PL2233519T3 - Poliester odporny na żarzący się drut - Google Patents

Poliester odporny na żarzący się drut

Info

Publication number
PL2233519T3
PL2233519T3 PL09156428T PL09156428T PL2233519T3 PL 2233519 T3 PL2233519 T3 PL 2233519T3 PL 09156428 T PL09156428 T PL 09156428T PL 09156428 T PL09156428 T PL 09156428T PL 2233519 T3 PL2233519 T3 PL 2233519T3
Authority
PL
Poland
Prior art keywords
glow
antimony
tetrabromobisphenol
molding composition
resistant polyester
Prior art date
Application number
PL09156428T
Other languages
English (en)
Inventor
Marcus Schäfer
Jochen Endtner
Matthias Bienmüller
Ralf Jantz
Alexander Radeck
Original Assignee
Lanxess Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lanxess Deutschland Gmbh filed Critical Lanxess Deutschland Gmbh
Publication of PL2233519T3 publication Critical patent/PL2233519T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C08K5/3417—Five-membered rings condensed with carbocyclic rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Resistance Heating (AREA)
  • Organic Insulating Materials (AREA)
PL09156428T 2009-03-27 2009-03-27 Poliester odporny na żarzący się drut PL2233519T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP09156428A EP2233519B1 (de) 2009-03-27 2009-03-27 Glühdrahtbeständige Polyester

Publications (1)

Publication Number Publication Date
PL2233519T3 true PL2233519T3 (pl) 2012-01-31

Family

ID=40910871

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09156428T PL2233519T3 (pl) 2009-03-27 2009-03-27 Poliester odporny na żarzący się drut

Country Status (5)

Country Link
EP (1) EP2233519B1 (pl)
JP (1) JP5465056B2 (pl)
CN (1) CN101845201B (pl)
AT (1) ATE522568T1 (pl)
PL (1) PL2233519T3 (pl)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2676799B1 (en) 2011-03-18 2014-06-11 Mitsubishi Chemical Europe GmbH Thermoplastic resin composition, resin molded article, and method of manufactoring resin molded article with plated layer
EP2596064B2 (en) * 2011-03-18 2017-06-28 Mitsubishi Chemical Europe GmbH Process for producing a circuit carrier
US9447523B2 (en) 2011-12-22 2016-09-20 3M Innovative Properties Company Melt blown fiber forming process and method of making fibrous structures
JP5937855B2 (ja) * 2012-03-14 2016-06-22 ナミックス株式会社 樹脂組成物
EP2639262A1 (en) * 2012-03-16 2013-09-18 Mitsubishi Chemical Europe GmbH Thermoplastic composition
US9365693B2 (en) 2012-03-23 2016-06-14 Mitsubishi Engineering-Plastics Corporation Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer
US20140142571A1 (en) * 2012-11-21 2014-05-22 Ticona Llc Liquid Crystalline Polymer Composition for Melt-Extruded Substrates
KR101339640B1 (ko) * 2013-04-02 2013-12-09 김한주 레이저 직접 구조화 방법
JP6196478B2 (ja) * 2013-06-11 2017-09-13 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2886605B2 (de) * 2013-12-20 2021-09-01 Ems-Chemie Ag Kunststoffformmasse und deren Verwendung
EP2942367B1 (de) * 2014-05-05 2018-07-11 LANXESS Deutschland GmbH Polyester Zusammensetzungen
KR101770350B1 (ko) * 2014-08-29 2017-08-22 주식회사 엘지화학 도전성 패턴 형성용 조성물, 이를 사용한 도전성 패턴 형성 방법과, 도전성 패턴을 갖는 수지 구조체
WO2017038409A1 (ja) * 2015-09-03 2017-03-09 三菱エンジニアリングプラスチックス株式会社 レーザーダイレクトストラクチャリング用ポリエステル系樹脂組成物
JP6667953B2 (ja) * 2016-03-11 2020-03-18 三菱エンジニアリングプラスチックス株式会社 樹脂成形品の製造方法
CN107417977B (zh) * 2017-07-19 2019-07-12 广州铂钡信息科技有限公司 一种用于聚合物的添加剂及其制备方法
CN115989276A (zh) * 2020-08-25 2023-04-18 宝理塑料株式会社 阻燃性树脂组合物和其成型品
WO2022044947A1 (ja) * 2020-08-25 2022-03-03 ポリプラスチックス株式会社 難燃性樹脂組成物及びその成形品

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1580834A (pl) 1968-01-04 1969-09-12
US3644574A (en) 1969-07-17 1972-02-22 Eastman Kodak Co Shaped articles of blends of polyesters and polyvinyls
US4013613A (en) 1971-10-01 1977-03-22 General Electric Company Reinforced intercrystalline thermoplastic polyester compositions
JPS5039599B2 (pl) 1973-03-30 1975-12-18
US4035958A (en) 1973-03-30 1977-07-19 Tokyo Kosei Kaken Co. Ltd. Mobile floor cleaning and polishing device
DE2407776A1 (de) 1974-02-19 1975-09-04 Licentia Gmbh Schaltung zur regelung der betriebsspannung fuer die transistor-zeilenendstufe eines fernsehempfaengers
DE2715932A1 (de) 1977-04-09 1978-10-19 Bayer Ag Schnellkristallisierende poly(aethylen/alkylen)-terephthalate
DE3631540A1 (de) 1986-09-17 1988-03-24 Bayer Ag Thermoplastische formmassen mit hoher alterungsbestaendigkeit und guter tieftemperaturzaehigkeit
DE3631539A1 (de) 1986-09-17 1988-03-24 Bayer Ag Alterungsbestaendige thermoplastische formmassen mit guter zaehigkeit
DE3704655A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3704657A1 (de) 1987-02-14 1988-08-25 Bayer Ag Teilchenfoermige mehrphasenpolymerisate
DE3738143A1 (de) 1987-11-10 1989-05-18 Bayer Ag Verwendung von redoxpfropfpolymerisaten zur verbesserung der benzinbestaendigkeit von thermoplastischen, aromatischen polycarbonat- und/oder polyestercarbonat-formmassen
DE4236122A1 (de) 1992-10-27 1994-04-28 Bayer Ag Flammgeschützte, mineralgefüllte, thermoplastische Formmassen mit hoher Kriechstromfestigkeit
DE19643280A1 (de) 1996-10-21 1998-04-23 Basf Ag Flammgeschützte Formmassen
DE19723734C2 (de) 1997-06-06 2002-02-07 Gerhard Naundorf Leiterbahnstrukturen auf einem nichtleitenden Trägermaterial und Verfahren zu ihrer Herstellung
DE19731346C2 (de) 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
EP1062850B1 (de) 1998-12-10 2007-05-30 LPKF Laser & Electronics Aktiengesellschaft Verfahren zur herstellung von leiterbahnstrukturen
DK1156798T3 (da) 1999-02-09 2003-11-03 Univ Virginia Felbamat-afledte forbindelser
CN1326435C (zh) * 2001-07-05 2007-07-11 Lpkf激光和电子股份公司 导体轨道结构的制造方法
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
EP1288260A1 (en) * 2001-08-29 2003-03-05 Albemarle Corporation Flame retardant compositions
CN1823124A (zh) * 2003-05-21 2006-08-23 韦尔曼公司 慢结晶聚酯树脂
DE102004003891A1 (de) 2004-01-27 2005-08-11 Mitsubishi Polyester Film Gmbh Orientierte, mittels elektromagnetischer Strahlung strukturierbare Folie aus thermoplastischem Polyester, Verfahren zu ihrer Herstellung und ihre Verwendung
WO2005121245A1 (de) * 2004-06-08 2005-12-22 Lanxess Deutschland Gmbh Formmassen auf basis eines thermoplastischen polyesters mit verbesserter fliessfähigkeit
JP4692108B2 (ja) * 2004-07-07 2011-06-01 三菱エンジニアリングプラスチックス株式会社 絶縁材料部品
DE102004039148A1 (de) 2004-08-12 2006-02-23 Clariant Gmbh Glühdrahtbeständige flammwidrige Polymere
DE102004048876A1 (de) 2004-09-13 2006-03-30 Bayer Ag Halogenfreie flammgeschützte thermoplastische Formmassen auf Basis von Polyamid mit erhöhter Glühdrahtbeständigkeit
US7547849B2 (en) * 2005-06-15 2009-06-16 E.I. Du Pont De Nemours And Company Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
JP2008019400A (ja) * 2006-07-14 2008-01-31 Wintech Polymer Ltd 難燃性ポリブチレンテレフタレート樹脂組成物
JP2008140972A (ja) * 2006-12-01 2008-06-19 Auto Network Gijutsu Kenkyusho:Kk 導電回路を有する成形品及びその製造方法

Also Published As

Publication number Publication date
EP2233519B1 (de) 2011-08-31
JP5465056B2 (ja) 2014-04-09
CN101845201B (zh) 2014-04-09
EP2233519A1 (de) 2010-09-29
ATE522568T1 (de) 2011-09-15
JP2010229410A (ja) 2010-10-14
CN101845201A (zh) 2010-09-29

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