KR920002919Y1 - Speaker duct device - Google Patents

Speaker duct device Download PDF

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Publication number
KR920002919Y1
KR920002919Y1 KR2019900006699U KR900006699U KR920002919Y1 KR 920002919 Y1 KR920002919 Y1 KR 920002919Y1 KR 2019900006699 U KR2019900006699 U KR 2019900006699U KR 900006699 U KR900006699 U KR 900006699U KR 920002919 Y1 KR920002919 Y1 KR 920002919Y1
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KR
South Korea
Prior art keywords
speaker
heat
duct
heat sink
duct device
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KR2019900006699U
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Korean (ko)
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KR910021341U (en
Inventor
윤상락
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삼성전자 주식회사
강진구
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Priority to KR2019900006699U priority Critical patent/KR920002919Y1/en
Publication of KR910021341U publication Critical patent/KR910021341U/en
Application granted granted Critical
Publication of KR920002919Y1 publication Critical patent/KR920002919Y1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

내용 없음.No content.

Description

스피커 덕트장치Speaker duct

제1도는 본 고안의 개략도.1 is a schematic diagram of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 방열구멍 3 : 스피커 케비넷1: heat dissipation hole 3: speaker cabinet

4 : 닥트 8 : 방열판4: Doc 8: heat sink

본 고안은 텔레비젼, 오디오기기와 같이 저역주파수를 재생하는 장치에서 내부에 발생하는 열을 효과적으로 방출하기 위한 장치에 관한 것이다.The present invention relates to a device for effectively dissipating heat generated inside a device for reproducing low frequencies, such as televisions and audio equipment.

종래에 사용되어온 기기에서는 PCB기판에 정착된 다수개의 소자에서 발생하는 열을 외부로 방출하기 위한 수단으로서 외부 케이스의 주면에 형성된 방열 구멍에 의존하여 방열하게 되므로 방열효과가 매우 낮았던 문제점이 있었다.In a conventionally used device, since the heat generated from a plurality of devices fixed to the PCB is radiated to the outside, the heat radiation effect is very low, depending on the heat radiation holes formed on the main surface of the outer case.

특히 낮은 주파수의 음향을 재생하기 위하여서는 많은 전류를 필요로하므로 전력증폭기를 사용함에 따라 여기서 발생하는 열을 방출하기 위하여 면적이 큰 히트 싱크(heat Sink)를 사용하게 됨에 따라 기기의 부피가 커지는 문제점이 있었다.In particular, since a large amount of current is required to reproduce low frequency sound, the volume of the device increases due to the use of a large heat sink to dissipate the heat generated by the power amplifier. There was this.

본 고안은 상기와 같은 문제점을 해소하기 위하여 안출된 것으로서 음을 재생하기 위한 스피커 시스템에 덕트가 설치됨에 착안하여 닥트의 입구위치를 많은 발열을 하는 소자의 상면에 위치토록하여, 공기의 순환을 원활히하여 기기내부 공간의 고온화를 방지토록 함에 본 고안의 목적이 있다.The present invention devised to solve the above problems, the duct is installed in the speaker system for reproducing sound, so that the inlet position of the duct on the upper surface of the element that generates a lot of heat, the air circulation smoothly It is an object of the present invention to prevent the high temperature of the internal space of the device.

본 고안의 또다른 목적은 내부 PCB에 정착되는 발열소자에 부착되는 히트싱크의 면적을 줄임으로서 기기의 소형화에 이바지할 수 있도록 함에 있다.Another object of the present invention is to reduce the area of the heat sink attached to the heating element is fixed to the internal PCB to contribute to the miniaturization of the device.

상기 목적을 달성하기 위한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.An embodiment for achieving the above object will be described in detail with reference to the accompanying drawings.

우선 본 고안의 구성을 설명하면, 외부에 방열구멍(1)이 형성된 케이스(10)일측에 설치되는 스피커(2)를 내부에서 감싸고 있는 스피커케비넷(3)과 연통되는 덕트(4)의 입구(5)를 PCB기판(6)에 장착되는 발열소자(7)상면에 위치토록 하여서 된석으로서 도면중 미설명 부호 8은 방열판이다.First, the configuration of the present invention, the inlet of the duct (4) in communication with the speaker cabinet (3) surrounding the speaker (2) installed on one side of the case (10) formed with a heat dissipation hole (1) outside ( 5) is placed on the upper surface of the heat generating element 7 mounted on the PCB substrate 6, and reference numeral 8 in the drawing denotes a heat sink.

이와같이 구성된 본 고안의 작용효과는 기기내부에 설치된 PCB기판(6)에 장착된 전자회로에 의하여 영상 및 음향을 재생토록하게 되는데 이때 음의 재생을 위하여 필수적인 요소인 스피커(2)는 고음과 저음을 재생하기 위한 별도의 스피커를 구비하게 되며 특히 저음을 재생하기 위한 스피커(2b)는 보다 많은 에너지를 필요로 하고 그 만큼 스피커 전동판이 크게 진동하므로 높은 전력을 얻기 위하여 전력증폭기를 사용하여야 되며 상기 증폭기는 작동시 많은 열을 발산하게 되는데 이를 위하여 방열판(8)을 부착하게 된다.The effect of the present invention configured as described above is to reproduce the image and sound by the electronic circuit mounted on the PCB board 6 installed inside the device. In this case, the speaker 2, which is an essential element for the reproduction of sound, has high and low sound. A separate speaker for reproducing, and in particular, the speaker 2b for reproducing bass requires more energy and the speaker driving plate vibrates as much, so a power amplifier must be used to obtain high power. During operation, a lot of heat is emitted, and for this purpose, a heat sink 8 is attached.

이때 방열판(8)에서 발산하는 열을 스피커(2)의 진동판이 진동하면서 스피커 케비넷(3)내의 공기의 압력의 변화가 생기게 되며 이때 발생하는 압력에 따라 내부 공기가 덕트(4)를 통해 유입 또는 방출하게 된다.At this time, as the diaphragm of the speaker 2 vibrates heat radiated from the heat sink 8, a change in the pressure of air in the speaker cabinet 3 occurs, and internal air flows in through the duct 4 according to the generated pressure. Will be released.

이때 덕트(4)의 입구(5)측에 방열판(8)이 위치하므로 공기의 흐름에 의하여 방열판(8)에서 발산하는 열을 덕트(4) 또는 방열 구멍(1)을 통하여 외부로 방출하게 된다.At this time, since the heat sink 8 is located at the inlet 5 side of the duct 4, the heat emitted from the heat sink 8 due to the flow of air is discharged to the outside through the duct 4 or the heat radiation hole (1). .

따라서 방열판의 크기를 줄여도 효과적으로 방열하게 되므로 방열판의 크기를 줄일수 있으며 내부의 공기순환을 원활히하므로 기기내부에 온도상승을 방지할 수 있게 되는 것이다.Therefore, even if the size of the heat sink is effectively radiated, the size of the heat sink can be reduced and the internal air circulation can be smoothly prevented the temperature rise inside the device.

Claims (1)

텔레비젼, 오디오 기기와 같이 스피커시스템이 부착되는 음성발생 장치에 있어서, 기기 본체케이스(10)의 일측에 설치되는 스피커케이스(3)의 일측에 형성된 덕트(4)의 입구(5)를 발열소자(7)의 방열판(8)상면에 위치토록하여 기기내부의 공기 순환을 원활히 하도록 함을 특징으로 하는 스피커 덕트장치.In a sound generating device to which a speaker system is attached, such as a television and an audio device, the inlet 5 of the duct 4 formed on one side of the speaker case 3 provided on one side of the main body case 10 is connected to a heating element ( The speaker duct device, characterized in that to facilitate the air circulation inside the device to be located on the heat sink (8) upper surface of 7).
KR2019900006699U 1990-05-18 1990-05-18 Speaker duct device KR920002919Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019900006699U KR920002919Y1 (en) 1990-05-18 1990-05-18 Speaker duct device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019900006699U KR920002919Y1 (en) 1990-05-18 1990-05-18 Speaker duct device

Publications (2)

Publication Number Publication Date
KR910021341U KR910021341U (en) 1991-12-20
KR920002919Y1 true KR920002919Y1 (en) 1992-05-08

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ID=19298906

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019900006699U KR920002919Y1 (en) 1990-05-18 1990-05-18 Speaker duct device

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KR (1) KR920002919Y1 (en)

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KR910021341U (en) 1991-12-20

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