KR970076093A

KR970076093A - Positioning of registration mark of photomask and exposure method using it

Info

Publication number: KR970076093A
Application number: KR1019960014646A
Authority: KR
Inventors: 김태욱; 박진호
Original assignee: 김광호; 삼성전자 주식회사
Priority date: 1996-05-06
Filing date: 1996-05-06
Publication date: 1997-12-10

Abstract

본 발명은 포토 마스크의 상, 하 스크라이브 라인을 위한 영역에 각각 하나씩 대각선 방향으로 배치되고, 좌, 우 스크라이브 라인을 위한 영역에 각각 하나씩 대각선 방향으로 배치되어 웨이퍼위에 전사되는 포토 마스크의 스크라이브 라인을 위한 패턴이 오버랩됨으로써 웨이퍼위에 형성되는 반도체 칩의 수를 증가시킨다. 따라서, 웨이퍼의 면적을 최대한 활용할 수 있어 원가 절감의 효과가 있다.The present invention relates to a scribe line for a photomask which is arranged diagonally one by one in the regions for the upper and lower scribe lines of the photomask and arranged diagonally one by one in the regions for the left and right scribe lines, The patterns are overlapped to increase the number of semiconductor chips formed on the wafer. Therefore, it is possible to utilize the area of the wafer as much as possible, thereby reducing the cost.

Description

Positioning of registration mark of photomask and exposure method using it

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제3도는 본 발명에 의한 포토마스크의 정합 마크 배치를 나타낸 예시도, 제4도는 제3도의 마스크를 이용하여 웨이퍼위에 패턴들을 노광하는 방법을 나타낸 예시도.FIG. 3 is an exemplary view showing a registration mark arrangement of a photomask according to the present invention, and FIG. 4 is an exemplary view showing a method of exposing patterns on a wafer using a mask of FIG.

Claims

Wherein the registration keys are arranged in an area for the upper and lower scribe lines of the photomask and in an area for the left and right scribe lines, respectively, and a scribe line of the photomasks to be transferred onto the wafer, Wherein a region of the first photomask is overlapped with a region of the second photomask.

2. The photomask according to claim 1, wherein each of the regions for the upper and lower scribe lines is disposed in a diagonal direction and one region is arranged in a diagonal direction for each of the left and right scribe lines. .

3. The image forming apparatus according to claim 1 or 2, characterized in that the registration keys are formed horizontally in the area for the upper and lower scribe lines, and the registration keys are longitudinally formed in the area for the left and right scribe lines Matching mark placement on mask.

A method of exposing a photomask, comprising: exposing a photomask to expose a scribe line of the photomask on which the registration keys are disposed, the photomask being exposed to light;

5. The exposure method according to claim 4, wherein the exposure is performed while matching the registration key of the photomask transferred first to the overlapping scribe line with the registration key of the photomask to be transferred next .

※ Note: It is disclosed by the contents of the first application.