RU2363771C2 - Silicon edges for surgical and nonsurgical application - Google Patents

Abstract

FIELD: medicine.

SUBSTANCE: invention concerns blades with rectilinear and curvilinear cutting edges, and to ways of their manufacturing. A blade is made of a plate from the crystalline material chosen from group, including crystalline silicon with selective orientation of crystals, silicon with orientation of crystals <110> and <111>, silicon alloyed to certain specific resistance and content of oxygen, silicon nitride, processing of the first side of a plate from a crystalline material, performance in it of the first profile of a blade with chamfer, forming cutting edge of a blade, and close to it the second chamfer, and processing of the second side of the plate from a crystalline material, making of the second profile of a blade in it with passing along the first chamfer by the third chamfer of a cutting edge and the fourth chamfer close to the third chamfer, and a plate from a crystalline material is exposed to isotropic etching, obtaining a blade from it.

EFFECT: invention allows creating disposable blades in the conditions of the strict control of all technological process, as sharp as diamond blades, and as cheap, as stainless steel blades.

57 cl, 3 tbl, 73 dwg

Description

Cross reference to related applications

In accordance with 35 U.S.C. § 119 (e) of this application claims priority on provisional application US 60/503459, filed September 17, 2003 and fully incorporated into this description by reference.

BACKGROUND OF THE INVENTION

FIELD OF THE INVENTION

The present invention relates to blades intended for use in ocular and other operations and for other non-surgical purposes. The invention relates, in particular, to blades made of silicon or other crystalline material for use in ocular surgery, microsurgery and other non-surgical purposes.

State of the art

Currently, surgical blades are made in different ways, each of which has certain advantages and certain disadvantages. Most often, the blades are made by mechanical grinding of stainless steel. To obtain a sharp edge, the polished blades are then honed in various ways, such as ultrasonic processing using special pastes, mechanical abrasive treatment, finishing, or polishing using electrochemical methods. The advantage of such methods is their high reliability and economy and the possibility of manufacturing a large number of disposable blades. The main disadvantage of these methods is the instability of the quality of the cutting edge and the inability to manufacture blades with a very sharp cutting edge. This is due primarily to the fundamental limitations that underlie these methods themselves. The radius of the cutting edge of the blades made by traditional methods, usually ranges from 30 to 1000 nm.

In the manufacture of stainless steel blades, instead of grinding, hot stamping or embossing have recently begun to be used. To obtain a sharp edge, the edges of the blades made by these methods are then polished electrochemically. This method is more economical than conventional grinding. In addition, the quality and sharpness of the cutting edges, the blades made in this way differ from each other less than the blades made by grinding. In this case, however, according to this indicator, the blades made in this way are inferior to the blades processed with a diamond tool. Currently, operations on soft tissues mainly use disposable blades with a fairly high quality cutting edge.

For the sharpness of the cutting edge, diamond blades are undoubtedly ideal for a wide variety of surgical operations and especially eye operations. With diamond blades, soft fabrics can be cut very cleanly with minimal resistance. The undoubted advantage of diamond blades is the sharpness of their cutting edge, which does not change over time from one cut to another. Most surgeons performing complex lengthy operations prefer to work with diamond blades, which retain their high sharpness much longer than blades made of metal. After finishing, the diamond blades have a very sharp edge, the radius of which varies in very small limits. Typically, the radius of the cutting edge of diamond blades is in the range of 5 to 30 nm. The disadvantage of diamond blades is their high complexity and, as a consequence, the high cost, ranging from 500 to $ 5,000. Therefore, such blades are usually sold for reusable use. To reduce the cost of blades of the same sharpness, materials that are less solid than diamond, such as rubies or sapphires, are currently used for their manufacture. At the same time, however, despite the lower cost compared to diamonds, surgical blades made of ruby and / or sapphire nevertheless remain quite expensive (their cost ranges from 50 to $ 500) and therefore are designed for about two hundred operations. Therefore, such blades, like diamond blades, are sold for reusable, albeit limited use.

Recently, several methods have been proposed for manufacturing surgical blades from silicon materials. However, all these methods have certain limitations and do not provide the possibility of manufacturing blades of various configurations, which, due to their low cost, could be used as disposable. Most of these methods are based on anisotropic etching of silicon. In anisotropic etching, the material is processed in essentially the same direction with different etching intensities in different directions. In this way, a blade with a very sharp cutting edge can be made. However, however, by its nature, this method has certain limitations in terms of the shape of the manufactured blades and the angles of inclination of their cutting edges. In the manufacture of blades with a sharp cutting edge, silicon wafers are treated along a defined crystal plane by wet anisotropic etching in a bath with potassium hydrochloride (KOH), ethylenediamine / pyrocatechol (EDKP) and trimethyl-2-hydroxyethylammonium hydroxide (GTMA). The etching plane, usually the (111) plane in silicon with crystallographic indices <100>, is inclined to the surface plane of the silicon wafer at an angle of 54.7 °. Therefore, for blades made in this way, the angle of inclination of the cutting edge is 54.7 °, which is considered unacceptable for most surgical operations due to the too large angle of inclination of the cutting edge of the blade. Such a feature and such a disadvantage of anisotropic etching are even more pronounced in the manufacture of blades with a two-sided bevel of the cutting edge with an inclination angle between its faces equal to 109.4 °. In addition, the possibilities of this method are limited by the shape of the manufactured blades. When processing silicon wafers in this way, the etching planes are located at an angle of 90 ° to each other. Therefore, in this way, only rectangular-shaped blades can be made.

Thus, there is currently a need to develop a new method of manufacturing blades, devoid of all the disadvantages of the above methods. The system and method of the invention make it possible to produce disposable blades as sharp as diamond blades and as cheap as stainless steel blades. In addition, the proposed system and method can be used for mass production of blades in conditions of tight control of the entire process. In addition, the system and method proposed in the invention can be used for the manufacture of blades with straight and curved cutting edges for surgical and non-surgical use.

Summary of the invention

The above disadvantages can be eliminated with the help of new, having a number of advantages, proposed in the invention system and method for manufacturing surgical blades from crystalline or semi-crystalline material, in particular silicon, by grooving in a crystalline or semi-crystalline plate by various methods with any desired angle of inclination of the cutting edge or any blade configuration. The processed crystalline or semi-crystalline plates with grooves are then lowered into an isotropic etching solution, which uniformly, layer by layer removes molecules of crystalline or semi-crystalline material from the surface of the plate, forming cutting edges of the blades in the plate with the same radius and quality sufficient for operations on soft tissues . Proposed in the invention, the system and method enables the manufacture of relatively cheap surgical blades of very high quality.

In accordance with this, the present invention provides a method for manufacturing a surgical blade, the method being that a silicon or other crystalline or semi-crystalline wafer is mounted on a mounting fixture, straight or curved grooves are cut on the first side of the crystalline or semi-crystalline wafer, etched on one side of the crystalline or semi-crystalline plate with obtaining on it the cutting edges of one or more surgical blades th, the plate is cut into separate surgical blades, assemble them with holders and pack.

The present invention also proposes a method for manufacturing surgical blades, which consists in installing a crystalline or semi-crystalline plate on a mounting device, straight or curved grooves on the first side of the crystalline or semi-crystalline plate, and coating on the first side of the crystalline or semi-crystalline plate, crystalline or semi-crystalline plate is removed from the installation tool, turn over and again mounted on the setting device, is treated with the second side of the crystalline or semicrystalline plate was subjected to etching the second side of the crystalline or semicrystalline plate to give a cutting edge thereon one or more surgical blades, the plate is cut into individual surgical blades, collect them with holders and packaged.

The present invention also provides another method for manufacturing surgical blades, namely, that a crystalline or semi-crystalline plate is mounted on a mounting device, straight or curved grooves are cut with a cutter on the first side of the crystal or semi-crystalline plate, the crystal or semi-crystalline plate is removed from the mounting device, turned over and again mounted on the installation fixture, on the second side crystalline rectilinear or curvilinear grooves are cut with a cutter or a semi-crystalline plate, a second side of the crystalline or semi-crystalline plate is etched to produce cutting edges of one or more surgical blades, a layer of a new solid compound is obtained on the surface of the cutting edge by converting a layer of crystalline or semi-crystalline material, the plate is cut into individual surgical blades, assemble them with holders and pack.

The present invention further provides various surgical blades for ophthalmic and microsurgical surgeries, heart surgeries, surgeries for the treatment of vision and hearing, neurosurgical surgeries, reconstructive and cosmetic surgeries and for use in biological purposes, and also not intended for use in medicine or biology blades made by the methods of the invention.

Brief Description of the Drawings

Distinctive features and advantages of the present invention are described in more detail below on the example of several preferred options for its possible implementation with reference to the accompanying drawings, which show:

figure 1 is a flowchart of the stages of the proposed in the first embodiment of the invention a method of manufacturing a silicon surgical blade with a double-sided bevel of the cutting edge,

figure 2 is a flowchart of the stages of the proposed in the second embodiment of the invention a method of manufacturing a silicon surgical blade with a one-sided bevel of the cutting edge,

figure 3 is a flowchart of the stages of the proposed in the third embodiment of the invention a method of manufacturing a silicon surgical blade with a one-sided bevel of the cutting edge,

figure 4 is a top view of a silicon wafer located on the installation fixture,

figure 5 is a transverse section of a silicon wafer located on the installation fixture,

6 is a diagram illustrating the use of a laser with a water-jet optical fiber for pre-processing a silicon wafer on which grooves are made by the method proposed in one embodiment of the invention,

on figa-7G - diagrams illustrating the sharpening of the cutting discs used for cutting grooves in a silicon wafer processed by the method proposed in one embodiment of the invention,

on Fig is a diagram illustrating the processing of the cutting disk located on the installation fixture of a silicon wafer processed by the method proposed in one embodiment of the invention,

on figa-8B is a diagram illustrating the use of slots when performing in a silicon wafer with a cutting disc grooves proposed in one embodiment of the invention,

figure 9 is a cross section of a cutting disk designed to make grooves located on the tape silicon wafer proposed in one embodiment of the invention by a method,

on figa and 10B - silicon surgical blades with one-sided and two-sided bevel cutting edges made by the method proposed in one embodiment of the invention,

11 is a diagram illustrating the use of a laser with a water-jet light guide for grooving in a silicon wafer from which blades are made by the method proposed in one embodiment of the invention,

12 is a diagram illustrating the use of an ultrasonic grooving system in a silicon wafer from which blades are made by the method proposed in one embodiment of the invention,

13 is a diagram illustrating the use of the hot die forging method for grooving a silicon wafer from which blades are made by the method proposed in one embodiment of the invention,

on Fig - silicon wafer with grooves made on both sides and a coating deposited on one side of the processed wafer from which the blades are made by the method proposed in one embodiment of the invention,

on Fig is a cross section of a cutting disk designed to make the second groove in the silicon wafer located on the tape, from which the blades are made by the method proposed in one embodiment of the invention,

on Fig - obtained under a microscope image of a cross section of a silicon wafer with grooves machined on both sides, from which the blades are made by the method proposed in one embodiment of the invention,

on figa-17B are diagrams illustrating isotropic etching of the processed silicon wafer with grooves made on both sides, from which the blades are made by the method proposed in one embodiment of the invention,

on figa-18B is a diagram illustrating isotropic etching of the treated silicon wafer with grooves made on both sides and coated on one side of the coating from which the blades are made by the method proposed in one embodiment of the invention,

on Fig - image of a beveled on both sides of the cutting edge of a silicon surgical blade with a single-sided coating, manufactured by the method proposed in one of the embodiments of the invention,

on figa-20ZH are examples of surgical blades manufactured by the method proposed in the invention,

on figa and 21B is an enlarged 5000 times the image of the cross section of the cutting edge of a silicon surgical blade made by the method proposed in one embodiment of the invention, and a surgical blade made of stainless steel,

on figa and 22B is a magnified 10,000 times the image in the form of a top view of the cutting edge of a silicon surgical blade, manufactured by the method proposed in one embodiment of the invention, and a surgical blade made of stainless steel,

on figa and 23B are diagrams illustrating isotropic etching of the treated silicon wafer, from which the blades are made by the method proposed in another embodiment of the invention, with grooves made on one side and a coating deposited on the opposite side of the wafer,

on Fig is a diagram illustrating the fastening pins of the handle and the surgical blade made by the method proposed in one embodiment of the invention,

on figa and 25B is a profile of the cutting edge of a blade made of crystalline material, and a blade made in accordance with one embodiment of the invention from a crystalline material with a surface layer of a new compound formed as a result of the conversion of silicon on the surface of the cutting edge,

26-29 are diagrams illustrating the use of a cutter for making straight and curved grooves in a crystalline material from which blades are made by the method proposed in one embodiment of the invention,

on Fig is a flow chart of the milling of straight or curved grooves in a crystalline material by the method proposed in one of the embodiments of the invention,

on figa-31B - a blade with a two-sided bevel of a multifaceted cutting edge, manufactured by the method proposed in one embodiment of the invention,

on figa-32G - a blade with a two-sided bevel of the cutting edge of a variable profile, manufactured by the method proposed in one embodiment of the invention,

on figa-33G - the first and second variants of the first example of a surgical blade made by the methods of the invention, which can be used for eye and other microsurgical operations,

on figa-34B is a second example of execution made according to the invention by the methods of the surgical blade, which can be used for eye and other microsurgical operations,

on figa-35B is a third example of a surgical blade made by the methods of the invention, which can be used for eye and other microsurgical operations,

on figa-36B is a fourth example of a surgical blade made by the methods of the invention, which can be used for eye and other microsurgical operations,

on figa-37B - various parameters of a surgical blade manufactured by the proposed invention the method,

on figa and 38B are additional parameters of a surgical blade manufactured by the proposed invention, and

Fig. 39 is a comparison of the radii of the cutting edge of blades made of metal and blades made of silicon by the methods proposed in various embodiments of the invention.

Preferred Embodiments

Various features of the preferred embodiments of the invention are described in more detail below with reference to the relevant drawings, in which similar elements are denoted by the same positions. The most preferred embodiments of the invention described in the description below do not limit its scope, but merely illustrate the principles underlying it.

The present invention essentially provides a system and method for manufacturing surgical blades for incising soft tissues. However, by the methods of the invention, not only surgical blades, but also various other cutting devices can be manufactured.

The term “surgical blades”, as used in the description, does not obviously exclude the possibility of manufacturing the cutting devices of various types proposed by the invention, including razors, lancets, hypodermic needles, sampling cannulas and other sharp objects used in medicine. In addition, the blades made by the method of the invention according to the proposed system can be used for other non-medical purposes, for example, for shaving and for laboratory purposes (for cutting tissue samples). In addition, the blades for ophthalmic surgeries described in the description can also find other applications in medicine, for example, for performing heart surgeries, operations involving the treatment of vision and hearing, neurosurgical surgeries, cosmetic surgeries and reconstructive surgeries.

The meaning of the terms “one-sided” and “double-sided” bevel encountered in the description and well-known to specialists should nevertheless be clarified. A cutting edge with a one-sided bevel is an edge with one beveled face, the sharp edge of which lies in the plane of one of the sides of the blade. A blade with such a one-sided bevel of the cutting edge is shown in FIG. 10 and is described in more detail below. A two-sided bevel cutting edge is an edge with two beveled edges, the sharp edge of which lies in the middle plane of the blade. A blade with such a cutting edge is shown in FIGS. 10B, 20A and 31B. A face is a flat portion of the beveled side of a cutting edge. A blade may have one, two or more faces on each chamfered side of the cutting edge. In fact, the same blade can have several cutting edges (or, for example, several beveled sides with one or more faces on each beveled side).

The blades are preferably made of crystalline silicon with a specific (selective) orientation of the crystals. However, in principle, crystalline silicon, as well as other materials capable of isotropic etching, can be used to make blades. For the manufacture of silicon blades, it is possible, in particular, to use silicon wafers with the orientations <110> and <111>, as well as doped silicon wafers with a specific (different) resistivity and oxygen content. In addition to such blades, blades made of other materials, for example, silicon nitride and gallium arsenide, can also be used for making blades. Preferably, the blades are made of plates. In addition to crystalline materials, polycrystalline materials can also be used to make surgical blades. Such materials include, in particular, polycrystalline silicon. In this regard, it should be noted that the term "crystalline" as used in the description refers to both crystalline and polycrystalline materials.

It is obvious to those skilled in the art that surgical blades can be made by the methods of the invention not only from “silicon wafers”, but also from any combination of the above materials with different orientations of the crystallographic planes, as well as from other crystalline materials with the corresponding orientation of the crystallographic planes.

Figure 1 shows a block diagram of the sequence of stages of the proposed in one of the embodiments of the invention a method of manufacturing a surgical blade with a double-sided bevel of the cutting edge. A method, various embodiments of which, in the form of flow charts are shown in FIGS. 1-3, is primarily intended for the manufacture of silicon surgical blades of the invention. However, in addition, with a corresponding change in the sequence of stages shown in Figs. 1-3, the method proposed in the invention can be used to manufacture silicon surgical blades of various parameters or to make blades taking into account specific production conditions and capabilities.

So, for example, the method of manufacturing blades with a two-sided bevel of the cutting edge, proposed in the first embodiment of the invention, the flowchart of the stages of which is shown in FIG. 1, can also be used to make blades with a multifaceted cutting edge (for example, with three or more faces ) A blade with such a cutting edge is shown in FIGS. 31A-31B and is described in more detail below. In addition, the method of the invention can be used to make the blades with the double-sided cutting edge shown in FIG. 32. The blade shown in FIG. 32 is also described in detail below. In addition, the methods proposed in the invention and described in detail below can be used to produce the blades shown in FIGS. 20B and 20G with a single-sided cutting edge with two (or several) cutting surfaces with two (or several) bevel angles of the cutting edge and blades with different angles bevel cutting edges. In conclusion, it should be noted that, without departing from the scope of the invention, a variety of changes and improvements can be made to the block diagrams of the sequence of stages of the stages of the method of manufacturing silicon surgical blades proposed in the main (preferred) embodiments of the invention.

Proposed in the first embodiment of the invention, a method of manufacturing surgical blades with a double-sided bevel of the cutting edge, preferably from a crystalline material, in particular silicon, the flowchart of the sequence of steps shown in FIG. 1 begins with step 1002. At step 1002, a silicon wafer is placed on a special installation device 204, on which it is located during its subsequent processing. Figure 4 shows a silicon wafer 202 located on a prefabricated structure made of a support and UV-sensitive tape (mounting fixture) 204. Such mounting fixtures 204, used for machining silicon wafers, are currently widely used in the semiconductor industry. For specialists in this field it is obvious that the manufacture of surgical blades proposed in the preferred embodiments of the invention, the method does not require mandatory processing of silicon (crystalline) wafers 202 in a special installation tool 204.

In Fig. 5, the same silicon wafer 202 located on the mounting fixture 204 is shown in cross-section in side view (it does not matter left or right due to the symmetrical shape of the wafer). 5, the silicon wafer 202 is located on the tape 308, which in turn is placed on the mounting fixture 204. The silicon wafer 202 located on the mounting fixture has a first side 304 and a second side 306.

As shown in FIG. 1, after step 1002, step 1004 is performed. When step 1004 is performed, the need for pretreatment of the silicon wafer 202 in step 1006 is determined. For pretreatment of the wafer in step 1006, the laser 402 shown in FIG. 6 with a water-jet fiber is used. A beam 404 emitted from a laser 402 with a water-jet waveguide acts on the surface of the silicon wafer 204 located on the mounting fixture 204. The laser beam 404 cuts through the silicon wafer 202 the various through holes 406 shown in FIG. 6, which form the initial (reference) points for subsequent processing of the wafer.

A laser beam 404 aimed at the silicon wafer 202 cuts through the wafer. The ability of a laser to form cuts in a silicon wafer 202 depends on the wavelength X of the laser radiation. In a preferred embodiment of the invention, for the most effective pretreatment of the silicon wafer, a yttrium aluminum garnet (YAG) laser is usually used, the radiation wavelength of which is 1064 nm, which, however, does not exclude the possibility of processing the wafer also with laser radiation with a different wavelength and lasers of a different type . When using other crystalline or polycrystalline materials, other wavelengths of laser radiation and other types of lasers are more acceptable.

The through holes 406 cut in the silicon wafer (many holes can be made in the wafer in this way) are used as reference points for making grooves in the wafer (as described in more detail below in the description of step 1008), in particular, in those cases when the grooves in the plate are made with a suitably sharpened cutting disc. For pre-processing the silicon wafer and making through it (reference) holes 406, any lasers can be used (for example, an excimer laser or the aforementioned laser 402 with a water-jet fiber). Typically, through holes cut into a silicon wafer are cross-shaped or round. The choice of the shape of the through holes depends on the geometry of a particular tool and a number of other technological factors and is not limited to the two examples above.

In addition to the laser beam, other machining tools can be used to perform through the silicon wafer at the stage of preliminary processing of through (reference) holes. Such non-limiting means of the invention include drills, grinding tools and ultrasonic processing devices 100. As such, such means of machining the plates are well known to specialists, although their use in the implementation of the preferred options proposed in the invention method is quite new.

Previously, until the grooves forming the cutting edges of the blade edges are machined, the treated silicon wafer 202 with through holes must remain intact during its etching. A laser beam (for example, the aforementioned laser 402 with a water-jet waveguide or an excimer laser) can also be used to make through the elliptical edge of the insert through elliptical slots for approaching the cutting disk 502 (as described in more detail below with reference to figa-7B) when performing in the silicon wafer 202 grooves forming the cutting edges of the blades. Such slots for the entry of the cutting disc can also be performed using (described above) machining tools that can be used instead of a laser to make reference holes in the plate.

After pre-processing the silicon wafer 202 in step 1106 (after making through the reference holes 406 and slots for the disk cutter to enter therein) or immediately after performing steps 1002 and 1004 (the “step” 1004 is not a physically performed step; similar decision stages are given to illustrate the entire processing process and its variants), on which the plate is placed in the device for its subsequent processing and a decision is made on the need for its preliminary processing, step 1008 is performed (Fig. 1). At 1008, on the first side 304 of the silicon wafer 202, the cutting edges of the groove blades are formed. Depending on the production conditions and the design of the surgical blades made from silicon wafers, the grooves in the silicon wafer can be made using different methods.

In the silicon wafer, the cutting edges forming the grooves of the groove blades can be machined with a cutting disc, laser machined, ultrasonic machined, hot die forged or shaped milling. Obviously, there are other ways to solve this problem. All of these methods are discussed in detail below. Grooves made in a silicon wafer using any of these methods form oblique cutting edges of silicon surgical blades made from a wafer. When 202 grooves are made in a silicon wafer, the shape of the silicon material removed from the wafer depends on the profile of the disk cutter, the path of the excimer laser beam or the ultrasound source beam on the surface of the plate, and the very shape of the beveled cutting edge of the blade. If grooves with a cutting disc allow blades to be made from a silicon plate only with a straight cutting edge, then two other methods provide the possibility of manufacturing silicon surgical blades with almost any shape of the cutting edge. During hot forging, the silicon wafer is heated to a temperature sufficient for its plastic deformation, and squeezed in a bulk mold until grooves of the required profile are formed in the heated "soft" silicon wafer. The term “grooving” in the description refers to all methods for making grooves in a silicon wafer, including the above-mentioned methods for making grooves with a cutting disk, laser processing, ultrasonic processing, shaped milling or hot forging, as well as other similar processing not by the methods mentioned above. All of these methods are discussed in more detail below.

On figa-7G shows a cutting disc, which in accordance with one embodiment of the invention can be used to perform (cutting) grooves in a silicon wafer. FIG. 7A shows a first embodiment of a cutting disc 502 with one cutting surface sharpened at an angle Ф and intended for making blades with a single-sided cutting edge with the same angle of inclination. On figb shows a second embodiment of a cutting disc 504 with two cutting surfaces, sharpened on both sides at an angle f to the surface of the plate. Fig. 7B shows a third embodiment of a cutting disc 506 with one cutting surface sharpened at the same angle Ф, but with a different profile than that of the first cutting disc 502. On figg shows a fourth embodiment of the cutting disc 508 with two, as shown in Fig.7B cutting disc, cutting surfaces sharpened at an angle F.

All cutting discs 502, 504, 506 and 508 shown in FIGS. 7A-7G are sharpened at the same angle Ф, which, however, does not exclude the possibility of sharpening them at different angles, obvious for specialists in this field, the choice of which depends from the required angle of inclination of the cutting edge made of silicon surgical blades. In addition, as discussed in more detail below, the same silicon surgical blade may have different cutting edges, beveled at different angles. The second cutting disc 504 can be used to increase the productivity of the line on which silicon surgical blades with the same geometry of the cutting edge are made, or for manufacturing silicon surgical blades with two or three cutting edges. Various embodiments of blades manufactured by the method of the invention are discussed in more detail below with reference to FIGS. 20A-20G. In a preferred embodiment of the invention, it is proposed to use a cutting disc with a diamond cutting edge as a cutting disc.

To make the grooves on the first side 304 of the silicon wafer 202, special cutting discs are used, as mentioned above. The cutting disc is chosen so that after the final surface treatment the silicon wafer has a sufficiently high durability. The working surface of the cutting disc is profiled depending on the profile of the grooves made in the silicon wafer 202. The profile of the cutting edge of the finished blades directly depends on the profile of the working surface of the cutting disc and the shape of the grooves. Typically, the angle of inclination of the cutting edge of surgical blades with one-sided and two-sided bevel of the cutting edge is from 15 to 45 °. In the manufacture of silicon surgical blades by the method proposed in the invention, the optimal choice of the cutting disc and the etching mode allows you to accurately control the angle of inclination of their cutting edges.

On Fig schematically illustrates the process of processing a cutting disk of a silicon wafer placed on a mounting device, proposed in the invention method. FIG. 8 shows a cutting disc that grooves on the first side 304 of a silicon wafer 202. In the manufacture of silicon surgical blades with beveled cutting edges in this manner, any of the cutting discs shown in FIGS. 7A-7G (502, 504, 506 or 508). In this regard, it should be noted, however, that in addition to the cutting disks shown in FIGS. 7A-7G, other cutting disks can be used for the manufacture of silicon blades by the method according to the invention. Figure 9 shows a cross section of a cutting disc during cutting by a groove in a silicon wafer located on a tape, as proposed in one embodiment of the invention. Fig. 9 shows, on an enlarged scale, the cross section of the cutting disc shown in Fig. 8, at the time of cutting the groove in the silicon wafer 202. The cutting disc 502 shown in this drawing does not pass through the silicon wafer 202, but penetrates into it to a depth of equal to the height of the cutting edge of the blade with a one-sided bevel of the cutting edge and approximately 50-90% of the thickness of the silicon wafer 202. The same ratio between the height of the cutting edge of the blades with a single-sided bevel of the cutting edge and the thickness of the silicon plas tinki must be observed when performing grooves in the plate forming the cutting edge of the blade edge by any method (including during the hot forging of silicon wafers). When making blades with a double-sided bevel of a cutting edge with cutting a groove in a silicon wafer with a cutting disk or when grooving by other methods, the depth of the grooves on each side of the silicon wafer 202 should be approximately 25-49% of its thickness. Silicon surgical blades made by the method according to the invention with one-sided and two-sided bevels of the cutting edge are shown in FIGS. 10A and 10B, respectively.

As noted above, narrow slots can be cut out in the silicon wafer 202, in particular in those cases where the grooves forming the cutting edges of the blade edges are made with a cutting disc. Such narrow slots can be made in silicon wafer 202 in the same manner as through holes, for example, with a laser with a water-jet optical waveguide or an excimer laser, using them for completely different purposes. It should be noted that the through holes are used as reference marks for the exact positioning of the silicon wafer 202 on the machine for making grooves. Through holes are especially necessary in the manufacture of blades with a two-sided bevel of the cutting edge, since the grooves performed during the second processing of the silicon wafer 202 (processing its other side) must exactly match the grooves made previously on the first side of the wafer. The narrow slots, however, are for a different purpose. The narrow slots made on the edge of the silicon wafer 202 are intended for the entry of the cutting disk and prevent cracking or destruction of the silicon wafer during grooves (Fig. 8). The execution in the silicon wafer of narrow slots for the entry of the cutting disk (see figa) is a preferred embodiment of the method of manufacturing silicon surgical blades proposed in the invention. In the absence of narrow slots (Fig. 8), the silicon wafer 202, which is very thin after grooving in the manner described above, can easily break even under very small stresses. In other words, the silicon wafer made without narrow slots for the entry of the cutting disc, shown in Fig. 8, has a small structural rigidity. Such a silicon wafer in stiffness differs significantly from the wafer shown in FIG. The treated silicon wafer 202 shown in FIG. 8B has much greater rigidity, markedly reduces rejects and increases the productivity of the entire silicon surgical blade manufacturing line. Silicon wafers 202 processed according to the circuit shown in FIG. 8B break much less frequently than silicon wafers processed according to the circuit shown in FIG. 8B. As shown in FIGS. 8A and 8B, a narrow slot has a width and length greater than the thickness of the cutting disc that is necessary for the cutting disc to reach a depth sufficient to start cutting the grooves. When lowering into a narrow slot, the cutting disc does not touch the silicon wafer 202 and therefore does not split or break it, but cuts a groove in the wafer only when moving in the horizontal direction. On figv shows the first side of the processed silicon wafer 202 with narrow slots for the entry of the cutting disk and forming the cutting edges of the blades grooves.

Figure 11 schematically illustrates the use of a laser to make grooves in a silicon wafer in accordance with one embodiment of the inventive method for manufacturing silicon surgical blades. The grooves in the silicon wafer can also be performed in detail by ultrasonic treatment described in detail below according to the scheme shown in Fig. 12. The advantage of both of these methods for processing a silicon wafer is the ability to produce blades with different, including complex, shapes of the cutting edge, for example, sickle-shaped blades, spoon-like blades, and scleral blades. 11 shows a diagram of a laser processing machine 900 for silicon wafers. The silicon wafer laser processing machine 900 has a laser 902 that emits a laser beam 904, and a multi-axis moving mechanism 906 fixed to the machine bed 908. Obviously, such a machine can have (for simplicity, not shown in the drawing) a computer and, if necessary, a network interface.

The silicon wafer 202 being processed on the laser machine 900 is mounted on the mounting fixture 204, and the multi-axis moving mechanism 906 is set to the desired position. The use of a laser machine 900 and appropriate means of masking a laser beam makes it possible to produce blades from a silicon wafer with a different profile of the cutting edge. The means for masking the laser beam located inside the laser 902, when properly implemented, ensure that the laser beam processes only the necessary portions of the silicon wafer. In the manufacture of blades with a two-sided bevel of the cutting edge, the other side of the silicon wafer is treated in the same way, using the 206A, 206B slots pre-cut in it or through (reference) holes 406 to precisely align the grooves.

Laser 902 is used for precision execution according to a specific pattern (or, according to the accepted for laser processing, in accordance with the “ablation profile” or “material ablation profile”) groove system on the first side 304 or on the second side 306 of the silicon wafer 202 in preparation for subsequent isotropic etching in the block diagram of step 1018 considered in the description of FIG. 1; the possibility of obtaining a raster of the above ablation profiles in silicon wafer 202 is provided by the presence of a multi-axis mechanism displacement and appropriate means of masking the laser beam. In this way, you can get a variety of drawings of a curved profile. To process a silicon wafer at this stage, various types of lasers can be used. As an example, the excimer laser and laser 402 with a water-jet waveguide mentioned above can be mentioned. The radiation wavelength of the excimer laser lies in the range from 157 to 248 nm. Other lasers that can be used to create a groove system in a silicon wafer include a yttrium aluminum garnet (YAG) laser and lasers with a radiation wavelength of 355 nm. Obviously, other lasers with a certain radiation wavelength in the range from 150 to 11000 nm can be used to perform a groove system in a silicon wafer.

On Fig shows a diagram of a machine for ultrasonic processing, designed to make grooves in a silicon wafer in the manufacture of silicon surgical blades by the method proposed in one embodiment of the invention. The ultrasonic processing machine has a precision ultrasonic head 104, which, using an abrasive slurry 102, processes the first side 304 or the second side 306 of the silicon wafer 202. On the machine, one side of the wafer is processed at a time. In the manufacture of blades with a double-sided bevel of the cutting edge, the other side of the insert is processed in a similar manner using through reference holes 406 to align the grooves.

The ultrasonic processing machine is used for the precision execution of a groove system in a silicon wafer 202 before its subsequent wet isotropic etching. For ultrasonic processing of a silicon wafer, a head 104 vibrating with a frequency of ultrasonic vibrations is used. The head 104 does not touch the silicon wafer 202, but is close to it and acts on the abrasive slurry 102 by ultrasonic waves emitted by it. Under the action of ultrasonic waves emitted by the head 104 into the abrasive slurry 102 in the silicon wafer 202 according to a certain pattern, which is determined by the profile given to the working surface of the head, erosion of the material occurs.

To perform a system of grooves in a silicon wafer on the working surface of the head 104 by milling, grinding or EDM, an appropriate profile is provided. The pattern of the grooves made in the silicon wafer 202 thereby depends on the attached profile surface 104 of the head. The advantage of ultrasonic processing over excimer laser treatment is the possibility of ultrasonic processing of one side of the silicon wafer 202 if there are a variety of groove systems on its other side. Ultrasonic processing of silicon wafers does not require a high investment of time and is characterized by a relatively low cost. In the same way as with excimer laser processing, ultrasonic processing allows you to perform a variety of groove systems with a curved profile in a silicon wafer.

On Fig shows a diagram of a machine for hot stamping in a silicon wafer of the groove system in accordance with another embodiment of the proposed invention the method of manufacturing silicon surgical blades. In this embodiment, the grooves in the silicon wafer are hot stamped. To do this, the processed silicon wafer is heated to a temperature at which the material from which it is made becomes "soft". The heated silicon wafer is stamped in the mold with a punch whose working surface profile is a negative image of the grooves extruded into the wafer.

The silicon wafer 202 is preheated in a heating chamber or immediately on the basis of the mold 1054. After a certain time, the heated silicon wafer 202 gradually “softens”. After heating to a softening temperature, a hot punch 1052 is pressed onto the silicon wafer 202 with a force sufficient to extrude the groove system on its first side 304, the profile of the lower surface of which is a negative image of the grooves extruded into the wafer. The corresponding design of the punch 1052 allows grooves in silicon wafers with different inclination angles, different depths, lengths and different profiles to be used and used to make blades with different shapes and profiles of the cutting edge. The diagram shown in Fig. 13, although it is simplified, nevertheless reflects all the main features of the method of the invention for executing a system of grooves in a silicon wafer by hot forming.

On Fig.26-29 shows the various stages of use of the cutter for milling in the crystalline material of straight or curved grooves. 26 shows through holes 622 drilled in a silicon wafer 202. Through holes 622 performed in the wafer in a preferred embodiment of the invention prevent microcracks in the crystalline material from forming during milling of the grooves. As noted above, through holes in a silicon wafer can be performed by various methods, including drilling, ultrasonic processing, laser processing or laser processing with a water-jet optical fiber, as well as any other method. The number of through holes depends on the number of blades that are made of silicon wafer 202. The specific number of through holes used in milling grooves in this embodiment of the invention can, in principle, be any, although at least two through holes 622 are usually made for each blade in a silicon wafer (at the beginning and at the end of the milled groove).

After drilling through the holes 622 in the silicon wafer 202, a rotary cutter 620 is lowered into one of them and rotated (counterclockwise, viewed from above) at a certain speed. The cutter 620 lowered into the hole at a certain depth is moved in the required direction in accordance with the commands of the program control system ( see Fig. 27). The program control system controls the depth to which the cutter is lowered into the hole (and raises the cutter after milling the grooves), and also controls the direction and speed of the cutter relative to the silicon wafer 202 in the X-Y plane. The profile of the cutter 620 depends on the angle of inclination of the cutting edge of the blades made of the blade. So, for example, special-purpose surgical blades should have certain angles of inclination of the cutting edge and other specific design features. On Fig shows the shape of the cutter 620, milling a groove in the silicon wafer 202. So, for example, for the manufacture of blades with a two-sided bevel of the cutting edge with a coverage angle equal to 30 °, the cone angle of the cutting surface of the cutter should be 150 °.

Milling cutter 620 is a relatively inexpensive tool for making straight or curved grooves in a silicon wafer 202. As shown in FIG. 29, the cutting edge of the same blade can have both straight and curved sections. The use of one relatively cheap tool for making grooves in a silicon wafer saves both time and cost of manufacturing blades, and thereby reduce their cost.

On Fig shows a block diagram of the sequence of stages when milling straight or curved grooves in a crystalline material by the method proposed in one of the embodiments of the invention. In step 604, the required number of through holes 622 are drilled in the silicon wafer 604. At step 606, a milling cutter 620 rotating at a predetermined speed is lowered to the required depth into the first through bore 622. The program control system then moves the milling cutter 620 in a certain direction relative to the wafer, in which a groove with a predetermined angle of inclination and a profile is milled (step 608). When the cutter reaches the last through hole 622, the program control system lifts the cutter from the hole (step 610). In this way, in the silicon wafer 202, grooves are successively milled in an amount that depends on the number of blades made from it (step 612).

After considering several possible ways to perform grooves on the silicon wafer forming the cutting edges of the blades, it is necessary to return to the flowchart shown in FIG. 1. After making the grooves in step 1008, on the first side 304 of the silicon wafer 202 in step 2001, a decision is made whether to coat the silicon wafer 202. FIG. 14 shows a silicon wafer with grooves on both sides and a coating applied in accordance with one embodiment implementation of the invention to one of its processed parties. Coating 1102 is optionally applied to the first side 304 of the silicon wafer 202 in step 2002 by any method well known to those skilled in the art. The coating 1102 applied to the plate facilitates more effective control of the etching process and increases the strength of the cutting edge of the blade. The silicon wafer 202 is placed in a special chamber in which its entire first side 304, including the grooves, is covered with a thin layer of silicon nitride (Si ₃ N ₄ ). The coating applied to the plate has a thickness of 10 nm to 2 μm. The coating composition may include any material whose hardness is greater than the hardness of the silicon (crystalline) plate 202. Thus, in particular, coating 1102 may contain titanium nitride (TiN), titanium aluminum nitride (AlTiN), silicon dioxide (SiO ₂ ), silicon carbide ( SiC), titanium carbide (TiC), boron nitride (BN) or diamond-like crystals (APC). Coatings for blades with a double-sided bevel of the cutting edge are discussed in detail below with reference to figa and 18B.

After coating 1102 is applied in step 2002, or immediately after step 1008 (in the case when no coating is applied) in step 2003, the silicon wafer is removed from the installation tool and reinstalled on it. In step 2003, silicon wafer 202 is typically removed from tape 308 in the same machine specifically designed for this. In this machine, the UV-sensitive tape 308 is irradiated with ultraviolet light, and as a result, its thickness decreases. Instead of the UV-sensitive tape 308, a tape with low tack or a tape that ceases to be sticky when heated can be used as an intermediate support for the silicon wafer. After sufficiently intense UV irradiation, the adhesion of the tape to the silicon wafer 202 is significantly reduced, and the wafer can be easily removed from the tape. The plate 202 removed from the tape is turned over and again placed on the tape for subsequent grooves on its now second side 306 located on top.

In step 2004, the second side of the silicon wafer 202 is processed. At this stage, on the second side 306 of the silicon wafer 202, grooves forming the cutting edges of the double-sided bevels are performed similarly to step 1008. FIG. 15 is a cross-sectional view of a cutting disk 502, which in this embodiment of the invention makes grooves on the second side of the silicon wafer 202 located on the tape. It is obvious that, instead of the cutting disk, an excimer laser 902 can be used to make grooves on the second side of the silicon wafer 202 , an ultrasonic processing device 100 or a hot forging press. On Fig shows a cutting disk 502, which perform (cut) the second groove on the second side 306 of the silicon wafer 202. The silicon wafer processed at this stage has a coating 1102 deposited on it at the stage 2002. Fig. 10A and 10B respectively show the blade with one-sided and two-sided bevel of the cutting edge. The angle of inclination of the cutting edge of the blade shown in FIG. 10A and made from a silicon wafer 202 machined on one side is F. The blade shown in FIG. 10B has a beveled cutting edge formed on both sides resulting from execution (by any of the above methods) on the second side of the silicon wafer 202 grooves with the same angle as the grooves made on its first side, the angle of inclination. The blade made in this way is a silicon surgical blade with a double-sided bevel of the cutting edge, each side of which is inclined to the plane of the blade at an angle Ф, and the total angle at the top of the cutting edge is 2F. On Fig shows a microscopic image of a silicon wafer with grooves on two sides, from which the blades are made by the method proposed in one embodiment of the invention.

On figa-31B shows a blade with a multifaceted beveled on both sides of the cutting edge, made by the method proposed in one of the embodiments of the invention. On figa this blade 700 is shown in plan view. Shown in these drawings, the blade 700 with a multifaceted beveled on both sides of the cutting edge is, in particular, a blade with a tetrahedral beveled on both sides of the cutting edge with a double bevel, manufactured by the methods of the invention. The angle θ ₁ shown in the drawings is equal to the angle of inclination of the first group of faces 704a, 704b of the cutting edge of the blade, and the angle θ ₂ is equal to the angle of inclination of its second group of faces 704c, 704d.

The multifaceted chamfered cutting edge of the blade 700 can be made by any of the methods described above for making grooves forming the cutting edge in a silicon wafer. So, for example, for processing grooves and forming in the silicon wafer bevels a multifaceted bevel on both sides of the cutting edge of the blades, you can use the laser beam 904. With the first pass of the laser beam 904, you can first cut the first groove on the first side of the silicon wafer, and then the second pass adjacent second groove. In addition, it is possible to make a blade with a multifaceted cutting edge beveled on both sides by the hot die forging method described above with reference to Fig. 13. In other words, it is possible to make grooves in the silicon wafer and make the blade 700 shown in FIGS. 31A-31B with a polyhedral cutting edge beveled on both sides using any of the methods described above.

On figa-32G shown made by the proposed in one embodiment of the invention, the blade with a variable angle of inclination of the beveled on both sides of the cutting edge. On figa blade 702 with a variable angle of inclination of the beveled on both sides of the cutting edge is shown in plan view. The blade 702 with a variable angle of inclination of the beveled bevel on both sides can be produced by different methods. The blunt edge at an acute angle θ ₄ of inclination of the bevel of the cutting edge becomes gradually toward the blade edge becomes sharper and in angle θ _3. This shape of the cutting edge increases the strength of the sharp edge of the blade 702 with a variable angle of inclination of the beveled bevel on both sides.

The cutting edge of the blade 702, beveled on both sides with a variable angle of inclination, can be made by any of the methods described above for making grooves forming the cutting edge in a silicon wafer. Thus, for example, a laser beam 904 can be used to groove and form a silicon wafer that is beveled on both sides with a variable angle of inclination of the cutting edge of the blade 702. To control the laser beam 904 cutting a beveled groove with a variable angle of inclination in a silicon wafer, you can use the system program management. Similarly, to produce a blade 702 with a variable angle of inclination of the beveled beveled on both sides can be described above with reference to Fig.13 by the method of hot stamping. In other words, the grooves in the silicon wafer can be made and the blade 702 shown on FIGS. 32A-32B can be made with a cutting edge slanted on both sides with a variable angle of inclination using any of the methods described above. On figb and 32B shows the two sides of the blade 702 with a variable angle of inclination of the beveled bevel on both sides and variable angles f ₃ and f ₄ tilt, the value of which varies depending on the distance from the edge of the cutting edge. On figg shows a front view of the blade 702 with a variable angle of inclination of the beveled beveled on two sides of the cutting edge in section by plane CC. On figg shows the first, second, third and fourth edges 706a-706d and the edges 708a and 708b of the cutting edge of the blade.

On figb and 20G in a top view shows the blade with a multifaceted cutting edge with different angles of inclination of the faces. Proposed in the invention methods, it is possible to produce blades with different angles of inclination of the edges of the cutting edge, including the blades shown in figv and 20G. The blades shown in figv and 20G, have four cutting edges, beveled on one or both sides at different angles. In addition, each side of the beveled cutting edge may have, as indicated above, several faces. The blades shown in these drawings only illustrate the methods of the invention and do not limit its scope.

After the grooves of the grooves on the two sides are formed in silicon wafer 202 at the stage of 2004, at the next stage of 2005, they decide to further process it, either by etching in step 1018 or by cutting in step 1016. You can cut the wafer in step 1016 a cutting disc or a laser (e.g., an excimer laser or a 402 laser with a water-jet light guide). The plate is cut into separate strips, which (at 1018) are etched in special clamps and not in cassettes (which is described in more detail below).

On figa and 17B schematically illustrates the process of isotropic etching of a silicon wafer with grooves made on both sides, from which silicon blades are made in accordance with one embodiment of the method of the invention. During etching in step 1018, the treated silicon wafer 200 is removed from the tape 308. Then, the silicon wafer 202 is placed in a cassette and immersed in a bath 1400 with an isotropic acid etchant. For the most uniform etching of the plate, the temperature of the isotropic etchant 1402, its concentration and degree of mixing are continuously monitored and regulated. In a preferred embodiment, the isotropic etchant consists of hydrofluoric acid, nitric acid and acetic acid (FAA). For etching a silicon wafer, acid etchants with different combinations and different concentrations of individual components can be used. So, for example, acetic acid can be replaced with water. The etching of a silicon wafer in a bath with an isotropic etchant can be replaced by jet etching, isotropic etching with gaseous xenon difluoride, and electrolytic etching. For gas etching, sulfur hexafluoride or other fluorinated gases can be used instead of xenon difluoride.

When treated with an isotropic etchant, the silicon wafer 202 is etched until the jumpers between the grooves made on its opposite sides are completely dissolved. After that, the silicon wafer 202 is immediately removed from the bath with an isotropic etchant 1402 and washed. The radius of the cutting edge expected after etching ranges from 5 to 500 nm.

During isotropic chemical etching, silicon is uniformly removed from the surface of the silicon wafer. In the manufacture of silicon blades in accordance with one embodiment of the method of the invention, the profile of the grooves made as a result of the above-described treatment during etching changes uniformly, and grooves located on opposite sides of the plate cut through the jumper separating them (in the manufacture of single-sided bevel blades cutting edges during etching grooves made on one side of the plate, cut through its opposite untreated side). Isotropic etching allows you to make sharp blades with the required radius of the cutting edge and maintains the angle of inclination of its beveled face. All attempts to cut the thin jumper between the grooves (or the groove and the unprocessed side of the plate) only mechanically failed, since the very thin jumper between the sharp cutting edges of the blades manufactured by the method of the invention does not withstand the mechanical and thermal loads that arise. Each component of the isotropic acid etchant 1402 in the bath 1400 performs its specific function. So, in particular, nitric acid oxidizes exposed silicon, and hydrofluoric acid removes oxidized silicon. Acetic acid in this process acts as a diluent. To obtain stable results during etching, it is necessary to precisely control and regulate the composition of the isotropic etchant, its temperature and degree of mixing.

On figa shows a silicon wafer 202 without coating 1102, placed in a bath 1400 with an isotropic etchant. At this stage of processing, all surgical blades (first blade 1404, second blade 1406 and third blade 1408) that are made from this plate are connected to each other. The etchant 1402 acting on the silicon wafer sequentially, layer by layer, removes silicon molecules from the wafer surface, and the wafer thickness (blade thickness) gradually decreases until the bridge between the vertices of the two angles 1410 and 1412 (the bevels of the cutting edge of the first surgical blade 1404) disappears at that point where the edge of its cutting edge is connected to an adjacent surgical blade (second surgical blade 1406). As a result of etching, several surgical blades are obtained from a silicon wafer (1404, 1406, 1408). During isotropic etching and dissolution of the plate material by the etchant 1402, the inclination angles of the grooves made in the plate, forming the cutting edges of the blades made of the plate, do not change, but only the plate thickness changes.

On figa and 18B shows the process of isotropic etching of a silicon wafer with grooves made on both sides and coated on one side in the manufacture of silicon blades in accordance with another embodiment of the proposed invention the method. The lower side of the silicon wafer 202 with a coating 1102 shown in FIGS. 18A and 18B is covered by a tape 308, and therefore the isotropic etchant acts only on the second side 306 of the wafer. Etching of a silicon wafer located on the tape is not mandatory, but only a possible technological technique. During etching, an isotropic etchant 1402 acting on exposed areas of the silicon wafer uniformly removes silicon material (layer by layer) from the surface of the wafer without changing the angles of inclination of the grooves made on the second side of the wafer 306 in step 2004. As a result of such processing, shown in FIG. 18B the finished surgical blades 1504, 1506 and 1508 will have the same angle of inclination of the cutting edges beveled on both sides as the grooves made in the plate in stages 1008 and 2004: on the first side due to the presence of tape 308 and coating 1102 and on the second side 306 due to the uniform removal of the layers of silicon molecules from the grooves by the isotropic etchant 1402. The first side 304 of the silicon wafer 202 not treated with an isotropic etch gives additional strength to the finished silicon surgical blades.

When applying a coating 1102 on the first side 340 of the silicon wafer 202 at the 2002 stage, the cutting edge of the blade (on the surface of a groove made on the first side of the wafer) can be coated with a layer of material (preferably a layer of silicon nitride), which has greater strength than the material of which it is made silicon wafer itself. Obviously, the application of such a coating 1102 significantly increases the strength and durability of the cutting edge of the blade. Coating 1102 also protects the blade surface from wear, which in electromechanical devices with reciprocating blade movement is in direct contact with steel parts. Table I shows the strength indicators of silicon surgical blades without coating and with a coating of 1102 (silicon nitride).

Table I Property Uncoated blades (silicon) Coated blades (silicon nitride) Young's Modulus (GPa) 160 323 Yield Strength (GPa) 7 fourteen

Young's modulus (or elastic modulus) characterizes the intrinsic stiffness of the material. The larger the Young's modulus, the stiffer the material. The yield strength is the point at which the deformation of the material under load changes from elastic to plastic. In other words, upon reaching this point, the material ceases to be elastic, but becomes plastic, inelastic or brittle. After etching (with or without coating 1102), the silicon wafer 202 is thoroughly washed and all the residues of the chemical etcher 1402 are removed from its surface.

On Fig shows a beveled on both sides of the cutting edge of a silicon surgical blade with a single-sided coating, made in accordance with one embodiment of the proposed invention the method. Such a blade, the radius of the cutting edge 1602 of which is from 5 to 500 nm, in this indicator (at a relatively lower cost) does not differ from a diamond surgical blade. After etching in step 1018, the silicon surgical blades in step 1020 are placed on the same mounting fixture that is used in steps 1002 and 2003.

The silicon surgical blades placed in step 1020 on the mounting fixture are separated in step 1022 from one another, cutting the silicon wafer into pieces with a cutting disk, a laser (e.g., a laser 402 with a water-jet waveguide or excimer laser) or some other suitable method for this purpose. For cutting a silicon wafer, lasers with a specific radiation wavelength in the range from 150 to 11000 nm can be used. As an example of a laser whose radiation wavelength lies in this range, we can name an excimer laser. A feature of a laser with a water-jet fiber (yttrium-aluminum garnet laser) is the possibility of using it to process a silicon wafer according to a spiral curved discontinuous pattern. The use of such a laser significantly expands the possibilities of the method proposed in the invention and makes it possible to produce a wide variety of blades with almost any cutting edge profile. A laser that uses a thin stream of water as a waveguide works essentially like a band saw. The use of such lasers allows one to obtain results that cannot be obtained with the current level of technology in installations for cutting semiconductor or similar materials with cutting discs, which, as was noted above, only continuous rectilinear slits or grooves can be cut in a silicon wafer.

At step 1024, individual silicon surgical blades are sorted and, depending on customer requirements, assembled in a crystal attachment unit with an appropriate handle (holder). Before sorting and joining the blades with the holders, the etched silicon wafers 202 (on the tape or on the carrier plate or the tape with the base plates) pass through a special machine in which, under the influence of UV radiation, the thickness of the tape 308 is reduced. Remaining on the “thin” (after irradiation ) the tape or in the cassettes separate blades served in the installation for attaching crystals, in which they are collected with the appropriate holders. As already mentioned above, depending on the specific conditions described above, the procedure for performing the individual stages can be changed accordingly. So, in particular, the stages of separation of the plate into individual blades and irradiation with UV radiation can, if necessary, be interchanged.

In an apparatus for attaching crystals, individual etched silicon surgical blades are removed from a “thin” (after irradiation) tape or from a carrier plate or tape with base plates and, with certain tolerances, are connected to the respective holders. An epoxy resin or adhesive can be used to connect the blades to the holders. Silicon surgical blades can be connected to the appropriate holder using other methods, including under the influence of heat, ultrasound, ultrasonic welding, laser welding or soldering with a eutectic alloy. Then, at step 1026, the finished silicon surgical blades assembled with the holders are packed in the most sterile and safe conditions and sent to the customer.

The surgical blade made by the method according to the invention can also be connected with a handle (holder) using through holes made in the blade. To connect the blade to the handle, it is possible, in particular, to use the aforementioned through holes or slots made in a silicon wafer with a laser with a water-jet optical fiber or excimer laser for the cutting disc to enter when cutting the grooves forming the cutting edges of the blade in the wafer. When connecting the blade to the handle, pins fixed to the handle are inserted into these holes. This method of connecting the blade to the handle is illustrated in FIG. The finished surgical blade 2402 shown in FIG. 24 has two through holes 2404a, 2404b formed at a blade end 2406 connected to a handle. When assembling the blade with the handle, pins 2408a, 2408b fixed to the handle 2410 are inserted into these holes. Through holes in the silicon wafer 202 can be made at any time during the manufacturing of surgical blades from it, but preferably before the wafer is divided into separate blades. For a more durable connection of the blade with the handle, you can use glue applied in certain places on the blade or handle. On the open side, a special decorative patch 2412 is glued to the blade connected to the handle. The blade 2402 connected to the handle with pins that fit into the corresponding holes of the blade can better withstand any pulling forces that sometimes occur during surgery.

In view of the above description of a method for manufacturing silicon surgical blades with a cutting edge beveled on both sides, a method for manufacturing silicon surgical blades, the cutting edge of which is beveled on only one side, is proposed in the second embodiment of the invention. The operations that are performed in the first stages 1002, 1004, 1006 and 1008 in the manufacture of single-sided bevel blades are no different from the operations performed in the manufacture of double-sided bevel blades in accordance with the flowchart shown in FIG. 1 , and do not require a repeated description. However, starting from step 1010, the method for manufacturing silicon surgical blades with a single-sided bevel of the cutting edge differs from the method of manufacturing blades with a double-sided bevel of the cutting edge and therefore requires a detailed description.

After completing step 1008, at step 1010, a decision is made about whether to remove the treated silicon wafer 202 from the mounting fixture 204. The silicon wafers removed from the mounting fixture (at 1012) with grooves made on one side are cut at step 1016. When performing the 1012 silicon the plate 202 is removed from the tape 308 in the same way as in the manufacture of blades with a double-sided bevel of the cutting edge, specially designed for this machine.

The silicon wafer 202 removed from the mounting device in step 1012 can be cut into separate strips in step 1016. For cutting a silicon wafer, at step 1016, a cutting disk, an excimer laser 902, or a laser 402 with a water-jet optical waveguide are used. The strips obtained as a result of cutting the strip are etched (at step 1018) not in cassettes for etching the plates, but in special clamps (discussed in more detail below). After cutting the wafers in step 1016 or after removing them from the installation fixture in step 1012 or after making grooves in them in step 1008, the wafers or individual strips from which silicon blades are made with a one-sided bevel of the cutting edge are etched in step 1018. The silicon processing process plates at the stage 1018 etching was already discussed in detail in the previous part of the description. Likewise, a second description does not require a repeated description of the further steps 1020, 1022, 1024, and 1026 of the method for manufacturing silicon surgical blades with a one-sided bevel of the silicon edges proposed in this embodiment of the invention described in the description of the method for manufacturing silicon surgical blades with a two-sided cutting edge.

Figure 3 shows a block diagram of the sequence of stages of the proposed in the third embodiment of the invention a method of manufacturing a silicon surgical blade with a one-sided bevel of the cutting edge. The method, the block diagram of the sequence of steps which is shown in figure 3, at stages 1002, 1004, 1006 and 1008 does not differ from the method, the block diagram of the sequence of steps that is shown in figure 2. After performing step 1008 in the manufacture of silicon surgical blades with a one-sided bevel of the cutting edge by the method proposed in the third embodiment of the invention, at step 2002, a plate with grooves is coated. The coating process in step 2002 does not differ from the coating in the manufacture of blades by a method whose block diagram of the sequence of steps is shown in FIG. 1 and therefore does not need to be repeated. When the coating is applied to the plate in step 2002, the same result is obtained as in the implementation of the method described above, i.e. silicon wafer 202 with a coating layer 1102 on the treated side.

After the coating layer is applied to a silicon wafer 202 in a step 2002, the wafer is removed from the installation fixture and, at the 2003 stage, it is turned over and placed again on the installation fixture. The operations performed at this stage are similar to the operations described above during the manufacture of silicon blades in accordance with the flowchart shown in FIG. 1 (stage 2003). The inverted silicon wafer is placed on the fixture 204 with the coated side. After that, the above steps 1018, 1020, 1022, 1024 and 1026 are performed. As a result, surgical blades are obtained with a cutting edge tapered on one side and a coating layer 1102 applied to the first (treated) side 304, increasing the strength and durability of the blades. A silicon surgical blade made in this way with a one-sided bevel of the cutting edge and a protective coating layer is shown in FIGS. 23A and 23B.

On figa and 23B illustrates the process of isotropic etching of one side of a silicon wafer with grooves made on its other side and a coating layer applied to this side, from which silicon surgical blades are made by the method proposed in another embodiment of the invention. As mentioned above, in this embodiment of the invention, the coating 1102 is applied to the first side 304 of the silicon wafer 202, which during etching is on the tape 308 (see figa). The silicon wafer 202 located on the tape, as in the embodiments described above, is lowered into a bath with an isotropic etch 1402. The isotropic etch 1402 acts on the second ("upper") side 306 of the silicon wafer 202 and evenly removes molecules from it silicon. After a certain time, the thickness of the silicon wafer 202 under the action of the etchant 1402 decreases, and the second side 306 of the wafer closes with its first side 304 and the coating layer 1102 applied to it. As a result, silicon surgical blades with a one-sided bevel of the cutting edge are coated with a layer of silicon nitride. All the advantages of the blades coated with silicon nitride described above with reference to FIGS. 18A, 18B and 19 fully apply to blades made by the method proposed in this embodiment of the invention.

On figa-20G shows different examples of silicon surgical blades manufactured by the proposed invention the method. Proposed in the invention method allows to produce blades of different designs. In this way, in particular, it is possible to produce blades with a one-sided bevel of the cutting edge, symmetrical and asymmetric blades with a two-sided bevel of the cutting edge, and blades with a curved cutting edge. In the manufacture of blades with a one-sided bevel cutting edge process only one side of the silicon wafer. Proposed in the invention method, it is possible to produce blades with a different profile, for example, a chisel or cutter with one cutting edge (Fig. 20A), a chisel or cutter with three cutting edges (Fig. 20B), a spear-shaped blade with two cutting edges (Fig. 20 B) , a lance-shaped blade with four cutting edges (FIG. 20G), a blade with one piercing cutting edge (FIG. 20D), keratome with one cutting edge (FIG. 20E) and a blade with a crescent-shaped curved cutting edge (FIG. 20G). Proposed in the invention method also allows the manufacture of blades with different bevel profiles of the cutting edges, different widths, lengths, thicknesses and with different angles of inclination of the bevels of the cutting edge. The combination proposed in the invention method with conventional photolithography methods can significantly expand the range of manufactured blades.

On figa and 21B in a side view with a 5000-fold magnification shows a silicon surgical blade made by the proposed method of the invention, and a conventional blade made of stainless steel. The images shown in FIGS. 21A and 21B make it possible to judge the differences between these blades. The blade shown in FIG. 21A has a smoother and more even cutting edge. On figa and 22B in a top view with a 10,000-fold increase shows the cutting edges of a silicon surgical blade made according to the invention, and a blade made of stainless steel. These images also make it possible to judge the differences between the two blades, the first of which made by the method of the invention and shown in FIG. 22A has a smoother and more even cutting edge than the second shown in FIG. 22B and made of stainless steel.

On figa and 25B shows the profiles of the cutting edge of a blade made of crystalline material and a blade made in accordance with one embodiment of the proposed method of the invention of a crystalline material formed on the surface of the cutting edge as a result of conversion of a layer of a new connection. In this embodiment, to improve the quality of the cutting edge of the blade, it is proposed after etching the silicon wafer to perform chemical conversion of the surface layer of the material of the wafer to obtain another material 2504 on the edge of the cutting edge of the material. Such conversion of the material on the cutting edge of the blade can also be called "thermal oxidation", " conversion to nitride "or" conversion of the surface layer of silicon to silicon nitride ". Depending on the reagent used for such processing, which interacts with the substrate / blade material, other compounds can also form on its surface. As a result of the transformation, a new material (or a transformed layer) is formed on the surface of the blade, the hardness of which exceeds the hardness of the base material of which the blade is made. Not having such a layer of new material formed as a result of the transformation, the cutting edge of the blade preserves the geometry and sharpness of the edge after etching of the silicon wafer. As shown in FIGS. 25A and 25B, during the conversion process, the thickness of the silicon blade does not change, i.e. the thickness "D1" (the thickness of the blade after etching) is equal to the thickness "D2" (the thickness of the blade with the converted layer 2504 formed on the surface of the blade).

On figa-36B shows several examples made by the proposed invention the methods of surgical blades that can be used in ophthalmology. On figa-33G shows the first and second variants of the first example manufactured by the proposed invention the methods of surgical blades, which can be used in ophthalmology and other microsurgical purposes. 33A-33B show a spear-shaped blade / spear-shaped knife 720, which, respectively, which can be used when performing eye operations related to cataract treatment. Such a lance-shaped blade / such a lance-shaped knife 720 has first and second cutting edges 722a, 722b. The first and second cutting edges 722a, 722b can be made with one bevel with equal or different tilt angles, with two bevels with equal or different tilt angles or with a variable tilt angle, as well as with one or more faces. The methods proposed in the invention allow, depending on the specific purpose, to produce lance-shaped blades / lance-shaped knives 720 with different angles of inclination of the bevels and different directions of the cutting edges, their different thicknesses and different number of faces on the cutting edges. On figb in a top view shows a lance-shaped blade / lance-shaped knife 720 with the first and second bevels 722a, 722b, the first and second sharp cutting edge 714a, 714b, the longitudinal axis 712 and the apex 715. On figg shows a second variant of the lance-shaped blade / spear-shaped knife 720. In this drawing, as in FIG. 33B, the first cutting edge 714a and its first and third bevels 722a, 722c are shown. The first and second sides of the blade / knife are indicated in the drawing with reference numerals 716a, 716b.

On figa-34B shows a second example made by the proposed invention the methods of surgical blades, which can be used in ophthalmology and other microsurgical purposes. On figa-34B shows the microkeratome 724 used in refractive surgery (for vision correction using the LASIK ™ method). Microkeratome 724 has one cutting edge 726 with one or two bevels and one or more faces. Proposed in the invention methods allow to produce such blades, as well as any of the blades shown in figa-36V, with any angles of inclination of the bevels of the cutting edge and any differently located faces. Shown in the drawings, microkeratome 724 has a beveled cutting edge 726 on both sides (with first bevel 726a and second bevel 726b). Holes 728a and 728b can be used to attach the microkeratome 724 to the handle by the method described above. On figb and 34B shows the sharp edge 718 of the cutting edge of the microkeratome 724 and its first and second bevels 719a, 719b.

FIGS. 35A-35B show a third example of a surgical blade made by the methods of the invention that can be used in ophthalmology and other microsurgical purposes. On figa-35B shows a rounded blade / rounded knife 730, which, respectively, which can be used when performing eye operations associated with the treatment of cataracts. The rounded blade / rounded knife 730 shown in FIGS. 35A-35B has a substantially one circular cutting edge. The round shape of the cutting edge of such a blade / knife is preferred, but not required, instead, such a blade / knife may have any rounded (eg, elliptical) cutting edge. The cutting edge of the blade / knife 730 may be any with a different number of faces and with one or two bevels. 35B and 35B, the cutting edge 732 at this blade / knife is formed by a bevel 742. The bevel of the cutting edge is obtained by processing the crystal plate with a substantially constant radius 748 (with a circular shape of the blade) on an arc of length θ from the first point 744a to the second point 744b. Typically, such rounded blades / knives 730 have a symmetrical shape and a cutting edge located around a center point 746 on either side of the longitudinal axis 750.

Figures 36A-36B show a fourth example of a surgical blade made by the methods of the invention that can be used in ophthalmology and other microsurgical purposes. On figa-36B shows a sickle blade / sickle knife 734, which, respectively, which can be used when conducting eye operations associated with the treatment of cataracts. The crescent blade / sickle knife 734 shown in FIGS. 36A-36B has one oval cutting edge. An oval shape of the cutting edge is preferred but not required. In the embodiment shown in the drawings, the cutting edge of the blade / knife 734 has one bevel, which, however, does not exclude the possibility of manufacturing such blades / knives with a two-sided bevel of the cutting edge with one or more faces, or a combination thereof, as described above. 36B and 36B, the sharp edge 736 of the cutting edge of such a blade / knife is formed by performing a corresponding bevel 752 on the edge of the silicon wafer and its subsequent etching. When making a bevel 752 of the cutting edge of the blade / knife, the edge of the silicon wafer is first machined within the angle θ on the first length from the first point 756a to the second point 756b. Starting from the second point 756b and up to the third point 756c, the cutting edge becomes substantially circular with a constant radius of the circle and an angular extension equal to the angle Ф (in this case, about 180 °). A further portion of the cutting edge (starting from the third point to the fourth point 756d) is machined rectilinearly within the angle θ over a length equal to the first length. Similarly to the blade shown in FIGS. 33A-33B, the cutting edge of the sickle blade / sickle knife 734 has a substantially symmetrical shape with equal lengths from the first to the second point and from the third point to the fourth.

After completing step 1018 of the flowchart shown in FIG. 1, the next step 1019 decides whether to transform the surface of the silicon wafer treated with an isotropic etchant. If the solution is positive (Yes solution in step 1019), the material located on the surface of the silicon wafer treated with an isotropic etchant in step 1021 is converted into a harder compound. If the decision is negative (the solution is “No” at step 1019), step 1020 is performed. The process of converting the surface of the silicon wafer requires the use of diffusion or high-temperature furnaces. In a furnace, a silicon wafer is heated in a vacuum or in an inert gas atmosphere to a temperature above 500 ° C. Certain gases with precisely controlled concentrations, which diffuse into the surface layer of the silicon wafer at high temperature, are fed into the furnace. The gases diffusing into the plate interact with silicon, forming a new compound. The formation of a new material on the surface of a silicon wafer, not as a result of coating it, but as a result of diffusion and interaction of gases with the wafer, allows one to maintain the initial geometry (sharpness) of the cutting edge of the blade made of the wafer. Another advantage of converting the surface layer of a silicon wafer is that the refractive index of the layer formed as a result of such a conversion on the surface of the wafer differs from the refractive index of the wafer itself and therefore changes the color of the blade. The color of the blade made in this way also depends on the composition of the layer of new material formed as a result of the conversion on the surface of the plate and on its thickness.

A blade with a surface layer of material resulting from the conversion of a single-crystal plate material has greater strength and wear resistance than a blade simply made from a single-crystal material. Higher hardness of the surface layer reduces the susceptibility of the substrate to crack nucleation and their propagation along crystalline planes.

In the manufacture of silicon surgical blades by the methods of the invention in the last step, the finished blades can be matted. Often, surgical blades, and especially silicon ones, made by the methods of the preferred embodiments of the invention have a surface with a high reflectivity. The high reflectivity of the surface of the blade makes it difficult for the surgeon to work, especially during surgery under a microscope with a light source. Therefore, it is advisable that the surface of the finished blade was not bright, but dull - frosted and could scatter the light incident on it (for example, from lamps with high radiation intensity used in operations). In the manufacture of silicon surgical blades by the methods of the invention, the matting of the surface of the blade is performed by irradiating it with an appropriate laser for ablation according to a specific pattern and with a specific density of individual sections of the surface of the blade. Typically, but not necessarily, the surface areas of the blade that are exposed to the laser have a circular shape that has a cross section of the laser beam. The diameter of the circular ablation portions is usually from 25 to 50 microns and depends on the type of laser used. Depth of ablation usually ranges from 10 to 25 microns.

By “matting density” is meant the percentage of the area of the circularly ablated areas to the total surface area of the blade. With a "matting" density of about 5%, the smooth mirror surface of the blade becomes dull. However, the ablated sections adjacent to each other do not affect the appearance of the rest of the surface of the blade, which remains mirror-like. Therefore, round, ablated areas should be distributed on the surface of the blade according to a random law. In practice, for matting the blade, it is possible to generate a graphic file in which, at a given matting density, the random nature of the distribution of the ablated areas on the surface of the blade is embedded. Such a graphic file can be created manually or automatically using a computer program. In addition to matting with a laser on the surface of the finished blade, you can also reproduce its serial number, the manufacturer’s logo or the name of the surgeon or the name of the hospital.

Usually, a gantry laser or an installation with a galvanic laser head is used to mat the surface of the finished blade. The gantry laser works more slowly, but more precisely, installations with a galvanic laser head. With low accuracy requirements, a more productive installation with a galvanic laser head is preferable. When using such a device, which can operate at speeds up to 1000 mm / s, the total time spent on matting one conventional surgical blade is about five seconds.

On figa-37B shows a few more images of a surgical blade 340 made by the method proposed in one embodiment of the invention. On figa indicated various parameters of surgical blades. Such parameters, in particular, include the length of the cutting edge, the distance from the end of the cutting edge to the shoulder and the angles of inclination of the bevels of the cutting edge. The meaning of each of these parameters depends on the design and purpose of the blade. Proposed in the invention methods of manufacturing surgical and non-surgical (see below) blades allow the manufacture of surgical blades with lower angles of inclination of the bevels of the cutting edge compared to conventional blades. As a non-limiting example of the invention, we can mention a blade made by the method of the invention in which the inclination angle of the bevel of the cutting edge is about 60 °. The other blade parameters discussed above are shown in FIGS. 37B and 37B.

One of the important and well-known parameters of the blade is the radius of its cutting edge. “Cutting radius” or “cutting radius” is the radius of the sharp edge of the cutting edge of the blade that cuts the skin, eye (in eye surgery) or other materials or substances. When a surgeon uses a blade to cut or incise an eye, it is extremely important that the cutting edge of the blade is as sharp as possible. On figa and 38B shows the radius of the cutting edge of the blade manufactured by the method proposed in one embodiment of the invention. FIG. 38B shows a section of the blade 350 of plane AA shown in FIG. 38A. Blades (surgical and non-surgical) made by the methods proposed in various embodiments of the invention may have a cutting edge with a radius of about 30 to about 60 nm, and in one embodiment, about 40 nm. Tables II and III show the initial data obtained by measuring the radius of the cutting edge of metal blades and silicon blades made by the methods described above, proposed in various embodiments of the invention. In Fig. 39, this data is presented in the form of a curve 362, on which the radii of the cutting edges of silicon blades are made, made by the methods proposed in the various embodiments of the invention described above, and in the form of a curve 364, on which the radii of the cutting edges of metal blades, which are much exceed the radii of the cutting edges of the blades manufactured by the methods of the invention. Obviously, a blade with a smaller radius of the cutting edge is sharper than a blade with a large radius of the cutting edge.

As noted above, as a result of chemical conversion (step 1021 in FIG. 1), a new compound is formed in the surface layer of the plate (see FIGS. 25A and 25B). The elements and compounds used to transform the surface layer of the wafer include oxygen or H ₂ O (which, when interacting with silicon, form silicon dioxide (SiO ₂ ) in the surface layer of a silicon wafer), ammonia or nitrogen (which, when interacting with silicon in the surface layer silicon wafers form silicon nitride (SiN ₃ )) or carbon-based compounds (which, when reacted with silicon, form silicon carbide (SiC) in the surface layer of the silicon wafer). Other elements well known in the semiconductor industry can be used to convert silicon or other material from which the plate is made. The layer of the new compound formed on the surface of the plate as a result of conversion has a small thickness compared to the blade. Typically, the thickness of this layer ranges from 0.1 to 10 microns. The transformation of the surface layer of the blade can be performed in the manufacture of the blades by any method proposed in the invention. To do this, to any of the above methods for manufacturing blades, you only need to add the stage of conversion of the surface layer of the blade.

In the above description, some of the possible embodiments of the method of manufacturing surgical and non-surgical blades proposed in the invention are described in detail. Obviously, the invention is not limited to the options described above and can be implemented in other specific forms. In this case, however, all changes and improvements made to the above options should not distort the main idea of the invention. It should be emphasized that the examples described in the description only illustrate, but do not limit the scope of the invention. The full scope of the invention is determined not by the above description, but by all independent and dependent claims.

Claims (57)

1. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, making it the first profile of the blade with a bevel that forms the cutting edge of at least one blade, and located next to it, the second bevel, the second side of the plate of crystalline material is processed, making a second blade profile in it with the third bevel of the at least one blade extending along the first bevel and located next to the third bevel of the fourth bevel, and the plate of crystalline material is isotropic etching to obtain from it at least one blade. 2. The method according to claim 1, in which after etching the blade is separated from the rest of the plate of crystalline material. 3. The method according to claim 1, wherein during etching, a bevel of the cutting edge inclined to the plane of the plate at a first angle and a bevel of the cutting edge inclined to the plane of the plate at a second angle are obtained. 4. The method according to claim 1, wherein when the first side of the plate is made of crystalline material and the first bevel is made therein, the first bevel of the cutting edge inclined to the plane of the plate at a first angle and the second bevel of the cutting edge inclined to the plane of the plate are obtained. 5. The method according to claim 1, in which when processing the first side of the plate of crystalline material and performing a second bevel in it, a third bevel of the cutting edge inclined to the plane of the plate at a first angle and a fourth bevel of the cutting edge inclined to the plane of the plate are obtained. 6. The method according to claim 1, in which the first side of the processed plate of crystalline material is coated. 7. The method according to claim 6, in which a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 8. The method according to claim 1, in which, after processing a plate of crystalline material, a coating is applied to its first side, and before etching, the plate of crystalline material is turned over and placed with its first side on a mounting fixture. 9. The method of claim 8, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 10. The method according to claim 1, in which the crystalline material is silicon. 11. The method according to claim 1, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new compound. 12. The blade made by the method according to claim 1. 13. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, performing in it the first variable profile of the blade with the first bevel of the first cutting edge of the blade, the angle of inclination of which to pl the blade angle changes from the first angle at the top of the blade to the second angle at a first distance from the top of the blade, the first cutting edge of which is formed by a section of the first profile of the blade extending from the top of the blade at a third angle to the central axis of the blade, process the first side of the plate of crystalline material, performing it contains a second variable profile of the blade with a second bevel of the second cutting edge of the blade, the angle of inclination of which to the plane of the blade changes from the first angle at the top of the blade to the second angle at the first distance away from the top of the blade, the second cutting edge of which is formed by a section of the first profile of the blade extending from the top of the blade at a third angle to the central axis of the blade to a point located essentially directly opposite the point at which the first profile of the blade ends, process the second side of the plate of crystalline material performing in it a third variable profile of the blade with a third bevel of the first cutting edge of the blade, the angle of inclination of which to the plane of the blade changes from the first angle at the top of the blade to the second angle by a second distance from the top of the blade, the first cutting edge of which is formed by a section of the third variable profile of the blade, going from the top of the blade at a third angle to the central axis of the blade to the point immediately below the point where the first variable profile of the blade ends, process the second side of the plate of crystalline material performing the fourth variable profile of the blade in it with the fourth bevel of the second cutting edge of the blade, the angle of inclination of which to the plane of the blade changes from the first angle at the tire of the blade to the second angle at a first distance from the top of the blade, the second cutting edge of which is formed by a section of the fourth variable profile of the blade extending from the top of the blade at a third angle to the central axis of the blade to the point immediately below the point where the second variable profile of the blade ends, and the plate of crystalline material is subjected to isotropic etching to obtain from it at least one blade. 14. The method according to item 13, in which after etching the blade is separated from the rest of the plate of crystalline material. 15. The method according to item 13, in which on the first side of the processed plate of crystalline material is coated. 16. The method of claim 15, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 17. The method according to item 13, in which after processing the plate of crystalline material on its first side is coated and before etching the plate of crystalline material is turned over and placed its first side on the installation fixture. 18. The method of claim 17, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 19. The method according to item 13, in which the crystalline material is silicon. 20. The method according to item 13, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new connection. 21. The blade made by the method according to item 13. 22. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, making it the first profile of the blade with the first bevel of the first cutting edge of the blade, which is formed by a section of the first The profile of the blade, going from the top of the blade a first distance at a first angle to the central axis of the blade, treats the first side of the plate of crystalline material, making the second profile of the blade with the second bevel of the second cutting edge of the blade, which is formed by the section of the first profile of the blade going from the top the blade at a first distance at a first angle to the Central axis of the blade, and the plate of crystalline material is subjected to isotropic etching to obtain from it at least one blade. 23. The method according to item 22, in which after etching the blade is separated from the rest of the plate of crystalline material. 24. The method according to item 22, in which on the first side of the processed plate of crystalline material is coated. 25. The method according to paragraph 24, in which on the first side of the processed plate of crystalline material is applied a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 26. The method according to item 22, in which after processing the plate of crystalline material on its first side is coated and before etching the plate of silicon material is turned over and placed its first side on the installation fixture. 27. The method according to p, in which the first side of the processed plate of crystalline material is applied a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron carbide and diamond-like crystals. 28. The method according to item 22, in which the crystalline material is silicon. 29. The method according to item 22, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new compound. 30. The blade made by the method according to item 22. 31. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, making the first bevel with the cutting edge of at least one blade, the second side of the plate is made of cry a metal material, performing a second bevel along the first bevel in it with a cutting edge of at least one blade, and a plate of crystalline material is subjected to isotropic etching to obtain at least one blade from it. 32. The method according to p, in which after etching the blade is separated from the rest of the plate of crystalline material. 33. The method according to p, in which the first side of the processed plate of crystalline material is coated. 34. The method according to claim 33, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron carbide and diamond-like crystals. 35. The method according to p, in which after processing the plate of crystalline material on its first side is coated and before etching the plate of silicon material is turned over and placed its first side on the installation fixture. 36. The method according to claim 35, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 37. The method according to p, in which the crystalline material is silicon. 38. The method according to p, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new compound. 39. The blade made by the method according to p. 31. 40. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, making a bevel in it with a cutting edge of at least one blade that starts at the first point and passes along an arc a substantially constant radius to a second point by a first angular distance, and the plate of crystalline material is subjected to isotropic etching to obtain at least one blade from it. 41. The method according to p, in which after etching the blade is separated from the rest of the plate of crystalline material. 42. The method according to p, in which the first side of the processed plate of crystalline material is coated. 43. The method according to § 42, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 44. The method according to p, in which after processing the plate of crystalline material on its first side is coated and before etching the plate of silicon material is turned over and placed its first side on the installation fixture. 45. The method according to claim 44, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 46. The method according to p, in which the crystalline material is silicon. 47. The method according to p, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new compound. 48. The blade made by the method according to p. 40. 49. A method of manufacturing at least one blade from a plate of crystalline material selected from the group comprising crystalline silicon with a selective orientation of crystals, silicon with an orientation of crystals <110> and <111>, silicon doped to a specific resistivity and oxygen content, silicon nitride, in which the first side of the plate is made of crystalline material, making a bevel in it with a cutting edge of at least one blade that starts at the first point and passes under at an angle to the central axis of the blade linearly by the first distance to the second point and continues from the second point to the third point along an arc of essentially constant radius by the first angular distance, and then from the third point to the fourth point at the first angle linearly by the first distance, and the plate of crystalline material is subjected to isotropic etching to obtain from it at least one blade. 50. The method according to § 49, in which after etching the blade is separated from the rest of the plate of crystalline material. 51. The method according to 49, in which the first side of the processed plate of crystalline material is coated. 52. The method of claim 51, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 53. The method according to 51, in which after processing the plate of crystalline material on its first side is coated and before etching the plate of silicon material is turned over and put it on the first side on the installation fixture. 54. The method of claim 53, wherein a coating layer of a material selected from the group consisting of silicon nitride, titanium nitride, titanium aluminum nitride, silicon dioxide, silicon carbide, titanium carbide, boron nitride and diamond-like crystals. 55. The method according to § 49, in which the crystalline material is silicon. 56. The method according to § 49, in which the surface layer of at least one blade is subjected to transformation to obtain a layer of a new compound. 57. The blade made by the method according to item 49.

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