KR20240054867A - Package structure, apparatus and forming methods thereof - Google Patents

Abstract

The package structure includes a cover and a cell placed within the cover. The cell includes a membrane, an operating layer and an anchor structure. The membrane includes a first membrane subpart and a second membrane subpart, where the first membrane subpart and the second membrane subpart are opposite each other in plan view. The operating layer is disposed on the first membrane subpart and the second membrane subpart in a planar view direction. The membrane is anchored by an anchor structure. The first membrane subpart includes a first anchored edge that is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are unanchored. The second membrane subpart includes a second anchored edge that is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are unanchored.

Description

Package structure, device and method of forming the same {PACKAGE STRUCTURE, APPARATUS AND FORMING METHODS THEREOF}

The present invention relates to a package structure, a device, and a method of forming the same, and more specifically, a package structure including a sound generating cell with high yield and/or high performance, a device including the same, a method of forming the package structure, and the package structure. It relates to a method of forming a device.

Micro sound generating devices, such as MEMS (Micro Electro Mechanical System) micro speakers, can be used in various electronic devices due to their small size, so micro sound generating devices have been rapidly developed in recent years. For example, a MEMS microspeaker may use a thin film piezoelectric material as the actuator and a silicon-containing layer as the membrane formed by at least one semiconductor process. In order to make micro speakers more widely used, the industry is focusing on designing micro speakers with high yield and high performance.

Accordingly, the main object of the present invention is to provide a package structure comprising sound producing cells with a specific slit design and/or a specific recess design to improve yield and performance, and to provide a method of forming this package structure. The invention also provides a device comprising such a package structure and a method of forming the device.

Embodiments of the present invention provide a package structure including a cover and a cell disposed within the cover. The cell includes a membrane, an operating layer and an anchor structure. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite each other in a plan view along a planar viewing direction, such that the first membrane subpart and the second membrane subpart The two membrane subparts oppose each other in a first direction perpendicular to the plane viewing direction. The operating layer is disposed on the first membrane subpart and the second membrane subpart in a planar view direction. The membrane is anchored by an anchor structure. The first membrane subpart includes a first anchored edge that is fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and the first membrane subpart other than the first anchored edge The edges of the part are not anchored. The second membrane subpart includes a second anchored edge fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and an edge of the second membrane subpart other than the second anchored edge has: Not anchored.

Another embodiment of the present invention provides a device including a housing and the package structure.

Another embodiment of the present invention provides a method of forming a package structure. This forming method includes performing a manufacturing method to fabricate a cell; and placing the cell within the cover. The method of manufacturing the cell includes providing a wafer including a first layer and a second layer; and patterning the first layer of the wafer to form at least one trench line. The first layer includes a membrane anchored by the anchor structure of the cell, wherein at least one slit is formed within and through the membrane due to at least one trench line. The membrane includes a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart facing each other in a plan view along a planar viewing direction, the first membrane subpart and the second membrane subpart The membrane subparts oppose each other in a first direction perpendicular to the planar viewing direction. The first membrane subpart includes a first anchored edge fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and an edge of the first membrane subpart other than the first anchored edge has Not anchored. The second membrane subpart includes a second anchored edge fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and an edge of the second membrane subpart other than the second anchored edge has: Not anchored.

Another embodiment of the present invention provides a method of forming a device. This forming method includes forming a package structure by the forming method; and assembling the package structure into a device including a housing through a surface mount technique.

These and other objects of the present invention will become apparent to those skilled in the art after reading the following detailed description of the preferred embodiments illustrated in the various drawings and drawings.

1 is a schematic diagram in a top view illustrating a sound production cell according to a first embodiment of the present invention.
FIG. 2 is an enlarged schematic diagram showing the structure in region R1 of FIG. 1 .
3 to 8 are schematic diagrams illustrating structures at different stages of a method of manufacturing a sound generating cell according to an embodiment of the present invention.
Figure 9 is a schematic diagram of a top view illustrating a sound production cell according to a second embodiment of the present invention.
Figure 10 is an enlarged schematic diagram showing the structure in region R2 of Figure 9.
Figure 11 is a schematic top view illustrating a sound production cell according to a third embodiment of the present invention.
Figure 12 is a schematic top view illustrating a sound production cell according to a fourth embodiment of the present invention.
Figure 13 is a schematic top view illustrating a sound production cell according to a fifth embodiment of the present invention.
Figure 14 is a schematic top view illustrating a sound production cell according to a sixth embodiment of the present invention.
Figure 15 is an enlarged schematic diagram showing the structure in region R3 of Figure 14.
Figure 16 is a schematic diagram of a top view illustrating a sound production cell according to a seventh embodiment of the present invention.
Figure 17 is a schematic diagram of a top view illustrating a sound production cell according to an eighth embodiment of the present invention.
Figure 18 is a schematic diagram of a plan view illustrating a sound production cell according to a ninth embodiment of the present invention.
Figure 19 is a schematic diagram of a side view illustrating a sound generating cell according to a ninth embodiment of the present invention.
Figure 20 is a schematic diagram of a top view illustrating a sound production cell according to a tenth embodiment of the present invention.
Figure 21 is a schematic diagram showing a package structure according to an embodiment of the present invention.
FIG. 22 is a schematic diagram of a bottom view showing the package structure shown in FIG. 21.
FIG. 23 is a schematic diagram of a cross-section illustrating the package structure shown in FIG. 21.
Figure 24 is a schematic diagram showing a package structure according to an embodiment of the present invention.
Figure 25 is a schematic diagram showing a package structure according to an embodiment of the present invention.
FIG. 26 is a schematic diagram of a cross-section illustrating the package structure shown in FIG. 25.
Figure 27 is a schematic diagram showing a package structure according to an embodiment of the present invention.
FIG. 28 is a schematic diagram of a cross-section illustrating the package structure shown in FIG. 27.
Figure 29 is a schematic diagram in cross-section illustrating a device according to an embodiment of the present invention.
Figure 30 is a schematic diagram illustrating a device according to an embodiment of the present invention.

In order to provide those skilled in the art with a better understanding of the present invention, preferred embodiments and typical material or range parameters for major components will be detailed in the following description. This preferred embodiment of the invention is illustrated in the accompanying drawings with numbered elements to illustrate in detail the contents and effects to be achieved. The drawings are simplified schematic diagrams, the materials and parameter ranges of the main components are illustrated based on the current state of the art, and thus show only the components and combinations relevant to the present invention, thereby demonstrating the basic structure, implementation or operation method of the present invention. It should be noted that it provides a clearer explanation for this purpose. Components will likely be more complex in practice, and the range of parameters or materials used may evolve as technology advances in the future. Additionally, for ease of explanation, components shown in the drawings may not represent their actual numbers, shapes, and dimensions; Details can be adjusted according to design requirements.

In the following description and claims, the terms “include,” “comprise,” and “have” are used in an open-ended manner, meaning “including but not limited to.” It should be interpreted as Accordingly, when the terms “include,” “comprise,” and “have” are used in the description of the present invention, the corresponding feature, region, step, operation and/or component refers to The presence of one or more corresponding features, regions, steps, operations and/or components will be indicated, but are not limited thereto.

In the following description and claims, when “a B1 element is formed by/of C1,” C1 is present in the formation of the B1 element or C1 is used in the formation of the B1 element, and one or more other features , the presence and use of areas, steps, operations and/or components are not excluded from the formation of B1 components.

In the following, the term "horizontal direction" generally refers to a direction parallel to a horizontal surface, and the term "horizontal surface" generally refers to a surface parallel to the direction (X) and direction (Y) in the drawing; The terms “vertical” and “plane viewing direction” generally mean a direction parallel to the direction (Z) in the drawing, where the directions (X, Y, and Z) are perpendicular to each other. In the following, the terms “top view” and “bottom view” generally refer to a view along a vertical direction, and the term “side view” generally refers to a view along a horizontal direction.

In the following description and claims, the term "substantially" generally means that small deviations may or may not exist. For example, the terms “substantially parallel” and “substantially along” mean that the angle between two components may be less than or equal to a certain angle threshold, such as 10 degrees, 5 degrees, 3 degrees, or 1 degree. . For example, the term “substantially aligned” means that the deviation between two components may be less than or equal to a certain difference threshold, such as 2 μm or 1 μm. For example, the term "substantially the same" means that the deviation is within 10% of a given value or range, or is average within 5%, 3%, 2%, 1%, or 0.5% of a given value or range. do.

Although terms such as first, second, third, etc. may be used to describe various constituent elements, such constituent elements are not limited by the terms. Terminology is used herein only to distinguish one component element from another component element, and unless a term is described herein, it does not relate to a manufacturing sequence. Claims may not use the same terminology, but instead may use the terms first, second, third, etc. in relation to the order in which elements are claimed. Accordingly, in the following description, a first constituent element may in the claims be a second constituent element.

It should be noted that technical features in the different embodiments described below can be replaced, recombined, or mixed with each other to constitute other embodiments without departing from the spirit of the present invention.

In the present invention, the sound generation cell can perform acoustic conversion, converting a signal (eg, an electrical signal or another suitable type of signal) into an acoustic wave. In some embodiments, the sound generating cell may be, but is not limited to, a component within a sound generating device, speaker, microspeaker, or other suitable device to convert electrical signals into acoustic waves. It is noted that operation of the acoustic generation cell means that acoustic conversion is performed by the acoustic generating cell (eg, acoustic waves are generated by actuating the acoustic generating cell with an electrical drive signal).

In use of the sound producing cell, the sound producing cell may be placed on a base. The base may be rigid or flexible, and the base may be made of silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g., polyimide (PI), polyethylene terephthalate (PET)), any other suitable material, or May include combinations. By way of example, but not limited to, the base may be a circuit board comprising a laminate (e.g., copper clad laminate (CCL)), a land grid array (LGA) board, or any other suitable board containing conductive material. No. Note that the normal direction of the base may be parallel to the direction Z in the drawing.

1 and 2, FIG. 1 is a schematic diagram of a top view illustrating a sound production cell according to a first embodiment of the present invention, and FIG. 2 is an enlarged schematic diagram showing the structure in region R1 of FIG. 1. am. As shown in FIG. 1, the sound generating cell 100 includes a membrane 110 and at least one anchor structure 120 outside the membrane 110, and the membrane 110 includes the anchor structure 120. It is connected to and anchored by the anchor structure 120. For example, but not limited to, membrane 110 may be surrounded by anchor structure 120.

During operation of the sound generating cell 100, the membrane 110 may be operated to have movement. In this embodiment, the membrane 110 can be actuated to move upward and downward, but is not limited to this. Note that, in the present invention, the terms “moving upward” and “moving downward” indicate that the membrane 110 moves substantially along direction Z. During operation of the sound generating cell 100, the anchor structure 120 may be fixed. That is, the anchor structure 120 may be a fixed end (or fixed edge) relative to the membrane 110 during operation of the sound generating cell 100.

The shape of the membrane 110 can be designed based on the requirement(s). In some embodiments, the shape of membrane 110 may be, but is not limited to, polygonal (i.e., rectangular or rectangular with a chamfer), shape with curved edges, or other suitable shape. For example, the shape of the membrane 110 shown in FIG. 1 may be a rectangle with a chamfer, but is not limited thereto.

Membrane 110 and anchor structure 120 may include any suitable material(s). In some embodiments, membrane 110 and anchor structure 120 individually include silicon (e.g., single crystalline silicon or polycrystalline silicon), a silicon compound (e.g., silicon carbide, silicon oxide), germanium, a germanium compound (e.g., gallium), nitride or gallium arsenide), gallium, gallium compounds, or combinations thereof, but are not limited thereto. Membrane 110 and anchor structure 120 may have the same material or different materials.

In the present invention, the membrane 110 may include a plurality of subparts. As shown in FIG. 1 , membrane 110 includes a first membrane subpart 112 and a second membrane subpart 114, wherein the first membrane subpart 112 and the second membrane subpart 114 ) are opposite each other in plan view (i.e., the first membrane subpart 112 and the second membrane subpart 114 are opposite each other in a horizontal direction (i.e., Y direction) perpendicular to the plan view direction (i.e., Z direction). opposite), only one edge of the first membrane subpart 112 is anchored by being connected to the anchor structure 120, and only one edge of the second membrane subpart 114 is connected to the anchor structure 120. is anchored by being anchored, and the other edges of the first membrane subpart 112 and the other edges of the second membrane subpart 114 are not anchored and connected to the anchor structure 120 (such edges are hereinafter referred to as “non- (referred to as a “non-anchored edge”). That is, in FIG. 1 , the first anchored edge 112a of the first membrane subpart 112 is only one edge of the first membrane subpart 112 that is anchored, and the first anchored edge 112a of the first membrane subpart 112 is the only edge of the first membrane subpart 112 that is anchored. The second anchored edge 114a is only one edge of the second membrane subpart 114 that is anchored, and the first membrane subpart 112 is only connected to the anchor structure 120 via the first anchored edge 112a. ), and the second membrane subpart 114 is directly connected to the anchor structure 120 only through the second anchored edge 114a. In the present invention, the first anchored edge 112a and the second anchored edge 114a may be fully or partially anchored. For example, in the embodiment shown in Figure 1, first anchored edge 112a and second anchored edge 114a are fully anchored.

As shown in FIG. 1, the membrane 110 has a plurality of slits (SL), and the membrane 110 may be divided into subparts by the slit(s) (SL). In the present invention, the slit SL may have at least one straight pattern, at least one curved pattern, or a combination thereof, and the width of the slit SL must be sufficiently small. For example, the width of the slit SL may range from 1 μm to 5 μm, but is not limited thereto.

1 and 2, the membrane 110 may have a first slit (SL1), at least one second slit (SL2), and at least one third slit (SL3), and the first slit (SL1) It may be formed between the first membrane subpart 112 and the second membrane subpart 114, and the second slit SL2 may be formed between the first membrane subpart 112 and the anchor structure 120. The third slit (SL3) may be formed between the second membrane subpart 114 and the anchor structure 120, and the end of the second slit (SL2) is located at the corner region (CR) of the membrane 110 ( shown in FIG. 2 ) and the end of the third slit ( SL3 ) can be located in another corner region (CR) of the membrane 110 . For example, in Figure 1, the membrane 110 may have one straight first slit (SL1), two second slits (SL2), and two third slits (SL3), and the first membrane subpart ( 112) may be between two second slits SL2 in a plan view, and the second membrane subpart 114 may be between two third slits SL3 in a plan view, but is not limited thereto.

In Figure 1, a non-anchored edge of each subpart can be achieved by a slit (SL). With respect to the first membrane subpart 112, a first non-anchored edge 112n1 opposing the first anchored edge 112a in plan view may be defined by a first slit SL1, A second non-anchored edge 112n2 adjacent to the first anchored edge 112a is defined by a second slit SL2. With respect to the second membrane subpart 114, a third non-anchored edge 114n3 opposing the second anchored edge 114a in plan view may be defined by a first slit SL1, The fourth non-anchored edge 114n4 adjacent to the second anchored edge 114a is defined by the third slit SL3.

In the present invention, the shape of the subparts of the membrane 110 may be designed based on the requirement(s), and the shape of the subparts of the membrane 110 may be polygonal (i.e., rectangular), curved edge, or other suitable shape. Shapes can be shapes. For example, in Figure 1, the shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 can be substantially rectangular, and the first membrane subpart 112 and the second membrane subpart ( 114) may be substantially congruent, but is not limited thereto. Accordingly, in Figure 1, the second non-anchored edge 112n2 may be adjacent to and between the first non-anchored edge 112n1 and the first anchored edge 112a, and the fourth non-anchored edge 112n2 may be adjacent to and between the first non-anchored edge 112n1 and the first anchored edge 112a. The anchored edge 114n4 may be adjacent to and between the third non-anchored edge 114n3 and the second anchored edge 114a, but is not limited thereto. In Figure 1, the second slit (SL2) and the third slit (SL3) are connected to the first slit (SL1). For example, the first slit (SL1) may be connected between two second slits (SL2) and between two third slits (SL3), but is not limited thereto.

Since the shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 may be substantially rectangular, a first anchored edge 112a, a first non-anchored edge 112n1, The second anchored edge 114a and the third non-anchored edge 114n3 are substantially parallel to each other and have substantially the same length, and the second non-anchored edge 112n2 and the fourth non-anchored edge (114n4) are substantially parallel to each other (i.e., parallel to direction (X)) and have substantially the same length. That is, the first slit SL1 defining the first non-anchored edge 112n1 and the third non-anchored edge 114n3 is the first anchored edge 112a and the second anchored edge 114a. is parallel to

In some embodiments, in Figure 1, the second slit SL2 and the third slit SL3 may be connected, such that the second slit SL2 and the third slit SL3 form a long straight slit. They may be combined, but are not limited thereto.

As shown in Figure 1, the first anchored edge 112a of the first membrane subpart 112 is one of the edges of the membrane 110, and the second anchored edge 112a of the second membrane subpart 114 is one of the edges of the membrane 110. (114a) is another one of the edges of the membrane 110. The second non-anchored edge 112n2 of the first membrane subpart 112 may or may not be one of the edges of the membrane 110, and the fourth non-anchored edge of the second membrane subpart 114 ( 114n4) may or may not be one of the edges of the membrane 110. For example, in Figure 1, the second non-anchored edge 112n2 of the first membrane subpart 112 may not be an edge of the membrane 110, and the fourth non-anchored edge 112n2 of the second membrane subpart 114 may not be an edge of the membrane 110. Anchored edge 114n4 may not be an edge of membrane 110, such that second slit SL2 may be between first membrane subpart 112 and one of the edges of membrane 110 in plan view. and the third slit SL3 may be, but is not limited to, between the second membrane subpart 114 and one of the edges of the membrane 110 in the plan view.

Note that the slits SL may release residual stresses in the membrane 110, which may be created during the manufacturing process of the membrane 110 or are originally present in the membrane 110.

The sound generating cell 100 may include an actuation layer 130 disposed on the membrane 110 in the Z direction and configured to actuate the membrane 110 . In some embodiments, as shown in Figure 1, operational layer 130 may not completely overlap membrane 110 in plan view. For example, in Figure 1, the operating layer 130 may be disposed on the first membrane subpart 112 and the second membrane subpart 114, and the operating layer 130 may be disposed on the first membrane subpart (114) in the plan view. It may overlap with a portion of 112) and a portion of the second membrane subpart 114. Optionally, in FIG. 1 , actuation layer 130 may be disposed on and overlap anchor structure 120 , and actuation layer 130 may overlap an anchored edge of a subpart of membrane 110. However, it is not limited to this.

As shown in Figure 1, in the top view, in order to improve the reliability of the slit SL and the operating layer 130, there may be a distance between the operating layer 130 and the slit SL, but is not limited to this. .

Actuating layer 130 may include an actuator with a monotonic electromechanical converting function for movement of membrane 110 along direction Z. In some embodiments, actuation layer 130 may include, but is not limited to, a piezoelectric actuator, electrostatic actuator, nanoscopic-electrostatic-drive (NED) actuator, electromagnetic actuator, or any other suitable actuator. For example, in one embodiment, actuating layer 130 may include a piezoelectric actuator, such as comprising two electrodes and a layer of piezoelectric material (e.g., lead zirconate titanate, PZT) disposed between the electrodes. ), and the piezoelectric material layer may actuate the membrane 110 based on a drive signal (eg, drive voltage) received by the electrode, but is not limited thereto. For example, in other embodiments, actuation layer 130 may include an electromagnetic actuator (e.g., a planar coil) that moves membrane 110 based on a received drive signal (e.g., drive current) and magnetic field. (i.e., the membrane 110 may be operated by electromagnetic force), but is not limited thereto. For example, in another embodiment, the actuating layer 130 may include an electrostatic actuator (e.g., a conductive plate) or a NED actuator, wherein the electrostatic actuator or NED actuator receives a received drive signal (e.g., a drive voltage) and electrostatic The membrane 110 may be actuated based on a field (i.e., the membrane 110 may be actuated by electrostatic forces), but is not limited thereto.

The membrane 110 is actuated by the actuating layer 130 to move along the direction Z, thereby performing acoustic transduction. That is, the subparts of the membrane 110 can be operated to perform up and down movements, thereby performing acoustic conversion. Note that the acoustic wave is generated due to the movement of the membrane 110 actuated by the actuating layer 130, and the movement of the membrane 110 is related to the sound pressure level (SPL) of the acoustic wave.

When the subpart performs an up and down movement, an opening in direction Z may be formed and adjacent to all its non-anchored edges. For example, during operation of the sound generating cell 100, the first non-anchored edge 112n1 of the first membrane subpart 112 and the third non-anchored edge of the second membrane subpart 114 ( A central opening may be formed between 114n3), between the second non-anchored edge 112n2 of the first membrane subpart 112 and the anchor structure 120 and between the second non-anchored edge 112n2 of the first membrane subpart 112 and the anchor structure 120. 4 Side openings may be formed between the non-anchored edge 114n4 and the anchor structure 120, respectively.

The subparts of membrane 110 move along the same or opposite directions based on requirement(s). In some embodiments, the first membrane subpart 112 and the second membrane subpart 114 can move up and down synchronously in direction Z (i.e., the first membrane subpart 112 and the second membrane subpart 114 the subparts 114 may be actuated to move towards the same direction), preventing a large central opening between the first membrane subpart 112 and the second membrane subpart 114 from forming, but not limited thereto. No.

Actuation layer 130 may actuate membrane 110 to generate acoustic waves based on received drive signal(s). The acoustic wave corresponds to the input audio signal, and the drive signal applied on the operating layer 130 corresponds to (is related to) the input audio signal.

The short side of the sound producing cell 100 (or membrane 110) may be beneficial for obtaining a higher resonant frequency, and the sound producing cell 100 (or membrane 110) may be beneficial for obtaining a higher resonant frequency. Note that the long side of can be beneficial for expanding the SPL. In other words, a sound producing cell 100 (or membrane 110) with a large aspect ratio, i.e. the ratio of the length of its long side to the length of its short side, has a higher resonant frequency and Both larger SPLs can be achieved. The aspect ratio for the sound producing cell 100 (or membrane 110) may depend on the actual requirements. For example, the aspect ratio of the sound generating cell 100 (or membrane 110) may be, but is not limited to, greater than 2 to improve the performance of the sound generating cell 100.

Hereinafter, details of the method of manufacturing the sound generating cell 100 will be further described by way of example. Note that in the following manufacturing method, the actuating layer 130 within the sound generating cell 100 may include, for example, but is not limited to, a piezoelectric actuator. Any suitable type of actuator may be included in the actuating layer 130 of the sound producing cell 100.

In the following manufacturing methods, the formation process may include atomic layer deposition (ALD), chemical vapor deposition (CVD), and other suitable process(es) or combinations thereof. The patterning process may include, for example, photolithography, an etching process, any other suitable process(s), or a combination thereof.

Referring to FIGS. 3 to 8, FIGS. 3 to 8 are schematic diagrams illustrating structures at different stages of a method of manufacturing a sound generating cell according to an embodiment of the present invention. In this embodiment, the sound generating cell 100 may be manufactured by at least one semiconductor process to become a MEMS chip, but is not limited thereto. As shown in FIG. 3, a wafer (WF) is provided, and the wafer (WF) may include a first layer (WL1) and a second layer (WL2), and may optionally include the first layer (WL1) and the second layer (WL2). An insulating layer (WL3) may be included between the two layers (WL2).

The first layer (WL1), the insulating layer (WL3) and the second layer (WL2) may individually include any suitable material such that the wafer (WF) may be of any suitable type. For example, the first layer (WL1) and the second layer (WL2) may individually be made of silicon (e.g., single crystal silicon or polycrystalline silicon), a silicon compound (e.g., silicon carbide, silicon oxide), germanium, or a germanium compound (e.g., gallium nitride). , gallium arsenide), gallium, gallium compounds, or combinations thereof, but are not limited thereto. In some embodiments, the first layer WL1 may include single crystal silicon, and thus the wafer WF may be a silicon on insulator (SOI) wafer, but is not limited thereto. For example, the insulating layer WL3 may include, but is not limited to, an oxide such as silicon oxide (eg, silicon dioxide). The thicknesses of the first layer (WL1), the insulating layer (WL3) and the second layer (WL2) can be individually adjusted based on the requirement(s).

In Figure 3, the compensation oxide layer (CPS) is optionally on the top side of the wafer (WF), the top side being above the top surface (WL1a) of the first layer (WL1) opposite the second layer (WL2). may be formed, so that the first layer (WL1) is between the compensation oxide layer (CPS) and the second layer (WL2). The material of the oxide contained in the compensation oxide layer (CPS) and the thickness of the compensation oxide layer (CPS) can be designed based on the requirement(s).

3 , the first conductive layer CT1 and the working material AM may be formed sequentially on the top side of the wafer WF (on the first layer WL1), thus forming the first conductive layer ( CT1) may be between the actuating material (AM) and the first layer (WL1). In some embodiments, the first conductive layer (CT1) may be in contact with the actuating material (AM).

The first conductive layer (CT1) may comprise any suitable conductive material and the actuating material (AM) may comprise any suitable material. In some embodiments, the first conductive layer (CT1) may include a metal (such as platinum) and the actuating material (AM) may include, but is not limited to, a piezoelectric material. For example, the piezoelectric material may include, but is not limited to, a lead-zirconate-titanate (PZT) material. Moreover, the thickness of the first conductive layer (CT1) and the actuating material (AM) can be adjusted individually based on the requirement(s).

Then, in Figure 3, the working material (AM), the first conductive layer (CT1) and the compensation oxide layer (CPS) may be patterned sequentially.

As shown in Figure 4, a isolation insulating layer (SIL) may be formed and patterned on the working material (AM). The thickness of the isolation insulating layer (SIL) and the material of the isolation insulating layer (SIL) may be designed based on the requirement(s). For example, the material of the isolation insulating layer (SIL) may be, but is not limited to, oxide.

As shown in FIG. 4, a second conductive layer (CT2) may be formed on the working material (AM) and the isolation insulating layer (SIL), and then the second conductive layer (CT2) may be patterned. . The thickness of the second conductive layer CT2 and the material of the second conductive layer CT2 can be designed based on requirement(s). For example, the second conductive layer CT2 may include a metal (eg, platinum), but is not limited thereto. For example, the second conductive layer (CT2) may be in contact with the actuating material (AM).

The actuating material (AM), the first conductive layer (CT1) and the second conductive layer (CT2) are such that the actuating layer (130) has a piezoelectric actuator comprising two electrodes and the actuating material (AM) between the two electrodes. Thus, it may be a sub-layer in the operating layer 130 of the sound generating cell 100 (for example, the first conductive layer CT1 and the second conductive layer CT2 are each the first electrode and the operating layer 130 in the operating layer 130). acts as a second electrode).

In FIG. 4 , the separation insulating layer (SIL) may be configured to separate at least a portion of the first conductive layer (CT1) from at least a portion of the second conductive layer (CT2).

As shown in FIG. 5 , the first layer WL1 of the wafer WF may be patterned to form a trench line TL. In FIG. 5 , the trench line TL is a portion where the first layer WL1 is removed. That is, the trench line TL is between two portions of the first layer WL1.

As shown in FIG. 6, the wafer WF is disposed on the substrate SB and the adhesive layer AL, and the adhesive layer AL is connected to the substrate SB and the first layer WL1 of the wafer WF. glued between In Figure 6, operational layer 130 is between wafer WF and substrate SB. Due to this step, the first layer WL1 of the wafer WF and the structures on the top side of the wafer WF (i.e. structures above the top surface WL1a of the wafer WF) can be protected in subsequent steps. there is.

As shown in FIG. 7, the second layer WL2 of the wafer WF is patterned such that the second layer WL2 forms the anchor structure 120 and the first layer WL1 forms the anchor structure 120. ) can form the anchored membrane 110. In detail, the second layer WL2 of the wafer WF may have a first component and a second component, the first component of the second layer WL2 may be removed, and the second layer WL2 The second part of may form anchor structure 120. Since the first part of the second layer WL2 is removed, the first layer WL1 forms a membrane 110, which in the plan view removes the first part of the second layer WL2. respond to that For example, the first component of the second layer WL2 may be removed by a deep reactive ion etching (DRIE) process, but is not limited thereto. When patterning the first layer WL1 of the wafer WF to form the trench line(s) TL, subparts of the membrane 110 (e.g., the first membrane subpart 112 and the second membrane Note that subpart 114) is determined.

Optionally, in FIG. 7 , since the insulating layer WL3 of the wafer WF is present, after the second layer WL2 of the wafer WF has been patterned, the corresponding first part of the second layer WL2 A portion of the insulating layer WL3 may also be removed, allowing the first layer WL1 to form the membrane 110, but is not limited to this.

Moreover, in Figure 7, the second part of the second layer WL2, the part of the insulating layer WL3 overlapping with the second part of second layer WL2, and the second part overlapping with the second part of second layer WL2 A portion of the first layer WL1 is combined to serve as the anchor structure 120.

As shown in FIG. 8, the substrate SB and the adhesive layer AL are removed by an appropriate process to complete the manufacturing of the sound generating cell 100. For example, the substrate SB and the adhesive layer AL may be removed by a peel-off process, but are not limited to this.

In FIG. 8, since the first component of the second layer WL2 is removed to form the membrane 110 included in the first layer WL1, the slit SL is formed by the membrane 110 due to the trench line TL. ) is formed within and penetrates it. Since the slit SL is formed by the trench line TL, the width of the trench line TL can be designed based on the requirements of the slit SL. For example, the width of the trench line TL may be 5 μm or less, 3 μm or less, or 2 μm or less so that the slit SL has a desired width, but is not limited thereto.

The sound generating cell of the present invention and its manufacturing method are not limited by the above embodiments. Other embodiments of the invention are described below. For ease of comparison, identical components will be labeled with the same symbol in the following. The following description relates to the differences between each embodiment, and repeated parts will not be explained redundantly.

9 and 10, FIG. 9 is a schematic diagram of a top view illustrating a sound production cell according to a second embodiment of the present invention, and FIG. 10 is an enlarged schematic diagram showing the structure in region R2 of FIG. 9. am. 9 and 10, the difference between this embodiment and the first embodiment is that the sound producing cell 200 in this embodiment is located at the corner of the sound producing cell 200 and outside the membrane 110. and a disposed recess structure (RS), which is directly connected to the slit segments (SLs) in the corner region (CR) of the membrane (110). 9, the sound producing cell 200 may include four recessed structures (RS) disposed at the four corners of the sound producing cell 200 and outside the membrane 110. , but is not limited to this.

The slit segments (SLs) in the corner region (CR) may be slits (SL) connected to the second slit (SL2) or the third slit (SL3), or the slit segments (SLs) in the corner region (CR) may be connected to the second slit (SL2) or the third slit (SL3). It may be part of the slit SL2 or a part of the third slit SL3. The slit segments SLs may have a curved pattern, a straight pattern, or a combination thereof. For example, in FIG. 10, slit segments SLs may be connected between the end of the second slit SL2 located in the corner region CR and the recess structure RS, and the slit segments SLs may be formed in a curved pattern. may have, but is not limited to this.

As shown in FIGS. 9 and 10 , recess structures RS may be formed on the anchor structure 120 and at the corners of the sound generating cell 200. For example, the sound generating cell 200 may have a first layer (WL1) and a second layer (WL2) disposed below the first layer (WL1) (e.g., FIG. 8), and the first layer (WL1) A portion may be configured to serve as membrane 110 (i.e., first layer WL1 may include membrane 110 ), and another portion of first layer WL1 may comprise membrane 110 . Surrounding and joining a second layer (WL2), which will become an anchor structure (120), the slit segments (SLs) at the corner regions (CR) of the membrane (110) can pass through the first layer (WL1), The recess structure RS may pass through the first layer WL1 and may have a lowermost portion (eg, the second layer WL2) belonging to the anchor structure 120, but is not limited thereto. In this case, with regard to the manufacturing method of the sound generating cell 200, the slit SL and recess structure RS of the membrane 110 may be patterned (etched) in the same process (same etching process).

9 and 10, the recess structure RS may have a curved pattern, and the curved pattern of the recess structure RS may be designed based on requirement(s). For example, in Figure 10, the slit segments (SLs) and recess structures (RS) in the corner region (CR) may be combined to form a pattern with a half circular arc, but are not limited to this.

The presence of curved recess structures (RS) connected to the slit segments (SLs) located in the corner regions (CR) can improve the success rate of the manufacturing process of the sound generating cell 200, thereby making the sound generating cell 200 can increase the yield. In detail, in the step of removing the substrate SB and the adhesive layer AL (e.g., a peeling process), the curved recess structure RS connected to the slit segments SLs located in the corner region CR Due to the presence, the stress concentration position may change from the corner region (CR) of the membrane 110 (e.g., the end of the slit (SL)) to the recess structure (RS), and applied to the recess structure (RS) The stress may be distributed, reducing damage to the membrane 110 during this process. Moreover, because the recess structure (RS) has a curved pattern, the stress applied to the recess structure (RS) in this process can be effectively distributed, thereby reducing damage to the recess structure (RS), thereby The success rate of the manufacturing process of the sound generating cell 200 can be improved.

Referring to Figure 11, Figure 11 is a schematic top view illustrating a sound generation cell according to a third embodiment of the present invention. As shown in FIG. 11 , the difference between this embodiment and the first embodiment is that the membrane 110 of the sound producing cell 300 of this embodiment includes a latch structure 310 . Under the condition that the first membrane subpart 112 and the second membrane subpart 114 move along the direction Z (i.e., the direction normal to the base on which the membrane 110 is disposed), the latch structure 310 , when the movement distance of the first membrane subpart 112 along the direction Z and the movement distance of the second membrane subpart 114 along the direction Z are greater than the threshold value, the first membrane subpart ( 112) and the second membrane subpart 114 can be locked. That is, the latch structure 310 is configured to limit the movement distance of the first membrane subpart 112 and the second membrane subpart 114.

Because the subparts of membrane 110 have only one anchored edge, the subparts of membrane 110 may be fragile and may be damaged during the manufacturing process. In this embodiment, the presence of the latch structure 310 may improve the success rate of manufacturing the membrane 110, thereby increasing the yield of the sound producing cell 300. In particular, in the step of removing the substrate SB and the adhesive layer AL (e.g. a peeling process), the first membrane subpart 112 along the direction Z due to the adhesive force of the adhesive layer AL displacement of and displacement of the second membrane subpart 114 is caused. In this case, the latch structure 310 causes the first membrane subpart 112 and the second membrane subpart 114 to move along the direction Z with a displacement greater than a threshold value. (112) and the second membrane subpart 114 can be locked, thereby restricting the movement of the first membrane subpart 112 and the second membrane subpart 114, and the first membrane subpart 112 and By providing a restoring force to the second membrane subpart 114, damage to the membrane 110 is reduced.

Latch structure 310 may have any suitable design based on requirement(s). In this embodiment, the latch structure 310 shown in FIG. 11 may be formed by slit(s) SL. For example, in FIG. 11, the latch structure 310 may be formed by two first slits SL1 and three fourth slits SL4 and SL4', and the first slit SL1 and the fourth slit (SL1) SL4 and SL4') may be between the first membrane subpart 112 and the second membrane subpart 114, and the three fourth slits (SL4 and SL4') may be between the two first slits (SL1). can be connected to In FIG. 11, the first slits SL1 may be parallel to each other, but is not limited thereto. In FIG. 11, the fourth slit SL4' extending along the direction X may be connected between two fourth slits SL4 extending along the direction Y, and the fourth slit SL4' extending along the direction Y The fourth slit SL4 may be connected between the fourth slit SL4' extending along the direction X and the first slit SL1 extending along the direction X, but is not limited to this.

As shown in Figure 11, latch structure 310 may include a first latch component 312 and a second latch component 314, where the first latch component 312 is a first membrane sub. may be part of part 112 (equivalently, first latch component 312 may belong to first membrane subpart 112), and second latch component 314 may be part of second membrane subpart 112. 114 (equivalently, second latch component 314 may belong to second membrane subpart 114). 11 , the first latch component 312 may be disposed between the second latch component 314 of the second membrane subpart 114 and another portion of the second membrane subpart 114, Two latch components 314 may be disposed between the first latch component 312 of first membrane subpart 112 and another portion of first membrane subpart 112 . For example, in Figure 11, the longitudinal direction of the first latch component 312 and the longitudinal direction of the second latch component 314 may be substantially parallel to direction X, but are not limited thereto.

When first membrane subpart 112 and second membrane subpart 114 move along direction Z with a displacement greater than a threshold, first latch component 312 and second latch component 314 Buckled to, locking the first membrane subpart 112 and the second membrane subpart 114. Note that the width of the slit SL and the size of the latch component are related to the buckled effect of the latch structure 310.

Referring to Figure 12, Figure 12 is a schematic top view illustrating a sound production cell according to a fourth embodiment of the present invention. As shown in Figure 12, the difference between this embodiment and the first embodiment is that the membrane 110 of the sound producing cell 400 of this embodiment includes at least one spring connected between subparts of the membrane 110. It includes, and the number of spring(s) can be designed based on the required condition(s). In FIG. 12 , the membrane 110 may include a first spring (SPR1) directly connected between the first membrane subpart 112 and the second membrane subpart 114.

Due to the presence of the first spring SPR1, the success rate of manufacturing the membrane 110 can be improved, thereby increasing the yield of the sound generating cell 400. In detail, in the step of removing the substrate SB and the adhesive layer AL, the displacement of the first membrane subpart 112 and the second membrane along the direction Z due to the adhesive force of the adhesive layer AL Displacement of subpart 114 is caused. When the first membrane subpart 112 and the second membrane subpart 114 move along the direction Z with a large displacement, the first spring SPR1 moves the first membrane subpart 112 and the second membrane subpart 114. It may limit movement of part 114 and provide resilience to first membrane subpart 112 and second membrane subpart 114, thereby reducing damage to membrane 110.

The spring may have any suitable design based on requirement(s). As shown in FIG. 12, the first spring SPR1 may be formed by the slit(s) SL. In this embodiment, the first spring SPR1 shown in FIG. 12 may be formed by two first slits SL1 and two fifth slits SL5, and the fifth slit SL5 is the first slit SL5. It may be connected to the slit SL1, and the fifth slit SL5 may have a curved pattern. For example, the fifth slit SL5 may include a hook-shaped curved pattern, and one end of the fifth slit SL5 is not connected to the other slit SL, but the present invention is not limited thereto. For example, the first slits SL1 may be parallel to each other, but is not limited thereto.

When the membrane 110 moves, stress caused by deformation of the membrane 110 may be applied to the spring. In FIG. 12 , because the fifth slit SL5 includes a curved pattern (i.e., a hook-shaped curved pattern), the influence of stress concentration can be reduced, and thus the membrane 110 and the first spring Damage to (SPR1) can be reduced, thereby increasing the yield of the sound generation cell 400.

Moreover, as shown in FIG. 12 , the connection direction from the first spring SPR1 to the first membrane subpart 112 is the same as the connection direction from the first spring SPR1 to the second membrane subpart 114 may be different from For example, in Figure 12, the connection direction from the first spring (SPR1) to the first membrane subpart 112 may be opposite to the connection direction from the first spring (SPR1) to the second membrane subpart 114. , but is not limited to this. For example, in FIG. 12, the first spring SPR1 may be substantially 1-shaped, but is not limited thereto.

Referring to Figure 13, Figure 13 is a schematic top view illustrating a sound generation cell according to a fifth embodiment of the present invention. As shown in Figure 13, the difference between this embodiment and the fourth embodiment is the design of the first spring SPR1. In Figure 13, the first spring (SPR1) of the membrane 110 of the sound generating cell 500 is formed by two first slits (SL1), two fifth slits (SL5) and a sixth slit (SL6) The two fifth slits (SL5) can be connected to the same first slit (SL1), the sixth slit (SL6) can be connected to another first slit (SL1), and the fifth slit (SL5) may have two curved patterns and one straight pattern, and the sixth slit SL6 is between the two fifth slits SL5 and may have a curved pattern. For example, the fifth slit SL5 may include a hook-shaped curved pattern, and one end of the fifth slit SL5 is not connected to the other slit SL, but the present invention is not limited thereto.

Moreover, in the first spring SPR1 shown in FIG. 13 the direction of connection from the first spring SPR1 to the first membrane subpart 112 is from the first spring SPR1 to the second membrane subpart 114 It may be the same as the connection direction, but is not limited to this. For example, in FIG. 13, the first spring SPR1 may be substantially U-shaped, but is not limited thereto. Due to this design, the size of the central opening between the first membrane subpart 112 and the second membrane subpart 114 is reduced, thereby reducing air leakage during operation of the sound generating cell 500. .

When the membrane 110 moves, stress caused by deformation of the membrane 110 may be applied to the spring. 13 , due to the design of the U-shaped first spring SPR1 with a curved slit SL, the influence of stress concentration can be reduced, and thus the membrane 110 and the first spring SPR1 Damage to is reduced, thereby increasing the yield of the sound generation cell 500.

14 and 15, FIG. 14 is a schematic diagram of a top view illustrating a sound production cell according to a sixth embodiment of the present invention, and FIG. 15 is an enlarged schematic diagram showing the structure in region R3 of FIG. 14. am. 14 and 15, the difference between this embodiment and the first embodiment is that the membrane 110 of the sound producing cell 600 of this embodiment has a third membrane subpart 116 and a fourth membrane subpart 116. It further includes a membrane subpart 118. The third membrane subpart 116 and the fourth membrane subpart 118 may be disposed in plan view between the first membrane subpart 112 and the second membrane subpart 114, and the third membrane subpart ( 116) and the fourth membrane subpart 118 may face each other in plan view. In other words, the third membrane subpart 116 is separated from the first membrane subpart 112 and the second membrane subpart 114 in the top view by the first side (e.g., left) of the sound producing cell 600. The fourth membrane subpart 118 may be disposed between the first membrane subpart 112 and the second membrane subpart 112 in the top view by the second side (e.g., right side) of the sound generating cell 600. 114 , and the first and second sides of the sound generating cell 600 may face each other in plan view.

14 , only one edge of the third membrane subpart 116 can be anchored by connecting to the anchor structure 120 and only one edge of the fourth membrane subpart 118 can be anchored by connecting to the anchor structure 120. and the other edge of the third membrane subpart 116 and the other edge of the fourth membrane subpart 118 may be unanchored and not connected to the anchor structure 120 . That is, the third anchored edge 116a of the third membrane subpart 116 is only one edge of the third membrane subpart 116 that is anchored, and the fourth anchored edge 116a of the fourth membrane subpart 118 is anchored. Edge 118a is only one edge of anchored fourth membrane subpart 118, and third membrane subpart 116 is directly connected to anchor structure 120 only via third anchored edge 116a. and the fourth membrane subpart 118 may be directly connected to the anchor structure 120 only through the fourth anchored edge 118a.

In FIG. 14 , one second slit SL2 is connected to one second non-anchored edge 112n2 of the first membrane subpart 112 and one fifth non-anchored edge 112n2 of the third membrane subpart 116. It may be between the first membrane subpart 112 and the third membrane subpart 116 to define the anchored edge 116n5, and another second slit SL2 may be located between the first membrane subpart 112. the first membrane subpart 112 and the fourth membrane subpart to define one sixth non-anchored edge 118n6 of the other second non-anchored edge 112n2 and the fourth membrane subpart 118 It may be between the parts 118 , wherein one third slit (SL3) is located at one fourth non-anchored edge 114n4 of the second membrane subpart 114 and one third slit SL3 of the third membrane subpart 116. There may be between the second membrane subpart 114 and the third membrane subpart 116 to define another fifth non-anchored edge 116n5, and another third slit SL3 may be located between the second membrane subpart 116n5. with second membrane subpart 114 to define another fourth non-anchored edge 114n4 of part 114 and another sixth non-anchored edge 118n6 of fourth membrane subpart 118. It may be between the fourth membrane subparts 118. In some embodiments, the fifth non-anchored edge 116n5 of the third membrane subpart 116 may be adjacent the third anchored edge 116a of the third membrane subpart 116, and the fourth The sixth non-anchored edge 118n6 of the membrane subpart 118 may be adjacent to the fourth anchored edge 118a of the fourth membrane subpart 118, but is not limited to this.

14 , the shape of the first membrane subpart 112 and the shape of the second membrane subpart 114 may be substantially trapezoidal, and the shape of the third membrane subpart 116 and the fourth membrane subpart 114 may be substantially trapezoidal. The shape of the membrane subpart 118 may be substantially triangular, the first membrane subpart 112 and the second membrane subpart 114 may be substantially congruent, the third membrane subpart 116 and The fourth membrane subpart 118 may be, but is not limited to, substantially congruent.

During operation of the sound producing cell 600, the side openings are between the first membrane subpart 112 and the third membrane subpart 116, the second membrane subpart 114 and the third membrane subpart 116, respectively. ), between the first membrane subpart 112 and the fourth membrane subpart 118, and between the second membrane subpart 114 and the fourth membrane subpart 118. The size of the side openings is relative to the low frequency roll-off (LFRO) effect in the frequency response of the sound generating cell 600, where a strong LFRO effect can cause a pronounced SPL drop of the acoustic wave at low frequencies.

In detail, with respect to the side opening of the sound generating cell 600, the acoustic resistance to low frequencies can follow the formula: , where R is the acoustic resistance to low frequencies, L is the thickness of the membrane 110, and b is the length of the second non-anchored edge 112n2 of the first membrane subpart 112 or the second membrane subpart is the length of the fourth non-anchored edge 114n4 of 114, and d is the maximum size of the side opening in direction Z. As the acoustic resistance to low frequencies increases, air leakage (eg, acoustic leakage) during operation of the sound generating cell 600 is reduced, thereby reducing the LFRO effect in the frequency response of the sound generating cell 600.

According to the formula, when d (i.e. the maximum size of the lateral opening in direction Z) is reduced, the acoustic resistance to low frequencies increases. In the first embodiment shown in Figure 1, with respect to the first membrane subpart 112, the maximum size of the side opening in direction Z is the second non-anchored edge 112n2 in direction Z. ) is the maximum distance between the anchor structure 120. In the sixth embodiment shown in FIG. 14 , with respect to the first membrane subpart 112, the maximum size of the lateral opening in direction Z is that of the first membrane subpart 112 in direction Z. the second non-anchored edge 112n2 and the fifth non-anchored edge 116n5 of the third membrane subpart 116 (or the sixth non-anchored edge 118n6 of the fourth membrane subpart 118) )) is the maximum distance between In the sixth embodiment shown in FIG. 14 , because the third membrane subpart 116 and the fourth membrane subpart 118 are present, d shown in the equation is It can be reduced by controlling the membrane subpart 116 and the fourth membrane subpart 118 closer to the first membrane subpart 112 and the second membrane subpart 114 in the direction Z. That is, in FIG. 14, the third membrane subpart 116 may be configured to reduce acoustic leakage on the first side (left side) of the sound generating cell 600, and the fourth membrane subpart 118 may be configured to reduce acoustic leakage. It is configured to reduce acoustic leakage on the second side (right) of the production cell.

The sound producing cell 600 may include at least one suitable structure to improve acoustic resistance to low frequencies by reducing d (i.e., the maximum size of the lateral opening in direction Z). In this embodiment, due to this suitable structure, during operation of the sound generating cell 600, the fifth non-anchored edge 116n5 of the third membrane subpart 116, respectively, moves in the direction Z. It may be close to the second non-anchored edge 112n2 of the first membrane subpart 112 and the fourth non-anchored edge 114n4 of the second membrane subpart 114, and the fourth membrane subpart ( The sixth non-anchored edge 118n6 of 118 is connected to the second non-anchored edge 112n2 of the first membrane subpart 112 and the second membrane subpart 114 in the direction Z, respectively. It may be close to the fourth non-anchored edge 114n4. Accordingly, during operation of the sound generating cell 600, the size of the side opening can be reduced, improving the acoustic resistance to low frequencies, thereby reducing the LFRO effect in the frequency response of the sound generating cell 600. there is.

For example, to reduce d, the membrane 110 may include at least one spring connected between subparts of the membrane 110 such that the non-anchored edges of these subparts are connected to the sound generating cell 600. ) can be close to each other in the direction (Z) during operation. As shown in FIG. 14, the membrane 110 may include at least one second spring (SPR2) and at least one third spring (SPR3), where the second spring (SPR2) is a first membrane subpart. There may be a direct connection between 112 and the third membrane subpart 116, or a direct connection between the first membrane subpart 112 and the fourth membrane subpart 118, and a third spring SPR3 Can be directly connected between the second membrane subpart 114 and the third membrane subpart 116 or between the second membrane subpart 114 and the fourth membrane subpart 118. In FIG. 14 , the membrane 110 may include two second springs (SPR2) and two third springs (SPR3), where the two second springs (SPR2) each form a first membrane subpart 112. ) and the third membrane subpart 116 and between the first membrane subpart 112 and the fourth membrane subpart 118, respectively, and the two third springs SPR3 are respectively connected to the second A connection may be made between the membrane subpart 114 and the third membrane subpart 116 and between the second membrane subpart 114 and the fourth membrane subpart 118, but is not limited thereto. The second spring SPR2 and the third spring SPR3 are due to a slit SL (e.g., a slit SL other than the first slit SL1, the second slit SL2, and the third slit SL3). Note the formation.

Moreover, in one spring shown in FIG. 14, the direction of connection from this spring to one subpart may be the same as the direction of connection from this spring to another subpart, but is not limited to this. For example, in Figure 14, the spring may be substantially U-shaped, but is not limited thereto. For example, the U-shape of the spring may have a large curvature, but is not limited thereto. Due to this design, the size of the side opening between the two subparts can be reduced (i.e., d is reduced), thereby reducing the leakage of air during operation of the sound generating cell 600, thereby reducing the sound generation. Reduces the LFRO effect in the frequency response of the cell 600.

For example, to reduce d, the operating layer 130 is on the first membrane subpart 112, the second membrane subpart 114, the third membrane subpart 116, and the fourth membrane subpart 118. can be placed in During operation of the sound producing cell 600, the actuating layer 130 can actuate this subpart to move along direction Z, such that the non-anchored edge of this subpart moves in direction Z. can be close to each other.

Moreover, in region R3 shown in FIG. 15 , the sound generating cell 600 may include a recessed structure (RS) outside the membrane 110 , where the recessed structure (RS) is positioned outside the membrane 110 . may be directly connected to the slit segments (SLs) in the corner regions (CR) of has exist). For example, in FIG. 15, slit segments SLs may be connected between the end of the second slit SL2 located in the corner region CR and the recess structure RS, and the slit segments SLs may have a straight pattern. You may have it, but you are not limited to this. The presence of curved recess structures (RS) connected to the slit segments (SLs) located in the corner regions (CR) can improve the success rate of the manufacturing process of the sound generating cell 600, thereby making the sound generating cell 600 can increase the yield.

Referring to Figure 16, Figure 16 is a schematic top view illustrating a sound generation cell according to a seventh embodiment of the present invention. As shown in Figure 16, the difference between this embodiment and the sixth embodiment is the design of the spring. In the sound generating cell 700 shown in FIG. 16, the fifth slit (SL5) including a hook-shaped curved pattern and a straight pattern is connected to the first slit (SL1), the second slit (SL2), or the third slit (SL1). SL3), and the second spring (SPR2) and the third spring (SPR3) are connected to the first slit (SL1), the second slit (SL2), the third slit (SL3), and the fifth slit (SL5) It may be formed due to, but is not limited to. Moreover, in Figure 16, the spring may be substantially V-shaped, but is not limited thereto.

Referring to FIG. 17, FIG. 17 is a schematic top view illustrating a sound generating cell according to an eighth embodiment of the present invention. As shown in FIG. 17 , the difference between this embodiment and the sixth embodiment is that the slit SL in the membrane 110 of the sound generating cell 800 is connected to the third membrane subpart 116 and/or the third membrane subpart 116. 4 and further includes at least one side slit (SLi) formed on the membrane subpart 118.

Due to the presence of the side slit (SLi), the structural strength of the third membrane subpart 116 and the fourth membrane subpart 118 may be weakened, and thus the second spring (SPR2) and the third spring (SPR3) ) can pull the third membrane subpart 116 and the fourth membrane subpart 118 so that the membrane subpart 118 orients their non-anchored edges during operation of the sound generating cell 800. (Z) to bring it closer to the non-anchored edges of the first membrane subpart 112 and the second membrane subpart 114.

On the other hand, compared to a structure in which no side slit (SLi) is present, the membrane 110 of this embodiment has one original slit between the two non-anchored edges of the subpart during the operation of the sound generating cell 800. may form a plurality of smaller openings replacing the larger openings of )(SLi). That is, d of the original larger aperture is changed to a plurality of d' of the smaller aperture, and d' is smaller than d. For example, according to the formula above, assuming that one original larger aperture is replaced by three smaller apertures and that d of the original larger aperture is 3 times larger than d' of the smaller aperture, then three smaller apertures are replaced by three smaller apertures. The acoustic resistance of the aperture is 9 times greater than that of the original larger aperture. Accordingly, the acoustic resistance to low frequencies can be increased with this design.

As shown in FIG. 17, the second spring SPR2 may be formed by the first slit SL1, the second slit SL2, the fifth slit SL5, and the side slit(s) SLi. , the third spring SPR3 may be formed by the first slit SL1, the third slit SL3, the fifth slit SL5, and the side slit(s) SLi, but is not limited thereto.

In some embodiments, as shown in FIG. 17, operational layer 130 may be disposed on first membrane subpart 112 and second membrane subpart 114, and operational layer 130 may be disposed on first membrane subpart 112 and second membrane subpart 114. 3 may not be disposed on the membrane subpart 116 and the fourth membrane subpart 118 (i.e., no operating layer may be disposed on the third membrane subpart 116 and the fourth membrane subpart 118). (not limited to this), but not limited thereto.

Moreover, in FIG. 17 , the membrane 110 may optionally include a first spring (SPR1) directly connected between the first membrane subpart 112 and the second membrane subpart 114. For example, the first spring SPR1 shown in FIG. 17 may be formed by two first slits SL1 and two fifth slits SL5, but is not limited thereto.

Referring to FIGS. 18 and 19, FIG. 18 is a schematic diagram of a plan view illustrating a sound generating cell according to a ninth embodiment of the present invention, and FIG. 19 is a schematic diagram illustrating a sound generating cell according to a ninth embodiment of the present invention. 18 and 19 show only the first membrane subpart 112, and the design of the second membrane subpart 114 may be similar to that of the first membrane subpart 112. As shown in Figure 18, the difference between this embodiment and the first embodiment is the design of the anchored edges of the subparts of the membrane 110. In the sound producing cell 900 of this embodiment, the anchored edges of the subparts of the membrane 110 are partially anchored, such that the anchored edges are divided into at least one anchored part and at least one non-anchored part. Includes, the anchored part of the anchored edge is anchored, and the non-anchored part of the anchored edge is not anchored. For example, in Figure 18, the first anchored edge 112a of the partially anchored first membrane subpart 112 has two anchored parts AP and one between the two anchored parts AP. It may include, but is not limited to, a non-anchored part (NP). The non-anchored part (NP) of the first anchored edge 112a moves in the direction Z when the sound generating cell 900 is activated (i.e., when the first membrane subpart 112 is activated). By moving towards, the deformation of the membrane 110 can be improved, thereby increasing the SPL of the acoustic wave generated by the sound generating cell 900.

The slit (SL) of the membrane 110 may include at least one internal slit such that the anchored edge has anchored part(s) (AP) and non-anchored part(s) (NP). . In this embodiment, the first membrane subpart 112 may have at least one first internal slit (SLn1) and at least one second internal slit (SLn2), and the length of the first anchored edge 112a -The anchored part (NP) may be defined by a first internal slit (SLn1), and the second internal slit (SLn2) is connected to the first internal slit (SLn1), so that the first anchored edge (112a) It has anchored part(s) (AP) and non-anchored part(s) (NP). That is, the first internal slit SLn1 may be parallel to the first anchored edge 112a and may be between the first membrane subpart 112 and the anchor structure 120, and the second internal slit SLn2 ) may not be parallel to the first anchored edge 112a. For example, in Figure 18, the first membrane subpart 112 may have one first slit (SL1) and two second slits (SL2), and the second inner slit (SLn2) is located at the first anchored edge. It may be, but is not limited to, a straight slit perpendicular to (112a). For example, the second internal slit SLn2 may extend from the first anchored edge 112a toward the first slit SL1, and the second internal slit SLn2 may be connected to the first slit SL1. It may not work.

The first internal slit SLn1 defining the non-anchored part NP of the first anchored edge 112a may be connected between the two slits SL. For example, in FIG. 18 , the first inner slit SLn1 may be connected between two second inner slits SLn2, and thus the anchored part AP of the first anchored edge 112a and the non- The anchored part NP may be divided by the second internal slit SLn2, but is not limited thereto.

Optionally, in FIG. 18, the first inner slit (SLn1) and the second inner slit (SLn2) may be separated from the first slit (SL1), the second slit (SL2), and the third slit (SL3), but Not limited.

As shown in FIG. 18, the first membrane subpart 112 may be divided into a plurality of parts by an internal slit (SL). For example, in Figure 18, first membrane subpart 112 can be divided into three parts 912p1, 912p2, and 912p3, with parts 912p1 and 912p3 having a second slit SL2 and It may be between the second internal slits SLn2, and the component 912p2 may be between the two second slits SL2. For example, in FIG. 18 , part 912p1 and part 912p3 have an anchored part AP of a first anchored edge 112a, so that they can be anchored by anchor structure 120 . For example, in FIG. 18 , component 912p2 may have a non-anchored part (NP) of the first anchored edge 112a, such that component 912p2 may be present during operation of sound generating cell 900. It can move along the direction Z with a larger displacement (compared to parts 912p1 and 912p3), thereby increasing the SPL of the acoustic wave generated by the sound generating cell 900.

As shown in Figure 18, the operating layer 130 includes three parts disposed on each of the three parts 912p1, 912p2 and 912p3 of the first membrane subpart 112, Part 112 can be operated.

19 , which shows a side view of the sound generating cell 900 during operation of the sound generating cell 900, component 912p2 is more active (compared to components 912p1 and 912p3) during operation of the sound producing cell 900. It may move along the direction Z with a large displacement, and the non-anchored part NP of the first anchored edge 112a may be higher than the anchored part AP in the direction Z.

Referring to FIG. 20, FIG. 20 is a schematic top view illustrating a sound generating cell according to Embodiment 10 of the present invention. As shown in Figure 20, the difference between this embodiment and the ninth embodiment is the design of the anchored edges of the subparts of the membrane 110. In the sound producing cell 900' shown in FIG. 20, the first anchored edge 112a of the first membrane subpart 112 is divided into two non-anchored parts (NP) and two non-anchored parts. (NP) may include, but is not limited to, one anchored part (AP) between them. 20, the first membrane subpart 112 may have two first internal slits (SLn1) and two second internal slits (SLn2), where the first internal slit (SLn1) has a second internal slit (SLn1). It may be connected between SLn2) and the second slit (SL2), but is not limited to this.

In FIG. 20 , component 912p2 has an anchored part (AP) of a first anchored edge 112a so that it can be anchored by anchor structure 120 . 20, parts 912p1 and 912p3 may have a non-anchored part (NP) of the first anchored edge 112a, such that parts 912p1 and 912p3 may produce sound. During operation of the cell 900' it can move along the direction Z with a larger displacement (compared to the part 912p2), thereby increasing the SPL of the acoustic wave generated by the sound generating cell 900'. .

Hereinafter, details about the package structure (PKG) of the sound generating cell (SPC) will be further described by way of example. The package structure (PKG) is not limited by the following exemplary embodiments, and the package structure (PKG) is an embodiment of the sound generation cell (SPC) (e.g., the above-described Note that it is possible to have one of the embodiments or a combination thereof).

Referring to FIGS. 21 to 23, FIG. 21 is a schematic diagram showing a package structure according to an embodiment of the present invention, FIG. 22 is a schematic diagram of a bottom view showing the package structure shown in FIG. 21, and FIG. 23 is a schematic diagram showing a package structure according to an embodiment of the present invention. A schematic diagram of a cross-sectional view illustrating the package structure shown in FIG. 21. As shown in FIGS. 21 to 23, the package structure (PKG) of the sound generating cell (SPC) of the present invention includes a base (BS), a cover (HS) disposed on the base (BS), and a cover (HS) and the sound producing cell (SPC) disposed within, where the sound producing cell (SPC) is between the base (BS) and the cover (HS).

The base (BS) may be rigid or flexible and may include any suitable material. For example, the base (BS) may include silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g. PI, PET), any other suitable material, or combinations thereof. For example, as shown in FIGS. 21 to 23, the base BS is a laminate (e.g., a copper clad laminate (CCL), a land grid array (LGA) board, or a conductive board. The base (BS) may be a circuit board comprising any other suitable board comprising materials, the base (BS) having one or more connection trace(s), active component(s), passive component(s) and/or connection pad(s). For example, as shown in FIG. 22, the base BS has at least one conductive layer CDB, and the acoustic layer is on the opposite side of the base BS. A production cell (SPC) and a conductive layer (CDB) are disposed, the conductive structure (CDB) includes a plurality of conductive pads (CPC) and a conductive ring (CRC), and the conductive pad (CPC) is a sound generation cell (SPC). It is configured to be electrically connected between the external device and the package structure (PKG).

The base BS may be substantially parallel to the X and Y directions (that is, the normal direction of the base BS may be substantially parallel to the Z direction), but is not limited thereto. For example, as shown in FIGS. 21 to 23, the base BS may be substantially parallel to the membrane 110 of the sound generating cell (SPC), but is not limited thereto.

The cover HS may include an upper structure TS and at least one side wall SW, and the side wall SW is located between the base BS and the upper structure TS. In some embodiments, the base BS and the upper structure TS may be substantially parallel to each other. For example, as shown in FIGS. 21 to 23, the upper structure TS may be substantially parallel to the X and Y directions (i.e., the normal direction of the upper structure TS may be substantially parallel to the Z direction). may be parallel, and the side wall(s) (SW) is in the Z direction, but is not limited to this. For example, in FIGS. 21-23 , the top structure TS may be substantially parallel to the membrane 110 of the sound producing cell (SPC), and the side wall(s) (SW) may be substantially parallel to the membrane 110 of the sound producing cell (SPC). It may surround, but is not limited to this.

The top structure (TS) and side walls (SW) may be rigid or flexible and may include any suitable material. For example, the top structure (TS) and side walls (SW) may individually be made of silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (e.g. PI, PET), any other suitable material, or a combination thereof. It can be included. For example, referring to FIGS. 21 to 23 , the upper structure TS and the side wall SW may include metal to form an integrated structure (eg, a cap), but are not limited thereto.

As shown in FIGS. 21 to 23, a sound generating cell (SPC) is disposed on the base (BS), and the cavity (CV) inside the cover (HS) is divided into two cells by the membrane of the sound generating cell (SPC). It may be divided into sub-cavities (ie, a first sub-cavity (CV1) and a second sub-cavity (CV2)), where the membrane 110 is between the two sub-cavities. The first sub-cavity (CV1) may be between the membrane 110 and the upper structure (TS), and the second sub-cavity (CV2) may be between the membrane 110 and the base (BS).

Additionally, as shown in FIGS. 21 to 23, at least one first cover opening OP1 and at least one second cover opening OP2 may be individually formed in the cover HS or the base BS. The first cover opening OP1 may be connected to the first sub-cavity CV1, the second cover opening OP1 may be connected to the cover opening OP2, and the cover opening OP2 may be connected to the second sub-cavity CV2. For example, the first cover opening OP1 may be a sound outlet, but is not limited thereto. For example, as shown in FIGS. 21 to 23, the first cover opening OP1 may be formed in the upper structure TS, and the second cover opening OP2 may be formed in the base BS. It is not limited to this.

The number of first cover openings OP1, the arrangement of the first cover openings OP1, the number of second cover openings OP2, and the arrangement of the second cover openings OP2 can be designed according to requirements.

In some embodiments, one first cover opening (OP1) and/or one second cover opening (OP2) is a package structure (PKG) that generates an acoustic wave with the highest SPL from a sound generating cell (SPC). It can correspond to the area of . For example (FIGS. 21 to 23), one first cover opening OP1 may be located at the planar center of the upper structure TS (or the center of the side wall SW) and/or one second cover opening OP1 may be located at the center of the upper structure TS. The cover opening OP2 may be located at the center of the base BS in a plane view, but is not limited thereto. For example, one first cover opening (OP1) and/or one second cover opening (OP2) may correspond to the center of the membrane 110 in the normal direction (i.e., Z direction) of the base BS. However, it is not limited to this. For example, each membrane 110 may correspond to at least one first cover opening OP1 and/or at least one second cover opening OP2.

For example (e.g., Figure 27), when the cover HS includes a plurality of first cover openings OP1 (or a plurality of second cover openings OP2), the first cover opening OP1 (or The second cover opening (OP2) may be arranged in a plurality of columns extending along one direction (e.g., X direction) and/or a plurality of rows extending along another direction (e.g., Y direction), but is limited thereto. It doesn't work. For example, when the cover HS includes a plurality of first cover openings OP1 (or a plurality of second cover openings OP2), the first cover opening OP1 (or the second cover opening OP2) )) may be arranged in an array form, but is not limited thereto. .

The planar pattern of the first cover opening (OP1) and the planar pattern of the second cover opening (OP2) may be designed according to requirements. For example, the planar pattern of the cover openings may be polygonal (eg, rectangular, hexagonal, etc.), circular, or other suitable shape.

The size of the first cover opening OP1 and the size of the second cover opening OP2 can be designed according to requirements, and the protective effect of the cover HS is determined by the sound outlet (e.g., the first cover opening OP1). ) becomes larger as the size decreases, and as the total area of the sound outlet (eg, the first cover opening OP1) increases, the acoustic resistance of the cover HS decreases. Accordingly, in some embodiments, the size of the acoustic outlet (e.g., first cover opening OP1) decreases as the number of acoustic outlet(s) increases, such that the cover HS has a high protective effect and low acoustic resistance. Have it.

The sound producing cell (SPC) may be electrically connected to external devices using any suitable method. For example, as shown in FIGS. 21 to 23, the sound generating cell (SPC) may be electrically connected to an external device through a conductive component (e.g., connection pad (CPC)) of the base (BS). , but is not limited to this.

In the present invention, the sound generating cell (SPC) can be electrically connected to a control unit that generates a driving signal, and the driving signal can be applied to the driving layer 130 to drive the membrane 110. Controllers can be placed within the package structure (PKG) or outside the package structure (PKG).

The method of forming the package structure (PKG) may be any suitable forming method. In the forming method of some embodiments, the cover HS and the base BS may be provided, and the sound producing cell (SPC) may be manufactured by the above-described method. Then, the sound generating cell (SPC) may be placed on the base (BS) and within the cover (HS). For example, the sound generating cell (SPC) is disposed on the base BS before the cover HS is disposed on the base BS, but the present invention is not limited to this. For example, the second cover opening(s) OP2 is formed on the base BS before the sound producing cell SPC is placed on the base BS, and the first cover opening(s) OP1 is formed on the cover HS before the sound generating cell SPC is disposed within the cover HS, but is not limited thereto.

Referring to FIG. 24, FIG. 24 is a schematic diagram showing a package structure according to an embodiment of the present invention. As shown in FIG. 24, the first cover opening OP1 may not be located at the center of the upper structure TS in a plan view, but is not limited thereto. As shown in FIG. 24, the first cover opening OP1 may correspond to the center of the membrane 110 in the normal direction (i.e., Z direction) of the base BS, but is not limited thereto.

Referring to FIGS. 25 and 26, FIG. 25 is a diagram schematically showing a package structure according to an embodiment of the present invention, and FIG. 26 is a schematic cross-sectional view illustrating the package structure shown in FIG. 25. As shown in FIGS. 25 and 26, the first cover opening OP1 may be formed in the side wall SW of the cover HS, but is not limited thereto.

Referring to FIGS. 27 and 28, FIG. 27 is a diagram schematically showing a package structure according to an embodiment of the present invention, and FIG. 28 is a schematic cross-sectional view illustrating the package structure shown in FIG. 27. As shown in FIGS. 27 and 28, the upper structure TS (or side wall SW) of the cover HS of the package structure PKG may have a plurality of first cover openings OP1, and the first cover openings OP1 The cover openings OP1 may be small or very small. For example, the size of the first cover opening OP1 may be 10%, 5%, 3%, or 1% or less of the upper structure TS of the cover HS, but is not limited thereto.

Since the upper structure (TS) has a plurality of small first cover openings (OP1), the upper structure (TS) of the present invention has a high sound generation cell (SPC) when the acoustic resistance of the upper structure (TS) is low. It will provide physical protection. . For example, the superstructure (TS) of the present invention may produce sound during subsequent use of the package structure (PKG) (e.g., operation of the sound producing cell (SPC), the process of placing the package structure (PKG) in the device). By protecting the cell (SPC), the yield of the package structure (PKG) and the yield of the device can be improved, but are not limited to this. In addition, due to the presence of the upper structure TS having a plurality of first cover openings OP1, it is difficult for external objects (eg, dust, foreign substances, sharp objects, etc.) to enter the package structure PKG.

In the first frequency response of the membrane 110 of the sound producing cell (SPC) before being placed in the package structure (PKG), the minimum resonance peak of the membrane 110 is generated at the first frequency (i.e., the first frequency is (110) is the minimum resonance frequency), and has a first peak value (i.e., SPL). In the second frequency response of the membrane 110 of the sound producing cell (SPC) disposed in the package structure (PKG), the minimum resonance peak of the membrane 110 is generated at the second frequency (i.e., the second frequency is 110), and has a second peak value (i.e., SPL). In some embodiments, the first frequency is greater than the second frequency, and/or the first peak value is greater than the second peak value.

In the second frequency response of the membrane 110 of the sound producing cell (SPC) after placement in the package structure (PKG), a second frequency (i.e., minimum resonance frequency) and a second peak value (i.e., peak of minimum resonance peak) value) decreases as the total area of the first cover opening OP1 decreases. In some embodiments, the difference between the first and second frequencies may be greater than or equal to 1000 Hz, 2000 Hz, 5000 Hz, or other suitable value. Accordingly, the minimum resonance frequency of the membrane 110 and the peak value of the minimum resonance peak of the membrane 110 in the package structure PKG may be changed by adjusting the total area of the first cover opening OP1.

In the following, details of the device (APT) comprising the above-described sound producing cell (SPC) will be described further illustratively, wherein the device (APT) may be headphones, earphones, earbuds or other suitable sound producing devices. there is. The device (APT) is not limited by the following exemplary embodiments, and the sound generating cell (SPC) included in the device (APT) is limited to embodiments (e.g., the above embodiments) that do not depart from the spirit of the present invention. one of the examples or a combination of the above examples).

Referring to Figure 29, Figure 29 is a schematic diagram of a cross-sectional view illustrating a device according to an embodiment of the present invention. As shown in FIG. 29, the device (APT) may include a housing (OC), a package structure (PKG) of a sound generating cell (SPC), and a device base (BS_AS), where the package structure (PKG) is a device base. It can be placed on (BS_AS) and inside the housing (OC). Note that the package structure (PKG) of the sound producing cell (SPC) may be one of the above-described embodiments or a combination of the above-described embodiments.

The device base (BS_AS) may include silicon, germanium, glass, plastic, quartz, sapphire, metal, polymer (eg, PI, PET), any other suitable material, or combinations thereof. For example, as shown in FIG. 29, the device base (BS_AS) can be a laminate (e.g., copper clad laminate (CCL)), a land grid array (LGA) board, or any other suitable board containing a conductive material. The device base (BS_AS) may include one or more conductive component(s) such as connection trace(s), active component(s), passive component(s), and/or connection pad(s). It can be included.

As shown in FIG. 29, the device base BS_AS can have at least one device base opening BS_ASp, and the second sub-cavity CV2 of the package structure PKG is the second sub-cavity CV2 of the package structure PKG. 2 It can be connected to the device base opening (BS_ASp) of the device base (BS_AS) through the cover opening (OP2).

As shown in FIG. 29, the housing OC may have at least one discharge opening OCp, and the first sub-cavity CV1 of the package structure PKG may have a first cover of the package structure PKG. It can be connected to the front exterior of the device (APT) through the opening (OP1) and the outlet opening (OCp) of the housing (OC).

Optionally, the housing OC of this embodiment secures the device base BS_AS and the package structure PKG and includes a first sub-cavity CV1 and a second sub-cavity CV2 within the device APT. To separate the device base (BS_AS) and the package structure (PKG) from each other, the device base (BS_AS) and the package structure (PKG) may be clamped (e.g., the housing (OC) may be clamped to the sidewall(s) of the device base (BS_AS) and the sidewalls of the package structure (PKG). (s) (SW)), but is not limited thereto. Optionally, the device (APT) may further include a gasket, the gasket may be disposed between the package structure (PKG) and the housing (OC), the gasket may surround the outlet opening(s) (OCp). may, but is not limited to this.

29, the package structure (PKG) can be assembled to the device (APT) via a surface mount technique, and a conductive adhesive layer (e.g., including solder) is assembled to the device base (BS_AS) and the package structure (BS_AS) by a surface mount technique. It is placed between the bases (BS) of the PKG), so that the package structure (PKG) is placed on the device base (BS_AS).

In the present invention, since surface mount technology is performed, the package structure (PKG) containing the sound generating cell (SPC) needs to be designed to withstand the highest processing temperature of surface mount technology. As a result, the package structure (PKG) has a heat resistance temperature with an upper limit higher than the highest process temperature of the surface mount technology, so that no breakage of the package structure (PKG) occurs and the package structure (PKG) remains intact even after performing the surface mount technology. will maintain normal operation (i.e., sound waves can be generated normally). In some embodiments, the highest processing temperature for surface mount technology may range from 240°C to 250°C, and thus the upper limit of the heat resistance temperature of the package structure (PKG) may be higher than 240°C or higher than 250°C, but limited thereto. It doesn't work. Additionally, in some embodiments, each material included in the package structure (PKG) has a heat resistance temperature that has an upper limit higher than the highest processing temperature of the surface mount technology, ensuring that the package structure (PKG) is not damaged during the surface mount technology. do. For example, each material included in the package structure (PKG) has a heat resistance temperature with an upper limit of 240°C or higher or 250°C or higher, but is not limited thereto.

Surface mounting technology is described below. The surface mounting technology below is an example, and some steps are omitted to make the description of the surface mounting technology clear.

In the process of surface mount technology, a device base (BS)_AS may first be provided, having at least one conductive pad (BS_ASc), at least one conductive trace and a device base opening (BS_Asp), wherein the conductive pad (BS_ASc) and The device base opening (BS_Asp) may be formed prior to performing surface mount technology. Next, a conductive adhesive layer (CAL) is placed on the conductive pad (BS_ASc) of the device base (BS_AS). For example, the conductive adhesive layer (CAL) may be printed on the device base (BS_AS), but is not limited thereto. Next, electronic components such as the package structure (PKG) of the sound generating cell (SPC) are placed on the conductive adhesive layer (CAL) and brought into contact. The conductive pad (CPC) of the package structure (PKG) contacts the conductive adhesive layer (CAL). Thereafter, a temperature raising step (e.g., a reflow step) is performed to increase the process temperature so that the conductive adhesive layer (CAL) melts and the conductive pad (BS_ASc) of the device base (BS_AS) and the conductive pad of the package structure (PKG) are melted. It is bonded to (CPC). As a result, the package structure (PKG) is placed on the device base (BS_AS) using surface mounting technology and is electrically connected to the conductive pad (BS_ASc) through a conductive adhesive layer (CAL).

Because some components (e.g. rubber suspension and/or adhesive materials attached to the coil) cannot withstand the highest processing temperatures of surface mount technology, conventional speakers (or conventional sound producing devices) cannot withstand the highest processing temperatures of surface mount technology. production devices), surface mount technology cannot be used. In contrast, in the present invention, since the package structure (PKG) is designed to withstand the highest process temperature of surface mounting technology, damage to the package structure (PKG) does not occur, and the package structure (PKG) operates normally even after surface mounting technology. It can work. In addition, since the present invention applies surface mounting technology, there is no need to perform a wire bonding method/process (a method/process using a conductive wire to electrically connect between electronic components and the device base (BS_AS)), so the device ( The lateral size of the APT) can be significantly reduced.

The method of forming the device (APT) may be any suitable forming method. In the method of forming the device (APT) of some embodiments, the package structure (PKG) may be formed by the method described above. The package structure (PKG) can then be assembled into the device (APT) containing the housing (OC) via surface mount technology. For example, the package structure (PKG) is placed on the device base (BS_AS) of the device (APT) via surface mount technology.

Referring to Figure 30, Figure 30 is a schematic diagram illustrating a device according to an embodiment of the present invention. As shown in FIG. 30, the device (APT) of this embodiment may include a package structure (PKG) of a sound generating cell (SPC) and two venting devices (VD), all of which are housed in a housing (OC). can be placed within.

The venting device VD is configured to form or close a vent, and the internal cavity CVi of the device APT is connected to the periphery of the device APT via the vent when the vent is formed. As shown in Figure 30, the venting device (VD) includes a venting substrate (ST_V) having at least one substrate opening (OPV), a covering structure (CS_V) disposed on the venting substrate (ST_V), and a venting substrate (ST_V). and a film structure (TF_V) disposed between the covering structure (CS_V), wherein the film structure (TF_V) is configured to be operative to form or close a vent, and the covering structure (CS_V) is configured to cover the film structure (TF_V). It is configured to cover and protect and has at least one lid opening (not shown in the drawings). Once the vent is formed by the film structure (TF_V), the airflow passes through the lid opening of the covering structure (CS_V), the vent, and the substrate opening (OPV) of the venting substrate (ST_V) into the internal cavity (CVi) of the device (APT). It can be connected to the surroundings of the device (APT).

The venting device (VD) may be configured to suppress occlusion effects during operation of the sound producing cell (SPC). The occlusion effect occurs due to the enclosed volume of the ear canal causing a sound pressure that is significantly perceived by the user (i.e. the listener). In some cases, while the user performs certain movements that produce bone conduction sound (e.g. walking, jogging, talking, eating, touching an acoustic transducer, etc.) and uses a device (APT) placed in the user's ear canal, the occlusion effect occurs. Occurrence occurs, and the occlusion effect causes the user to hear occlusion noise, thereby degrading the user's listening quality. In this embodiment, the vent of the venting device VD can be formed or closed depending on the presence or absence of an occlusion effect. When an occlusion effect occurs, a vent in the exhaust device VD is formed so that the volume of the ear canal is not sealed, thus suppressing the occlusion effect. If the occlusion effect does not occur, the vent of the venting device (VD) is closed to improve the quality of the acoustic waves generated by the device (APT). Therefore, the presence of the venting device (VD) may improve the performance and experience of the user using the device (APT).

In the embodiment shown in FIG. 30, the two venting devices VD may be arranged symmetrically, but the present invention is not limited thereto. In one embodiment, the venting device (VD) may be a MEMS device or a package containing a MEMS structure.

In one embodiment, the apparatus APT may further include a sensing device, and the vents of the venting device VD are formed or closed based on sensing results generated by the sensing device. For example, the sensing device may include a motion sensor, a force sensor, a light sensor, an acceleration sensor, a pressure sensor, an altitude sensor, a proximity sensor, or a combination thereof.

The venting device (VD), package structure (PKG), and sensing device may be coupled to a controller, and the controller may generate signals to control the venting device (VD), package structure (PKG), and sensing device.

Details or variations of venting devices, controllers and sensing devices are disclosed in U.S. Application Nos. 17/344,980, 17/344,983, 17/842,810 and 18/172,346, the disclosures of which are incorporated in their entirety. They are incorporated herein by reference and constitute a part of this specification.

In the present invention, a cell having a different function from the sound generating cell may also have a structure that is a structure of the sound generating cell of one of the above embodiments or a combination of the above embodiments. Therefore, the manufacturing method of this cell may refer to the manufacturing method of the above-described sound generating cell, and the structure and forming method of the package structure including this cell may refer to the structure and forming method of the package structure of the sound generating cell described above. The structure and forming method of the device including this cell may refer to the structure and forming method of the above-described device including the sound generating cell (or including the package structure including the sound generating cell). there is.

In some embodiments, cells disposed within the package structure of the present invention may have different acoustic functions than the sound producing cells. In some embodiments, a cell disposed within the package structure of the present invention may be a venting cell within a venting device configured to suppress occlusion effects during operation of the sound producing cell by forming or closing a vent. For example, in a variant embodiment of the device (APT) shown in Figure 30. The venting device VD, which is a package structure, may include a venting cell including the above-described structure (i.e., one or a combination of the embodiments shown in FIGS. 1 to 20), thereby providing a film structure for the venting cell. (TF_V) or the design of the membrane design may refer to the design of one or a combination of the embodiments shown in FIGS. 1 to 20 (e.g., FIG. 11), and the design of the covering structure (CS_V) may refer to the design of FIGS. 21 to 20 (e.g., FIG. 11). Reference may be made to one or a combination of the embodiments shown in Figure 28 (e.g., Figures 21-23). Note that, in this variant embodiment, the sound producing cell (SPC) may include the structures described herein or other suitable structures.

In summary, according to the design of the sound generation or venting cell of the present invention, the sound generation or venting cell can achieve higher resonant frequency, greater SPL, higher yield and/or lower air leakage. Additionally, some cells that have different functions from the sound generation cell may refer to the sound generation cell.

Those skilled in the art will readily appreciate that numerous modifications and variations of the apparatus and methods may be made while retaining the teachings of the present invention. Accordingly, the above disclosure should be construed as limited only by the scope of the appended claims.

Claims (24)

As a package structure,
cover; and
Cells placed within the cover
Including,
The cell is:
A membrane comprising a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite each other in a plan view along a planar viewing direction, wherein the first membrane subpart and wherein the second membrane subparts oppose each other in a first direction perpendicular to the planar viewing direction;
an operating layer disposed on the first membrane subpart and the second membrane subpart in the plan view direction; and
anchor structure, wherein the membrane is anchored by the anchor structure;
Including,
The first membrane subpart includes a first anchored edge completely or partially connected to the anchor structure, such that it is completely or partially anchored by the anchor structure, and a first anchored edge other than the first anchored edge. the edges of the first membrane subpart are not anchored,
The second membrane subpart includes a second anchored edge fully or partially connected to the anchor structure, such that the second membrane subpart is completely or partially anchored by the anchor structure, and the second membrane other than the second anchored edge The edges of the subpart are not anchored,
package structure. According to paragraph 1,
The package structure of claim 1, wherein the cover includes a top structure and a side wall, the top structure being substantially parallel to the membrane, and a first cover opening formed on the top structure. According to paragraph 1,
The package structure of claim 1, wherein the cover includes a top structure and a side wall, wherein a first cover opening is formed on the side wall. According to paragraph 1,
The package structure of claim 1, wherein the cover includes a top structure and a side wall, the top structure being substantially parallel to the membrane, and a plurality of first cover openings formed on the top structure. According to paragraph 1,
The package structure of claim 1 , wherein the first ratio of the membrane is greater than 2, and wherein the first ratio of the membrane is, in a plan view, the ratio of a first length of the first side to a second length of the second side of the membrane. According to paragraph 1,
The membrane is
a first slit formed between the first membrane subpart and the second membrane subpart, wherein a first non-anchored edge of the first membrane subpart is defined by the first slit, and the first non-anchor the anchored edge opposes the first anchored edge in plan view; and
a second slit, wherein a second non-anchored edge of the first membrane subpart is defined by the second slit, the second non-anchored edge adjacent the first anchored edge, and
A package structure containing . According to paragraph 1,
A package structure comprising a recess structure disposed at a corner of the cell and configured to distribute stresses applied to the recess structure during a peeling process. According to paragraph 1,
A package structure comprising four recess structures disposed at four corners of the cell and configured to distribute stresses applied to the recess structures during a peeling process. According to paragraph 1,
the membrane includes a latch structure configured to limit the movement distance of the first membrane subpart and the second membrane subpart;
The moving distance is a distance along the normal direction of the base where the cell is placed,
package structure. According to paragraph 1,
The package structure wherein the membrane further includes a first spring directly connected between the first membrane subpart and the second membrane subpart. According to paragraph 1,
the membrane comprises a third membrane subpart,
the third membrane subpart is disposed by the first side of the cell in plan view between the first membrane subpart and the second membrane subpart,
the third membrane subpart is configured to reduce acoustic leakage at the first side of the cell,
wherein the third membrane subpart includes a third anchored edge that is anchored, and edges of the third membrane subpart other than the third anchored edge are not anchored,
package structure. According to paragraph 1,
the first anchored edge is partially anchored;
the first anchored edge includes at least one anchored part and at least one non-anchored part, wherein at least one anchored part is anchored and at least one non-anchored part is not anchored;
wherein the at least one non-anchored part of the first anchored edge moves toward the normal direction of the base on which the cell is disposed when the first membrane subpart is actuated.
package structure. housing; and
Package structure according to paragraph 1
A device containing a. According to clause 13,
A device wherein the device is a headphone, earphone, or earbud. A method of forming a package structure, comprising:
performing a manufacturing method to manufacture a cell; and
Placing the cell within the cover
Including,
The manufacturing method is:
providing a wafer comprising a first layer and a second layer; and
Patterning the first layer of the wafer to form at least one trench line.
Including,
the first layer comprising a membrane anchored by the anchor structure of the cell, the at least one trench line forming at least one slit in and through the membrane;
The membrane includes a first membrane subpart and a second membrane subpart, the first membrane subpart and the second membrane subpart facing each other in a plan view along a planar viewing direction, wherein the first membrane subpart the part and the second membrane subpart oppose each other in a first direction perpendicular to the planar viewing direction;
The first membrane subpart includes a first anchored edge fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and the first membrane other than the first anchored edge. The edges of the subpart are not anchored;
The second membrane subpart includes a second anchored edge fully or partially connected to the anchor structure to be completely or partially anchored by the anchor structure, and the second membrane other than the second anchored edge. The edges of the subpart are not anchored,
How to form. According to clause 15,
further comprising forming a first cover opening in the cover prior to placing the cell within the cover,
wherein the cover includes a top structure and a side wall, the top structure being substantially parallel to the membrane, and the first cover opening being formed on the top structure.
How to form. According to clause 15,
further comprising forming a first cover opening in the cover prior to placing the cell within the cover,
wherein the cover includes an upper structure and a side wall, and the first cover opening is formed on the side wall,
How to form. According to clause 15,
further comprising forming a plurality of first cover openings on the cover prior to placing the cell within the cover,
wherein the cover includes a top structure and a side wall, the top structure being substantially parallel to the membrane, and the first cover opening being formed on the top structure.
How to form. According to clause 15,
The manufacturing method further includes forming a recess structure at the edge of the cell,
How to form. According to clause 15,
The manufacturing method further includes forming a latch structure that limits the moving distance of the first membrane sub-part and the second membrane sub-part,
The moving distance is a distance along the normal direction of the base on which the cell is placed,
How to form. According to clause 15,
The manufacturing method further comprises forming a spring between the first membrane subpart and the second membrane subpart,
How to form. According to clause 15,
The manufacturing method further comprises patterning the first layer of the wafer such that the membrane further includes a third membrane subpart and a fourth membrane subpart,
the third membrane subpart is configured to reduce acoustic leakage at the first side of the cell;
wherein the fourth membrane subpart is configured to reduce acoustic leakage on the second side of the cell.
How to form. According to clause 15,
The manufacturing method further comprises forming at least one first internal slit and at least one second internal slit on the first membrane subpart,
the first anchored edge is partially fixed,
the first anchored edge includes at least one anchored part and at least one non-anchored part,
at least one non-anchored part of the first anchored edge is defined by the at least one first internal slit;
The at least one anchored part and the at least one non-anchored part are divided according to the at least one second internal slit,
How to form. A method of forming a device comprising:
forming a package structure by the forming method according to claim 15; and
Assembling the package structure into a device including a housing through surface mounting technology.
A formation method comprising: