414B1 (en) |
CN (1) | CN102498549A (en) |
SG (2) | SG10201404152UA (en) |
TW (1) | TWI519384B (en) |
WO (1) | WO2011008918A2 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018434B4 (en) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Receiving device for holding semiconductor substrates |
DE102011082777A1 (en) * | 2011-09-15 | 2012-02-09 | Siltronic Ag | Method for double-sided polishing of semiconductor wafer e.g. silicon wafer, involves forming channel-shaped recesses in surface of polishing cloth of semiconductor wafer |
JP2014124718A (en) * | 2012-12-26 | 2014-07-07 | Toyo Tire & Rubber Co Ltd | Method of manufacturing laminated abrasive pad |
TWI599447B (en) * | 2013-10-18 | 2017-09-21 | 卡博特微電子公司 | Cmp polishing pad having edge exclusion region of offset concentric groove pattern |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
SG11201703114QA (en) | 2014-10-17 | 2017-06-29 | Applied Materials Inc | Cmp pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
CN108290267B (en) | 2015-10-30 | 2021-04-20 | 应用材料公司 | Apparatus and method for forming polishing article having desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US10875146B2 (en) * | 2016-03-24 | 2020-12-29 | Rohm And Haas Electronic Materials Cmp Holdings | Debris-removal groove for CMP polishing pad |
USD816774S1 (en) * | 2016-03-25 | 2018-05-01 | Craig Franklin Edevold | Spiral pattern for cribbage board |
EP3571009A4 (en) * | 2017-01-20 | 2021-01-20 | Applied Materials, Inc. | A thin plastic polishing article for cmp applications |
USD855110S1 (en) * | 2017-01-31 | 2019-07-30 | Gary Peterson | Game board |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
JP7299970B2 (en) | 2018-09-04 | 2023-06-28 | アプライド マテリアルズ インコーポレイテッド | Formulations for improved polishing pads |
CN112720282B (en) * | 2020-12-31 | 2022-04-08 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN113829176B (en) * | 2021-08-31 | 2023-04-14 | 北京航天控制仪器研究所 | Grinding flat plate for grinding and polishing beryllium mirror body and grinding and polishing method |
CN114274043B (en) * | 2021-12-29 | 2023-02-24 | 湖北鼎汇微电子材料有限公司 | Polishing pad |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5921855A (en) * | 1997-05-15 | 1999-07-13 | Applied Materials, Inc. | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
EP1284841B1 (en) * | 2000-05-27 | 2005-03-23 | Rohm and Haas Electronic Materials CMP Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6736709B1 (en) * | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US7121938B2 (en) * | 2002-04-03 | 2006-10-17 | Toho Engineering Kabushiki Kaisha | Polishing pad and method of fabricating semiconductor substrate using the pad |
JP3849594B2 (en) * | 2002-06-28 | 2006-11-22 | Jsr株式会社 | Polishing pad |
US20040014413A1 (en) * | 2002-06-03 | 2004-01-22 | Jsr Corporation | Polishing pad and multi-layer polishing pad |
JP3849582B2 (en) * | 2002-06-03 | 2006-11-22 | Jsr株式会社 | Polishing pad and multilayer polishing pad |
JP2004071985A (en) * | 2002-08-08 | 2004-03-04 | Jsr Corp | Working method for grinding pad for semiconductor wafer and grinding pad for semiconductor wafer |
JP2004167605A (en) * | 2002-11-15 | 2004-06-17 | Rodel Nitta Co | Polishing pad and polishing device |
JP3872081B2 (en) * | 2004-12-29 | 2007-01-24 | 東邦エンジニアリング株式会社 | Polishing pad |
CN101024260A (en) * | 2006-02-24 | 2007-08-29 | 三芳化学工业股份有限公司 | Polishign cushion with surface grains and its making method and apparatus |
US8192257B2 (en) * | 2006-04-06 | 2012-06-05 | Micron Technology, Inc. | Method of manufacture of constant groove depth pads |
-
2010
- 2010-07-15 CN CN2010800414168A patent/CN102498549A/en active Pending
- 2010-07-15 SG SG10201404152UA patent/SG10201404152UA/en unknown
- 2010-07-15 JP JP2012520766A patent/JP2012533888A/en active Pending
- 2010-07-15 SG SG2012002234A patent/SG177625A1/en unknown
- 2010-07-15 KR KR1020127003925A patent/KR101478414B1/en not_active IP Right Cessation
- 2010-07-15 WO PCT/US2010/042073 patent/WO2011008918A2/en active Application Filing
- 2010-07-16 TW TW099123549A patent/TWI519384B/en not_active IP Right Cessation
- 2010-07-16 US US12/837,705 patent/US20110014858A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW201121711A (en) | 2011-07-01 |
US20110014858A1 (en) | 2011-01-20 |
TWI519384B (en) | 2016-02-01 |
KR20120042985A (en) | 2012-05-03 |
CN102498549A (en) | 2012-06-13 |
WO2011008918A3 (en) | 2011-04-28 |
SG177625A1 (en) | 2012-02-28 |
KR101478414B1 (en) | 2014-12-31 |
WO2011008918A2 (en) | 2011-01-20 |
JP2012533888A (en) | 2012-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201404152UA (en) | Grooved cmp polishing pad | |
EP2193010A4 (en) | Polishing pad | |
DE602009000201D1 (en) | Chemical-mechanical polishing pad | |
EP2435187A4 (en) | Grinder | |
SG11201400614RA (en) | Polishing pad | |
IL220649A0 (en) | Cmp pad with local area transparency | |
EP2242615A4 (en) | Chemical-mechanical planarization pad | |
EP2382651A4 (en) | Chemical-mechanical planarization pad including patterned structural domains | |
EP2404530A4 (en) | Seat pad | |
PL2438224T3 (en) | Ultra-resilient pad | |
AU329851S (en) | Coffee grinder | |
EP2493659A4 (en) | Vitreous bonded abrasive | |
EP2242614A4 (en) | Chemical-mechanical planarization pad | |
TWI561578B (en) | Creep-resistant polishing pad window | |
EP2641268A4 (en) | Polishing pad comprising transmissive region | |
EP2199018A4 (en) | Polishing device | |
SG11201400637XA (en) | Polishing pad | |
EP2732917A4 (en) | Polishing pad | |
IL214055A0 (en) | Composition for post chemical-mechanical polishing cleaning | |
EP2271463A4 (en) | Polishing pad with controlled void formation | |
EP2425749A4 (en) | Seat pad | |
TWI370758B (en) | Method for making polishing pad | |
PL2266752T3 (en) | Centerless grinding machine | |
EP2461353A4 (en) | Cmp polishing pad and method for manufacturing same | |
PL2213414T3 (en) | Wide-wheel grinding machine |