KR20230104567A - Camera module and optical apparatus - Google Patents

Abstract

This embodiment, the circuit board; an image sensor located on an upper surface of the circuit board; a circuit element unit located on an upper surface of the circuit board and located outside the image sensor; and a base positioned on an upper surface of the circuit board, wherein an element accommodating part accommodating at least a part of the circuit element unit is formed on the base.

Description

Camera module and optical apparatus {Camera module and optical apparatus}

This embodiment relates to a camera module and an optical device.

The contents described below provide background information on the present embodiment, but do not describe the prior art.

As the spread of smart phones is widely generalized and wireless Internet services are commercialized, consumer demands related to smart phones are also diversifying, and various types of additional devices are being installed in smart phones.

Among them, a typical example is a camera module that takes a picture or video of a subject. Meanwhile, in recent camera modules, an auto focus function and an image stabilization function are becoming basic specifications. However, in the conventional camera module, due to the use of an image stabilization function, the overall length of the camera module is increased and only the camera module portion protrudes from the smartphone, which is a problem.

(Patent Document 1) US 2006-0290802 A

In order to solve the above-mentioned problem, it is intended to provide a camera module in which the electric field in the optical axis direction is minimized.

It is intended to provide an optical device including the camera module.

The camera module according to this embodiment includes a circuit board; an image sensor located on an upper surface of the circuit board; a circuit element unit located on an upper surface of the circuit board and located outside the image sensor; and a base positioned on an upper surface of the circuit board, and an element accommodating portion accommodating at least a portion of the circuit element unit may be formed on the base.

The element accommodating part may pass through the base in an optical axis direction.

The base may not overlap the circuit element unit in an optical axis direction.

The element accommodating part may include a first accommodating part located on one side of the image sensor and a second accommodating part located on the other side of the image sensor.

The circuit element unit includes first to fourth circuit elements spaced apart from each other, and the element accommodating part includes a first accommodating part accommodating the first and second circuit elements, and the third and fourth circuit elements. It includes a second accommodating portion for accommodating, and the first accommodating portion and the second accommodating portion may be spaced apart from each other by the base.

a cover member positioned above the base; a lens module positioned above the image sensor; and a filter disposed between the lens module and the image sensor, wherein the base includes a filter support portion supporting the filter and a cover member support portion supporting the cover member, and the element accommodating portion includes the filter support portion. It may be located between the support part and the cover member support part.

The filter support unit connects a first support unit supporting a part of the lower surface of the filter, a second support unit facing the side surface of the filter, and the first support unit and the second support unit to connect the circuit board A third support unit disposed on the upper surface may be included, and a length of the cover member support portion in an optical axis direction may correspond to a length of the first support unit in an optical axis direction.

A length of the second support unit in the optical axis direction may correspond to a length of the filter in the optical axis direction.

The filter may include at least one of an infrared absorption filter and an infrared reflection filter.

a cover member positioned above the base; a bobbin located inside the cover member; a first driving unit located on the bobbin; a second driving unit disposed between the cover member and the bobbin and facing the first driving unit; And it is located on the base and may further include a third driving unit facing the second driving unit.

The first driving unit may include a first coil unit, the second driving unit may include a magnet unit, and the third driving unit may include a second coil unit.

The optical device according to the present embodiment includes a circuit board; an image sensor located on an upper surface of the circuit board; a circuit element unit located on an upper surface of the circuit board and located outside the image sensor; and a base positioned on an upper surface of the circuit board, and an element accommodating portion accommodating the circuit element unit and penetrating the base in an optical axis direction may be formed on the base.

Through the present invention, the base thickness can be reduced by opening the ceiling of the upper side of the circuit element.

In addition, when the design is applied, it is possible to lower the position of the lower surface of the lens driving unit.

1 is a plan view of a camera module according to an exemplary embodiment.
Figure 2 is a cross-sectional view seen from AA of Figure 1;
3 is a cross-sectional view seen from BB in FIG. 1;
4 is a plan view showing some configurations of the camera module according to the present embodiment.
5 is a cross-sectional view seen from CC of FIG. 4 .
6 is an exploded perspective view of the lens driving unit according to the present embodiment.
7 is a cross-sectional view illustrating (a) a comparative example and (b) a camera module according to the present embodiment to explain the effect of the present embodiment.
8 is a cross-sectional view showing some configurations of a camera module according to a modified example of the present embodiment.

Hereinafter, some embodiments of the present invention will be described through exemplary drawings. In describing the reference numerals for the components of each drawing, the same numerals indicate the same components as much as possible, even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, the element may be directly connected, coupled, or connected to the other element, but not between the element and the other element. It should be understood that another component may be “connected”, “coupled” or “connected” between elements.

The "optical axis direction" used below is defined as the optical axis direction of the lens module coupled to the optical lens assembly. Meanwhile, "optical axis direction" may be used interchangeably with a vertical direction, a z-axis direction, and a vertical direction.

The "auto focus function" used below refers to focusing on a subject by adjusting the distance to the image sensor by moving the lens module in the optical axis direction according to the distance of the subject so that a clear image of the subject can be obtained from the image sensor. defined as a function. Meanwhile, “auto focus” may be used interchangeably with “auto focus (AF)”.

The “hand shake correction function” used below is defined as a function of moving or tilting a lens module in a direction perpendicular to an optical axis direction to offset vibration (movement) generated in an image sensor by an external force. Meanwhile, "hand shake correction" may be used interchangeably with "Optical Image Stabilization (OIS)".

"FBL" used below is an abbreviation of Flange Back Length and means the distance from the upper surface of the image sensor to the lower surface of the lens module. FBLs are shown as L1 and L2 in FIG. 7 .

Hereinafter, one of the AF coil unit 7220, the driving magnet unit 7320, and the OIS coil unit 7410 is referred to as a "first driving unit", the other is referred to as a "second driving unit", and the other is referred to as a "third driving unit". drive unit".

As shown in FIGS. 2 , 3 and 7 , the cover member support 420 may support the lens driving unit 700 . Hereinafter, the cover member support unit 420 may be referred to as a “lens driving unit support unit”.

Hereinafter, the configuration of the optical device according to the present embodiment will be described.

The optical device according to the present embodiment includes a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), and a portable multimedia player (PMP). ), navigation, etc., but is not limited thereto, and any device for capturing images or photos is possible.

The optical device according to the present embodiment includes a main body (not shown), a display unit (not shown) disposed on one surface of the main body to display information, and a camera module (not shown) installed in the main body to take images or photos. It may include a camera (not shown) having a time).

Hereinafter, the configuration of the camera module according to the present embodiment will be described with reference to the drawings.

1 is a plan view of a camera module according to this embodiment, FIG. 2 is a cross-sectional view taken from A-A in FIG. 1, FIG. 3 is a cross-sectional view taken from B-B in FIG. 1, and FIG. 4 is a part of the camera module according to this embodiment. FIG. 5 is a cross-sectional view seen from line C-C in FIG. 4, and FIG. 6 is an exploded perspective view of the lens driving unit according to the present embodiment.

1 to 6, the camera module according to the present embodiment includes a circuit board 100, an image sensor 200, a conducting unit 300, a first base 400, a lens module 500, a filter ( 600), a lens driving unit 700, and a circuit element unit 800. However, in the camera module according to the present embodiment, the circuit board 100, the image sensor 200, the conducting unit 300, the first base 400, the lens module 500, the filter 600, the lens driving unit ( 700), and any one or more of the circuit element unit 800 may be omitted.

An image sensor 200 may be positioned on the upper surface of the circuit board 100 . The circuit board 100 may be energized with the image sensor 200 through the conductive part 300 . The first base 400 may be located on the upper surface of the circuit board 100 . The image sensor 200 may be located inside the upper surface of the circuit board 100 and the first base 400 may be located outside. The third support unit 413 of the first base 400 may be positioned on the upper surface of the circuit board 100 . The lower surface of the first support unit 411 of the first base 400 may be in contact with the upper surface of the circuit board 100 . The circuit board 210 may supply power to first to third driving units (not shown). Control units for controlling the first to third driving units may be located on the circuit board 210 .

The image sensor 200 may be located on an upper surface of the circuit board 100 . The image sensor 200 may be energized with the circuit board 100 through the conducting part 300 . The image sensor 200 may not overlap with the first base 400 in the optical axis direction. A lens module 500 may be positioned above the image sensor 200 . A filter 600 may be positioned between the image sensor 200 and the lens module 500 . The image sensor 200 may be spaced apart from the filter 600 . The conducting part 300 may be located outside the image sensor 200 .

The image sensor 200 may be mounted on the circuit board 100 . The image sensor 200 may be accommodated inside the first base 400 . The image sensor 200 may be positioned such that an optical axis coincides with the lens module 500 . Through this, the image sensor 200 may acquire light passing through the lens module 500 . The image sensor 200 may output the acquired light as an image. The image sensor 200 may include one or more of a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID. However, it is not limited thereto.

The conducting unit 300 may conduct electricity between the image sensor 200 and the circuit board 100 . The conductive part 300 may not overlap with the first base 400 in the optical axis direction. The conductive part 300 may be spaced apart from the filter 600 . The conductive part 300 may include a wire loop positioned outside the image sensor 200 . A first base 400 may be located outside the wire loop. That is, the first base 400 may be avoided to the outside of the wire loop.

The first base 400 may be located on an upper surface of the circuit board 100 . A lens driving unit 700 may be positioned above the first base 400 . A cover member 7100 may be positioned above the first base 400 . An OIS coil unit 7410 may be located on the first base 400 . Meanwhile, either one of the first base 400 and the second base 7500 of the lens driving unit 700 may be omitted. Also, the first base 400 and the second base 7500 of the lens driving unit 700 may be integrally formed.

The first base 400 may not overlap with the image sensor 200 in the optical axis direction. The first base 400 may not overlap with the conductive part 300 in the optical axis direction. In the present embodiment, a Flange Back Length (FBL), which is a distance from the upper surface of the image sensor 200 to the lower surface of the lens module 500, can be minimized through such a structure. Furthermore, in this embodiment, the length of the camera module can also be minimized due to the minimization of the FBL.

The first base 400 may not overlap the circuit element unit 800 in the optical axis direction. That is, the upper side of the circuit element unit 800 may be open. Through this structure, the position of the lower surface of the lens driving unit 700 may be lowered. Accordingly, the overall length of the camera module can also be minimized.

The first base 400 may include a filter support 410 supporting the filter 600 . The first base 400 may include a cover member support 420 supporting the cover member 7100 . An element accommodating part 430 may be formed in the first base 400 to accommodate the circuit element unit 800 and is positioned between the filter support part 410 and the cover member support part 420 . An element accommodating portion 430 accommodating the circuit element unit 800 and penetrating the first base 400 in the optical axis direction may be formed in the first base 400 .

The filter support 410 may be separated from the cover member support 420 at least in part. An element accommodating part 430 may be formed in a spaced space between the filter support part 410 and the cover member support part 420 .

The filter support 410 may include a first support unit 411 supporting a portion of the lower surface of the filter 600 . The filter support 410 may include a second support unit 412 facing the side of the filter 600 . The filter support 410 may include a third support unit 413 positioned on the upper surface of the circuit board 100 and connecting the first support unit 411 and the second support unit 412 .

The first support unit 411 may support a part of the lower surface of the filter 600 . The lower surface of the first support unit 411 may contact the upper surface of the circuit board 100 . That is, the first support unit 411 may be directly supported by the circuit board 100 . A width of the first support unit 411 in a direction (horizontal direction) perpendicular to the optical axis direction may increase from the lower end of the first support unit 411 to the upper side. That is, the first support unit 411 may extend from the upper surface of the circuit board 100 to the lower surface of the filter 600 with an inclination.

The second support unit 412 may face the side of the filter 600 . The height of the second support unit 412 in the optical axis direction may correspond to the height of the filter 600 in the optical axis direction. That is, the second support unit 412 may not protrude upward from the filter 600 .

The third support unit 413 may connect the first support unit 411 and the second support unit 412 . The third support unit 413 may be located on the upper surface of the circuit board 100 . The first to third support units 411, 412, and 413 may be integrally formed.

The cover member support 420 may be positioned between the cover member 7100 and the circuit board 100 . The lower surface of the cover member support part 420 may be located on the upper surface of the circuit board 100 . A lower end of the cover member 7100 may be positioned on an upper surface of the cover member support 420 .

A length of the cover member support 420 in the optical axis direction may correspond to a length of the first support unit 411 in the optical axis direction. A length of the cover member support 420 in the optical axis direction may be smaller than a length of the filter support 410 in the optical axis direction. That is, the height of the cover member support 420 may be lower than the height of the filter support 410 . Accordingly, the lower surface of the lens driving unit 700 whose lower surface is supported by the cover member support 420 may be lowered. Accordingly, the overall length of the camera module can also be minimized.

The element accommodating portion 430 may be formed by omitting a part of the first base 400 . The element accommodation unit 430 may be positioned between the filter support unit 410 and the cover member support unit 420 . The element accommodating portion 430 may be of an open top type. That is, the circuit element unit 800 accommodated in the small intestine accommodation unit 430 may be exposed upward. The element accommodating portion 430 may accommodate the circuit element unit 800 . The element accommodating portion 430 may pass through the base 400 in the optical axis direction.

The element accommodating unit 430 may include a plurality of accommodating units. The element accommodating portion 430 may include first to fourth accommodating portions 431 , 432 , 433 , and 434 spaced apart from each other. However, the number of accommodating units constituting the element accommodating unit 430 is not limited to four.

The element accommodating part 430 may include a first accommodating part 431 located on one side of the image sensor 200 . The element accommodating part 430 may include a second accommodating part 432 spaced apart from the first accommodating part 431 at one side of the image sensor 200 . The element accommodating part 430 may include a third accommodating part 433 located on the other side of the image sensor 200 . That is, the third accommodating part 433 may be located on the opposite side of the first accommodating part 431 . The element accommodating part 430 may include a fourth accommodating part 434 spaced apart from the third accommodating part 433 on the other side of the image sensor 200 .

The first accommodating part 431 and the second accommodating part 432 may be located on one side of the image sensor 200 . The third accommodating part 433 and the fourth accommodating part 434 may be located on the other side of the image sensor 200 . The first accommodating part 431 and the second accommodating part 432 may be spaced apart from each other by the first base 400 . The third accommodating part 433 and the fourth accommodating part 434 may be spaced apart from each other by the first base 400 .

Each of the first to fourth accommodating units 431, 432, 433, and 434 may accommodate at least one circuit element. The first accommodating portion 431 may accommodate the first and second circuit elements 801 and 802 . Furthermore, the first accommodating part 431 may accommodate three or more circuit elements. The second accommodating portion 432 may accommodate the third and fourth circuit elements 803 and 804 . Furthermore, the second accommodating portion 432 may accommodate three or more circuit elements. The description of the first and second accommodating portions 431 and 432 may also be applied to the third and fourth accommodating portions 433 and 434 .

The lens module 500 may be positioned above the image sensor 200 . A filter 600 may be positioned between the lens module 500 and the image sensor 200 . The lens module 500 may be located inside the cover member 7100 . The lens module 500 may be fixed to the first base 400 .

The lens module 500 may include at least one lens (not shown). The lens module 500 may include a lens and a lens barrel. The lens module 500 may include one or more lenses and a lens barrel accommodating the one or more lenses. However, one component of the lens module 500 is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses is possible. The lens module 500 may be screwed to a bobbin (not shown). Alternatively, the lens module 500 may be coupled to the bobbin by an adhesive. Light passing through the lens module 500 may be irradiated onto the image sensor 200 .

The filter 600 may be positioned between the lens module 500 and the image sensor 200 . A part of the lower surface of the filter 600 may be supported by the first support unit 411 . A side of the filter 600 may face the second support unit 412 . The height of the filter 600 may correspond to the height of the second support unit 412 . The filter 600 may be spaced apart from the image sensor 200 . The filter 600 may be spaced apart from the conducting part 300 .

The filter 600 may block infrared light from being incident on the image sensor 200 . The filter 600 may include an infrared absorption filter (Blue filter). The filter 600 may include an IR cut filter. The filter 600 may be formed of a film material or a glass material. The filter 600 may be formed by coating an infrared blocking coating material on a flat plate-shaped optical filter such as a cover glass for protecting an imaging surface or a cover glass. However, it is not limited thereto.

The lens driving unit 700 includes a cover member 7100, a first mover 7200, a second mover 7300, a stator 7400, a second base 7500, a support member 7600, and a sensor unit. (7700). However, in the lens driving unit 700 according to this embodiment, the cover member 7100, the first mover 7200, the second mover 7300, the stator 7400, the second base 7500, and the support member At least one of 7600 and the sensor unit 7700 may be omitted. In particular, the sensor unit 7700 is a component for an auto focus feedback function and/or a hand shake correction feedback function and can be omitted.

The cover member 7100 may form the exterior of the lens driving unit 700 . The cover member 7100 may have a hexahedral shape with an open bottom. However, it is not limited thereto. The cover member 7100 may include a top plate 7101 and a side plate 7102 extending downward from an outside of the top plate 7101 . Meanwhile, the lower end of the side plate 7102 of the cover member 7100 may be mounted on the second base 7500 . The first mover 7200, the second mover 7300, the stator 7400, and the support member 7600 may be positioned in the inner space formed by the cover member 7100 and the second base 7500. . In addition, the inner surface of the cover member 7100 may be mounted on the second base 7500 in close contact with part or all of the side surface of the second base 7500 . Through such a structure, the cover member 7100 may protect internal components from external shocks and at the same time have a function of preventing permeation of external contaminants.

As an example, the cover member 7100 may be formed of a metal material. More specifically, the cover member 7100 may be made of a metal plate material. In this case, the cover member 7100 can block radio wave interference. That is, the cover member 7100 may block radio waves generated outside the lens driving unit 700 from flowing into the cover member 7100 . Also, the cover member 7100 may block radio waves generated inside the cover member 7100 from being emitted to the outside of the cover member 7100 . However, the material of the cover member 7100 is not limited thereto.

The cover member 7100 may include an opening 7110 formed in the upper plate 7101 to expose the lens module 500 . The opening 7110 may have a shape corresponding to that of the lens module 500 . The size of the opening 7110 may be larger than the diameter of the lens module 500 so that the lens module 500 can be assembled through the opening 7110 . In addition, light introduced through the opening 7110 may pass through the lens module 500 . Meanwhile, light passing through the lens module 500 may be transmitted to the image sensor.

The first mover 7200 may be coupled to the lens module 500 . The lens module 500 may be located inside the first mover 7200 . An outer circumferential surface of the lens module 500 may be coupled to an inner circumferential surface of the first mover 7200 . Meanwhile, the first mover 7200 may move integrally with the lens module 500 through interaction with the second mover 7300 . That is, the first mover 7200 may move the lens module 500 .

The first mover 7200 may include a bobbin 7210 and an AF coil unit 7220. The first mover 7200 may include a bobbin 7210 coupled to the lens module 500 . The first mover 7200 may include an AF coil unit 7220 that is located on the bobbin 7210 and moves by electromagnetic interaction with the driving magnet unit 7320.

The bobbin 7210 may be coupled to the lens module 500 . More specifically, the outer circumferential surface of the lens module 500 may be coupled to the inner circumferential surface of the bobbin 7210 . Meanwhile, the AF coil unit 7220 may be coupled to the bobbin 7210. In addition, the lower part of the bobbin 7210 may be coupled to the lower support member 7620, and the upper part of the bobbin 7210 may be coupled to the upper support member 7610. The bobbin 7210 may be located inside the housing 7310. The bobbin 7210 may move relative to the housing 7310 in the optical axis direction.

The bobbin 7210 may include a lens coupler 7211 formed inside. The lens module 500 may be coupled to the lens coupler 7211 . A screw thread having a shape corresponding to a screw thread formed on an outer circumferential surface of the lens module 500 may be formed on an inner circumferential surface of the lens coupler 7211 . That is, the outer circumferential surface of the lens module 500 may be screwed to the inner circumferential surface of the lens coupler 7211 . Meanwhile, an adhesive may be injected between the lens module 500 and the bobbin 7210 . At this time, the adhesive may be an epoxy cured by ultraviolet (7UV). That is, the lens module 500 and the bobbin 7210 may be bonded by UV curing epoxy. Alternatively, the lens module 500 and the bobbin 7210 may be bonded by heat-hardened epoxy.

The bobbin 7210 may include a first driving part coupling part 7212 on which the AF coil part 7220 is wound or mounted. The first driving unit coupling part 7212 may be integrally formed with the outer surface of the bobbin 7210 . In addition, the first drive unit coupling part 7212 may be continuously formed along the outer surface of the bobbin 7210 or may be formed spaced apart at predetermined intervals. The first driving part coupling part 7212 may include a recessed part formed by a part of the outer surface of the bobbin 7210 being recessed. An AF coil unit 7220 may be positioned in the depression, and in this case, the AF coil unit 7220 may be supported by the first driving unit coupling unit 7212 .

As an example, the first driving unit coupling part 7212 may be formed by protruding parts located on the upper and lower sides of the recessed part. can be direct. Alternatively, as another example, the first driving unit coupling part 7212 may be formed with an upper or lower side of the recessed part open and a hooking part provided on the other side. At this time, the coil of the first driving unit 7300 is pre-wound. It can be inserted and coupled through the open part in the state.

The bobbin 7210 may include an upper coupling portion 7213 coupled to the upper support member 7610 . The upper coupling portion 7213 may be coupled to the inner portion 7612 of the upper support member 7610 . As an example, a protrusion (not shown) of the upper coupling part 7213 may be inserted into a groove or hole (not shown) of the inner part 7612 and coupled thereto.

The bobbin 7210 may include a lower coupling portion (not shown) coupled to the lower support member 7620 . The lower coupling portion formed below the bobbin 7210 may be coupled to the inner portion 7622 of the lower support member 7620 . As an example, a protrusion (not shown) of the lower coupling portion may be inserted into a groove or hole (not shown) of the inner portion 7622 and coupled thereto.

The AF coil unit 7220 may be positioned to face the driving magnet unit 7320 of the second mover 7300 . The AF coil unit 7220 may move the bobbin 7210 relative to the housing 7310 through electromagnetic interaction with the driving magnet unit 7320 . The AF coil unit 7220 may include a coil. The coil may be guided to the first driving part coupling part 7212 and wound around the outer surface of the bobbin 7210 . Also, as another embodiment, the AF coil unit 7220 may be disposed on an outer surface of the bobbin 7210 such that four coils are independently provided so that two adjacent coils form a 90° angle to each other. The AF coil unit 7220 may receive power through the lower support member 7620 . In this case, the lower support member 7620 may be provided separately as a pair to supply power to the AF coil unit 7220. Meanwhile, the AF coil unit 7220 may include a pair of lead wires (not shown) for power supply. In this case, each of the pair of lead wires of the AF coil unit 7220 may be electrically coupled to each of the pair of lower support members 7620a and 7620b. Alternatively, the AF coil unit 7220 may receive power from the upper support member 7610 . Meanwhile, when power is supplied to the AF coil unit 7220, an electromagnetic field may be formed around the AF coil unit 7220. In another embodiment, the positions of the AF coil unit 7220 and the driving magnet unit 7320 may be exchanged.

The second mover 7300 may be located outside the first mover 7200 and facing the first mover 7200 . The second mover 7300 may be supported by the second base 7500 located at the lower side. The second mover 7300 may be supported by a fixing member. In this case, the fixing member may include a second base 7500 and a stator 7400 . That is, the second mover 7300 may be supported by the second base 7500 and/or the stator 7400 . The second mover 7300 may be located in the inner space of the cover member 7100 .

The second mover 7300 may include a housing 7310 and a driving magnet part 7320. The second mover 7300 may include a housing 7310 positioned outside the bobbin 7210. In addition, the second mover 7300 may include a driving magnet part 7320 positioned opposite to the AF coil part 7220 and fixed to the housing 7310 .

At least a portion of the housing 7310 may be formed in a shape corresponding to an inner surface of the cover member 7100 . In particular, an outer surface of the housing 7310 may be formed in a shape corresponding to an inner surface of the side plate 7102 of the cover member 7100 . The outer surface of the housing 7310 and the inner surface of the side plate 7102 of the cover member 7100 may be formed flat. More specifically, when the housing 7310 is in its initial position, an outer surface of the housing 7310 and an inner surface of the side plate 7102 of the cover member 7100 may be parallel. In this case, when the housing 7310 is moved toward the cover member 7100 as much as possible, the outer surface of the housing 7310 and the inner surface of the side plate 7102 of the cover member 7100 are in contact with the housing 7310 and/or the cover. An impact generated on the member 7100 may be dispersed. The housing 7310 may have, for example, a hexahedral shape including four side surfaces. However, the shape of the housing 7310 may be provided in any shape that can be disposed inside the cover member 7100 . An upper support member 7610 may be coupled to an upper portion of the housing 7310, and a lower support member 7620 may be coupled to a lower portion of the housing 7310.

The housing 7310 is formed of an insulating material and may be made as an injection molding product in consideration of productivity. The housing 7310 is a moving part for driving the OIS and may be spaced apart from the cover member 7100 by a predetermined distance. However, in the AF model, the housing 7310 may be fixed on the second base 7500. Alternatively, in the AF model, the housing 7310 may be omitted and the driving magnet portion 7320 may be fixed to the cover member 7100.

The upper and lower sides of the housing 7310 are open to accommodate the first mover 7200 movably in the vertical direction. The housing 7310 may include an upper and lower open inner space 7311 inside. A bobbin 7210 may be movably positioned in the inner space 7311 . That is, the inner space 7311 may have a shape corresponding to that of the bobbin 7210 . In addition, the inner circumferential surface of the housing 7310 forming the inner space 7311 may be spaced apart from the outer circumferential surface of the bobbin 7210 . The housing 7310 may be movably supported with respect to the second base 7500 . That is, the housing 7310 may move or tilt in a horizontal direction with respect to the second base 7500.

The housing 7310 may include a second driving unit coupling part 7312 formed on a side surface in a shape corresponding to the driving magnet unit 7320 and accommodating the driving magnet unit 7320 . That is, the second drive unit coupler 7312 may accommodate and fix the drive magnet unit 7320 . The driving magnet unit 7320 may be fixed to the second driving unit coupling unit 7312 using an adhesive (not shown). Meanwhile, the second driving unit coupling part 7312 may be located on an inner circumferential surface of the housing 7310 . In this case, there is an advantage in electromagnetic interaction with the AF coil unit 7220 located inside the driving magnet unit 7320. In addition, the second drive unit coupler 7312 may have an open bottom, for example. In this case, there is an advantage in electromagnetic interaction between the substrate 7420 positioned below the driving magnet unit 7320 and the driving magnet unit 7320 . As an example, the lower end of the driving magnet part 7320 may be positioned to protrude lower than the lower end of the housing 7310 . As an example, four second drive unit couplers 7312 may be provided. A driving magnet unit 7320 may be coupled to each of the four second driving unit coupling units 7312 .

The housing 7310 may include an upper coupling portion 7313 coupled to the upper support member 7610 . The upper coupling portion 7313 may be coupled to the outer portion 7611 of the upper support member 7610 . As an example, the protrusion of the upper coupling portion 7313 may be inserted into a groove or hole (not shown) of the outer portion 7611 and coupled thereto.

The housing 7310 may include a lower coupling portion (not shown) coupled to the lower support member 7620 . The lower coupling portion formed at the lower portion of the housing 7310 may be coupled to the outer portion 7621 of the lower support member 7620 . As an example, the protrusion of the lower coupling portion may be inserted into a groove or hole (not shown) of the outer portion 7621 and coupled thereto.

The housing 7310 may include a first side surface, a second side surface adjacent to the first side surface, and a corner portion positioned between the first side surface and the second side surface. An upper stopper (not shown) may be positioned at a corner of the housing 7310 . The upper stopper may overlap the cover member 7100 in a vertical direction. When the housing 7310 moves upward due to an external impact, the upper stopper may contact the cover member 7100 to limit the upward movement of the housing 7310 .

The driving magnet part 7320 may be positioned to face the AF coil part 7220 of the first mover 7200 . The driving magnet unit 7320 may move the AF coil unit 7220 through electromagnetic interaction with the AF coil unit 7220 . The driving magnet unit 7320 may include a magnet. The magnet may be fixed to the second driving part coupler 7312 of the housing 7310. As an example, as shown in FIG. 2 , the drive magnet unit 7320 may be disposed on the housing 7310 such that four magnets are provided independently and two adjacent magnets form a 90° angle to each other. That is, the driving magnet unit 7320 is mounted on the four side surfaces of the housing 7310 at equal intervals to promote efficient use of the internal volume. In addition, the driving magnet unit 7320 may be attached to the housing 7310 by an adhesive, but is not limited thereto.

The stator 7400 may be located on the second base 7500. The stator 7400 may be positioned to face the lower side of the second mover 7300 . The stator 7400 may movably support the second mover 7300 . The stator 7400 can move the second mover 7300. A through hole 7421 corresponding to the lens module 500 may be positioned at the center of the stator 7400 . In this embodiment, since the terminal unit 7430 is formed on the stator 7400 and directly conducts to the outside, a separate FPCB may not be provided. Therefore, in the present embodiment, compared to a model in which the FPCB and the pattern coil are separately provided, a cost reduction effect can be expected according to the reduction in the number of parts, the number of processes, and process management points. In addition, since the overall height of the product is lowered, it can contribute to miniaturization.

The stator 7400 may include an OIS coil unit 7410 and a substrate 7420 as an example. The stator 7400 may include an OIS coil unit 7410 disposed on a substrate 7420 . The stator 7400 may include a substrate 7420 positioned opposite to the lower side of the driving magnet unit 7320 and seated on the second base 7500 . The stator 7400 may include a terminal portion 7430 that is bent downward from the board 7420 and extends.

The OIS coil unit 7410 may face the driving magnet unit 7320. The OIS coil unit 7410 may move the driving magnet unit 7320 through electromagnetic interaction. When power is applied to the OIS coil unit 7410, the driving magnet unit 7320 and the housing 7310 to which the driving magnet unit 7320 is fixed may move integrally by interaction with the driving magnet unit 7320. The OIS coil unit 7410 may be mounted on or electrically connected to the substrate 7420 or integrally formed with the substrate 7420 . The OIS coil unit 7410 may be disposed, mounted, or formed on the substrate 7420 as a fine pattern (FP) coil, for example. The OIS coil unit 7410, for example, may be formed to minimize interference with the OIS sensor 7720 located on the lower side. The OIS coil unit 7410 may be formed so as not to overlap the OIS sensor 7720 in the vertical direction. The OIS sensor 7720 may be mounted below the stator 7400 so as not to overlap with the OIS coil unit 7410 in the vertical direction. The OIS coil unit 7410 and the drive magnet unit 7320 may be disposed interchangeably.

The substrate 7420 may be seated on the second base 7500 . Meanwhile, the substrate 7420 may supply power to the OIS coil unit 7410. In addition, the substrate 7420 may supply power to the AF coil unit 7220 . As an example, the substrate 7420 may supply power to the AF coil unit 7220 through the lateral support member 7630, the upper support member 7610, the conducting member 7640, and the lower support member 7620. Alternatively, the substrate 7420 may supply power to the AF coil unit 7220 through the side support member 7630 and the upper support member 7610 .

The substrate 7420 may be supported from a lower side such that the housing 7310 is moved in a horizontal direction or tilted. The substrate 7420 may be coupled through the housing 7310 and the lateral support member 7630. An OIS sensor 7720 for detecting the position or movement of the housing 7310 may be positioned on the substrate 7420 . An OIS coil unit 7410 may be positioned on an upper surface of the substrate 7420 and an OIS sensor 7720 may be positioned on a lower surface of the substrate 7420 .

The substrate 7420 may include a through hole 7421 . The substrate 7420 may include a through hole 7421 through which light passing through the lens module 500 passes. The through hole 7421 may be formed in the center of the substrate 7420 . The through hole 7421 may be formed in a circular shape, but is not limited thereto.

The terminal unit 7430 may be connected to an external power source, through which power may be supplied to the board 7420 . The terminal portion 7430 may be formed to extend from a side of the substrate 7420 . The terminal unit 7430 may be located on both sides of the board 7420 . The substrate 7420 and the terminal portion 7430 may be integrally formed. The width of the terminal portion 7430 may be smaller than that of the board 7420 . The terminal unit 7430 may be accommodated in a terminal accommodating unit 7540 formed by recessing a part of the side surface of the second base 7500 inward. The terminal accommodating portion 7540 may have a width corresponding to that of the terminal portion 7430 .

The second base 7500 can support the second mover 7300. The first base 400 may be positioned below the second base 7500 . Meanwhile, either one of the first base 400 and the second base 7500 may be omitted, and the first base 400 and the second base 7500 may be integrally formed. The second base 7500 may include a through hole 7510 formed at a position corresponding to the lens coupler 7211 of the bobbin 7210 .

As an example, the second base 7500 may include a foreign matter collecting unit 7520 that collects foreign matter introduced into the cover member 7100 . The foreign matter collecting unit 7520 is located on the upper surface of the second base 7500 and can collect foreign matter on the inner space formed by the cover member 7100 and the second base 7500, including an adhesive material. there is.

The second base 7500 may include a sensor unit accommodating groove 7530 to which the OIS sensor 7720 is coupled. That is, the OIS sensor 7720 may be mounted in the sensor unit accommodating groove 7530. In this case, the OIS sensor 7720 may sense the horizontal movement or tilt of the housing 7310 by sensing the driving magnet unit 7320 coupled to the housing 7310 . As an example, two sensor unit accommodating grooves 7530 may be provided. An OIS sensor 7720 may be positioned in each of the two sensor unit accommodating grooves 7530 . In this case, the OIS sensor 7720 may be disposed to detect both movements of the housing 7310 in the x-axis and y-axis directions. That is, a virtual line connecting each of the two OIS sensors 7720 and the optical axis may be orthogonal.

The support member 7600 may connect any two or more of the first mover 7200, the second mover 7300, the stator 7400, and the second base 7500. The support member 7600 elastically connects any two or more of the first mover 7200, the second mover 7300, the stator 7400, and the second base 7500 so as to provide a space between each component. Relative movement can be made possible. The support member 7600 may be provided as an elastic member. The support member 7600 may include, for example, an upper support member 7610, a lower support member 7620, a side support member 7630, and a conducting member 7640. However, the energizing member 7640 is provided for energizing the upper support member 7610 and the lower support member 7620, and the upper support member 7610, the lower support member 7620, and the side support member 7630 It can be explained separately from .

The upper support member 7610 may include, for example, an outer portion 7611, an inner portion 7612, and a connection portion 7613. The upper support member 7610 includes an outer portion 7611 coupled to the housing 7310, an inner portion 7612 coupled to the bobbin 7210, and a connecting portion elastically connecting the outer portion 7611 and the inner portion 7612 ( 7613) may be included.

The upper support member 7610 may be connected to an upper portion of the first mover 7200 and an upper portion of the second mover 7300 . In more detail, the upper support member 7610 may be coupled to the upper part of the bobbin 7210 and the upper part of the housing 7310. The inner portion 7612 of the upper support member 7610 is engaged with the upper coupling portion 7213 of the bobbin 7210, and the outer portion 7611 of the upper support member 7610 is coupled to the upper coupling portion 7313 of the housing 7310. can be combined with

As an example, the upper support member 7610 may be divided into six upper conductive parts. At this time, two upper conductive parts among the six upper conductive parts may be used to apply power to the AF coil unit 7220 by being energized with the lower support member 7620 . Each of the two upper conductive parts may be electrically connected to each of the pair of lower support members 7620a and 620b through the conductive member 7640 . Meanwhile, the remaining four upper conductive parts among the six upper conductive parts may be energized with the AF sensor unit 7710 located on the bobbin 7210 . The remaining four upper conductive parts may be used to supply power to the AF sensor unit 7710 and transmit/receive information or signals between the control unit and the AF sensor unit 7710. Also, as a modified example, two upper conductive parts among the six upper conductive parts may be directly connected to the AF coil unit 7220, and the remaining four upper conductive parts may be connected to the AF sensor unit 7710.

The lower support member 7620 may include, for example, a pair of lower support members 7620a and 620b. That is, the lower support member 7620 may include a first lower support member 7620a and a second lower support member 7620b. In this case, the lower support member 7620 may be described as including two lower conducting parts. Each of the first lower support member 7620a and the second lower support member 7620b may be connected to a pair of lead wires of the AF coil unit 7220 provided as a coil to supply power. Meanwhile, the pair of lower support members 7620a and 620b may be electrically connected to the OIS coil unit 7410. Through this structure, the pair of lower support members 7620 may provide power supplied from the OIS coil unit 7410 to the AF coil unit 7220.

The lower support member 7620 may include, for example, an outer portion 7621, an inner portion 7622, and a connection portion 7623. The lower support member 7620 includes an outer portion 7621 coupled to the housing 7310, an inner portion 7622 coupled to the bobbin 7210, and a connecting portion elastically connecting the outer portion 7621 and the inner portion 7622 ( 7623) may be included.

The lower support member 7620 may be connected to a lower portion of the first mover 7200 and a lower portion of the second mover 7300 . In more detail, the lower support member 7620 may be coupled to the lower part of the bobbin 7210 and the lower part of the housing 7310. The lower coupling portion of the bobbin 7210 may be coupled to the inner portion 7622 of the lower support member 7620, and the lower coupling portion of the housing 7310 may be coupled to the outer portion 7621 of the lower support member 7620.

The side support member 7630 may have one side coupled to the stator 7400 and/or the second base 7500 and the other side coupled to the upper support member 7610 and/or the second mover 7300. As an example, the side support member 7630 may have one side coupled to the stator 7400 and the other side coupled to the housing 7310. Also, in another embodiment, the side support member 7630 may have one side coupled to the second base 7500 and the other side coupled to the upper support member 7610. In this way, the lateral support member 7630 elastically supports the second mover 7300 so that the second mover 7300 can move or tilt in the horizontal direction with respect to the second base 7500. let it be

The side support member 7630 may include a plurality of wires. In addition, the side support member 7630 may include a plurality of leaf springs. As an example, the side support members 7630 may be provided in the same number as the upper support members 7610 . That is, the lateral support members 7630 may be separated into six pieces and connected to each of the six upper support members 7610 separated into six pieces. In this case, the side support members 7630 may supply power supplied from the stator 7400 or the outside to each of the upper support members 7610 . As an example, the number of side support members 7630 may be determined in consideration of symmetry. As an example, eight side support members 7630 may be provided, two at each corner of the housing 7310 .

The side support member 7630 or the upper support member 7610 may include, for example, a shock absorber (not shown) for absorbing shock. The shock absorber may be provided on at least one of the lateral support member 7630 and the upper support member 7610 . The shock absorber may be a separate member such as a damper. In addition, the shock absorber may be realized by changing the shape of at least one part of the side support member 7630 and the upper support member 7610.

The conducting member 7640 may electrically connect the upper support member 7610 and the lower support member 7620 to each other. The conductive member 7640 may be provided separately from the lateral support member 7630. Power supplied to the upper support member 7610 through the conductive member 7640 may be supplied to the lower support member 7620, and power may be supplied to the AF coil unit 7220 through the lower support member 7620. Meanwhile, as a modified example, when the upper support member 7610 is directly connected to the AF coil unit 7220, the conducting member 7640 may be omitted.

The sensor unit 7700 may be used for at least one of auto focus feedback and hand shake correction feedback. The sensor unit 7700 may detect the position or movement of one or more of the first mover 7200 and the second mover 7300 .

The sensor unit 7700 may include an AF sensor unit 7710 and an OIS sensor 7720 as an example. The AF sensor unit 7710 may provide information for AF feedback by sensing a relative vertical flow of the bobbin 7210 with respect to the housing 7310 . The OIS sensor 7720 may sense horizontal movement or tilt of the second mover 7300 and provide information for OIS feedback.

The AF sensor unit 7710 may be located on the first mover 7200 . The AF sensor unit 7710 may be located on the bobbin 7210. The AF sensor unit 7710 may be inserted into and fixed to a sensor guide groove (not shown) formed on an outer circumferential surface of the bobbin 7210 . As an example, the AF sensor unit 7710 may include a first sensor 7711, a flexible printed circuit board 7712, and a terminal unit 7713.

The first sensor 7711 may detect the movement or position of the bobbin 7210. Alternatively, the first sensor 7711 may detect the position of the driving magnet part 7320 mounted on the housing 7310. The first sensor 7711 may be, for example, a hall sensor. In this case, the first sensor 7711 may detect a relative positional change between the bobbin 7210 and the housing 7310 by detecting magnetic force generated from the driving magnet unit 7320 .

A first sensor 7711 may be mounted on the flexible printed circuit board 7712 . The flexible printed circuit board 7712 may be provided in a strip shape as an example. At least a portion of the flexible printed circuit board 7712 may be provided in a shape corresponding to the sensor guide groove recessed in the upper part of the bobbin 7210 and inserted into the sensor guide groove. The flexible printed circuit board 7712 may be, for example, an FPCB. That is, the flexible printed circuit board 7712 is provided with flexibility and can be bent to correspond to the shape of the sensor guide groove. A terminal portion 7713 may be formed on the flexible printed circuit board 7712 .

The terminal unit 7713 may receive power and supply power to the first sensor 7711 through the flexible printed circuit board 7712 . Also, the terminal unit 7713 may receive a control command for the first sensor 7711 or transmit a sensed value from the first sensor 7711 . As an example, four terminal units 7713 are provided and may be electrically connected to the upper support member 7610 . In this case, two terminal units 7713 may be used to receive power from the upper support member 7610, and the remaining two terminal units 7713 may be used to transmit/receive information or signals.

The OIS sensor 7720 may be located on the stator 7400. The OIS sensor 7720 may be located on an upper or lower surface of the OIS coil unit 7410. The OIS sensor 7720, for example, may be disposed on the lower surface of the OIS coil unit 7410 and located in the sensor unit receiving groove 7530 formed in the second base 7500. The OIS sensor 7720 may include a hall sensor as an example. In this case, the relative motion of the second mover 7300 with respect to the stator 7400 may be sensed by sensing the magnetic field of the driving magnet unit 7320 . The Hall sensor may be mounted on the substrate 7420 through surface mounting technology (7SMT). As an example, two or more OIS sensors 7720 may be provided to detect both x-axis and y-axis movements of the second mover 7300 .

The circuit element unit 800 may be mounted on the circuit board 100 . The circuit element unit 800 may be located in the element accommodating part 430 of the first base 400 . The circuit element unit 800 may be exposed upward. The circuit element unit 800 may not overlap the first base 400 in the optical axis direction. That is, the circuit element unit 800 may be exposed upward.

The circuit element unit 800 may include a plurality of circuit elements spaced apart from each other. The circuit element unit 800 may include first to fourth circuit elements 801 , 802 , 803 , and 804 spaced apart from each other. The first to fourth circuit elements 801 , 802 , 803 , and 804 may be accommodated together in one accommodating unit constituting the element accommodating unit 430 or may be separately accommodated in a plurality of accommodating units.

Hereinafter, effects of the camera module according to the present embodiment will be described with reference to FIG. 7 .

7 is a cross-sectional view illustrating (a) a comparative example and (b) a camera module according to the present embodiment to explain the effect of the present embodiment.

Referring to (a) of FIG. 7 , in the camera module according to the comparative example, it can be confirmed that the first base 400 made of a mold material for supporting the filter 600 is present on the upper side of the conducting part 300 . In the case of the comparative example, due to the thickness of the first base 400, the distance FBL (L1) from the upper surface of the image sensor 200 of the camera module to the lower surface of the lens module 500 is increased.

In addition, in the camera module according to the comparative example, it can be confirmed that the first base 400 exists above the circuit element unit 800 . In the case of the comparative example, the height of the lower surface of the lens driving unit 700 supported by the cover member support 420 increases due to the thickness of the cover member support 420 of the first base 400 . Accordingly, the length of the entire length of the camera module (H1 in FIG. 7) is also increased.

Referring to (b) of FIG. 7 , it can be seen that in the camera module according to the present embodiment, the shape of the injection first base 400 supporting the filter 600 is avoided to the outside of the conductive part 300 . That is, in the camera module according to the present embodiment, it can be confirmed that the first base 400 does not overlap with the conducting part 300 in the optical axis direction.

Therefore, in this embodiment, the lens module 500 can be designed by lowering the FBL by the thickness of the injection molding material supporting the filter 600 compared to the comparative example. That is, through the camera module according to the present embodiment, FBL (L2), which is a distance from the upper surface of the image sensor 200 to the lower surface of the lens module 500, can be minimized. Furthermore, in this embodiment, the camera module overall length can also be minimized due to the minimization of the FBL.

Meanwhile, in the camera module according to the present embodiment, it can be confirmed that the thickness of the cover member support part 420 is minimized by omitting a part of the first base 400 and opening the ceiling of the circuit element unit 800 . That is, in the camera module according to the present embodiment, it can be confirmed that the first base 400 does not overlap the circuit element unit 800 in the optical axis direction.

Accordingly, in the present embodiment, the lower surface of the lens driving unit 700 may be lowered by the thickness of the cover member support 420 being reduced compared to the comparative example. Therefore, in this embodiment, the length of the entire length of the camera module (H2 in FIG. 7) can also be minimized.

Hereinafter, a configuration of a camera module according to a modified example of the present embodiment will be described with reference to FIG. 8 .

8 is a cross-sectional view showing some configurations of a camera module according to a modified example of the present embodiment.

5 and 8 , the camera module according to the modified example may further include an extension part 440 compared to the camera module according to the present embodiment. The extension part 440 may connect the filter support part 410 and the cover member support part 420 . The extension part 440 may be integrally formed with the filter support part 410 and the cover member support part 420 . The extension part 440 may be located above the device 800 mounted on the circuit board 100 .

Compared to the camera module according to the present embodiment, the camera module according to the modified example may further include a recessed portion 450 . The recessed portion 450 may be formed by recessing at least a portion of the upper surface of the cover member support unit 420 downward.

Meanwhile, in the modified example, the element accommodating part 430 may not penetrate the first base 400 in the optical axis direction. That is, in the modified example, the element accommodating part 430 may be a groove in which a part of the lower surface of the first base 400 is recessed upward.

In the camera module according to the present embodiment, the device 800 mounted on the circuit board 100 is exposed upward, but in the camera module according to the modified example, the device 800 may not be exposed upward. Therefore, compared to the present embodiment, the modified example has an advantage in effective protection of the device 800 because foreign matter or the like is prevented from entering the device 800 through the upper side. However, in this embodiment, since the length of the structure supporting the cover member 700 in the optical axis direction is shorter than that of the modified example, there is an advantage in that the length of the entire length of the camera module in the optical axis direction is shorter than that of the modified example.

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, terms such as "comprise", "comprise" or "having" described above mean that the corresponding component may be present unless otherwise stated, and thus exclude other components. It should be construed as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and unless explicitly defined in the present invention, they are not interpreted in an ideal or excessively formal meaning.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: circuit board 200: image sensor
300: conducting part 400: base
500: lens module 600: filter
700: lens driving unit 800: circuit element unit

Claims (20)

circuit board;
an image sensor and circuit elements disposed on the circuit board;
a filter support part and a lens driving unit support part disposed on the circuit board;
a filter disposed on the filter support;
a lens driving unit disposed on the lens driving unit support; and
Including a lens coupled to the lens driving unit,
the image sensor is disposed within the filter support;
The camera module of claim 1 , wherein the circuit element is disposed in a spaced space between the filter support part and the lens driving unit support part so that the circuit element is visible when viewed from above. According to claim 1,
A base disposed between the circuit board and the lens driving unit;
The camera module of claim 1 , wherein the base includes the filter support part and the lens driving unit support part. According to claim 1,
The upper surface of the circuit board includes a first area where the filter support is disposed, a second area disposed within the first area, a third area where the lens driving unit support is disposed, and the first area and the third area. Including a fourth region disposed between the regions,
The image sensor is disposed in the second area of the circuit board,
The circuit element is disposed in the fourth region of the circuit board. According to claim 2,
The camera module wherein the base does not overlap with the circuit element in an optical axis direction. According to claim 1,
The image sensor, the filter support, the circuit element, and the lens driving unit support overlap each other in a direction perpendicular to an optical axis. According to claim 1,
The circuit elements include six circuit elements disposed on one side of the image sensor and four circuit elements disposed on the other side of the image sensor. According to claim 1,
In a direction perpendicular to the optical axis, the filter support is disposed between the image sensor and the circuit element. According to claim 1,
A camera module comprising a wire electrically connecting the circuit board and the image sensor. According to claim 1,
The filter support unit connects a first support unit on which the lower surface of the filter is disposed, a second support unit facing the side surface of the filter, and the first support unit and the second support unit, and is formed on the upper surface of the circuit board. A camera module including a third support unit disposed thereon. According to claim 9,
The camera module of claim 1 , wherein in a direction perpendicular to the optical axis, a width of the first support unit increases from a lower end to an upper end of the first support unit. According to claim 9,
An upper surface of the first support unit and an inner surface of the first support unit form an acute angle. According to claim 9,
In the optical axis direction, the length of the second support unit from the first support unit corresponds to the thickness of the filter. According to claim 9,
An upper surface of the second support unit is disposed at the same height as an upper surface of the filter. According to claim 1,
The camera module wherein the filter is an infrared absorption filter or an infrared reflection filter. circuit board;
an image sensor and circuit elements disposed on the circuit board;
a filter support part and a lens driving unit support part disposed on the circuit board;
a filter disposed on the filter support;
a lens driving unit disposed on the lens driving unit support; and
Including a lens coupled to the lens driving unit,
The upper surface of the circuit board includes a first area where the filter support is disposed, a second area disposed within the first area, a third area where the lens driving unit support is disposed, and the first area and the third area. Including a fourth region disposed between the regions,
The image sensor is disposed in the second area of the circuit board,
The circuit element is disposed in the fourth region of the circuit board,
An upper surface of the circuit element is disposed not to be covered by the filter support or the lens drive unit support so as to directly face the lens drive unit. According to claim 15,
A base disposed between the circuit board and the lens driving unit;
The base includes the filter support part and the lens driving unit support part,
The camera module wherein the circuit element does not overlap with the base in an optical axis direction. According to claim 15,
The circuit elements include six circuit elements disposed on one side of the image sensor and four circuit elements disposed on the other side of the image sensor. According to claim 15,
The filter support unit connects a first support unit on which the lower surface of the filter is disposed, a second support unit facing the side surface of the filter, and the first support unit and the second support unit, and is formed on the upper surface of the circuit board. Including a third support unit disposed,
The camera module of claim 1 , wherein in a direction perpendicular to the optical axis, a width of the first support unit increases from a lower end to an upper end of the first support unit. main body;
a display unit disposed on the main body to display information; and
An optical device comprising a camera module according to any one of claims 1 to 18 disposed on the main body to take images or photos. circuit board;
a base and an image sensor disposed on the circuit board;
a lens driving unit disposed on the base; and
A camera module including a lens coupled to the lens driving unit.

Images