RU175654U1 - DEVICE FOR THERMAL STABILIZATION OF ELECTRONIC EQUIPMENT - Google Patents

Abstract

The utility model relates to electronics and can be used to provide the required thermal regimes of elements of electronic equipment, in particular electronic circuit boards. The technical effect achieved by the proposed device for thermal stabilization of electronic equipment is to reduce the weight and dimensions of the system. This technical effect is achieved in the device for thermal stabilization electronic equipment containing a microchannel heat exchanger, pump, expansion tank, monitoring and control system, tr boprovody which, according to the utility model is provided with temperature stabilization unit based on thermoelectric modules with cooling and heating system of thermoelectric modules. 2 ill.

Description

The utility model relates to electronics and can be used to provide the required thermal regimes of elements of electronic equipment, in particular electronic circuit boards.

A known method and heat exchange system (see patent No. 2515308, class C10J 3/10, publ. 05/10/2014), based on mixing with additives and / or catalysts of biomass, which is compressed by a compression device 1 and fed into the reactor system 2, which includes a heating section 3, with a first heat exchanger 6, a reaction section 4 and a cooling section 5, with a second heat exchanger 12. A heat carrier, which uses molten salt, circulates between the first heat exchanger 6 and the second heat exchanger 12. The heat exchangers 6 and 12 are connected They are provided with a circulating coolant system, which also includes a first salt tank 13, which maintains a temperature close to the maximum working temperature of the molten salt, and a second salt tank 14, with a temperature close to the melting temperature of the molten salt.

The disadvantage of this system is the presence of additional structural elements that increase the mass, as well as the absence of heating elements of the system in case of lowering the temperature below the permissible.

A known temperature control system of a connected satellite (see patent No. 2158703, class B64G 1/50, publ. 10.11.2000) containing instrument heat exchangers, a compensator, an electric pump unit and a liquid circuit with a flow regulator and distributor. The latter has one input and two outputs. The second output of the distributor is bypassed to the output of the radiator-cooler of the system. The line parameters from the first output of the distributor to the connection point with the bypass satisfy the special condition. Through hydraulic sockets, the liquid cooling channel of the repeater is connected to the system before testing the satellite. Prior to this connection, the hydraulic connectors are connected to each other through an annular partition with a specially selected number of holes. The elements installed in the liquid circuit are preferably qualified during past system designs. The invention is aimed at improving the reliability and resource of the system when working in orbit, as well as at reducing its mass and manufacturing cost.

The disadvantage of this system is the impossibility of heating the system if the temperature drops below the permissible

The closest known technical solutions is the method and system of thermal control of the spacecraft (see patent No. 2237600, class B64G 1/50, publ. 10.10.2004 - prototype), containing a closed circulation circuit with a liquid coolant. The circuit includes a liquid sub-circuit of the apparatus service systems module interconnected by means of hydraulic connectors. In the liquid path, the sub-circuit of the unit's service systems module contains:

- radiator;

- liquid path for heat removal from devices;

- volume compensator;

- electric pump unit;

- coolant flow rate regulator;

- liquid subcontour of the payload module of the device, the liquid path of which passes through thermostatically controlled panels (heat-generating devices coated with thermal insulation are installed on their outer surfaces).

Thermostatic panels are made in the form of honeycomb panels with built-in liquid paths. Three panels are installed perpendicularly on them: two side panels, in parallel planes, perpendicular to the transverse axis of the vehicle, parallel to the geostationary orbital functioning of the axis of rotation of the Earth, and at least one central panel between these side panels mounted perpendicular to them.

In this case, the liquid path of the payload module in the honeycomb panels is made of pipelines with shelves in the areas of their contact with the inner surfaces of the skin in the areas of location on their outer surfaces of the fuel devices. On the side of the shelves glued to the inner surface of the inner lining of the panels, and on the unused side of the shelves the glued electric heater is turned on, for example, when the devices are not working (the outer surfaces of the outer lining of the side panels are designed to be used as a radiating surface, and an optical coating is glued on them , and devices are not installed on them, and therefore pipelines are not connected to the outer skin of the side panels).

Low heat appliances are installed on the side panels. Heat-loaded appliances with a relatively low maximum permissible operating temperature are located on the base panel. Heat-loaded devices with a relatively high maximum permissible operating temperature are installed on the central panel, which ensures the flow of coolant into the radiator with the highest possible temperature. The minimum possible wall and shelf thicknesses are 1.2 mm and 1.5 mm, respectively; the minimum possible shelf width is 30 mm. Pipelines have one shelf in the side and base panels, and two shelves in the central one. Optimum internal diameters of pipelines and types of connection of fluid paths: in the side panels, parallel connection of fluid paths with an inner diameter of pipelines of 12 mm is allowed, and in the remaining panels, serial connection of fluid paths with an inner diameter of 16 mm is allowed.

The disadvantage of this device is the presence of an additional coolant heater, which significantly increases the mass.

The objective of this utility model is to reduce the mass and dimensions of the device.

The task is achieved in that in a device for thermal stabilization of electronic equipment containing a microchannel heat exchanger, a pump, an expansion tank, a monitoring and control system, pipelines, which according to a utility model is equipped with a thermal stabilization unit based on thermoelectric modules with a cooling and heating system for thermoelectric modules.

The essence of the utility model is illustrated in FIG. 1, 2, where in FIG. 1 shows a pneumohydraulic circuit of a device for thermal stabilization of electronic equipment, consisting of a pneumohydraulic circuit for cooling or heating electronic equipment and a cooling or heating system for thermoelectric modules, FIG. 2 shows a schematic block diagram of the monitoring and control of a device for thermal stabilization of electronic equipment. The device includes:

1 - pneumohydraulic circuit for cooling or heating electronic equipment;

2 - pump;

3 - microchannel heat exchanger;

4 - thermostabilized element;

5 - block thermal stabilization based on thermoelectric modules;

6 - an expansion tank;

7 - pipelines;

8 - a cooling or heating system for thermoelectric modules;

9 - air heat exchanger (cooler);

10 - temperature sensor of the electronic module ";

11 - ambient temperature sensor;

12 - block input and output parameters;

13 - block monitoring and control system.

Structurally, the device for thermal stabilization of electronic equipment contains a pneumohydraulic circuit 1 for cooling or heating of electronic equipment. Circuit 1 consists of a pump 2, a microchannel heat exchanger 3, a thermally stabilized element 4, a thermal stabilization unit 5 based on thermoelectric modules, an expansion tank 6, pipelines 7. For the most efficient operation of the thermal stabilization unit 5, in addition to circuit 1, a separate cooling or heating system for thermoelectric modules 8 is used (Fig. 1) air cooling or heating of thermoelectric modules. The cooling or heating system of thermoelectric modules 8 consists of a cooler 9, which is an air finned heat exchanger with fans. The expansion tank 6 serves to charge the device with a coolant and compensate for its expansion during operation. To determine the temperature parameters of the device, a temperature sensor for the thermostabilized element 10 and an ambient temperature sensor 11 are provided. The shaded arrows indicate the direction of motion of the coolant (liquid). The monitoring and control system comprises an input and output unit for parameters 12, a monitoring and control system 13.

The advantage of this device is to reduce the size and weight by replacing the heating or cooling modules with thermoelectric modules, on which the thermal stabilization unit is based.

Thus, the implementation of this utility model leads to an increase in heat transfer efficiency, a decrease in mass and dimensions.

Claims (1)

A device for thermal stabilization of electronic equipment containing a microchannel heat exchanger, a pump, an expansion tank, a monitoring and control system, pipelines, characterized in that it is equipped with a thermal stabilization unit based on thermoelectric modules with a cooling and heating system for thermoelectric modules.

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