KR880700482A - Electrical circuit device - Google Patents

Electrical circuit device

Info

Publication number
KR880700482A
KR880700482A KR860700951A KR860700951A KR880700482A KR 880700482 A KR880700482 A KR 880700482A KR 860700951 A KR860700951 A KR 860700951A KR 860700951 A KR860700951 A KR 860700951A KR 880700482 A KR880700482 A KR 880700482A
Authority
KR
South Korea
Prior art keywords
circuit device
electrical circuit
electrical
circuit
Prior art date
Application number
KR860700951A
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/728,956 external-priority patent/US4659872A/en
Application filed filed Critical
Publication of KR880700482A publication Critical patent/KR880700482A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Conductors (AREA)
  • Multi-Conductor Connections (AREA)
KR860700951A 1985-04-30 1986-12-29 Electrical circuit device KR880700482A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US72898785A 1985-04-30 1985-04-30
US06/728,956 US4659872A (en) 1985-04-30 1985-04-30 Flexible flat multiconductor cable
PCT/US1986/000639 WO1986006551A1 (en) 1985-04-30 1986-03-31 Flexible electrical jumper cable and assembly

Publications (1)

Publication Number Publication Date
KR880700482A true KR880700482A (en) 1988-03-15

Family

ID=27111780

Family Applications (1)

Application Number Title Priority Date Filing Date
KR860700951A KR880700482A (en) 1985-04-30 1986-12-29 Electrical circuit device

Country Status (4)

Country Link
EP (1) EP0221924A1 (en)
JP (1) JP2524138B2 (en)
KR (1) KR880700482A (en)
WO (1) WO1986006551A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377284U (en) * 1986-11-10 1988-05-23
JP2629490B2 (en) * 1991-07-12 1997-07-09 日立化成工業株式会社 Anisotropic conductive adhesive
US5484648A (en) * 1993-08-11 1996-01-16 Shin-Etsu Polymer Co., Ltd. Heat-sealable connector and method for the preparation thereof
GB2280993B (en) * 1993-08-12 1997-05-14 Shinetsu Polymer Co Heat-sealable connector and method for the preparation thereof
EP0951161A1 (en) * 1998-04-16 1999-10-20 Koninklijke Philips Electronics N.V. Contact device for connecting a liquid crystal display to a printed circuit board
US6522715B2 (en) * 2000-12-29 2003-02-18 Ge Medical Systems Global Technology Company Llc High density flex interconnect for CT detectors
US6840796B2 (en) 2003-06-06 2005-01-11 Sony Ericsson Mobile Communications Ab Portable electronic devices with a flexible connection between internal electronics and an auxiliary connection
US7439962B2 (en) 2005-06-01 2008-10-21 Synaptics Incorporated Touch pad with flexible substrate
CN107256104B (en) 2012-01-12 2020-03-20 辛纳普蒂克斯公司 Single-layer capacitive image sensor
US9542023B2 (en) 2013-08-07 2017-01-10 Synaptics Incorporated Capacitive sensing using matrix electrodes driven by routing traces disposed in a source line layer
US10042489B2 (en) 2013-09-30 2018-08-07 Synaptics Incorporated Matrix sensor for image touch sensing
US20150091842A1 (en) 2013-09-30 2015-04-02 Synaptics Incorporated Matrix sensor for image touch sensing
US9298325B2 (en) 2013-09-30 2016-03-29 Synaptics Incorporated Processing system for a capacitive sensing device
US9459367B2 (en) 2013-10-02 2016-10-04 Synaptics Incorporated Capacitive sensor driving technique that enables hybrid sensing or equalization
US9274662B2 (en) 2013-10-18 2016-03-01 Synaptics Incorporated Sensor matrix pad for performing multiple capacitive sensing techniques
US9495046B2 (en) 2013-10-23 2016-11-15 Synaptics Incorporated Parasitic capacitance filter for single-layer capacitive imaging sensors
US9081457B2 (en) 2013-10-30 2015-07-14 Synaptics Incorporated Single-layer muti-touch capacitive imaging sensor
US9798429B2 (en) 2014-02-28 2017-10-24 Synaptics Incorporated Guard electrodes in a sensing stack
US10133421B2 (en) 2014-04-02 2018-11-20 Synaptics Incorporated Display stackups for matrix sensor
US9927832B2 (en) 2014-04-25 2018-03-27 Synaptics Incorporated Input device having a reduced border region
US9690397B2 (en) 2014-05-20 2017-06-27 Synaptics Incorporated System and method for detecting an active pen with a matrix sensor
US10175827B2 (en) 2014-12-23 2019-01-08 Synaptics Incorporated Detecting an active pen using a capacitive sensing device
US10795471B2 (en) 2015-01-05 2020-10-06 Synaptics Incorporated Modulating a reference voltage to perform capacitive sensing
US9939972B2 (en) 2015-04-06 2018-04-10 Synaptics Incorporated Matrix sensor with via routing
US9720541B2 (en) 2015-06-30 2017-08-01 Synaptics Incorporated Arrangement of sensor pads and display driver pads for input device
US9715304B2 (en) 2015-06-30 2017-07-25 Synaptics Incorporated Regular via pattern for sensor-based input device
US10095948B2 (en) 2015-06-30 2018-10-09 Synaptics Incorporated Modulation scheme for fingerprint sensing
CN205028263U (en) 2015-09-07 2016-02-10 辛纳普蒂克斯公司 Capacitance sensor
US10037112B2 (en) 2015-09-30 2018-07-31 Synaptics Incorporated Sensing an active device'S transmission using timing interleaved with display updates
US10067587B2 (en) 2015-12-29 2018-09-04 Synaptics Incorporated Routing conductors in an integrated display device and sensing device
CN106933400B (en) 2015-12-31 2021-10-29 辛纳普蒂克斯公司 Single layer sensor pattern and sensing method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51134666A (en) * 1975-05-16 1976-11-22 Seiko Epson Corp Electric clock
JPS56149782A (en) * 1980-04-22 1981-11-19 Fujitsu Ltd Method of connecting conductive pattern
US4413257A (en) * 1981-07-13 1983-11-01 Beckman Instruments, Inc. Conductive particle lead termination for an electro-optic display
JPS60140685A (en) * 1983-12-28 1985-07-25 日本写真印刷株式会社 Filmlike electrode connector and method of producing same

Also Published As

Publication number Publication date
JP2524138B2 (en) 1996-08-14
WO1986006551A1 (en) 1986-11-06
EP0221924A1 (en) 1987-05-20
JPS62502715A (en) 1987-10-15

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Legal Events

Date Code Title Description
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid