RU156137U1 - DEVICE FOR PASSIVE TWO PHASE IMMERSION COOLING OF ELECTRONIC EQUIPMENT - Google Patents

Abstract

1. Device for passive two-phase immersion cooling of electronic equipment, made with the possibility of complete immersion of electronic equipment in a dielectric heat dissipating liquid for heat removal, comprising a carriage, a frame mounted on the carriage, at least one stainless steel tank made sealed, mounted on the frame and formed by two adjoining lower and upper boxes, glued on the outside with a layer of heat-insulating material, and in the lower box, which is a a bath with internal dimensions corresponding to a 19-inch rack, there is a dielectric heat-transfer fluid, at least one lid with a sealing gasket is located on the upper box made of large sizes, and an internal heat exchanger attached to the inner wall of the upper box is installed inside the upper box, an additional heat exchanger connecting the internal volume of the upper and lower boxes with the external environment, an additional cooling circuit located in the upper part of the upper box in the region od lid, and switching transition plate and located directly under the cover plate plexiglass representing shutter, preventing the formation of turbulent flows of vapor when opening kryshki.2. The device according to claim 1, characterized in that it is configured to vertically install electronic equipment in a dielectric heat sink liquid. 3. The device according to claim 1, characterized in that one of the covers provides access to the technological part of the upper box. The device according to claim 1, characterized

Description

The utility model relates to the field of electronic technology, namely, devices for passive two-phase immersion cooling of electronic equipment - various standard electronic devices, electrical components, server farms, computing units, non-computing equipment (active parts of uninterruptible power supply units for computing devices, etc.) .

The prior art device for single-phase immersion cooling (patent WO 2014165824, IPC H02P 11/00, published 09.10.2014), made with the possibility of partial immersion of electronic equipment in a dielectric fluid to remove heat and install this equipment vertically. The device comprises a frame, a container mounted on the frame. In the container is a dielectric fluid. Electronic equipment is cooled by partially immersing it in a dielectric fluid. Heated fluid is pumped through an external heat exchanger. The prior art device for single-phase immersion cooling (patent US 2015013960, IPC H05K 7/20, published 01/15/2015), made with the possibility of complete immersion of electronic equipment in a dielectric fluid to remove heat and install this equipment vertically. The device contains a container in which there is a dielectric fluid. Electronic equipment is cooled by partially immersing it in a dielectric fluid. Heated fluid is pumped through an external heat exchanger. Heat from the heat exchanger circuit can either be used or dissipated.

The prior art device for single-phase and possibly two-phase immersion cooling (patent US 2014124174, IPC F28D 15/00, published 05/08/2014), made with the possibility of full or partial immersion of electronic equipment in a dielectric fluid to remove heat. The device contains a separate capacity for each motherboard in which the dielectric fluid is located. Tanks are located in a standard rack horizontally. Capacities are connected between the special one so that the pump simultaneously pumps dielectric fluid through all the containers. The dielectric liquid enters the heat-generating components and removes heat, while the liquid can partially evaporate. The circulation takes place using a pump installed in a separate rack. The condensation of the heat-transfer fluid vapor occurs on the same heat exchanger on which the dielectric fluid is cooled, also located in a separate rack

The disadvantages of the known devices are the use of single-phase cooling and partial immersion of electronic components. The low density of the installation of electronic components, the impossibility of providing, hot swapping of faulty units of equipment and functioning in difficult conditions, as well as the high level of required energy.

The prior art device for passive two-phase immersion cooling (patent US 6019167, IPC F28F 1/10, H01L 23/44, F28D 15/00, published 01.02.2000), made with the possibility of complete immersion of electronic equipment in a dielectric fluid to remove heat and installing this equipment vertically. The device contains a double-walled vessel. At the bottom of the vessel is a dielectric fluid in which the heat-generating components are immersed. The dielectric fluid begins to boil on the surface of the heat-generating components and the resulting steam passively removes heat. Circulation occurs naturally through evaporation and subsequent condensation. Vapors are cooled in the upper part of the tank due to heat dissipation by the fins of the external radiators, which is integral with the outer wall of the tank.

The disadvantages of the known device is the low density of the installation of printed circuit boards, due to the presence of two walls of the container, two walls of the container, the internal and external systems of the cooling plates, the electronic components of the system cannot be removed from the sealed enclosure without violating the integrity of the entire apparatus.

Closest to the claimed device is a device for passive two-phase immersion cooling (patent US 2014218858 of Dell products LP, IPC G06F 1/20, published 07.08.2014), made with the possibility of complete immersion of electronic equipment in a dielectric fluid to remove heat and install this equipment vertically. The device comprises a container consisting of lower and upper boxes interconnected. In the lower box is a dielectric fluid. In the upper box, a main heat exchanger, an additional heat exchanger, a cooler, a cover with a seal are installed to ensure the tightness of the boxes. Manholes covering the process openings are installed using sealant. With load fluctuations, the ratio of vapor-air swift changes, and when the temperature decreases, air is taken from the external environment. The dielectric fluid begins to boil on the surface of the heat-generating components and the resulting steam passively removes heat. Circulation occurs naturally through evaporation and subsequent condensation. The condensation of the heat-transfer fluid vapor occurs on the main heat exchanger. Heat from the heat exchanger circuit can either be used or dissipated.

The disadvantages of the known device is the inability to use equipment with a standard size of 19 inches. Since this embodiment of the server farm is not described in the description section of the invention, it is difficult to assess the density of the installation of computing nodes inside the tank. In addition, the disadvantages are the inability to ensure quick start, and operation in difficult conditions.

The technical result of the utility model is to expand the technical capabilities and ensure quick start-up of the cooling device, the ability to hot-swap faulty units of equipment, reduce the required energy, increase the efficiency of cooling of fuel elements, ensure quiet operation, ensure the functioning of the system in difficult conditions - high dust content, negative ambient temperatures , as well as in the field, increasing fire and environmental safety.

The essence of the utility model lies in the fact that the device for passive two-phase immersion cooling is made with the possibility of complete immersion of electronic equipment in a dielectric heat dissipating liquid to remove heat. The device comprises a carriage, a frame mounted on the carriage, at least one stainless steel tank made sealed, mounted on the frame and formed by two adjoining lower and upper boxes, glued on the outside with a layer of thermal insulation material. In the lower box, which is a bath with internal dimensions corresponding to a 19-inch rack, there is a dielectric heat-transfer fluid. On the upper box, made with large sizes, at least one cover with a sealing gasket is located, and inside the upper box there is an internal heat exchanger attached to the inner wall of the upper box, an additional heat exchanger connecting the internal volume of the upper and lower boxes with the external environment, an additional cooling circuit located in the upper part of the upper box in the area under the lid, and the adapter patch plate. Plexiglass plates are located directly under the lid, which are a curtain that prevents the formation of turbulent flows of the vapor-air mixture when the lid is opened. The device can be made with the possibility of vertical installation of electronic equipment in a dielectric heat sink fluid. One of the device covers can provide access to the technological part of the upper box, and also one of the device covers can provide access to the computing nodes in the lower box.

The utility model is illustrated by the following drawings.

In FIG. 1 shows a diagram of a device for passive two-phase immersion cooling of electronic equipment, including one tank and two covers, where 1 is a tank, 2 is an upper box, 3 is a lower box, 4 is an internal heat exchanger, 6 is an additional cooling circuit, 7 is a first cover, 8 - the second cover, 9 - transitional switching plate, 10 - plexiglass plates, 11 - frame, 12 - wheels, 13 - decorative side panels.

In FIG. 2 shows a section A illustrating the operation of an additional heat exchanger, where 5 is an additional heat exchanger, 14 is a tube of an additional heat exchanger.

A device for passive two-phase immersion cooling comprises a carriage with a frame 11 installed on it. At the bottom of the frame 11, castors 12 are mounted. At least one stainless steel tank is mounted on the frame 11 (Fig. 1 shows one tank, indicated by 1), around which are fixed decorative side panels 13. The tank 1 is sealed. To ensure tightness, adapter plates and hatches covering technological holes are installed using sealant.

The reservoir 1 is formed by two contacting (adjacent, interconnected) upper 2 and lower 3 boxes. Structurally, boxes 2 and 3 can be a single unit, including those made from one bent sheet, to reduce the likelihood of leaks. The upper 2 and lower 3 boxes are glued on the outside with a layer of heat-insulating material.

The bottom box 3 is a bathtub with internal dimensions corresponding to a 19-inch rack. In the lower box 3 is a dielectric heat dissipating fluid. As such a liquid, ZM engineering fluid can be used. Unlike a rack, electronic equipment is installed vertically, rather than horizontally, and is completely immersed in a dielectric heat sink fluid.

The upper box 2 is made with larger dimensions than the lower box 3.

The upper 2 and lower 3 boxes perform different geometries so that the upper box 2 is as standard as possible and the lower box 3 can be changed depending on the fuel elements immersed in the dielectric fluid. Since the dielectric heat sink fluid is expensive, it is necessary to optimize the size of the lower box 3 into which it is poured.

At least one cover is located on the upper box 2. To ensure the tightness of the boxes, the lid is equipped with a sealing gasket (seal). As an example in FIG. 1 shows the first lid 7 and the second lid 8. Directly under the lid (in Fig. 1, under the first lid 7) there are plexiglass plates 10, which are a curtain that prevents the formation of turbulent flows of the vapor-air mixture when the lid is opened.

Inside the upper box 2, an internal heat exchanger 4, an additional heat exchanger 5, an additional cooling circuit 6, an adapter plate 9 are installed.

The internal heat exchanger 4 is attached to the inner wall of the upper box 2. The internal heat exchanger 4 communicates via a pipe with a common circulation pump and an external heat exchanger (the specified pipe, a common circulation pump and an external heat exchanger are external to the claimed device and are not shown in the figures). To ensure fault tolerance, a duplicate common circulation pump (not shown in the figures) is installed parallel to the external common circulation pump.

An additional heat exchanger 5 (see Fig. 2) installed in the upper box 2 serves to condense the vapor of the heat-transfer fluid. By means of a tube of an additional heat exchanger 14 located inside it, the internal volume of the upper 2 and lower 3 boxes is connected with the external environment. At the first start-up, the generated steam displaces the air from boxes 2 and 3. When the load fluctuates, the ratio of the vapor-air mixture will change, and when the temperature decreases, air will be taken from the external environment.

An additional cooling circuit 6 (see Fig. 1) is located in the upper part of the upper box 2 of the tank 1 in the area under the lid. An additional cooling circuit 6 serves to condense the vapor of the heat-transfer fluid in the area under the cover before opening it in order to minimize fluid loss. As an example in FIG. 1 additional cooling circuit 6 is located under the first cover 7.

The adapter patch plate 9, installed in the upper box 2 of the tank 1, is designed to install adapter patch connectors for cables connecting the equipment immersed in the heat-transfer fluid with the external environment. Namely, a data connector or a cable is passed through one hole in the adapter plate 9, and a power cable is passed through the other hole in the adapter plate 9. The device receives power from an external power source through the specified power cables, one ends of which are connected to an external power source, and the other ends are connected to a power connector in the upper unit 2.

One of the device covers (for example, indicated in FIG. 1 as the first cover 7) can provide access to the computing nodes in the lower box 3 of the tank 1. The first cover 7 is installed using clamping bolts.

In addition, one of the lids of the device (for example, in Fig. 1 is designated as the second lid 8) can provide access to the technological part of the upper box 2. The second lid 8 is attached to the tank 1 with screws.

It is possible that the device for passive two-phase immersion cooling contains several sealed tanks, the internal heat exchangers of which are interconnected by means of a system of inlet and outlet pipelines in communication with an external heat exchanger and a common circulation pump.

The device is single-loop.

A device for passive two-phase immersion cooling works as follows.

In a two-phase immersion cooling system, electronic equipment is completely immersed in the bath of the lower box 3 with a dielectric heat-transfer fluid, which is a much better heat conductor than air, water or oil.

The dielectric heat dissipating liquid begins to boil directly on the surface of the heat-generating components and the resulting steam passively removes heat. Due to the large heat capacity, one liter of liquid can provide the removal of more than 10 kW of heat.

Circulation occurs naturally through evaporation and subsequent condensation, without additional energy costs for the organization of forced circulation. Vapors of the heat dissipating liquid rise up and condense on the internal heat exchanger 4 installed in the upper box 2.

Heat from the internal heat exchanger 4 is removed by the coolant circulating in the cooling circuit. Ethylene glycol or its analogs may be used as a coolant. The circulation is provided by a common circulating pump, and cooling is provided by an external heat exchanger blown by a fan (not shown in the figures).

If the ambient temperature does not exceed 0 ° C, then the fan of the external heat exchanger is turned off. An external circulation pump pumps coolant through the internal 4 and external heat exchangers.

The heat from the cooling circuit of the internal heat exchanger 4 can either be used or dissipated, for example, using dry cooling towers.

Compared to traditional methods of air, water or oil cooling, this passive system requires much less energy.

The ambient temperature at which operation of the claimed cooling device is possible ranges from -50 ° C to + 45 ° C.

Thus, the utility model provides the expansion of technical capabilities and the quick start of the cooling device, the ability to hot-swap faulty units of equipment, reduce the required energy, increase the efficiency of cooling of fuel elements, ensure quiet operation, ensure the functioning of the system in difficult conditions - high dust, low ambient temperatures environment, as well as in the field, increasing fire and environmental safety.

The expansion of the technical capabilities of the cooling device is provided by the use of standard electronic equipment (computing nodes) of 19 inches in size. In particular, increasing the density of installation of electronic equipment is achieved due to the lack of an individual enclosure in which electronic equipment is enclosed, and an individual container in which one or more motherboards are contained, cooling devices used in known solutions, for example, heat-removing boards and cooling modules, non-use of standard server racks with a standard width of seats for computing nodes and with mounting and operating intervals.

The quick start-up of the cooling device is ensured by the fact that the dielectric heat dissipating liquid directly cooling the electronic equipment does not leave the tank.

The ability to hot-swap faulty equipment units (power supplies, information storage devices) without shutting down the entire system is achieved through the use of standard devices.

Reducing the required energy is ensured by eliminating additional energy costs for the organization of forced circulation. In addition, the liquid needs much less than air, therefore, less space is needed to accommodate equipment that prepares cold air / liquid. Since there is less equipment, its energy consumption is less.

Improving the cooling efficiency of fuel elements is provided by the use of liquid.

Silent operation is ensured by the absence of fans, since heat is removed by boiling the liquid.

The functioning of the system in difficult conditions (increased dust, in the field), as well as the ability to hot-swap power supplies and storage devices are achieved due to improvements in the design of the cooling device.

The functioning of the system at negative ambient temperatures is achieved by controlling the rate of circulation of the coolant in the cooling circuit.

Improving fire safety is achieved by the fact that the liquid is a flame retardant, i.e. “natural” fire protection is carried out.

Improving environmental safety is achieved by the fact that the liquid is environmentally friendly - it does not destroy the ozone layer and does not cause global warming.

Claims (4)

1. Device for passive two-phase immersion cooling of electronic equipment, made with the possibility of complete immersion of electronic equipment in a dielectric heat dissipating liquid for heat removal, comprising a carriage, a frame mounted on the carriage, at least one stainless steel tank made sealed, mounted on the frame and formed by two adjoining lower and upper boxes, glued on the outside with a layer of heat-insulating material, and in the lower box, which is a a bath with internal dimensions corresponding to a 19-inch rack, there is a dielectric heat-transfer fluid, at least one lid with a sealing gasket is located on the upper box made of large sizes, and an internal heat exchanger attached to the inner wall of the upper box is installed inside the upper box, an additional heat exchanger connecting the internal volume of the upper and lower boxes with the external environment, an additional cooling circuit located in the upper part of the upper box in the region od lid, and switching transition plate and located directly under the cover plate plexiglass representing shutter, preventing the formation of turbulent flows of vapor when opening the lid. 2. The device according to p. 1, characterized in that it is configured to vertically install electronic equipment in a dielectric heat sink fluid. 3. The device according to claim 1, characterized in that one of the covers provides access to the technological part of the upper box. 4. The device according to claim 1, characterized in that one of the covers provides access to the computing nodes in the lower box.

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