NL1038892C2 - Heat sinking coating. - Google Patents

Heat sinking coating. Download PDF

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Publication number
NL1038892C2
NL1038892C2 NL1038892A NL1038892A NL1038892C2 NL 1038892 C2 NL1038892 C2 NL 1038892C2 NL 1038892 A NL1038892 A NL 1038892A NL 1038892 A NL1038892 A NL 1038892A NL 1038892 C2 NL1038892 C2 NL 1038892C2
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NL
Netherlands
Prior art keywords
layer
heat
article
transfer film
coating
Prior art date
Application number
NL1038892A
Other languages
Dutch (nl)
Inventor
Johannes Jacobus Smits
Original Assignee
Holding B V Ges
Next Generation Energy Solutions B V
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Holding B V Ges, Next Generation Energy Solutions B V filed Critical Holding B V Ges
Priority to NL1038892A priority Critical patent/NL1038892C2/en
Application granted granted Critical
Publication of NL1038892C2 publication Critical patent/NL1038892C2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

P 2011 NL 022 TITLE: Heat sinking coating
FIELD OF THE INVENTION
The present invention relates in general to a heatsink material.
5 BACKGROUND OF THE INVENTION
Electric and electronic components, whether active or passive, dissipate energy and consequently they generate heat. Thus, there is a general need for heat sinking bodies, capable of absorbing and removing such generated heat. This need 10 increases as components have smaller sizes and/or higher power. Traditionally, heat sinking bodies are made from metal, typically aluminium or cupper. One problem with these materials is the large weight: heat sinking bodies tend to be bulky and heavy.
15 In most electronic circuits, cooling of the components takes place via conduction to the ambient air and/or via conduction to a carrier (PCB) on which the component is mounted. However, air is a good thermal insulator and hence not a good vehicle for carrying away heat, unless perhaps 20 forced cooling by means of a ventilator or the like is used. Also, a PCB is not an adequate heat transporter. So, heat may accumulate in the component, resulting in a rise of temperature. A typical example of electronic components where heat accumulation may form a problem are transistors. Another 25 example is the use of power LEDs in illumination systems. The operational temperature of these components has a large influence on the life expectancy of these components: the lower the operational temperature, the better the life expectancy. It is noted that another mechanism for heat 30 transport is radiation, but in electronic components this only is effective at temperatures which are as high as to be avoided in the first place.
1038892 2 US-4782893 discloses an example of a heatsinking device having a plurality of diamond particles, relatively uniform in size, impregnated in a thin film with a thickness smaller than the minimum dimension of the diamond particles and consisting 5 of a material with high dielectric strength. However, such foil-shaped device is relatively complicated to manufacture and therefore relatively costly, so that application of these devices is only feasible in expensive equipment.
10 SUMMARY OF THE INVENTION
It is a general objective of the present invention to provide a new heat-sinking material with greatly improved properties. Specifically, the present invention aims to provide a new heat-sinking material with a lower specific 15 weight (kg/m3) and a higher specific thermal conductivity (W/mK) as compared to cupper and aluminium. Further, while metals are not only heat conductive but also electrically conductive, the present invention aims to provide a new heat sinking material with low electric conductivity, more 20 preferably electrically insulating. Further, the present invention aims to provide such heat-sinking material that is relatively easy to manufacture and easy to apply.
BRIEF DESCRIPTION OF THE DRAWINGS
25 These and other aspects, features and advantages of the present invention will be further explained by the following description with reference to the drawings, in which same reference numerals indicate same or similar parts, in which indications "below/above", "higher/lower", "left/right" etc 30 only relate to the orientation displayed in the drawings, and in which: figure 1 schematically shows a heat sinking layer arranged on a carrier body; figures 2A-2B schematically illustrate a PCB on which an LED 35 is mounted; figure 3 schematically illustrates more details of the coating proposed by the present invention; figure 4 illustrates electrically conductive lines on top of the inventive coating.
3
DETAILED DESCRIPTION OF THE INVENTION
Figure 1 schematically shows an important aspect of the •present invention. A heat sinking layer 2 is arranged on a 5 carrier body 1. The heat sinking layer 2 is applied in the form of a coating. An important advantage of a coating is that it can be applied by spraying, which brings the advantage of allowing the coating to be easily applied on all kinds of surfaces, including curved surfaces, facetted surfaces, 10 surfaces with recesses and/or holes, etc. This would not, or only with great difficulty, be possible with a foil.
Figures 2A-2B schematically illustrate an example of a situation in which the present invention is useful. The 15 carrier body 1 is a PCB on which a heat-generating electric component such as an LED 3 is mounted. The PCB as such is insulating. If the LED 3 would be mounted directly on the PCB 1, without the invention, the generated heat would stay close to the heat source, heating the PCB and, more 20 importantly, the LED to high temperatures, as illustrated by the curve 4 in figure 2A which shows temperature as a function of place. With the inventive heat sinking layer 2, the heat generated by the LED is conducted away from the source and spreaded over a larger surface area, as illustrated by the 25 temperature curve 5 in figure 2B, so that the creation of a hot spot is avoided. Thus, a larger surface area is effectively heated to a lower temperature.
Eventually, the distributed heat should be discharged to the surroundings: in the absense of heat discharge, the entire 30 body would gradually heat up. Therefore, a second aspect of the inventive heat sinking layer 2 is that is should be capable of effectively radiating energy (infra red radiation) and/or transferring the heat to contacting air, which air is replaced by convection and/or forced air flow. In this 35 respect, too, it is advantageous if the heat sinking layer 2 distributes the generated heat over as large a surface area as possible, because the heat transfer rate towards the surroundings will be proportional to the surface area.
4
Figure 3 schematically illustrates, on a larger scale, more details of the coating 2 proposed by the present invention. The coating 2 comprises a first layer 10 and a second layer 20 on top of the first layer 10. The first layer 5 10 comprises graphite powder particles 11 in a matrix 30. The second layer 20 comprises diamond nano-powder particles 21 in a matrix 30. In a preferred embodiment, the graphite particles 11 have their sizes mainly in the range from 8 to 10 pm, while the diamond particles 21 have their sizes mainly in the range 10 from 0.2 to 4 pm.
It is noted that, in the figures, the relative sizes of the graphite powder particles 11 and the diamond nano-powder particles 21 are not shown to scale.
The matrix material of the first layer 10 may be 15 different from the matrix material of the second layer 20, but it is more advantageous if both materials are the same. In a preferred embodiment, the matrix consists mainly of polyimide, while it is advantageous to use a matrix material that will quickly set (i.e. harden) under the influence of UV light. An 20 alternative material is for instance water glass (sodium silicate). An important advantage of polyimide is that it has both good heat conductive properties and good electrical insulating properties.
Graphite is electrically and thermally conductive, and 25 has a large heat capacity. The density of the graphite particles is set to be sufficiently high such that the particles are in good mechanical contact with each other, i.e.
neighbouring particles touch each other, such as to be able to quickly absorb heat and pass on heat to their neighbours.
30 Consequently, the first layer 10 will quickly take up the heat of a point heat source and will quickly convey this heat away from the source and distribute it over a large surface area.
Diamond (i.e. crystalline carbon) has a high thermal conductivity combined with very low electrical conductivity, 35 and has a low heat capacity. The density of the diamond particles is set to be sufficiently high such that the particles are in good mechanical contact with each other, i.e.
neighbouring particles touch each other, such as to be able to quickly absorb heat and pass on heat to their neighbours.
5
Consequently, the second layer 20 will quickly take up heat . from the underlying first layer 10, and (in view of the low heat capacity) the second layer 20 will quickly discharge heat to the surrounding atmosphere by radiation and convection.
5 All in all, the inventive heat-sinking layer 2 provides for quickly conveying heat away from the source and distributing it over a large surface area, and also provides for quickly discharging the distributed heat to the surroundings. An equilibrium or steady state situation will be 10 reached, wherein the overall heat discharge is equal to the heat generation in the source, at a relatively low temperature of the source and its surroundings.
It is noted that, if desired, a designer may vary the density of the graphite particles and/or of the diamond 15 particles such as to vary the thermal conductivity and thus vary the heat discharge rate. Obviously, this will vary the equilibrium temperature of the object to be cooled.
A further advantageous feature of the inventive heat 20 sinking coating 2 is illustrated in figure 4. The figure illustrates that it is possible to arrange electrically conductive lines 40 on top of the coating 2, thanks to the fact that diamond is electrically insulating. In an advantageous embodiment, the conductive lines 40 are made from 25 copper or a copper alloy. The conductive lines 40 may be used as an alternative to or an addition to the conductive lines of a standard PCB. Thus, it is possible to combine, in one layer 2, the advantages of heat conduction and guided electrical conduction.
30
It should be clear to a person skilled in the art that the present invention is not limited to the exemplary embodiments discussed above, but that several variations and 35 modifications are possible within the protective scope of the invention as defined in the appending claims.
In the above, the first layer 10 and the second layer 20 are separate layers applied one before the other. This has an advantage in that first equipment optimized for applying the 6 first layer can be used, and second equipment optimized for applying the second layer. However, it would also be possible that the materials of the first and second layers are mixed, and that a single layer containing both materials is applied 5 in one single spraying process.
In the above, it is explained that a sprayed coating has advantages over the use of a foil. That does not mean to say that there are no applications where the use of a foil can be useful. If it is desired to use a foil, such can be combined 10 with the present inventive concept. In such case, the coating according to the present invention is first applied on a suitable foil, now having the function of a carrier. It is possible to apply two coatings on opposite surfaces of the foil. It is possible to apply a second foil over the coated 15 first foil, so that the coating is sandwiched between two foils. It is possible to subsequently apply a heat-pressing step such as to firmly merge the foil(s) and the coating(s) by melting.
The reference numerals used in the claims only serve as 20 clarification when understanding the claims with a view to the exemplary embodiments described, and should not be interpreted in any way limiting.
1038892

Claims (14)

1. Werkwij ze voor het verbeteren van de warmteafvoerprestaties van een voorwerp (1), welke werkwijze de stappen omvat van het op het voorwerp aanbrengen van een eerste laag (10) met goede thermische geleidbaarheid en 5 relatief grote warmtecapaciteit, en een tweede laag (20) met goede thermische geleidbaarheid en relatief lage warmtecapaciteit, met de tweede laag (20) aan de van het voorwerp (1) afgekeerde zijde van de eerste laag (10).Method for improving the heat dissipation performance of an article (1), the method comprising the steps of applying a first layer (10) with good thermal conductivity and relatively large heat capacity to the article, and a second layer ( 20) with good thermal conductivity and relatively low heat capacity, with the second layer (20) on the side of the first layer (10) remote from the object (1). 2. Werkwijze volgens conclusie 1, waarbij de eerste laag (10) op het voorwerp wordt aangebracht voordat de tweede laag (20) wordt aangebracht.The method of claim 1, wherein the first layer (10) is applied to the article before the second layer (20) is applied. 3. Werkwijze volgens conclusie 1, waarbij de eerste laag (10) 15 en de tweede laag (20) worden aangebracht in een gemengde vorm.The method of claim 1, wherein the first layer (10) and the second layer (20) are applied in a mixed form. 4. Werkwijze volgens conclusie 1, waarbij de eerste laag (10) wordt aangebracht op een overdrachtfolie, waarbij de tweede 20 laag (20) wordt aangebracht op de eerste laag (10) op de overdrachtfolie, en waarbij de overdrachtfolie wordt aangebracht op het voorwerp met de eerste laag (10) tussen het voorwerp en de tweede laag (20).4. Method according to claim 1, wherein the first layer (10) is applied to a transfer film, the second layer (20) is applied to the first layer (10) on the transfer film, and wherein the transfer film is applied to the object with the first layer (10) between the article and the second layer (20). 5. Werkwijze volgens conclusie 1, waarbij de eerste laag (10) wordt aangebracht op een eerste zijde van een overdrachtfolie, waarbij de tweede laag (20) wordt aangebracht op de tegenoverliggende zijde van de overdrachtfolie, en waarbij de overdrachtfolie wordt aangebracht op het voorwerp met de 30 eerste zijde naar het voorwerp gericht.The method of claim 1, wherein the first layer (10) is applied to a first side of a transfer film, the second layer (20) is applied to the opposite side of the transfer film, and wherein the transfer film is applied to the object with the first side facing the object. 6. Werkwijze volgens een willekeurige der conclusies 1-5, waarbij de eerste laag (10) grafietpoederdeeltjes (11) in een matrix (30) omvat. 1038892The method of any one of claims 1-5, wherein the first layer (10) comprises graphite powder particles (11) in a matrix (30). 1038892 7. Werkwijze volgens een willekeurige der conclusies 1-6, waarbij de tweede laag (20) nanopoederdeeltjes (21) van diamant in een matrix (30) omvat.The method of any one of claims 1-6, wherein the second layer (20) comprises nanopowder particles (21) of diamond in a matrix (30). 8. Werkwijze volgens een willekeurige der voorgaande conclusies, waarbij de eerste en tweede lagen als een coating door sproeien worden aangebracht.A method according to any one of the preceding claims, wherein the first and second layers are applied as a coating by spraying. 9. Warmteafvoercoating (2), omvattende een eerste laag (10) 10 met goede thermische geleidbaarheid en relatief grote warmtecapaciteit, en een tweede laag (20) met goede thermische geleidbaarheid en relatief lage warmtecapaciteit, waarbij de tweede laag in goed thermisch contact met de eerste laag is.A heat dissipation coating (2) comprising a first layer (10) with good thermal conductivity and relatively large heat capacity, and a second layer (20) with good thermal conductivity and relatively low heat capacity, the second layer being in good thermal contact with the first layer. 10. Warmteafvoercoating volgens conclusie 9, waarbij de eerste laag (10) grafietpoederdeeltjes (11) in een matrix (30) omvat.The heat dissipation coating of claim 9, wherein the first layer (10) comprises graphite powder particles (11) in a matrix (30). 11. Warmteafvoercoating volgens conclusie 9 of 10, waarbij de tweede laag (20) nanopoederdeeltjes (21) van diamant in een 20 matrix (30) omvat.A heat dissipation coating according to claim 9 or 10, wherein the second layer (20) comprises nanopowder particles (21) of diamond in a matrix (30). 12. Voorwerp (2) omvattende ten minste één warmtebron (3), welk voorwerp is voorzien van een warmteafvoercoating volgens een willekeurige der conclusies 9-11. 25An article (2) comprising at least one heat source (3), which article is provided with a heat dissipation coating according to any of claims 9-11. 25 13. Voorwerp volgens conclusie 12, waarbij het voorwerp een printplaat is, waarbij de ten minste ene warmtebron een elektronische component is zoals bijvoorbeeld een vermogenstransistor of een LED gemonteerd op één zijde van de 30 printplaat, en waarbij de warmteafvoercoating is aangebracht op de ene zijde van de printplaat.13. Object according to claim 12, wherein the object is a printed circuit board, wherein the at least one heat source is an electronic component such as for example a power transistor or an LED mounted on one side of the printed circuit board, and wherein the heat dissipation coating is provided on the one side of the circuit board. 14. Voorwerp volgens conclusie 12 of 13, verder omvattende ten minste één elektrisch geleidende lijn (40) die is aangebracht 35 op de tweede laag (20). 1038892The article of claim 12 or 13, further comprising at least one electrically conductive line (40) disposed on the second layer (20). 1038892
NL1038892A 2011-06-24 2011-06-24 Heat sinking coating. NL1038892C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL1038892A NL1038892C2 (en) 2011-06-24 2011-06-24 Heat sinking coating.

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Application Number Priority Date Filing Date Title
NL1038892 2011-06-24
NL1038892A NL1038892C2 (en) 2011-06-24 2011-06-24 Heat sinking coating.

Publications (1)

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NL1038892C2 true NL1038892C2 (en) 2013-01-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112492743A (en) * 2020-11-06 2021-03-12 龙南骏亚电子科技有限公司 Heat radiation structure of multilayer printed circuit board

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US20020141155A1 (en) * 1999-10-28 2002-10-03 P1 Diamond, Inc., A California Corporation Thermal management components
EP1376689A1 (en) * 2001-04-06 2004-01-02 Shin-Etsu Chemical Company, Ltd. Radiating structural body of electronic part and radiating sheet used for the radiating structural body
US20050013119A1 (en) * 2003-07-17 2005-01-20 Sanjay Misra Thermal diffusion apparatus
US20050045855A1 (en) * 2003-09-03 2005-03-03 Tonapi Sandeep Shrikant Thermal conductive material utilizing electrically conductive nanoparticles
US20090117345A1 (en) * 2007-11-05 2009-05-07 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US20110001148A1 (en) * 2009-07-06 2011-01-06 Zhuo Sun Thin flat solid state light source module

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4782893A (en) * 1986-09-15 1988-11-08 Trique Concepts, Inc. Electrically insulating thermally conductive pad for mounting electronic components
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US20020141155A1 (en) * 1999-10-28 2002-10-03 P1 Diamond, Inc., A California Corporation Thermal management components
EP1376689A1 (en) * 2001-04-06 2004-01-02 Shin-Etsu Chemical Company, Ltd. Radiating structural body of electronic part and radiating sheet used for the radiating structural body
US20050013119A1 (en) * 2003-07-17 2005-01-20 Sanjay Misra Thermal diffusion apparatus
US20050045855A1 (en) * 2003-09-03 2005-03-03 Tonapi Sandeep Shrikant Thermal conductive material utilizing electrically conductive nanoparticles
US20090117345A1 (en) * 2007-11-05 2009-05-07 Laird Technologies, Inc. Thermal interface material with thin transfer film or metallization
US20110001148A1 (en) * 2009-07-06 2011-01-06 Zhuo Sun Thin flat solid state light source module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112492743A (en) * 2020-11-06 2021-03-12 龙南骏亚电子科技有限公司 Heat radiation structure of multilayer printed circuit board

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