KR20230048178A - Display module and manufacturing method of the same - Google Patents

Abstract

The display module of the present invention comprises: a display panel comprising a first area comprising pixels, a second area wherein a driving chip connected to the pixel is mounted, and a third area disposed between the first area and the second area and bent based on a virtual axis extending in a first direction; a bending protective layer that covers the third area; a cover layer disposed on the second area, and covering the driving chip; and a protective film disposed on the cover layer, wherein the protective film overlaps the third area on a flat surface, and protrudes beyond the bending protective layer in a second direction intersecting the first direction. Therefore, the present invention is capable of allowing a separate equipment device not to be required.

Description

Display module and its manufacturing method {DISPLAY MODULE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a display module and a manufacturing method thereof, and more particularly to a display module having a simplified process and a manufacturing method thereof.

Electronic devices such as smart phones, tablets, notebook computers, and smart televisions are being developed. These electronic devices include a display device to provide information. Electronic devices further include various electronic modules in addition to the display device. An electronic device is manufactured by assembling a display module and an electronic module.

Before assembling the display module and the electronic module, in order to prevent damage to the display module during transport, the display module includes a separate protective member.

An object of the present invention is to provide a display module to which a protective film is attached that can protect a bending area of the display module during transportation, storage, or transportation of the display module.

An object of the present invention is to simplify the manufacturing process of the display module, thereby reducing process time and cost.

A display module according to the present invention includes a first area including pixels, a second area in which a driving chip connected to the pixels is mounted, and a virtual area disposed between the first area and the second area and extending in a first direction. A display panel including a third area bent with respect to an axis of , a bending protection layer covering the third area, a cover layer disposed on the second area and covering the driving chip, and a cover layer on the cover layer. and a protective film disposed thereon, wherein the protective film overlaps the third region on a plane and protrudes beyond the bending protective layer in a second direction crossing the first direction.

The display device may further include a window covering the display panel, and the window may protrude beyond the bending protection layer in the second direction.

The window may protrude beyond the protective film in the second direction.

It may further include an adhesive layer disposed between the cover layer and the protective film.

The adhesive layer may include a first part and a second part disposed spaced apart from the driving chip and spaced apart from each other in the first direction with the driving chip as a center.

The adhesive layer may further include a third portion spaced apart from the first portion and the second portion and disposed adjacent to the third region rather than the driving chip.

The adhesive force between the adhesive layer and the protective film may be greater than the adhesive force between the adhesive layer and the cover layer.

Adhesive strength between the adhesive layer and the cover layer may be 150 gf/in or more and 300 gf/in or less.

The bending protection layer may further cover a portion of the second region, and the cover layer may further cover at least a portion of a region overlapping the second region of the bending protection layer.

It may further include an adhesive layer disposed on the cover layer, wherein the adhesive layer overlaps a region of the cover layer covering the bending protection layer.

It may further include an optical film disposed on the first region.

The bending protection layer may further cover a portion of the first region, and one end of the bending protection layer adjacent to the first region may contact the optical film.

The protective film may have a thickness of 50 micrometers or more and 200 micrometers or less.

The cover layer may include a plurality of layers, and the protective film may include the same material as any one of the plurality of layers.

The protective film may be characterized in that it includes a polymer material.

A display module manufacturing method according to the present invention provides bending protection covering the third region of a display panel including a first region, a second region, and a third region disposed between the first region and the second region. Forming a layer, mounting a driving chip on the second area, forming a cover layer covering the driving chip, attaching a protective film on the cover layer, and It includes bending.

The method may further include attaching a window on the display panel after attaching the protective film and before bending the third region.

The attaching of the protective film may be characterized in that the protective film and the cover layer are adhered through an adhesive layer.

The method may further include attaching a flexible circuit board to an end portion of the second region.

removing the protective film after the bending of the third region; and coupling the display panel to the mother board, wherein in the coupling of the display panel to the mother board, the mother board is electrically connected through a connector of the flexible circuit board. can

The display module of the present invention includes a protective film capable of covering a bending area.

According to the present invention, the shape of the protective film may not be separately designed according to the type and shape of the electronic device, and the mold required for manufacturing the protective film may not be separately designed and manufactured. In addition, a separate equipment for attaching the protective film may not be required.

Therefore, it is possible to provide a display module with reduced manufacturing time and manufacturing cost by simplifying the manufacturing process of the protective film.

1 is a perspective view of an electronic device according to an embodiment of the present invention.
2A is an exploded perspective view of an electronic device according to an embodiment of the present invention.
2B is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention.
3 is a partial plan view of a display module according to an embodiment of the present invention.
4 is a partial plan view of a display module according to an embodiment of the present invention.
FIG. 5 is a cross-sectional view taken along the cutting line II′ shown in FIG. 4 .
6A to 6I are cross-sectional views illustrating a method of manufacturing a display module according to an embodiment of the present invention.

In this specification, when an element (or region, layer, section, etc.) is referred to as being “on,” “connected to,” or “coupled to” another element, it is directly placed/placed on the other element. It means that they can be connected/combined or a third component may be placed between them.

Like reference numerals designate like components. Also, in the drawings, the thickness, ratio, and dimensions of components are exaggerated for effective description of technical content. “And/or” includes any combination of one or more that the associated elements may define.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, a second element may be termed a first element, without departing from the scope of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In addition, terms such as "below", "lower side", "above", and "upper side" are used to describe the relationship between components shown in the drawings. The above terms are relative concepts and will be described based on the directions shown in the drawings.

Terms such as "include" or "have" are intended to indicate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but that one or more other features, numbers, or steps are present. However, it should be understood that it does not preclude the possibility of existence or addition of operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms such as terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined herein, interpreted as too idealistic or too formal. It shouldn't be.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

1 is a perspective view of an electronic device according to an embodiment of the present invention. 2A is an exploded perspective view of an electronic device according to an embodiment of the present invention. 2B is a cross-sectional view of a display panel according to an exemplary embodiment of the present invention.

Referring to FIG. 1 , the electronic device EA may be a device that is activated according to an electrical signal. The electronic device EA may include various embodiments. For example, the electronic device EA may be applied to electronic devices such as a smart watch, tablet, laptop computer, computer, and smart television.

The electronic device EA may display the image IM in the third direction DR3 on the display surface IS parallel to the first and second directions DR1 and DR2 respectively. The display surface IS on which the image IM is displayed may correspond to the front surface of the electronic device EA. The image IM may include a still image as well as a dynamic image.

In this embodiment, the front (or upper surface) and the rear surface (or lower surface) of each member are defined based on the third direction DR3 in which the image IM is displayed. The front surface and the rear surface oppose each other in the third direction DR3, and a normal direction of each of the front surface and the rear surface may be parallel to the third direction DR3.

The separation distance between the front and rear surfaces in the third direction DR3 may correspond to the thickness of the electronic device EA in the third direction DR3. Meanwhile, directions indicated by the first to third directions DR1 , DR2 , and DR3 may be converted into other directions as a relative concept.

The electronic device EA may detect an external input applied from the outside. The external input may include various types of inputs provided from the outside of the electronic device EA. For example, the external input may include a contact by a part of the user's body, such as a user's hand, as well as an external input (eg, hovering) applied close to the electronic device EA or adjacent to it at a predetermined distance. . In addition, the external input may have various forms such as force, pressure, temperature, and light.

The front surface of the electronic device EA may be divided into a transmission area TA and a bezel area BZA. The transmission area TA may be an area where the image IM is displayed. The user views the image IM through the transmission area TA. In this embodiment, the transmission area TA is shown as a quadrangular shape with rounded vertices. However, this is shown as an example, and the transmission area TA may have various shapes, and is not limited to one embodiment.

The bezel area BZA is adjacent to the transmission area TA. The bezel area BZA may have a predetermined color. The bezel area BZA may surround the transmission area TA. Accordingly, the shape of the transmission area TA may be substantially defined by the bezel area BZA. However, this is shown as an example, and the bezel area BZA may be disposed adjacent to only one side of the transmission area TA or may be omitted. An electronic device (EA) according to an embodiment of the present invention may include various embodiments, and is not limited to any one embodiment.

Referring to FIG. 2A , the electronic device EA according to the present embodiment may include a display module DM, an electronic module EM, and a housing EDC. The display module DM according to this embodiment may include a window WM, an optical film RPP, a display panel DP, a flexible circuit film FCB, and a cover layer CIC.

The window WM may be made of a transparent material capable of emitting an image. For example, the window WM may be made of glass, sapphire, or plastic. The window WM is illustrated as a single layer, but is not limited thereto and may include a plurality of layers. Meanwhile, the above-described bezel area BZA of the electronic device EA may be substantially provided as an area in which a material including a predetermined color is printed on one area of the window WM.

The optical film RPP may be disposed under the window WM. The optical film RPP reduces reflectance of external light incident from an upper side of the window WM. The optical film RPP may include a retarder and a polarizer. The retarder may be a film type or a liquid crystal coating type, and may include a λ/2 retarder and/or a λ/4 retarder. A polarizer may also be a film type or a liquid crystal coating type. The film type may include a stretchable synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. A retarder and a polarizer may be implemented as one polarizing film. The optical film RPP may further include a protective film disposed above or below the polarization film.

The display panel DP may be disposed under the optical film RPP. Between the display panel DP and the window WM, a functional layer performing other functions besides the optical film RPP, such as a protective layer, may be further disposed.

The display panel DP may be a component that substantially generates an image. The display panel DP may be any one of an organic light emitting display panel, an inorganic light emitting display panel, and a quantum-dot display panel, and is particularly limited. It doesn't work.

The display panel DP may be defined by an active area AA and a peripheral area NAA. The active area AA may be defined as an area where an image provided from the display panel is emitted. The peripheral area NAA is adjacent to the active area AA. For example, the peripheral area NAA may surround the active area AA. However, this is shown as an example, and the peripheral area NAA may be defined in various shapes, and is not limited to any one embodiment. According to an exemplary embodiment, the active area AA of the display panel DP may correspond to at least a portion of the transmission area TA.

The display panel DP may include a first area NBA1 , a second area NBA2 , and a third area BA. The third area BA may be disposed between the first area NBA1 and the second area NBA2. The first area NBA1 and the second area NBA2 may be spaced apart from each other in the second direction DR2 with the third area BA interposed therebetween.

According to this embodiment, the pixel PX may be disposed in the first area NBA1. Accordingly, the first area NBA1 may include the active area AA where the pixels are disposed and the peripheral area NAA surrounding the active area AA.

The second area NBA2 may include pads PLD on which the driving chip DIC is mounted and disposed adjacent to an end of the second area NBA2 . The third area BA may be bent so that the second area NBA2 faces the rear surface of the display module DM. That is, the third area BA may be bent about an imaginary axis FX (refer to FIG. 5 ) extending in the first direction DR1 .

In the present specification, a portion of the first area NBA1 , the second area NBA2 , and the third area BA may correspond to the peripheral area NAA.

According to an embodiment, the width of the first area NBA1 in the first direction DR1 may be greater than the width of the second area NBA2 in the first direction DR1. 2A exemplarily shows that the width of the third area BA is constant in the first direction DR1, but is not limited thereto, and the width of the third area BA in the first direction DR1 is not limited thereto. may gradually become narrower from the first area NBA1 to the second area NBA2.

The flexible circuit film FCB may be disposed on the pads PLD of the second area NBA2 of the display panel DP and electrically connected to the display panel DP. The flexible circuit film (FCB) may include a connector (CNT).

According to this embodiment, the cover layer CIC may be disposed on the second area NBA2 of the display panel DP. The cover layer CIC may cover the entire driving chip DIC. Also, the cover layer CIC may cover at least a portion of the flexible circuit film FCB. For example, the cover layer CIC may cover one end portion including a region overlapping the second region NBA2 of the flexible circuit film FCB.

2A exemplarily shows that the width of the cover layer CIC in the first direction DR1 is smaller than the width of the second area NBA2 of the display panel DP in the first direction DR1. . However, it is not limited thereto, and the width of the cover layer CIC in the first direction DR1 may be greater than or equal to the width of the second area NBA2 in the first direction DR1.

The electronic device EA may include an electronic module EM. The electronic module (EM) is mounted on the motherboard and includes various functional modules for operating the electronic device (EA). The motherboard may be electrically connected to the display module DM through the connector CNT of the flexible circuit film FCB.

The electronic module EM may include a control module, a wireless communication module, an image input module, an audio input module, an audio output module, a memory, an external interface, a light emitting module, a light receiving module, and a camera module. 2A exemplarily shows that the electronic module EM includes at least one of a camera, a speaker, a light sensor, and a heat sensor.

The housing EDC may be coupled to the window WM. The housing EDC may be coupled to the window WM to provide a predetermined internal space. The display module DM and the electronic module EM may be accommodated in the inner space.

The housing EDC may include a material with relatively high rigidity. For example, the housing EDC may include a plurality of frames and/or plates made of glass, plastic, or metal, or a combination thereof. The housing EDC may stably protect components of the electronic device EA accommodated in the inner space from external impact.

Referring to FIG. 2B , the display panel DP may include a base layer BL, a circuit layer DP-CL, a light emitting element layer DP-OLED, an encapsulation layer TFE, and an input sensor ISP. can The base layer BL may include a synthetic resin film. The synthetic resin layer may include a thermosetting resin. The base layer BL may have a multilayer structure. For example, the base layer BL may have a three-layer structure of a synthetic resin layer, an adhesive layer, and a synthetic resin layer.

In particular, the synthetic resin layer may be a polyimide-based resin layer, and the material thereof is not particularly limited. The synthetic resin layer may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and perylene resin. . In addition, the base layer BL may include a glass substrate or an organic/inorganic composite material substrate.

The circuit layer DP-CL may be disposed on the base layer BL. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. An insulating layer, a semiconductor layer, and a conductive layer may be formed on the base layer BL by a method such as coating or deposition, and thereafter, the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned through a plurality of photolithography processes. there is. After that, semiconductor patterns, conductive patterns, and signal lines included in the circuit layer DP-CL may be formed.

The light emitting device layer DP-OLED may be disposed on the circuit layer DP-CL. The light emitting device layer DP-OLED may include a light emitting device. For example, the light emitting device layer DP-OLED may include an organic light emitting material, a quantum dot, a quantum rod, or a micro LED.

The encapsulation layer TFE may be disposed on the light emitting device layer DP-OLED. The encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer sequentially stacked, but the layers constituting the encapsulation layer TFE are not limited thereto.

The inorganic layers may protect the light emitting device layer DP-OLED from moisture and oxygen, and the organic layer may protect the light emitting device layer DP-OLED from foreign substances such as dust particles. The inorganic layers may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acryl-based organic layer, but is not limited thereto.

The input sensor ISP may be disposed on the encapsulation layer TFE. The input sensor ISP may be directly disposed on the encapsulation layer TFE and formed through a continuous process with the encapsulation layer TFE. Being directly disposed may mean that a third component is not disposed between the input sensor ISP and the encapsulation layer TFE. That is, a separate adhesive member may not be disposed between the input sensor ISP and the encapsulation layer TFE. However, it is not limited thereto, and the input sensor ISP may be coupled to the encapsulation layer TFE by a separate adhesive member disposed on the encapsulation layer TFE.

The input sensor ISP may detect an external input using one of a self-capacitance type and a mutual capacitance type. Conductive patterns included in the input sensor ISP may be variously deformed, disposed, and connected according to a method.

3 is a partial plan view of a display module according to an embodiment of the present invention. 4 is a partial plan view of a display module according to an embodiment of the present invention. 5 is a cross-sectional view taken along line II′ of FIG. 4 .

3 to 5 show a display module (DM) disassembled from the electronic device (EA, see FIG. 2A) shown in FIGS. 1 and 2 . The display module DM shown in FIGS. 3 to 5 may be manufactured as a display module DM before being included in the components of the electronic device EA, and may be transported, stored, or transported. The display module DM to be described with reference to FIGS. 3 to 5 may be provided with a protective film PTF attached to the display module DM described with reference to FIG. 2A . Accordingly, the display module DM, which will be described below, may be a display module DM that is not electrically connected to the electronic module EM (see FIG. 2A).

3 shows the display module DM in a state where the third area BA of the display panel DP is not bent, and FIGS. 4 and 5 show the third area BA of the display panel DP. It shows the display module DM in a bent state.

3 is a plan view of the display module DM in the direction of looking at the front of the display panel DP. In FIG. 3 , a portion of the front surface of the display panel DP covered by the window WM and the flexible circuit film FCB is indicated by a dotted line. 4 illustrates the rear surface of the display panel DP in a state where the third area BA is bent.

Referring to FIGS. 3 and 4 , a display module (DM) according to an embodiment includes a window (WM), a display panel (DP), a flexible circuit film (FCB), a cover layer (CIC), and a protective film (PTF). ) may be included. 3 and 4, among the display modules DM, the optical film RPP described in FIG. 2A is omitted.

The display module (DM) according to an embodiment may further include a protective film (PTF). In the present specification, the protective film (PTF) may be attached to protect the display module (DM) in the process of manufacturing, transporting, storing, or transporting the display module (DM).

The protective film (PTF) may be disposed on the cover layer (CIC). As shown in FIG. 3 , the protective film PTF may overlap at least a portion of the second area NBA2 and at least a portion of the third area BA before the display panel DP is bent.

Referring to FIG. 4 , after the third area BA of the display panel DP is bent, the rear surface of the first area NBA1 of the display panel DP and the second area NBA2 of the display panel DP are formed. The rear surfaces of may face each other. That is, the second area NBA2 may be disposed below the first area NBA1. Accordingly, the driving chip DIC, the flexible circuit film FCB, the cover layer CIC, and the protective film PTF may also be disposed below the first region NBA1.

The protective film PTF may cover the bent third area BA. Accordingly, the protective film PTF can protect the bent area of the display panel DP, which is vulnerable to external impact, during the transfer process of the display module DM.

The protective film (PTF) may be combined with the cover layer (CIC) by the adhesive layer (ACL).

According to an embodiment, the adhesive layer ACL may include a first part PP1 , a second part PP2 , and a third part PP3 spaced apart from each other. The first part PP1 and the second part PP2 may be spaced apart from each other in the first direction DR1 with the driving chip DIC interposed therebetween. The third portion PP3 may be disposed at one end of the second area NBA2 adjacent to the third area BA. The third portion PP3 may extend in the first direction DR1. The third part PP3 may be spaced apart from the first part PP1 and the second part PP2 in the second direction DR2.

However, the arrangement of the adhesive layer (ACL) is not limited to any one embodiment as long as the cover layer (CIC) and the protective film (PTF) can be bonded to each other. For example, among the first to third parts PP1 , PP2 , and PP3 , the first and second parts PP1 and PP2 may be omitted, and the first to third parts PP1 , PP2 , and PP3 may be omitted. ), the third part PP3 may be omitted.

Further, according to another embodiment of the present invention, the adhesive layer (ACL) may be disposed to overlap the entire surface of the protective film (PTF), and the adhesive layer (ACL) overlaps the driving chip (DIC). It may be arranged overlapping with the rest of the area except for one area.

5 illustrates a cross-section of the display module DM viewed from the first direction DR1. The same/similar reference numerals are used for the same/similar configurations as those described in FIGS. 1 to 4, and redundant descriptions are omitted. Hereinafter, configurations of the display module DM will be described in detail with reference to FIG. 5 .

Referring to FIG. 5 , the display module DM according to the present embodiment includes a window WM, a display panel DP, an optical film RPP, a bending protective layer BRL, a lower protective member LP, and a support. It may include a member (SP), a cover layer (CIC), a flexible circuit film (FCB), an adhesive layer (ACL), and a protective film (PTF).

The window WM may include a base substrate BS and a window protection layer WP disposed on the base substrate BS.

According to an embodiment, an edge of the base substrate BS may have a predetermined curvature. However, it is not limited thereto, and in another embodiment, the edge of the base substrate BS may have a flat shape that does not include a curved surface.

The window protective layer (WP) may include a synthetic resin film. The window WM may include an adhesive layer (not shown) coupling the window protection layer WP and the base substrate BS.

According to this embodiment, the window WM may cover the display panel DP in a bent state when viewed from the front surface of the window WM. That is, the window WM may overlap all of the first area NBA1 , the second area NBA2 , and the third area BA of the display panel DP in a bent state. Also, the window WM may protrude beyond the bending protection layer BRL in the second direction DR2 .

The optical film RPP may be disposed between the window WM and the display panel DP. As shown in FIG. 5 , the optical film RPP may be disposed on the upper surface of the first area NBA1 of the display panel DP.

The window WM and the optical film RPP may be coupled by the first adhesive member AM1. The first to third adhesive members AM1 to AM3 described below are optically clear adhesive films (OCA), optically clear resins (OCR), or pressure-sensitive adhesive films (PSA). , Pressure Sensitive Adhesive film). The first adhesive member AM1 to the third adhesive member AM3 include a photocurable adhesive material or a heat curable adhesive material, and the material is not particularly limited. Also, some of the first to third adhesive members AM1 to AM3 may be omitted.

The bending protection layer BRL may be disposed on the entire surface of the third area BA of the display panel DP to cover the third area BA. The bending protection layer BRL may make the neutral plane of the third area BA defined during bending adjacent to the circuit layer DP-CL (refer to FIG. 2B ) of the display panel DP. Accordingly, the transistors disposed in the circuit layer (DP-CL, see FIG. 2B) of the display panel DP and the wires connected thereto may be prevented from being damaged by tensile stress.

According to an embodiment, the bending protection layer BRL may further cover a portion of the first area NBA1. The bending protection layer BRL may contact the optical film RPP in an area overlapping the first area NBA1. For example, one end overlapping the first area NBA1 of the bending protection layer BRL and one end adjacent to the third area BA of the optical film RPP may contact each other.

According to one embodiment, the thickness of the bending protection layer (BRL) may be thinner than the thickness of the optical film (RPP). However, it is not limited thereto, and the thickness of the bending protection layer (BRL) may be thicker than the thickness of the optical film (RPP), and the thickness of the bending protection layer (BRL) may be the same as the thickness of the optical film (RPP).

According to an embodiment, the first adhesive member AM1 may also be disposed on a portion of the bending protection layer BRL overlapping the first area NBA1. Accordingly, the bending protection layer BRL may be combined with the window WM at a portion overlapping the first region NBA1. However, it is not limited thereto, and the first adhesive member AM1 may be disposed only on the optical film RPP.

According to an embodiment, the bending protection layer BRL may further cover a portion of the second area NBA2. Accordingly, the bending protection layer BRL may extend from the first area NBA1 to the second area NBA2 via the third area BA so as to overlap.

According to an embodiment, the bending protection layer BRL may include an organic material. The bending protection layer (BRL) may include an organic resin, for example, an acrylic resin.

The lower protective member LP may be disposed on the rear surface of the display panel DP. According to this embodiment, the lower protection member LP may include a first lower protection member LP1 and a second lower protection member LP2. The first lower protection member LP1 may be disposed on the rear surface of the first area NBA1 of the display panel DP. The second lower protection member LP2 may be disposed on the rear surface of the second area NBA2 of the display panel DP.

The lower protective member LP may not be disposed on the rear surface of the third area BA. Since the lower protective member LP is not disposed in the third area BA, stress generated in the circuit layer DP-CL (refer to FIG. 2B ) during bending may be reduced.

The lower protective member LP may include a plastic film manufactured through a separate molding process as a base layer. The lower protective member (LP) includes polyethersulphone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethyelenen napthalate (PEN), and polyethylene terephthalate (PET). , polyethyleneterepthalate), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC, polycabonate), poly(aryleneether sulfone) And it may include a plastic film containing any one selected from the group consisting of combinations thereof.

Materials constituting the lower protective member LP are not limited to plastic resins, and may include organic/inorganic composite materials. The lower protective member LP may include a porous organic layer and an inorganic material filled in pores of the organic layer.

The support member SP may be disposed between the first lower protection member LP1 and the second lower protection member LP2. The support member SP may be disposed between the first area NBA1 and the second area NBA2 of the bent display panel DP to support the bent display panel DP.

According to one embodiment, the support member SP may include a cushion layer SP1 and a metal layer SP2.

The cushion layer SP1 may be disposed under the first lower protective member LP1. According to one embodiment, the cushion layer SP1 may include a porous material. The cushion layer SP1 can improve absorption performance and prevent the display panel DP from being damaged by external impact. The cushion layer SP1 may be coupled to the first lower protection member LP1 by the second adhesive member AM2.

The metal layer SP2 may be disposed below the cushion layer SP1. That is, the metal layer SP2 may be disposed on the second lower protective member LP2. According to an embodiment, the metal layer SP2 may include a metal material. For example, the metal layer SP2 may include copper (Cu). The metal layer SP2 can prevent the display panel DP from being damaged by external impact by increasing rigidity between the first area NBA1 and the second area NBA2 of the display panel DP. The metal layer SP2 may be coupled to the second lower protection member LP2 by the third adhesive member AM3.

The cover layer CIC may be disposed on the entire surface of the second area NBA2 of the display panel DP. According to this embodiment, the cover layer CIC may cover at least a portion of the bending protection layer BRL disposed on the second area NBA2.

According to one embodiment, the cover layer CIC may have a multi-layer structure. The cover layer CIC may include a conductive layer and an insulating layer disposed on the conductive layer. That is, the conductive layer may be disposed closer to the entire surface of the second region NBA2 of the display panel DP than the insulating layer.

The conductive layer of the cover layer CIC may include a conductive material. For example, the conductive layer may include any one of a metal material and conductive fibers. The conductive fiber according to one embodiment may include a non-woven fabric.

The flexible circuit film (FCB) or the display panel (DP) according to the present embodiment may include at least one conductive pattern for receiving a reference voltage, and the conductive layer of the cover layer (CIC) may be electrically connected to the conductive pattern. there is. Accordingly, by shielding static electricity that may be generated around the driving chip DIC through the conductive layer, the cover layer CIC can prevent the display panel DP from being damaged by external static electricity.

A conductive adhesive layer may be disposed between the conductive layer of the cover layer CIC and the display panel DP and the flexible circuit film FCB. The conductive adhesive layer may bond the display panel DP and the flexible circuit film FCB to the conductive layer.

The conductive adhesive layer may include a conductive adhesive material. For example, the conductive adhesive layer may be a film formed by dispersing metal particles in a synthetic resin. The conductive adhesive layer may electrically connect the cover layer CIC and the conductive patterns receiving the reference voltage.

The insulating layer of the cover layer CIC may include an insulating material. For example, the insulating layer may include a polymer material. The polymer material according to an embodiment may include at least one of polyethylene terephthalate (PET) and foam. Polyethylene terephthalate (PET) may provide rigidity to the cover layer CIC, and the foam may provide high impact absorption to the cover layer CIC.

In addition, the polymer material according to an embodiment may include polyethylene terephthalate (PET) having a black color, and the insulating layer may serve as a light blocking function.

Accordingly, the cover layer CIC blocks noise formed around the flexible circuit film FCB and the driving chip DIC, and covers wires disposed on the flexible circuit film FCB, thereby preventing impacts and other factors provided from the outside. You can protect yourself from the same risks.

The protective film PTF may be disposed on the entire surface of the second area NBA2 of the display panel DP.

The protective film PTF may cover the third area BA of the bent display panel DP when looking at the rear surface of the window WM. That is, the protective film PTF may overlap the third area BA of the display panel DP. The protective film PTF may protrude from the bending protective layer BRL in the second direction DR2 .

The protective film PTF may include a rear surface adjacent to the cover layer CIC and an upper surface opposite thereto. A portion of the rear surface of the protective film PTF protruding from the bending protection layer BRL may face a portion of the rear surface of the window WM protruding from the bending protection layer BRL.

According to one embodiment, the protective film (PTF) may have a plate shape. The protective film PTF may extend in the second direction DR2 , and a separation space may exist between a portion of the protective film PTF that does not overlap the adhesive layer ACL and the cover layer CIC. Through this, the protective film (PTF) does not come into contact with the portion of the cover layer (CIC) that covers the driving chip (DIC) and the flexible circuit film (FCB), thereby protecting the driving chip (DIC) and the flexible circuit film (FCB). damage can be prevented.

However, the shape and arrangement of the protective film (PTF) are not limited thereto. The protective film PTF may contact the cover layer CIC overlapping the driving chip DIC.

According to an embodiment, the protective film PTF may include a material included in an insulating layer of the cover layer CIC. Therefore, the protective film (PTF) may include an insulating material. For example, the protective film (PTF) may include a polymer material. The polymer material according to an embodiment may include at least one of polyethylene terephthalate (PET) and foam.

According to one embodiment, the thickness of the protective film (PTF) may be 50 micrometers or more and 200 micrometers or less. When the thickness of the protective film PTF is less than 50 micrometers, it is easily damaged by an external impact, and thus the third area BA of the display panel DP may not be protected. When the thickness of the protective film PTF exceeds 200 micrometers, the display module DM may be damaged because the remaining elements of the display module DM are pressed by the weight of the protective film PTF.

According to the present invention, if the protective film (PTF) has a plate shape capable of covering the third area (BA) of the bent display panel (DP), it is related to the type and shape of the electronic device (EA, see FIG. 1). It can be applied to all electronic devices (EA) without Accordingly, the shape of the protective film PTF may not be separately designed according to the type and shape of the electronic device EA. Accordingly, according to the type and shape of the electronic device EA, a mold required for manufacturing the protective film PTF may not be separately designed and manufactured.

In addition, according to the present invention, the protective film (PTF) may be attached on the cover layer (CIC) using the same facility as the facility for attaching the cover layer (CIC) on the flexible circuit film (FCB). Accordingly, a separate facility for attaching the protective film (PTF) may not be required.

Therefore, according to the present invention, it is possible to provide a display module (DM) in which manufacturing time and manufacturing cost are reduced by simplifying the manufacturing process of the protective film (PTF).

The adhesive layer (ACL) may be disposed between the protective film (PTF) and the cover layer (CIC) to bond the protective film (PTF) and the cover layer (CIC). FIG. 5 shows a cross section of the third portion (PP3, see FIG. 4) of the adhesive layer ACL. According to an embodiment, the third portion PP3 (see FIG. 4 ) of the adhesive layer ACL may overlap the bending protection layer BRL.

Before the protective film (PTF) and the adhesive layer (ACL) according to the present invention are included in the components of the electronic device (EA, see FIG. 2a) after the display module (DM) is connected to the electronic module (EM, see FIG. 2a) Alternatively, it may be a component that is removed from the cover layer CIC in the process of being connected to the electronic module EM and being included in the components of the electronic device EA (see FIG. 2A).

The adhesive layer ACL may include a first surface S1 adjacent to the cover layer CIC and a second surface S2 opposite to the first surface S1 and adjacent to the protective film PTF. According to the present embodiment, the adhesive force between the first surface S1 of the adhesive layer ACL and the cover layer CIC is the adhesive force between the second surface S2 of the adhesive layer ACL and the protective film PTF. may be smaller than Accordingly, in the process of removing the protective film (PTF) from the cover layer (CIC), the protective film (PTF) and the adhesive layer (ACL) can be easily removed.

According to an embodiment, the adhesive strength between the first surface S1 of the adhesive layer ACL and the cover layer CIC may be greater than or equal to 150 gf/in and less than or equal to 300 gf/in. The unit gf/in is defined as the strength of force required to remove an adhesive layer (ACL) of 1 inch in width.

When the adhesive force between the first surface S1 of the adhesive layer ACL and the cover layer CIC is less than 150 gf/in, the adhesive force between the cover layer CIC and the protective film PTF is not sufficient, and thus the display module During the transfer process of the (DM), the protective film (PTF) may separate from the cover layer (CIC). Accordingly, the third area BA of the display panel DP may be exposed and damaged.

When the adhesive force between the first surface S1 of the adhesive layer ACL and the cover layer CIC exceeds 300 gf/in, it may not be easy to remove the protective film PTF. After removing the protective film (PTF), a part of the adhesive layer (ACL) may remain on the cover layer (CIC), or the cover layer (CIC) may be damaged by applying strong force in the process of removing the protective film (PTF). .

6A to 6I are cross-sectional views sequentially illustrating a method of manufacturing a display module according to an embodiment of the present invention. Hereinafter, referring to FIGS. 6A to 6I , in describing a manufacturing method of a display module DM according to an embodiment of the present invention, same/similar references are made to the same/similar configurations as those described in FIGS. 1 to 5 . Codes are used, and redundant explanations are omitted.

Referring to FIG. 6A , a method of manufacturing a display module DM according to an exemplary embodiment includes forming a bending protection layer BRL on the display panel DP. The provided display panel DP may include a first area NBA1, a second area NBA2, and a third area BA disposed between the first area NBA1 and the second area NBA2. , An optical film RPP may be disposed on the first area NBA1. The bending protection layer BRL may be formed on the third area BA of the display panel DP.

According to an embodiment, the bending protection layer BRL may be formed to further cover an end portion of the first area NBA1 adjacent to the third area BA. One end of the bending protection layer BRL may be formed to contact one end of the optical film RPP disposed on the first region NBA1.

Also, according to an embodiment, the bending protection layer BRL may be formed to further cover an end portion of the second area NBA2 adjacent to the third area BA.

Referring to FIG. 6B , a method of manufacturing a display module DM according to an exemplary embodiment includes mounting a driving chip DIC on a display panel DP. The driving chip DIC may be mounted on the second area NBA2 of the display panel DP.

A method of manufacturing a display module (DM) according to an embodiment includes attaching a flexible circuit film (FCB) to an end portion of a second area (NBA2) spaced apart from the third area (BA) of the display panel (DP). can include more. The attaching of the flexible circuit film (FCB) may be performed before the mounting of the driving chip (DIC) or may be performed after the mounting of the driving chip (DIC).

Referring to FIG. 6C , the method of manufacturing the display module DM according to an exemplary embodiment includes forming a cover layer CIC on the second area NBA2 of the display panel DP.

The cover layer CIC according to an exemplary embodiment may be formed to cover all of the driving chip DIC and at least a portion of the flexible circuit film FCB. Also, the cover layer CIC may be formed to cover a region disposed on the second region NBA2 of the bending protection layer BRL.

Referring to FIG. 6D , a method of manufacturing a display module (DM) according to an embodiment includes attaching a protective film (PTF) on a cover layer (CIC). The protective film PTF may be attached to overlap at least a portion of the second area NBA2 and at least a portion of the third area BA of the display panel DP.

According to an embodiment, the protective film (PTF) may be adhered on the cover layer (CIC) through the adhesive layer (ACL). FIG. 6D exemplarily shows bonding of the protective film (PTF) and the cover layer (CIC) through the adhesive layer (ACL) formed on the region of the cover layer (CIC) covering the bending protection layer (BRL). . However, if the protective film (PTF) can be combined with the cover layer (CIC), the arrangement of the adhesive layer (ACL) is not limited to any one embodiment.

According to the present invention, since the protective film (PTF) can be performed with a facility for attaching the cover layer (CIC), a separate facility for attaching the protective film (PTF) may not be added. Therefore, when manufacturing the display module DM through the manufacturing method of the display module DM of the present invention, equipment cost can be reduced.

Referring to FIG. 6E , a method of manufacturing a display module DM according to an exemplary embodiment includes attaching a window WM on the display panel DP. The window WM may be attached to overlap all of the first area NBA1 and at least a portion of the third area BA of the display panel DP.

A window protection layer WP may be provided on the base substrate BS of the window WM in an attached state. Accordingly, in the step of attaching the window WM to the display panel DP, it is possible to prevent the window WM from being damaged.

According to an embodiment, the window WM may be adhered to the display panel DP through the first adhesive member AM1. The first adhesive member AM1 may be formed on an area overlapping the first area NBA1 among the optical film RPP and the bending protection layer BRL. However, the arrangement of the first adhesive member AM1 is not limited thereto, and the first adhesive member AM1 may be formed only on the optical film RPP.

Referring to FIG. 6F , the manufacturing method of the display module DM according to an exemplary embodiment includes forming a lower protection member LP under the display panel DP.

The lower protection member LP may include a first lower protection member LP1 and a second lower protection member LP2. The first lower protection member LP1 may be formed below the first area NBA1, and the second lower protection member LP2 may be formed below the second area NBA2.

Referring to FIG. 6G , the manufacturing method of the display module DM according to an exemplary embodiment includes forming a preliminary support member SP-I under the first lower protection member LP1.

The preliminary support member SP-I includes a cushion layer SP1 disposed on the rear surface of the first lower protective member LP1, a metal layer SP2 disposed under the cushion layer SP1, and a metal layer SP2. A coating layer CTL may be disposed below to cover the metal layer SP2 .

According to one embodiment, the coating layer CTL may include polyethylene terephthalate (PET). The coating layer CTL may prevent plastic deformation of the metal layer SP2.

The first lower protection member LP1 and the preliminary support member SP-I may be bonded through the second adhesive member AM2.

Referring to FIG. 6H , a method of manufacturing a display module DM according to an exemplary embodiment includes bending the display panel DP. The rear surface of the first area NBA1 and the second area NBA2 are centered on an imaginary axis (FX, see FIG. 6i) extending from the third area BA of the display panel DP in the first direction DR1. ) can be bent so that the back surfaces face each other.

According to an embodiment, before bending the display panel DP, after exposing the metal layer SP2 by removing the coating layer (CTL, see FIG. 6G ) of the preliminary support member SP-I, the exposed metal layer ( A third adhesive member AM3 may be formed on SP2). Thereafter, the rear surface of the second lower protection member LP2 may be adhered to the lower portion of the support member SP through the third adhesive member AM3.

Then, referring to FIG. 6I , the third area BA of the display panel DP may be bent so that the second area NBA2 may be disposed below the first area NBA1. A driving chip DIC mounted on the second area NBA2, a flexible circuit film FCB attached to one end of the second area NBA2, a cover layer CIC attached on the second area NBA2, and protection The film PTF may also be disposed below the first region NBA1.

The display module (DM) manufactured through the manufacturing method of the display module (DM) of the present invention covers the third area (BA) where the protective film (PTF) is bent, so that the display module (DM) can be transported, stored, or It is possible to prevent the third area BA from being damaged by an external impact during transport. Through this, it is possible to provide a display module DM with improved reliability.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art or those having ordinary knowledge in the art do not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and changes can be made to the present invention within the scope.

Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but should be defined by the claims.

EA: Electronics
DM: display module
EM: electronic module
WM: Windows
DP: display panel
NBA1, NBA2, BA: Area 1, Area 2, Area 3
RPP: optical film
BRL: Bending protective layer
DIC: drive chip
FPC: Flexible Circuit Film
CIC: cover layer
PTF: protective film
ACL: adhesive layer
LP: lower protection member
SP: support member

Claims (20)

A first area including pixels, a second area in which a driving chip connected to the pixel is mounted, and a third area disposed between the first area and the second area and bent with respect to an imaginary axis extending in the first direction. a display panel including an area;
a bending protection layer covering the third region;
a cover layer disposed on the second region and covering the driving chip; and
Including a protective film disposed on the cover layer,
The display module of claim 1 , wherein the protective film overlaps the third region on a plane and protrudes beyond the bending protective layer in a second direction crossing the first direction. According to claim 1,
Further comprising a window covering the display panel,
The display module, wherein the window protrudes beyond the bending protection layer in the second direction. According to claim 2,
The display module wherein the window protrudes beyond the protective film in the second direction. According to claim 1,
The display module further comprises an adhesive layer disposed between the cover layer and the protective film. According to claim 4,
The adhesive layer is
A display module comprising a first part and a second part disposed spaced apart from the driving chip and spaced apart from each other in the first direction with the driving chip as a center. According to claim 5,
The adhesive layer is
and a third portion spaced apart from the first portion and the second portion and disposed adjacent to the third region rather than the driving chip. According to claim 4,
The adhesive force between the adhesive layer and the protective film is greater than the adhesive force between the adhesive layer and the cover layer. According to claim 7,
The adhesive force between the adhesive layer and the cover layer is 150 gf / in or more and 300 gf / in or less. According to claim 1,
The bending protection layer further covers a portion of the second region,
The cover layer further covers at least a portion of an area overlapping the second area of the bending protection layer. According to claim 9,
Further comprising an adhesive layer disposed on the cover layer,
The adhesive layer overlaps a region covering the bending protection layer among the cover layers. According to claim 1,
The display module further comprising an optical film disposed on the first area. According to claim 11,
The bending protection layer further covers a portion of the first region,
An end of the bending protection layer adjacent to the first region is in contact with the optical film. According to claim 1,
The thickness of the protective film is 50 micrometers or more and 200 micrometers or less. According to claim 1,
The cover layer includes a plurality of layers,
The protective film includes the same material as any one of the plurality of layers. According to claim 1,
The protective film is a display module containing a polymer material. forming a bending protection layer covering the third region of a display panel including a first region, a second region, and a third region disposed between the first region and the second region;
mounting a driving chip on the second area;
forming a cover layer covering the driving chip;
attaching a protective film on the cover layer; and
and bending the third region. According to claim 16,
After the step of attaching the protective film and before the step of bending the third region,
The display module manufacturing method further comprising attaching a window on the display panel. According to claim 16,
The step of attaching the protective film,
A method of manufacturing a display module in which the protective film and the cover layer are bonded through an adhesive layer. According to claim 16,
The display module manufacturing method further comprising attaching a flexible circuit board to an end portion of the second region. According to claim 19,
After the step of bending the third region,
removing the protective film; and
Further comprising the step of coupling the display panel to a motherboard,
In the step of coupling the display panel to the motherboard,
The method of manufacturing a display module in which the motherboard is electrically connected through a connector of the flexible circuit board.

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