SE0501028L - Hybrid radiation curable composition and use thereof - Google Patents
Hybrid radiation curable composition and use thereofInfo
- Publication number
- SE0501028L SE0501028L SE0501028A SE0501028A SE0501028L SE 0501028 L SE0501028 L SE 0501028L SE 0501028 A SE0501028 A SE 0501028A SE 0501028 A SE0501028 A SE 0501028A SE 0501028 L SE0501028 L SE 0501028L
- Authority
- SE
- Sweden
- Prior art keywords
- radiation curable
- free radical
- curable composition
- compound
- hybrid radiation
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
A hybrid cationic and free radical radiation curable coating or ink composition is disclosed. Said composition comprises at least one cycloaliphatic epoxide compound or epoxy resin and/or at least one oxetane resin or compound, at least one free radical polymerisable compound having an acrylate, methacrylate and/or ß-methyl acrylate functionality of at least 1 and a hydroxyl functionality of at least 1, at least one cationic photoinitiator and at least one free radical photoinitiator.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0501028A SE0501028L (en) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
PCT/SE2006/000531 WO2006118532A1 (en) | 2005-05-04 | 2006-05-03 | Hybrid radiation curable composition and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0501028A SE0501028L (en) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
SE0501028L true SE0501028L (en) | 2006-11-05 |
Family
ID=37308239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE0501028A SE0501028L (en) | 2005-05-04 | 2005-05-04 | Hybrid radiation curable composition and use thereof |
Country Status (2)
Country | Link |
---|---|
SE (1) | SE0501028L (en) |
WO (1) | WO2006118532A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103809377B (en) | 2005-09-13 | 2019-09-24 | 亨斯迈先进材料(瑞士)有限公司 | It is used to prepare the Photocurable composition of the product of Similar to ABS |
EP2152437B1 (en) * | 2006-10-11 | 2014-11-26 | Collins Ink Corporation | Radiation curable inks |
WO2008110512A1 (en) * | 2007-03-14 | 2008-09-18 | Huntsman Advanced Materials (Switzerland) Gmbh | Photocurable compositions for preparing abs-like articles |
US9186701B2 (en) | 2009-06-12 | 2015-11-17 | Axalta Coating Systems Ip Co., Llc | Process for multilayer coating |
EP2440619B1 (en) * | 2009-06-12 | 2015-08-12 | Coatings Foreign IP Co. LLC | Radiation curable coating compositions |
CN102167962B (en) * | 2011-03-22 | 2013-04-10 | 深圳市飞世尔实业有限公司 | Photocuring adhesive used for adhering optic glass lenses and preparation method thereof |
CN102436145B (en) * | 2011-09-01 | 2013-05-22 | 南昌大学 | Stereo lithography rapid prototyping photosensitive resin and preparation method thereof |
CN103275592A (en) * | 2013-05-24 | 2013-09-04 | 无锡市华明化工有限公司 | Anticorrosion acrylic ester paint and preparation method thereof |
CN103305092A (en) * | 2013-05-24 | 2013-09-18 | 无锡市华明化工有限公司 | Anticorrosive coating and preparation method thereof |
US10604659B2 (en) | 2015-06-08 | 2020-03-31 | Dsm Ip Assets B.V. | Liquid, hybrid UV/VIS radiation curable resin compositions for additive fabrication |
EP3567428B1 (en) * | 2015-10-01 | 2021-06-23 | DSM IP Assets B.V. | Liquid, hybrid uv/vis radiation curable resin compositions for additive fabrication |
SE541288C2 (en) * | 2017-12-19 | 2019-06-11 | Perstorp Ab | A hybrid photopolymer composition for additive manufacturing |
CN108441090B (en) * | 2018-02-28 | 2020-06-30 | 东莞市大兴化工有限公司 | Coil coating and preparation method thereof |
WO2021151707A1 (en) * | 2020-01-27 | 2021-08-05 | Abb Power Grids Switzerland Ag | Photo radiation curable epoxy for electrical components |
SE545292C2 (en) * | 2020-07-08 | 2023-06-20 | Perstorp Ab | A radiation curable composition comprising a biobased reactive diluent |
CN112062675A (en) * | 2020-09-15 | 2020-12-11 | 常州速固得感光新材料有限公司 | Monomer with free radical and cation dual curing functions, preparation method and radiation curing gravure ink |
CN113234376B (en) * | 2021-05-08 | 2023-03-17 | 江苏泰特尔新材料科技股份有限公司 | Solvent-free UV tin printing coating and preparation method and application thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4657779A (en) * | 1986-03-19 | 1987-04-14 | Desoto, Inc. | Shrinkage-resistant ultraviolet-curing coatings |
US5252694A (en) * | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
US6350792B1 (en) * | 2000-07-13 | 2002-02-26 | Suncolor Corporation | Radiation-curable compositions and cured articles |
US6579914B1 (en) * | 2000-07-14 | 2003-06-17 | Alcatel | Coating compositions for optical waveguides and optical waveguides coated therewith |
-
2005
- 2005-05-04 SE SE0501028A patent/SE0501028L/en not_active Application Discontinuation
-
2006
- 2006-05-03 WO PCT/SE2006/000531 patent/WO2006118532A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2006118532A1 (en) | 2006-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
NAV | Patent application has lapsed |