KR20210066402A - An electronic device including a communication module and method - Google Patents

Abstract

Disclosed is an electronic device comprising: a housing including a metal portion in at least a part thereof; a support member disposed in the housing; a communication module disposed adjacent to the support member; a conductive antenna pattern disposed on the support member and disposed on the periphery of the communication module in a designated pattern; and a grip sensor electrically connected to the communication module and the conductive antenna pattern, wherein the conductive antenna pattern supports a first frequency band which is a frequency band lower than or equal to a designated frequency, the communication module supports a second frequency band which is a frequency band higher than or equal to the designated frequency, and a processor operatively connected to the grip sensor is configured to control an operation of the communication module and/or power transmitted through the conductive antenna pattern on the basis of the detection of the grip sensor. In addition, other embodiments identified through the specifications are possible. The present invention can maintain transmission performance of an antenna while securing a recognition area of the grip sensor.

Description

An electronic device including a communication module and method

Various embodiments disclosed in this document relate to an electronic device and method including a communication module.

With the development of mobile communication technology, an electronic device having an antenna has been widely spread. When the housing of the electronic device includes a metal part such as a metal frame, the antenna may be implemented using the metal part of the housing. The electronic device may transmit and/or receive a radio frequency (RF) signal including a voice signal or data (eg, a message, photo, video, music file, or game) using an antenna.

Meanwhile, the electronic device may include a grip sensor that detects whether the user holds the electronic device by hand. When the user holds the electronic device with his/her hand, the grip sensor may detect a change in capacitance of a circuit of the grip sensor to determine whether the user holds the electronic device with his/her hand. The grip sensor may reduce the signal transmission output of the antenna when the user holds the electronic device 101 by hand. The electronic device may adjust the signal transmission output by connecting the grip sensor and the antenna.

A communication module may be disposed inside the electronic device to provide a communication function. When the communication module is disposed inside the electronic device, the conductive part of the antenna and the metal part of the housing may be connected. When the conductive part of the antenna and the metal part of the housing are connected, the capacitance of the circuit of the grip sensor may not change when the user holds the electronic device by hand. If the capacitance of the circuit of the grip sensor does not change, it may not be easy to adjust the signal transmission output when the user holds the electronic device with his/her hand. In order to use the grip sensor, it may be necessary to separate the conductive part of the antenna from the metal part of the housing or increase the arrangement area of the conductive part of the antenna. In this case, it may not be easy to arrange an antenna for transmitting signals of different frequency bands.

Various embodiments disclosed in this document provide an electronic device capable of maintaining signal transmission output performance of an antenna while enabling recognition of a grip sensor.

An electronic device according to an embodiment disclosed in this document may include a housing including at least a part of a metal part, a support member disposed in the housing, a communication module disposed adjacent to the support member, and disposed on the support member, wherein the electronic device is disposed on the support member. a conductive antenna pattern disposed on a periphery of a communication module in a specified pattern, and a grip sensor electrically connected to the communication module and the conductive antenna pattern, wherein the conductive antenna pattern comprises a first frequency band that is a frequency band less than or equal to a specified frequency. support, and the communication module supports a second frequency band that is a frequency band greater than or equal to the specified frequency, and the processor operatively connected to the grip sensor performs an operation of the communication module and/or the It can be set to control the power transmitted to the conductive antenna pattern.

In addition, the electronic device according to another embodiment of the present disclosure includes a housing including at least a part of the metal part, a communication module disposed in a support member disposed in a first direction of the metal part, and the first direction of the communication module. An LDS pattern disposed to surround a first surface facing to a second direction perpendicular to the first direction, and to at least partially surround at least one second surface adjacent to the first surface of the communication module in the first direction A first frequency band comprising a conductive antenna pattern comprising a conductive antenna pattern, a grip sensor electrically connected to the communication module and the conductive antenna pattern, and a processor electrically connected to the grip sensor, wherein the conductive antenna pattern is a frequency band of 6 GHz or less , and the communication module may support a second frequency band that is a frequency band of 6 GHz or more.

The method for controlling an electronic device according to an embodiment disclosed in this document includes the steps of determining whether a change in capacitance of a grip sensor of the electronic device is equal to or greater than a specified threshold value, and the transmission power of the communication module is greater than or equal to a specified output value It may include an operation of confirming whether the change in capacitance is greater than or equal to the specified threshold value and an operation of adjusting the size of the transmission power of the communication module while the transmission power is greater than or equal to the specified output value.

According to the embodiments disclosed in this document, by disposing a laser direct structuring (LDS) antenna module around the communication module, even in a structure in which the grip sensor cannot be connected to the conductive part of the antenna, the grip sensor allows the user to hold the electronic device by hand. It can be recognized whether

In addition, according to the embodiments disclosed in this document, it is possible to maintain the transmission performance of the antenna while securing the recognition area of the grip sensor.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
2 is an exploded perspective view of an electronic device according to an exemplary embodiment;
3 is an exploded perspective view illustrating a communication module and an LDS antenna module of an electronic device according to an exemplary embodiment.
4 is an exploded perspective view illustrating a grip sensor of an electronic device according to an exemplary embodiment.
5 is a diagram illustrating an LDS pattern of a dipole shape of an electronic device according to an exemplary embodiment.
6 is a diagram illustrating an LDS pattern in the form of a loop of an electronic device according to an exemplary embodiment.
7 is a diagram illustrating an LDS pattern in the form of a loop of an electronic device according to another exemplary embodiment.
8 is a graph illustrating characteristics of an antenna of an electronic device according to an exemplary embodiment.
9 is a flowchart illustrating an operation of a grip sensor of an electronic device according to an exemplary embodiment.
10 is a diagram illustrating a communication module, an LDS antenna, a grip sensor module, and a matching circuit according to an embodiment.
11 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments of the present disclosure;
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present invention.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100 , the electronic device 101 communicates with the electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the nonvolatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can operate independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 180 or communication module 190). have.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). Among these communication modules, a corresponding communication module may be a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It may communicate with an external electronic device via a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components may include a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), mobile industry processor interface (MIPI), or Peripheral component Interconnect Express (PCIe)) ) to connect to each other and to exchange signals (such as commands or data) with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the electronic devices 102 and 104 may be the same or a different type of the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more of the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. The one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

2 is an exploded perspective view 200 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment.

The electronic device 101 according to an embodiment includes a front plate 210 , a grip sensor 220 , a battery 230 , a communication module 240 , an LDS antenna module 250 , a printed circuit board (PCB), and a printed circuit. substrate) 260 , a support member 270 , and/or a back plate 280 .

In an embodiment, the front plate 210 may form the front surface of the electronic device 101 . The front plate 210 may be disposed to face the +Z axis direction. At least a portion of the front plate 210 may be formed of a transparent member. A display (eg, the display device 160 of FIG. 1 ) may be viewed in the +Z-axis direction through the front plate 210 . A USIM chip 211 for communication registration of the electronic device 210 may be inserted through the opening formed on one side of the front plate 210 . The front plate 210 may be coupled to the rear plate 280 using a plurality of connecting members 212a, 212b, 212c, 213a, 213b, and 213c. In the space formed by combining the front plate 210 and the rear plate 280, an acceleration sensor 214 for measuring the acceleration of the electronic device 101, and a movement sensor for measuring the speed of the electronic device 101 ( 215) may be disposed. A plurality of supports 216 and 217 may be disposed in the space between the front plate 210 and the rear plate 280 to support and/or divide the space.

In an embodiment, the grip sensor 220 may be disposed in a space between the front plate 210 and the rear plate 280 . The grip sensor 220 may include a sensing circuit 221 . The grip sensor 220 may be connected to the camera module 223 through a screw 222 .

In an embodiment, the battery 230 may be disposed in a space between the front plate 210 and the rear plate 280 . The battery 230 may be disposed in a region that does not overlap the grip sensor 220 in the +Z-axis direction. The battery 230 may supply power for driving the electronic device 101 . A support 231 may be disposed to support the battery 230 . The battery 230 may be connected to the power supply circuit 232 . The battery 230 may be connected to the support 231 through a screw 233 . The battery 230 may be connected to an external charging device through the charging terminal 234 .

In an embodiment, the communication module 240 may be disposed in a space between the front plate 210 and the rear plate 280 . The communication module 240 may be disposed adjacent to the grip sensor 220 . The communication module 240 may transmit/receive a signal of the first frequency band. For example, the first frequency band may be a millimeter wave (mmWave) frequency band and/or a 5G Sub-6 frequency band.

In an embodiment, the LDS antenna module 250 may be disposed in a space between the front plate 210 and the rear plate 280 . The LDS antenna module 250 may be disposed to overlap the grip sensor 220 at least partially in the +Z-axis direction. The LDS antenna module 250 may transmit/receive a signal of the second frequency band. The second frequency band may be different from the first frequency band. For example, the second frequency band may be a 4G frequency band and/or a 3G/2G frequency band in which a legacy antenna transmits and receives.

In an embodiment, the PCB 260 may be disposed in a space between the front plate 210 and the rear plate 280 . The PCB 260 may be disposed so as not to overlap the grip sensor 220 in the +Z-axis direction. The PCB 260 may mount a processor (eg, the processor 120 of FIG. 1 ). The PCB 260 may be mounted on the support member 270 by screws 261 .

In an embodiment, the support member 270 may be disposed in a space between the front plate 210 and the rear plate 280 . The support member 270 may mount the LDS antenna module 250 and the PCB 260 . The support member 270 may be coupled to the rear plate 280 by a screw 271 .

In an embodiment, the rear plate 280 may form the rear surface of the electronic device 101 . The rear plate 280 may be disposed to face the -Z axis direction. The front plate 210 and the rear plate 280 may form the housings 210 and 280 of the electronic device 101 .

3 is an exploded perspective view 300 illustrating a communication module 240 and an LDS antenna module 250 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment.

In an embodiment, the electronic device 101 may include a communication module 240 to provide a communication function. The communication module 240 may be connected to the housings 210 and 280 . The communication module 240 may be electrically connected to a processor (eg, the processor 120 of FIG. 1 ) mounted on the PCB 260 . The processor 120 may control the power supply circuit 232 to supply transmission power to the communication module 240 . The communication module 240 may transmit a signal of the first frequency band using transmission power.

In an embodiment, the communication module 240 may support a 5G millimeter wave (mmWave) module and/or 5G NR. The transceiver of the communication module 240 may be located adjacent to the +Y-axis direction.

In an embodiment, the LDS antenna module 250 may be disposed around the communication module 240 . For example, in the electronic device 101 , the communication module 240 may be disposed to be adjacent in the +Y-axis direction, and the LDS antenna module 250 may be disposed to surround at least one side of the communication module 240 . The LDS antenna module 250 may be electrically connected to the processor 120 . The LDS antenna module 250 may transmit a signal of a second frequency band different from the first frequency band.

4 is an exploded perspective view 400 illustrating a grip sensor 220 of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an exemplary embodiment.

In an embodiment, the electronic device 101 may include a grip sensor 220 connected to the communication module 240 to adjust an output of the communication module 240 in response to a user's contact.

In an embodiment, the grip sensor 220 may recognize a user's hand gripping the electronic device 101 . At least a portion of the housing of the electronic device 101 (eg, the housings 210 and 280 of FIG. 2 ) may include a metal part. The metal parts of the housings 210 and 280 may be connected to the communication module 240 and/or the LDS antenna module 250 . The metal part of the housings 210 and 280 may be used as an antenna radiator of the communication module 240 and/or the LDS antenna module 250 . The grip sensor 220 may be connected to a metal part of the housings 210 and 280 . When the user holds the electronic device 101 by hand, the grip sensor 220 may detect a change in capacitance between the metal part of the housings 210 and 280 and the grip sensor 220 . When the amount of change in capacitance between the metal parts of the housings 210 and 280 and the grip sensor 220 is greater than or equal to the specified amount of change, the processor (eg, the processor 120 of FIG. 1 ) detects that the user holds the electronic device 101 by hand. can recognize

In an embodiment, the processor 120 utilizes the grip sensor 220 when the communication module 240 is mounted in the +Y-axis direction of the electronic device 101 according to the user's usage condition of the communication module 240 . The transmit power can be controlled. The processor 120 utilizes the LDS antenna module 250 mounted in the +Y-axis direction of the electronic device 101 to improve the recognition performance of the grip sensor 220 without affecting the performance of the LDS antenna module 250 . can satisfy

FIG. 5 is a diagram 500 illustrating an LDS pattern 550 of a dipole type of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an exemplary embodiment. The electronic device 101 according to an embodiment includes a metal part 510 , a support member 520 , a communication module 530 , conductive antenna patterns 540 and 550 , a grip sensor 220 , and a PCB 260 . may include

In an embodiment, the metal part 510 may be included in at least a part of a housing (eg, the housings 210 and 280 of FIG. 2 ). The metal part 510 may be a side member of the housings 210 and 280 . The metal part 510 may be disposed in the +Y-axis direction of the electronic device 101 . The metal part 510 may be a 2G/3G/4G/5G NR antenna part. The metal part 510 may be a radiator of the antenna part. The metal part 510 may transmit signals of various frequency bands.

In an embodiment, the support member 520 may be disposed in the first direction (-Y-axis direction) of the metal part 510 . The support member 520 may be an antenna carrier. The support member 520 may be made of a non-metal material. For example, the support member 520 may be formed of a non-conductive injection molding material.

In an embodiment, the communication module 530 may be disposed in the support member 520 . The communication module 530 may be a 5G mmWave antenna module (eg, the third antenna module 1146 of FIG. 11 ) including an antenna, a PCB, and an RFIC.

In an embodiment, the communication module 530 may be disposed adjacent to the upper end (+Y-axis direction) of the electronic device 101 . For example, a 5G millimeter wave (mmWave) module and a power transmitter and/or receiver of 5G NR may be located on top of the mobile phone.

In an embodiment, the communication module 530 may transmit a signal of the first frequency band. For example, the communication module 530 may transmit a millimeter wave signal.

In an embodiment, the conductive antenna patterns 540 and 550 may process a signal transmission/reception process of the second frequency band. The second frequency band may be different from the first frequency band. For example, the second frequency band may be a 4G frequency band and/or a 3G/2G/5G (sub 6) frequency band in which a legacy antenna transmits and receives. The conductive antenna patterns 540 and 550 may be arranged in a designated pattern 550 around the communication module 530 . The conductive antenna patterns 540 and 550 may include an LDS antenna 540 and an LDS pattern 550 .

In an embodiment, the LDS antenna 540 may radiate a signal of the second frequency band. The LDS antenna 540 may be disposed within the support member 520 . The LDS antenna 540 may transmit a signal of a second frequency band different from the first frequency band. For example, the LDS antenna 540 may transmit/receive signals of 4G/3G/2G frequency bands.

In an embodiment, the LDS pattern 550 may adjust the range of the second frequency band. The LDS pattern 550 may be connected to the grip sensor 220 and used as an electrode of the grip sensor 220 . The LDS pattern 550 may be connected to the LDS antenna 540 . The LDS pattern 550 may be disposed to surround the communication module 530 from at least one side. For example, the LDS pattern 550 may be disposed to surround a lower surface and a side surface of the communication module 530 except for the upper surface. A dipole antenna array may be disposed on the upper surface of the communication module 530 .

In an embodiment, the LDS pattern 550 may be disposed to suppress a supra signal generated by the housings 210 and 280 when the antenna array disposed in the communication module 530 is radiated. For example, the LDS pattern 550 is disposed on at least one side of the patch antenna array included in the communication module 530 so that when the antenna array radiates a signal in the mmWave band, the rear plate (eg, the rear plate in FIG. 2 ) 280)) can suppress the leakage signal.

In an embodiment, the LDS pattern 550 may be electrically connected to the grip sensor 220 . When the LDS pattern 550 is connected to the grip sensor 220 , when the user grips the position where the LDS pattern 550 is disposed, the grip sensor 220 may detect a change in capacitance. Accordingly, when the LDS pattern 550 is connected to the grip sensor 220 , the LDS pattern 550 may sense an event in which the user grips the electronic device 101 .

In an embodiment, the LDS pattern 550 may be connected to the LDS antenna 540 . The LDS pattern 550 may be a dummy pattern that improves the radiation performance of the LDS antenna 540 .

In an embodiment, the LDS pattern 550 has a first surface facing the first direction (-Y-axis direction) of the communication module 530 in a second direction (+X) perpendicular to the first direction (-Y-axis direction). axial direction). For example, the LDS pattern 550 may be disposed to surround a lower surface of the communication module 530 in the -Y-axis direction in the lateral direction. The LDS pattern 550 may cover at least a part of the lower surface of the communication module 530 . The LDS pattern 550 may be disposed to at least partially surround at least one second surface adjacent to the first surface of the communication module 530 in the first direction (-Y-axis direction). For example, the LDS pattern 550 may be disposed to surround at least a portion of the lower surface and adjacent side surfaces of the communication module 530 in the -Y-axis direction.

In an embodiment, the designated pattern 550 of the conductive antenna patterns 540 and 550 may be symmetrically disposed around the communication module 530 . The designated pattern 550 may be symmetrically disposed to surround the lower surface and the side surface of the communication module 530 .

In an embodiment, the LDS pattern 550 may be symmetrically disposed around the communication module 530 . The LDS pattern 550 may be symmetrically disposed about a first virtual line 551 penetrating the communication module 530 in the first direction (-Y-axis direction). For example, the LDS pattern 550 may be symmetrically disposed about a virtual line 551 passing through the center of the communication module 530 .

In an embodiment, the conductive antenna patterns 540 and 550 may be disposed to surround the communication module 530 from at least one side. The conductive antenna patterns 540 and 550 may be electrically connected to the communication module 530 and simultaneously connected to the grip sensor 220 . The conductive antenna patterns 540 and 550 may transmit and receive each of two types of signals through separate paths while having two connection points. Since the conductive antenna patterns 540 and 550 have two poles to support two paths, they may have a dipole shape. The dipole shape is in the LDS region for recognizing the grip sensor (eg, the grip sensor 220 in FIG. 2 ) in the upper antenna part of the electronic device 101 and conductive antenna patterns 540 and 550 for transmitting the signal of the 4G frequency band. It can be implemented by connecting the included LDS pattern 550 in a dipole form.

In an embodiment, the grip sensor 220 may detect a touch to the metal part 510 . The grip sensor 220 may detect an amount of change in capacitance according to a touch on the metal part 510 .

In an embodiment, the processor (eg, the processor 120 of FIG. 1 ) may be electrically connected to the communication module 530 and the conductive antenna patterns 540 and 550 . For example, the processor 120 may be connected to the communication module 530 through at least one wire on the PCB 260 . As another example, the processor 120 may be directly connected to the conductive antenna patterns 540 and 550 and the LDS pattern 550 .

In an embodiment, the processor 120 may be configured to adjust the amount of transmission power of the communication module 530 based on the touch to the metal part 510 sensed by the conductive antenna patterns 540 and 550 . When a touch occurs on the metal part 510 , the capacitance measured by the grip sensor 220 may change. The processor 120 may be set to measure the amount of change in capacitance in the grip sensor 220 when a touch to the metal part 510 occurs. The amount of change in capacitance measured by the grip sensor 220 may be detected by the conductive antenna patterns 540 and 550 electrically connected to the grip sensor 220 . When a change in capacitance is detected in the conductive antenna patterns 540 and 550 , the processor 120 may transmit a power back-off signal to the communication module 530 to adjust the amount of transmit power of the communication module 530 .

In an embodiment, the size of the transmission power of the communication module 530 may be adjusted according to the length of the specified pattern 550 . As the length of the designated pattern 550 increases, the size of the radiator may increase, so that the size of the transmission power of the communication module 530 may increase.

6 is a diagram 600 illustrating an LDS pattern 640 of a loop type of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment.

In an embodiment, the conductive antenna patterns 540 and 640 may include a designated pattern 640 . The designated pattern 640 may be an LDS pattern 640 . The designated pattern 640 is symmetrically disposed around the communication module 530 and may include a closed curve pattern.

In an embodiment, the LDS pattern 640 may further extend in a first direction (-Y-axis direction) from a portion adjacent to the communication module 530 to form a closed curve. The LDS pattern 640 may extend in a first direction (-Y-axis direction) from a first point 641 and a second point 642 that are both ends of a portion adjacent to the communication module 530 to form a closed curve. . The LDS pattern 640 extends again in the second direction (+X-axis direction) from the end point of the extended first extension part 643 and the end point of the second extension part 644 to the third extension part 645 . can form. The LDS pattern 640 is formed by a portion including a first point 641 and a second point 642 , a first extension 643 , a second extension 644 , and a third extension 645 . It may have an entirely closed shape. For example, the LDS pattern 640 may further have a closed rectangular closed curve adjacent to the communication module 530 .

In one embodiment, the transmit power of the conductive antenna patterns 540 and 640 according to the length in the first direction (-Y-axis direction) and the length in the second direction (+X-axis direction) of the LDS pattern 640 . You can adjust the frequency. As the length of the LDS pattern 640 in the first direction (-Y-axis direction) and the length in the second direction (+X-axis direction) become longer, the resonant frequencies of the LDS antenna modules 540 and 640 may decrease. .

In an embodiment, the resonance frequency of the communication module 530 may be moved according to the length of the LDS pattern 640 connected to the LDS antenna 540 and/or the size of the loop. When the lengths 550 and 640 of the LDS patterns and/or the size of the loop 640 in the dipole and/or loop LDS patterns 550 and 640 increase, the size of the inductance may increase. When the magnitude of the inductance increases, a low shift in which the resonance frequency of the communication module 530 decreases may occur. When the lengths 550 and 640 of the LDS pattern and/or the size of the loop 640 decrease, a high shift in which the resonant frequency increases may occur.

In an embodiment, the LDS pattern 640 may have a loop shape. The loop-type LDS antenna modules 540 and 640 connect the LDS region for recognizing the grip sensor (eg, the grip sensor 220 of FIG. 5 ) in the upper antenna part and the conductive antenna patterns 540 and 640 in a loop form. can be implemented The LDS pattern 540 for recognizing the grip sensor 220 among the conductive antenna patterns 540 and 640 may be connected to a lower end and a side surface of the communication module 530 .

7 is a diagram 700 illustrating an LDS pattern 710 in a loop shape of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to another embodiment.

In an embodiment, the LDS pattern 710 may be disposed in a closed curve shape to be adjacent to the LDS antenna 540 . The LDS pattern 710 may be arranged such that the LDS region recognizing the grip sensor (eg, the grip sensor 220 of FIG. 5 ) avoids the communication module 530 . For example, the LDS pattern 710 extends from the connector 711 connected to the LDS antenna 540 in a direction opposite to the second direction (+X-axis direction) in which the communication module 530 is disposed (-X-axis direction). As a result, a closed curve 712 may be formed. As such, when the antenna is not disposed in an area other than the area in which the communication module 530 is disposed, the LDS pattern 710 may be disposed.

8 is a graph 800 illustrating characteristics of an antenna of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an embodiment.

In an embodiment, the first characteristic 810 may be a characteristic of an antenna when only the communication module 530 and the LDS antenna 540 are disposed. The second characteristic 820 may be a characteristic of an antenna when the dipole-shaped LDS pattern 550 is additionally disposed. The third characteristic 830 may be a characteristic of an antenna when the loop-shaped LDS patterns 640 and 710 are additionally disposed.

In an embodiment, the frequency of the antenna efficiency of the 4G frequency band 840 may be partially shifted in the second characteristic 820 and the third characteristic 830 compared to the first characteristic 810 . Compared with the first characteristic 810 , the performance of the second frequency band in the second characteristic 820 and the third characteristic 830 may be maintained. Compared to the first characteristic 810 , the performance of the second frequency band in the third characteristic 830 may be improved.

9 is a flowchart 900 of an operation of a grip sensor (eg, the grip sensor 220 of FIG. 4 ) of an electronic device (eg, the electronic device 101 of FIG. 1 ) according to an exemplary embodiment. The processor (eg, the processor 120 of FIG. 1 ) uses the grip sensor 220 to adjust the amount of transmission power of the communication module (eg, the communication module 530 of FIG. 5 ) of the electronic device 101 . A touch to the metal part (eg, the metal part 510 of FIG. 5 ) may be sensed.

In operation 910 , the processor 120 of the electronic device 101 according to an embodiment may determine whether the capacitance change amount of the upper grip sensor 220 is equal to or greater than a first threshold value. In operation 920 , the processor 120 may determine whether the capacitance change amount of the lower grip sensor 220 is equal to or greater than a second threshold value.

In an embodiment, the processor 120 may determine whether the amount of change in capacitance of the grip sensor 220 of the electronic device 101 is greater than or equal to a specified threshold value. The processor 120 calculates the amount of change in capacitance of the grip sensor 220 of the electronic device 101 at the upper end (+Y-axis direction end) and at the lower end (-Y-axis direction end) of the electronic device 101 . can be measured in When the amount of change in capacitance of the grip sensor 220 is equal to or greater than a specified threshold value (operation 910 and/or operation 920 - Yes), the processor 120 determines that the user holds the electronic device 101 and performs operation 930 and/or The process may proceed to operation 940 . When the amount of change in capacitance of the grip sensor 220 is less than a specified threshold (operation 910 and/or operation 920 - No), the processor 120 determines that the user does not hold the electronic device 101 and proceeds to operation 990 . can

In an embodiment, the communication module 530 may transmit a millimeter wave and/or a 5G Sub-6 signal. The communication module 530 may be disposed on the top of the electronic device 101 . When the capacitance change amount of the upper grip sensor 220 is equal to or greater than the first threshold value, the processor 120 determines that the user holds the upper end of the electronic device 101 by hand and transmits a millimeter wave and/or 5G Sub-6 signal. The size of the transmission power of the communication module 530 may be adjusted.

The processor 120 of the electronic device 101 according to an embodiment may determine whether the mmWave/5G Sub6 power is equal to or greater than the first output value in operation 930 . In operation 940 , the processor 120 may determine whether 4G/3G/2G power is equal to or greater than the second output value.

In an embodiment, the processor 120 may determine whether the transmission power of the communication module 530 is equal to or greater than a specified output value. The processor 120 may proceed to operations 950 and/or 960 when the transmission power of the communication module 530 is equal to or greater than a specified output value (operations 930 and/or operations 940 - Yes). When the transmission power of the communication module 530 is less than the specified output value (operations 930 and/or operations 940 - No), the processor 120 may proceed to operation 990 .

The processor 120 of the electronic device 101 according to an embodiment may perform a mmWave/5G Sub6 power back-off operation in operation 930 . The processor 120 may perform a power back-off operation in operation 950 . The power processor 120 may adjust the amount of transmit power of the communication module 530 while performing the back-off operation. For example, by reducing the amount of transmission power of the communication module 530 while performing the back-off operation, the communication module 530 and/or the LDS antenna 540 while holding the electronic device 101 by hand. It can reduce the impact on the human body. can As another example, the communication module 530 may radiate the mmWave signal only in a direction that the communication module 530 faces when transmitting the mmWave signal having straightness. In order to reduce the effect of electromagnetic waves on the human body when the grip is generated by the hand, the processor 120 may reduce the amount of transmit power of the communication module 530 in the corresponding direction to prevent path loss. As another example, path loss of the communication module 530 disposed in the direction in which the grip occurs may occur. In this case, the processor 120 may perform an operation of switching to another communication module 530 to transmit the mmWave signal using the communication module 530 arranged to face the other direction.

In operation 970 , the processor 120 of the electronic device 101 according to an embodiment may determine whether the amount of change in capacitance is less than the first threshold value or whether the power is less than the first output value. In operation 980 , the processor 120 may determine whether the amount of change in capacitance is less than the second threshold value or whether the power is less than the second output value.

In an embodiment, when the amount of change in capacitance is less than the specified threshold value or the power is less than the specified output value (operation 970 and/or operation 980 - Yes), the processor 120 may proceed to operation 990 . The processor 120 returns to operation 950 and/or operation 960 to perform a power back-off operation when the amount of change in capacitance is greater than or equal to the specified threshold value or the power is greater than or equal to the specified output value (operation 970 and/or operation 980 - No). have.

The processor 120 of the electronic device 101 according to an embodiment may stop the power back-off operation in operation 990 .

In an embodiment, the processor 120 adjusts the size of the transmit power of the communication module 530 while the amount of change in capacitance is equal to or greater than a specified threshold and the transmit power of the communication module 530 is equal to or greater than the specified output value. can do. The processor 120 may perform a power back-off operation while the amount of change in capacitance is equal to or greater than a specified threshold value and transmit power is equal to or greater than a specified output value.

In an embodiment, the processor 120 adjusts the magnitude of the transmission power of the millimeter wave and/or the 5G Sub-6 signal when the amount of change in capacitance of the first grip sensor at the top of the electronic device 1010 is equal to or greater than the first threshold. In addition, when the amount of change in capacitance of the second grip sensor at the bottom of the electronic device 101 is equal to or greater than the second threshold value, the amount of transmission power of the 4G/3G/2G signal may be adjusted.

In an embodiment, a flowchart 900 illustrating an operation of the grip sensor 220 shown in FIG. 9 is a diagram illustrating a case in which grip sensing is performed by the two grip sensors 220 disposed at the upper end and lower end of the electronic device 101 . It may be a flowchart 900 representing an operation. The first grip sensor 220 using the LDS patterns 550 , 640 , and 710 described with reference to FIGS. 5 to 7 is mounted on the upper end of the electronic device 101 to generate a millimeter wave (mmWave) corresponding to the first frequency band. And it is possible to adjust the transmission power of the Sub6 frequency band. At the lower end of the electronic device 101 , the transmission output of 4G/3G/2G may be adjusted using the second grip sensor 220 having substantially the same function as the first grip sensor 220 .

In an embodiment, the sensing of the first and second grip sensors 220 may each operate independently. The processor 120 may independently adjust the transmission output of millimeter wave (mmWave) and Sub6 frequency bands and the transmission output of 4G/3G/2G signals. The processor 120 may set an amount of change in capacitance that recognizes that the electronic device 101 is held by a user's hand and an output value for entering a power back-off operation. Each of the first threshold value, the second threshold value, the first output value, and the second output value may be obtained through an experiment. The processor 120 may preset each of the first threshold value, the second threshold value, the first output value, and the second output value. The memory of the electronic device 101 (eg, the memory 130 of FIG. 1 ) may store each of a first threshold value, a second threshold value, a first output value, and a second output value.

10 is a communication module 1010 (eg, the communication module 530 of FIG. 5 ), an LDS antenna 1020 (eg, the LDS antenna 540 of FIG. 5 ), and a grip sensor module 1030 according to an embodiment. (eg, the grip sensor 220 of FIG. 2 ), and a diagram 1000 illustrating a matching circuit 1040 .

In an embodiment, the communication module 1010 may be an RFIC (eg, the third RFIC 1126 of FIG. 11 ). The communication module 1010 may transmit a first signal that is an RF signal of a first frequency band. The communication module 1010 may receive an RF signal from the matching circuit 1040 or may transmit an RF signal to the matching circuit 1040 .

In an embodiment, the LDS antenna 1020 may transmit/receive a first signal that is an RF signal of a second frequency band different from the first frequency band transmitted/received by the communication module 1010 .

In an embodiment, the LDS antenna 1020 may further include a grip sensor (eg, the grip sensor 220 of FIG. 2 ). The grip sensor 220 may be connected to the LDS antenna 1020 . The grip sensor 220 is connected to the LDS antenna 1020 by connecting the grip sensor 220 in the form of a dipole and/or a loop to the LDS pattern (eg, the LDS pattern 550 in FIG. 5 ) connected to the LDS antenna 540 . can connect

In an embodiment, an area for recognizing a user's grip may be implemented by implementing the LDS pattern 550 . An LDS pattern 550 for recognizing the grip sensor 220 may be implemented in an area other than the upper area that is the area in the +Y-axis direction of the communication module 1010. When implementing the area recognizing the grip sensor 220 The grip sensor 220 may operate by recognizing a change in the capacitance value of the LDS region of the grip sensor 220. The grip sensor 220 may be connected to the LDS pattern 550 through a connection member (eg, C-clip).

In an embodiment, the grip sensor module 1030 may transmit/receive a second signal that is a signal for sensing a grip. The grip sensor 220 connected to the LDS antenna 1020 may sense the user's grip and transmit the second signal to the matching circuit 1040 . The matching circuit 1040 may transmit the second signal to the grip sensor module 1030 . The grip sensor module 1030 may detect whether to grip the second signal according to the sensed second signal.

In an embodiment, the matching circuit 1040 may be disposed on a power feeding unit of an antenna (eg, the LDS antenna 1020 ). The matching circuit 1040 may be a matching unit through which the communication module 1010 transfers the first signal, which is an RF signal, to the LDS antenna 1020 from the power supply unit of the antenna. The matching circuit 1040 may be a matching unit that transmits a second signal that is a grip sensing signal from the grip sensor 220 connected to the LDS antenna 1020 to the grip sensor module 1030 . A lumped element such as an inductor L may be disposed between the matching circuit 1040 and the grip sensor module 1030 . The inductor may reduce the influence of the first signal between the communication module 1010 and the LDS antenna 1020 by the second signal between the grip sensor 220 and the grip sensor module 1030 .

In an embodiment, the electronic device 101 may include an antenna path (eg, a path through which a first signal is transmitted) and a grip sensing path (eg, a path through which a second signal is transmitted). The antenna path (a path through which the first signal is transmitted) includes a metal part (eg, the metal part 510 of FIG. 5 ), the communication module 1010, and the LDS antenna (eg, the metal part 510 of FIG. 1020) may be a path formed. The grip sensing path (a path through which the second signal is transmitted) includes a metal part 510 that senses that the user holds the electronic device 101 by hand, the grip sensor 220 , the LDS pattern 550 , and the grip sensor. It may be a path formed by the module 1030 . A frequency of a signal transmitted from an antenna path (a path through which the first signal is transmitted) may shift by the grip sensing path (a path through which the second signal is transmitted). Resonant frequency of the antenna path (the path through which the first signal is transmitted) in order to reduce a phenomenon in which the frequency band of the antenna path (the path through which the first signal is transmitted) is shifted by the grip sensing path (the path through which the second signal is transmitted) The length of the LDS pattern 550 may be set to correspond to a change in . For example, when the resonant frequency of the antenna path (the path through which the first signal is transmitted) increases, the length of the LDS pattern 550 may be increased. As another example, when the resonant frequency of the antenna path (the path through which the first signal is transmitted) decreases, the length of the LDS pattern 550 may be reduced. When the length of the LDS pattern 550 is set to correspond to a change in the resonant frequency of the antenna path (the path through which the first signal is transmitted), the inductance of the antenna path (the path through which the first signal is transmitted) is adjusted to adjust the inductance of the antenna path (the path through which the first signal is transmitted). 1 A signal transmitted in the path through which a signal is transmitted) may be in-banded so that it belongs to a specified frequency band.

In an embodiment, the matching circuit 1040 is configured to perform impedance matching between the antenna path (the path through which the first signal is transmitted) and the grip sensing path (the path through which the second signal is transmitted) through the impedance matching of the antenna path (the path through which the first signal is transmitted). path) can be shifted. For example, if there is a tuner and/or a switch in the grip sensor module 1030 forming the grip sensing path (the path through which the second signal is transmitted), the antenna path (the first signal is transmitted) by changing the built-in code value and/or logic. 1 The signal transmitted in the path through which the signal is transmitted) can be in-banded so that it belongs to a designated frequency band.

In one embodiment, in order to reduce the movement of the frequency band of the antenna path (the path through which the first signal is transmitted) by the grip sensing path (the path through which the second signal is transmitted), the grip sensing path (the path through which the second signal is transmitted) is reduced. An inductor may be disposed between the grip sensor module 1030 and the matching circuit 1040 constituting the path). The size of the inductor may be greater than or equal to about 100 nH and less than or equal to about 120 nH. When an inductor is disposed between the grip sensor module 1030 and the matching circuit 1040 of the grip sensing path (the path through which the second signal is transmitted), the transmission performance of the communication module 1010 while maintaining the performance of the LDS antenna 1020 can be improved

11 is a block diagram 1100 of an electronic device 101 in a network environment including a plurality of cellular networks, according to various embodiments of the present disclosure. Referring to FIG. 11 , the electronic device 101 includes a first communication processor 1112 , a second communication processor 1114 , a first radio frequency integrated circuit (RFIC) 1122 , a second RFIC 1124 , and a third RFIC 1126 , a fourth RFIC 1128 , a first radio frequency front end (RFFE) 1132 , a second RFFE 1134 , a first antenna module 1142 , a second antenna module 1144 , and an antenna (1148) may be included. The electronic device 101 may further include a processor 120 and a memory 130 . The second network 199 may include a first cellular network 1192 and a second cellular network 1194 . According to another embodiment, the electronic device 101 may further include at least one component among the components illustrated in FIG. 1 , and the second network 199 may further include at least one other network. According to one embodiment, a first communication processor 1112 , a second communication processor 1114 , a first RFIC 1122 , a second RFIC 1124 , a fourth RFIC 1128 , a first RFFE 1132 , and the second RFFE 1134 may form at least a part of the wireless communication module 192 . According to another embodiment, the fourth RFIC 1128 may be omitted or may be included as a part of the third RFIC 1126 .

The first communication processor 1112 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 1192 and legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 1114 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 1194, and a 5G network through the established communication channel communication can be supported. According to various embodiments, the second cellular network 1194 may be a 5G network defined by 3GPP. Additionally, according to an embodiment, the first communication processor 1112 or the second communication processor 1114 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 1194 . 5G network communication through the establishment of a communication channel and the established communication channel can be supported. According to one embodiment, the first communication processor 1112 and the second communication processor 1114 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 1112 or the second communication processor 1114 may be formed in a single chip or a single package with the processor 120 , the coprocessor 123 , or the communication module 190 . have. According to one embodiment, the first communication processor 1112 and the second communication processor 1114 are directly or indirectly connected to each other by an interface (not shown), so as to provide data or control signals in either or both directions. may provide or receive

The first RFIC 1122, when transmitting, transmits a baseband signal generated by the first communication processor 1112 from about 700 MHz to about 700 MHz used for the first cellular network 1192 (eg, a legacy network). It can be converted to a radio frequency (RF) signal of 3 GHz. Upon reception, an RF signal is obtained from a first cellular network 1192 (eg, a legacy network) via an antenna (eg, a first antenna module 1142), and an RFFE (eg, a first RFFE 1132) It can be preprocessed through The first RFIC 1122 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 1112 .

The second RFIC 1124, when transmitting, uses the baseband signal generated by the first communication processor 1112 or the second communication processor 1114 to the second cellular network 1194 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from a second cellular network 1194 (eg, 5G network) via an antenna (eg, second antenna module 1144), and an RFFE (eg, second RFFE 1134) ) can be preprocessed. The second RFIC 1124 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 1112 or the second communication processor 1114 .

The third RFIC 1126 transmits the baseband signal generated by the second communication processor 1114 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 1194 (eg, 5G network). It can be converted into an RF signal (hereinafter, 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network 1194 (eg, 5G network) via an antenna (eg, antenna 1148 ) and pre-processed via a third RFFE 1136 . The third RFIC 1126 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 1114 . According to one embodiment, the third RFFE 1136 may be formed as a part of the third RFIC 1126 .

According to an embodiment, the electronic device 101 may include the fourth RFIC 1128 separately from or as at least a part of the third RFIC 1126 . In this case, the fourth RFIC 1128 converts the baseband signal generated by the second communication processor 1114 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 1126 . The third RFIC 1126 may convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from the second cellular network 1194 (eg, 5G network) via an antenna (eg, antenna 1148 ) and converted to an IF signal by a third RFIC 1126 . have. The fourth RFIC 1128 may convert the IF signal into a baseband signal for processing by the second communication processor 1114 .

According to an embodiment, the first RFIC 1122 and the second RFIC 1124 may be implemented as at least a part of a single chip or a single package. According to an embodiment, the first RFFE 1132 and the second RFFE 1134 may be implemented as at least a part of a single chip or a single package. According to an example, at least one antenna module of the first antenna module 1142 or the second antenna module 1144 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 1126 and the antenna 1148 may be disposed on the same substrate to form the third antenna module 1146 . For example, the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 1126 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) that is separate from the first substrate, and the antenna 1148 is located in another partial region (eg, the top surface). is disposed, the third antenna module 1146 may be formed. By disposing the third RFIC 1126 and the antenna 1148 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for 5G network communication by a transmission line. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 1194 (eg, a 5G network).

According to an embodiment, the antenna 1148 may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. In this case, the third RFIC 1126 may include, for example, as a part of the third RFFE 1136 , a plurality of phase shifters 1138 corresponding to a plurality of antenna elements. During transmission, each of the plurality of phase shifters 1138 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . Upon reception, each of the plurality of phase converters 1138 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 1194 (eg, 5G network) may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 1192 (eg, a legacy network). Example: Non-Stand Alone (NSA)). For example, the 5G network may have only an access network (eg, 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (eg, next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (eg, LTE protocol information) or protocol information for communication with a 5G network (eg, New Radio (NR) protocol information) is stored in the memory 1130, and other components (eg, a processor) 120 , the first communication processor 1112 , or the second communication processor 1114 ).

An electronic device according to the present document includes a housing including at least a part of a metal part, a support member disposed in the housing, a communication module disposed adjacent to the support member, and a pattern disposed on the support member and designated around the communication module a conductive antenna pattern disposed as a , and a grip sensor electrically connected to the communication module and the conductive antenna pattern, wherein the conductive antenna pattern supports a first frequency band that is a frequency band below a specified frequency, and the communication module comprises: A processor operatively connected to the grip sensor and supporting a second frequency band, which is a frequency band higher than the specified frequency, operates the communication module and/or power transmitted to the conductive antenna pattern based on the sensing of the grip sensor. can be set to control.

The designated pattern according to this document may be symmetrically disposed around the communication module.

The designated pattern according to the present document is symmetrically disposed around the communication module, and may include a pattern in the form of a closed curve.

The operation of the communication module according to this document may include stopping transmission in order to transmit to another communication module.

The conductive antenna pattern according to the present document may be disposed to surround the communication module from at least one side.

The sensing according to this document may be sensing that the human body is adjacent to the conductive antenna.

The grip sensor according to the present document may detect an amount of change in capacitance according to the distance between the human body and the antenna pattern.

The communication module according to this document may be disposed adjacent to an upper end of the electronic device.

The electronic device according to the present document includes a housing including at least a part of a metal part, a communication module disposed in a support member disposed in a first direction of the metal part, and a first surface of the communication module facing the first direction as the first A conductive antenna pattern including an LDS pattern disposed to surround in a second direction perpendicular to the direction and to at least partially surround at least one second surface adjacent to the first surface of the communication module in the first direction, the communication module and a grip sensor electrically connected to the conductive antenna pattern, and a processor electrically connected to the grip sensor, wherein the conductive antenna pattern supports a first frequency band that is a frequency band of 6 GHz or less, and the communication module includes: A second frequency band, which is a frequency band of GHz or higher, may be supported.

The conductive antenna pattern according to the present document may further include an LDS antenna disposed in the support member, and the LDS pattern may be connected to the LDS antenna.

The LDS pattern according to the present document may further extend in the first direction to form a closed curve.

The LDS pattern according to the present document may be symmetrically disposed about a first virtual line penetrating the communication module in the first direction.

A transmission frequency band of the conductive antenna pattern may be adjusted according to a length in the first direction and a length in the second direction of the LDS pattern according to this document.

The processor according to this document may be configured to reduce the amount of power transmitted from the communication module when the conductive antenna pattern detects a touch to the metal part.

The grip sensor according to the present document may detect a touch to a metal part of the housing of the electronic device detected from a conductive antenna pattern disposed in a specified pattern around the communication module.

The method for controlling an electronic device according to the present document includes an operation of determining whether an amount of change in capacitance of a grip sensor of the electronic device is equal to or greater than a specified threshold value, an operation of determining whether the transmission power of the communication module is equal to or greater than a specified output value and adjusting the size of the transmission power of the communication module while the amount of change in the capacitance is equal to or greater than the specified threshold value and the transmission power is equal to or greater than the specified output value.

The control method of the electronic device according to the present document may perform a power back-off operation while the amount of change in capacitance is equal to or greater than the specified threshold value and the transmit power is equal to or greater than the specified output value.

In the method of controlling an electronic device according to the present document, a change amount of a capacitance of a grip sensor of the electronic device may be measured at an upper end of the electronic device and a lower end of the electronic device.

In the method of controlling an electronic device according to this document, the communication module may transmit a millimeter wave and/or a 5G Sub-6 signal.

The control method of the electronic device according to this document adjusts the magnitude of the transmission power of the millimeter wave and/or 5G Sub-6 signal when the amount of change in the capacitance of the first grip sensor at the top of the electronic device is equal to or greater than a first threshold, , when the amount of change in capacitance of the second grip sensor at the lower end of the electronic device is equal to or greater than the second threshold value, the amount of transmission power of the 4G/3G/2G signal may be adjusted.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may be used simply to distinguish the component from other such components, and refer to those components in other aspects (eg, importance or order) is not limited. that one (e.g. first) component is "coupled" or "connected" to another (e.g. second) component with or without the terms "functionally" or "communicatively" When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 1436 or external memory 1438) readable by a machine (eg, electronic device 1401). may be implemented as software (eg, a program 1440) including For example, a processor (eg, processor 1420 ) of a device (eg, electronic device 1401 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg, downloaded or uploaded) directly between smartphones, eg, online. In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

Claims (20)

In an electronic device,
a housing including at least a part of the metal part;
a support member disposed within the housing;
a communication module disposed adjacent to the support member;
a conductive antenna pattern disposed on the support member and disposed in a designated pattern around the communication module; and
a grip sensor electrically connected to the communication module and the conductive antenna pattern;
The conductive antenna pattern supports a first frequency band that is a frequency band below a specified frequency,
The communication module supports a second frequency band that is a frequency band greater than or equal to the specified frequency,
A processor operatively connected to the grip sensor,
An electronic device configured to control an operation of the communication module and/or power transmitted to the conductive antenna pattern based on the sensing of the grip sensor. The method according to claim 1,
The designated pattern is an electronic device disposed symmetrically around the communication module. The method according to claim 1,
The designated pattern is symmetrically disposed around the communication module and includes a pattern in the form of a closed curve. The method according to claim 1,
The operation of the communication module includes stopping transmission in order to transmit to another communication module. The method according to claim 1,
The conductive antenna pattern is disposed to surround the communication module from at least one side. The method according to claim 1,
wherein the sensing is sensing that a human body is adjacent to the conductive antenna. The method according to claim 1,
The grip sensor is an electronic device that detects an amount of change in capacitance according to a distance between a human body and the antenna pattern. The method according to claim 1,
The communication module is an electronic device disposed adjacent to an upper end of the electronic device. In an electronic device,
a housing including at least a part of the metal part;
a communication module disposed in a support member disposed in a first direction of the metal part;
Surrounding a first surface facing the first direction of the communication module in a second direction perpendicular to the first direction, at least one second surface adjacent to the first surface of the communication module in the first direction at least a conductive antenna pattern including an LDS pattern disposed to partially surround;
a grip sensor electrically connected to the communication module and the conductive antenna pattern; and
a processor electrically connected to the grip sensor;
The conductive antenna pattern supports a first frequency band that is a frequency band of 6 GHz or less,
The communication module is an electronic device supporting a second frequency band, which is a frequency band of 6 GHz or higher. 10. The method of claim 9,
The conductive antenna pattern further comprises an LDS antenna disposed in the support member,
The LDS pattern is an electronic device connected to the LDS antenna. 10. The method of claim 9,
The LDS pattern further extends in the first direction to form a closed curve. 10. The method of claim 9,
The LDS pattern is symmetrically disposed about a first virtual line passing through the communication module in the first direction. 10. The method of claim 9,
An electronic device for adjusting a transmission frequency band of the conductive antenna pattern according to a length of the LDS pattern in the first direction and a length in the second direction. 10. The method of claim 9,
The processor is
An electronic device configured to reduce the amount of power transmitted from the communication module when the conductive antenna pattern senses a touch to the metal part. 10. The method of claim 9,
The grip sensor is an electronic device configured to sense a touch to a metal part of the housing of the electronic device detected from a conductive antenna pattern disposed in a specified pattern around the communication module. A method for controlling an electronic device, comprising:
checking whether a change in capacitance of the grip sensor of the electronic device is greater than or equal to a specified threshold value;
checking whether the transmission power of the communication module is equal to or greater than a specified output value; and
and adjusting the magnitude of the transmit power of the communication module while the amount of change in the capacitance is equal to or greater than the specified threshold value and the transmit power is equal to or greater than the specified output value. 17. The method of claim 16,
A method of performing a power back-off operation while the amount of change in the capacitance is greater than or equal to the specified threshold and the transmit power is greater than or equal to the specified output value. 17. The method of claim 16,
A method of measuring an amount of change in capacitance of a grip sensor of the electronic device at an upper end of the electronic device and a lower end of the electronic device. 17. The method of claim 16,
The communication module transmits millimeter wave and/or 5G Sub-6 signals. 17. The method of claim 16,
When the amount of change in capacitance of the first grip sensor at the upper end of the electronic device is equal to or greater than the first threshold, adjusting the magnitude of the transmission power of the millimeter wave and/or 5G Sub-6 signal;
A method of adjusting the amount of transmission power of a 4G/3G/2G signal when the amount of change in capacitance of the second grip sensor at the bottom of the electronic device is equal to or greater than a second threshold.

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