KR20210050725A - Tube and substrate processing apparatus using the same - Google Patents

Abstract

According to the present invention, disclosed are a tube capable of cooling a rim forming an inlet and a substrate processing device using the same. By forming a cooling flow path in the rim in contact with a manifold, it is possible to prevent damage to an O-ring between the manifold and the rim of the tube.

Description

Tube and substrate processing apparatus using the same {TUBE AND SUBSTRATE PROCESSING APPARATUS USING THE SAME}

The present invention relates to a substrate processing apparatus, and more particularly, to a tube capable of cooling an edge forming an inlet, and a substrate processing apparatus using the same.

The substrate processing apparatus is an apparatus for depositing an insulating film, a protective film, an oxide film, a metal film, etc. on a substrate such as a wafer.

A reactor may be exemplified as an example of a substrate processing apparatus.

The reactor is a device that deposits a thin film on a wafer through high-temperature heat treatment, and is configured to use a boat to process a large number of wafers at once.

The boat is configured to charge wafers in multiple layers in a predetermined unit (e.g. 180 sheets), and the reactor has a structure in which the boat charged with the wafers is vertically carried in or out.

Insulation is formed in the lower part of the boat. The thermal insulation part is for separating the temperature environment of the space where the boat where the wafer process is performed is located from the outside.

In order to proceed with the process, the boat and the heat insulation part are carried vertically into the reactor, and the carried boat and the heat insulation part are accommodated in the tube of the reactor.

The tube serves to separate the space in which the boat where the wafer process is performed is located from the outside.

The reactor is generally designed in a double tube structure including an inner tube and an outer tube. The inner tube accommodates the boat and thermal insulation and forms a process environment, and the outer tube houses the inner tube and protects the inner tube.

A heating block is formed outside the outer tube, and the heating block generates heat so that the inner space of the inner tube has a temperature environment for the process.

A manifold is formed under the inner tube and the outer tube. And, a cap flange is configured in the lower part of the heat insulation part.

The cap flange mounts the boat and insulation and can be raised or lowered.

When the cap flange is raised and lowered, the boat and the heat insulating part are carried into the inner tube, and the rim of the cap flange is assembled with the lower part of the manifold to maintain airtightness.

When the cap flange is lowered, the boat and the heat insulating portion are carried out from the inner tube, and the assembled state of the cap flange and the manifold is released.

In order to maintain airtightness, O-rings are formed between the cap flange and the manifold and between the manifold and the outer tube, respectively.

The outer tube is heated by the heat generated by the heating block. The heating block continues to generate heat even when the cap flange is lowered and the boat and the heat insulating portion are taken out of the inner tube, so that the outer tube is also heated continuously.

Due to the outer tube heated as described above, thermal damage may occur in the O-ring between the manifold and the outer tube. If the O-ring is thermally damaged, it is difficult to maintain airtightness.

In order to prevent thermal damage to the O-ring, the manifold may be configured such that Process Cooling Water (PCW) circulates inside the lower side of the location where the O-ring is configured. The position where the O-ring of the manifold is configured can be cooled by circulation of cooling water, and thermal damage of the O-ring can be prevented by the cooled manifold.

However, since the process cooling water is a liquid refrigerant having a high specific heat, there is a limit to temperature control for the O-ring.

In addition, when the manifold maintains a low temperature, there is a problem in that powder is formed on the inner wall of the manifold depending on the process.

The present invention is to solve the above-described problem, and provides a tube of a substrate processing apparatus capable of protecting the O-ring of a manifold in contact with the lower side from thermal damage by being cooled by a refrigerant such as a circulating gas. The purpose.

In addition, another object of the present invention is to provide a substrate processing apparatus capable of suppressing the transfer of heat from the outer tube to the lower manifold by cooling the rim of the outer tube in contact with the manifold by a refrigerant such as circulating gas. do.

The tube of the substrate processing apparatus of the present invention for achieving the above technical problem has an edge forming an inlet at the lower portion, a cooling passage for the flow of refrigerant is formed in the inside of the edge, and the upper column is heated by the refrigerant. It is characterized in that the transmission to the lower portion of the rim is suppressed.

In addition, the substrate processing apparatus of the present invention comprises: an inner tube; An outer tube having an inlet formed at a lower portion thereof and having a rim formed with a cooling passage for the flow of refrigerant therein, and accommodating the inner tube; And a manifold assembled under the rim of the outer tube.

According to the present invention, since the rim forming the inlet at the lower part of the tube is cooled by a refrigerant such as gas, it is possible to suppress the transfer of upper heat to the O-ring of the lower manifold, and as a result, protect the O-ring from thermal damage. can do.

In addition, according to the present invention, since the rim of the outer tube among the inner tube and the outer tube is cooled by a refrigerant such as gas circulating therein, it is possible to suppress the transfer of upper heat to the lower manifold.

Therefore, the O-ring configured for sealing between the manifold and the outer tube can be protected from thermal damage, and the reliability of the substrate processing apparatus can be improved.

In addition, since it is not necessary to cool the manifold itself to protect the O-ring from thermal damage, the manifold can be prevented from maintaining an excessively low temperature. Therefore, it is possible to prevent the powder from being generated on the inner wall of the manifold according to the process, and as a result, there is an advantage that the process reliability can be improved.

1 is a cross-sectional view showing a preferred embodiment of the substrate processing apparatus of the present invention.
2 is an enlarged cross-sectional view of portion A of FIG. 1.
3 is a partial cross-sectional view of 3-3 in FIG. 2.
Figure 4 is a partial exploded perspective view of the rim, coupling cover and ports.
5 is a view for explaining a refrigerant supply device and a monitoring device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Terms used in the present specification and claims are not limited to a conventional or dictionary meaning and are not interpreted, but should be interpreted as meanings and concepts consistent with the technical matters of the present invention.

Since the embodiments described in the present specification and the configurations shown in the drawings are preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, various equivalents and modifications that can replace them at the time of the present application are There may be.

The embodiment of the substrate processing apparatus of FIG. 1 illustrates a reactor having a double tube structure having an outer tube 10 and an inner tube 20. In addition, FIG. 2 is an enlarged cross-sectional view of portion A of FIG. 1, and FIG. 3 is a cross-sectional view of portion 3-3 of FIG. 2. In addition, Figure 4 is a partial exploded perspective view of the rim 14, the coupling cover 16 and ports.

An embodiment of the substrate processing apparatus of the present invention will be described with reference to FIGS. 1 to 4.

The embodiment of FIG. 1 is an outer tube 10, an inner tube 20, a manifold 30, a cap flange 40, a heat insulation part 50, a boat 60, a gas injection nozzle 70, a driving part ( 80) and assembly ring 35.

The outer tube 10 is for forming a buffer space, that is, a spaced apart space, for preventing the inner tube 20 from being damaged by an internal and external environmental difference (pressure difference and temperature difference).

Exemplarily, the outer tube 10 has a cylindrical shape, an exhaust port 12 for exhausting the gas exhausted from the inner tube 20 is formed at a lower portion of the side wall, and an edge forming an open inlet at the lower portion ( 14). The outer tube 10 may be formed of a quartz material as an example.

The body of the outer tube 10 on the upper portion of the rim 14 is illustrated in a cylindrical shape larger than the diameter of the inner tube 20, and the outer tube 10 has a volume capable of accommodating the inner tube 20 therein. Have.

Further, the rim 14 of the outer tube 10 protrudes from the outer wall by a predetermined width and is formed to have a predetermined thickness. In addition, a cooling flow path CL is formed inside the rim 14, and the cooling flow path CL is formed so that the refrigerant circulates along the rim 14.

As shown in FIG. 3, an inlet port IP is configured at an inlet position of the cooling path CL, and an outlet port OP is configured at an outlet position of the cooling path CL.

The inlet port IP provides a path for supplying the refrigerant from the outside to the cooling flow path CL, and the outlet port OP provides a path for discharging the refrigerant from the cooling flow path CL to the outside. The inlet port IP and the outlet port OP may be configured at the inlet position and the outlet position of the rim 14 using the coupling cover 16. A detailed description of the configuration of the inlet port IP and the outlet port OP will be described later with reference to FIGS. 3 and 4.

On the other hand, the inner tube 20 configured inside the outer tube 10 is for forming a reaction space in which a thin film is formed on the wafer WF, which is a substrate, and the boat 60 carried through the inlet of the lower portion And accommodates the heat insulating portion (50). The boat 60 is located above the center of the inner tube 20 when brought in, and the heat insulating part 50 is located below the center of the inner tube 20 when brought in.

A gas injection nozzle 70 installed vertically on one side of the inner space of the inner tube 20 is positioned.

In the side wall of the inner tube 20, injection ports 24 and 26 are formed on the opposite side of the side wall of the inner tube 20 from where the gas injection nozzle 70 is located.

Among them, the injection ports 24 are formed in a line vertically at a position facing the boat 60, and the injection ports 26 are formed at a position where at least a part of the injection hole 12 of the outer tube 10 faces. .

The injection ports 24 are for exhausting the process gas inside the inner tube 20 used for the wafer process through the boat 60 to the outer tube 10, and the injection ports 26 are It is for exhausting the purge gas to the outer tube 10.

The manifold 30 is configured under the outer tube 10 and the inner tube 20 described above.

The manifold 30 may be coupled to the rim 14 of the outer tube 10 using the coupling cover 16 in contact with the rim 16. The manifold 30 may be assembled using a coupling cover 16 and bolts and nuts (not shown) or using a separate clamp (not shown), which can be easily implemented by a person skilled in the art. Examples and descriptions of specific methods are omitted.

Here, the coupling cover 16 may be configured in a ring shape bent in a "b" shape that covers the upper and side surfaces of the rim 14 and contacts the inlet port (IP) and the outlet port (OP). Can have a configuration for A detailed description of the configuration of the coupling cover 16 will be described in detail with reference to FIGS. 3 and 4 to be described later.

In addition, the assembly ring 35 is assembled on the inner upper portion of the manifold 30, and the assembly ring 35 supports the lower end of the inner tube 20 forming an inlet. The assembly ring 35 may be illustratively understood to be configured to seal a spaced gap between the inlet of the outer tube 10 and the inlet of the inner tube 20.

The manifold 30 is configured above the rim of the cap flange 40 and is configured to supply gas between the cap flange 40 and the inner tube 20. To this end, an inlet 74 for supplying gas is installed on the side wall of the manifold 30, and the inlet 74 is coupled to the lower portion of the gas injection nozzle 70.

An outer tube 10 is formed on the upper surface of the manifold 30. The bottom surface of the rim 14 of the outer tube 10 is in contact with the upper surface of the manifold 30, and an O-ring (OR) between them is configured to maintain airtightness. The O-ring OR may be illustrated as being configured to be inserted into a channel formed along the rim 14 of the outer tube 10 on the upper surface of the manifold 30.

In addition, the manifold 30 is configured such that the lower side is in contact with the cap flange 40, and the O-ring (OR) is preferably configured to maintain airtightness between them.

The cap flange 40 supports the boat 60 and the heat insulating part 50 configured at the top, and may be configured to be elevated or lowered.

The lifting or lowering of the cap flange 40 may be controlled by an elevating module (not shown) configured at the lower portion.

The boat 60 and the heat insulation part 50 may be carried into the inner tube 20 by lifting the cap flange 40. At this time, the edge of the cap flange 40 is in contact with the lower side of the manifold 30 to maintain the sealing.

Conversely, the boat 60 and the heat insulating part 50 may be carried out to the outside of the inner tube 20 by the lowering of the cap flange 40. In this case, the edge of the cap flange 40 is separated from the lower side of the manifold 30.

1 illustrates a state in which the boat 60 and the heat insulation part 50 are positioned in the inner tube 20 by the elevation of the cap flange 40.

The drive unit 80 is configured under the cap flange 40 and includes a drive shaft that penetrates the cap flange 40 and is coupled to the inner heat insulation part 52 of the heat insulation part 50.

The driving unit 80 transmits the rotational force to the upper inner heat insulating unit 52 by rotating the drive shaft.

On the other hand, the heat insulating part 50 is configured on the lower portion of the boat 60 and the upper portion of the cap flange 40. The heat insulating part 50 includes an inner heat insulating part 52 and an outer heat insulating part 54. The inner heat insulating portion 52 and the outer heat insulating portion 54 are configured as a heat insulating material.

The outer heat insulating part 54 has a long hole in the vertical direction at the center and has a side wall of a uniform thickness, and the inner heat insulating part 52 has a circular column shape inserted into the long hole of the outer heat insulating part 54. The outer heat insulating portion 54 may be configured to be fixed while in contact with the upper surface of the cap flange 40.

The internal heat insulating part 52 may transmit the rotational force transmitted from the driving part 80 to the upper boat 60.

The boat 60 is configured to charge substrates, that is, wafers WF. The boat 60 includes an upper support plate 62, a lower support plate 64 and a plurality of rods 66. The upper support plate 62 and the lower support plate 64 are spaced apart from each other in parallel and are fixed by a plurality of rods 66 vertically installed therebetween. In addition, slots for occupying the wafer WF are formed in each of the plurality of rods 66 to form a plurality of layers. The wafers WF of each layer may be positioned between the plurality of rods 36 and then seated in the slots of the same layer of the rod 66.

The boat 60 is configured to be coupled to the upper portion of the inner heat insulating part 52 of the heat insulating part 50.

With the above configuration, the boat 60 can be rotated by the rotational force transmitted through the inner heat insulating portion 52 during the wafer process. By the rotation described above, the process gas may be evenly supplied to the entire surface of the wafers WF occupied by the boat 60.

A gas injection nozzle 70 is vertically installed on one side of the boat 60 and the heat insulation part 50. The gas injection nozzle 70 is installed in the nozzle area of the inner tube 20 and may be variously configured to have various shapes. The gas injection nozzle 70 has injection ports 72.

According to the embodiment of the present invention configured as described above, the process gas is activated in the process of flowing upward after flowing into the gas injection nozzle 70, and the wafers WF of the boat 60 through the injection holes 72 ) Can be sprayed.

In addition, the process gas injected to the wafers WF of the boat 60 passes through the wafers WF of the boat 60 or flows along the inner wall of the inner tube 20 and then the exhaust ports of the inner tube 20 ( 24) can be exhausted. Most of the process gas exhausted from the exhaust ports 24 of the inner tube 20 is discharged to the outside through the exhaust port 12 of the outer tube 10.

In addition, an inlet structure (not shown) for the purge gas may be configured in the cap flange 40 or the manifold 30, through which the purge gas may be supplied to the lower portion of the heat insulating part 50, and the inner tube It can be exhausted through the exhaust port 26 of 20 and the exhaust port 12 of the outer tube 10.

In the substrate processing apparatus configured as shown in FIG. 1, a heating block (not shown) is configured outside the outer tube 10.

The heating block may be configured to surround the side wall and the upper surface of the outer tube 10, and generate heat to heat the reaction space inside the inner tube 20.

The outer tube 10 is heated by the heat generated by the heating block. The heating block continues to generate heat even when the cap flange 40 descends and the boat 60 and the heat insulation part 50 are carried out from the inner tube 10. Therefore, the outer tube 10 is continuously heated for the process regardless of whether the boat 60 and the heat insulating part 50 are carried in or taken out.

The heat of the outer tube 10 may be transferred to the manifold 30 through the rim 14. In this case, thermal damage due to heat may be generated in the O-ring OR between the manifold 30 and the outer tube 10.

In order to prevent thermal damage to the O-ring OR, the cooling passage CL is formed in the rim 14 of the outer tube 10 as described above in the embodiment of the present invention.

The cooling flow path CL is formed at an upper portion overlapping with the O-ring OR for sealing between the manifold 30 and the rim 14 of the outer tube 10.

The refrigerant is supplied to the cooling passage CL at the inlet position, circulates within the rim 14 of the outer tube 10, and discharged from the cooling passage CL at the outlet position. At this time, the inlet position and the outlet position may be formed adjacent to each other, and the cooling passage CL starts circulation at the inlet position, is formed along the rim 14, and is formed to end circulation at the outlet position.

When the refrigerant is circulated in the cooling passage CL, heat from the upper portion of the outer tube 10 may be suppressed from being transferred to the lower portion of the rim 14 by the refrigerant. That is, heat from the upper portion of the outer tube 10 may be suppressed from being transferred to the O-ring OR, and thermal damage to the O-ring OR may be prevented.

In particular, in the embodiment of the present invention, the cooling passage CL is formed in an overlapped position on the upper portion of the O-ring OR. Therefore, it is possible to more effectively suppress heat transfer to the O-ring (OR).

In addition, it is preferable that gas is supplied as a refrigerant supplied to the cooling passage CL. Since the gas has a lower specific heat than the liquid, there is an advantage that it is easy to control the temperature of the frame 14 than the liquid.

An embodiment of the present invention includes an inlet port IP, an outlet port OP, and a coupling cover 16 in order to circulate the refrigerant along the cooling passage CL.

The inlet port IP penetrates the side surface of the rim 14 at the inlet position described above, and is configured to supply the refrigerant to the cooling passage CL from the outside.

The outlet port OP passes through the side surface of the rim 14 at the outlet position close to the inlet position and is configured to discharge the refrigerant circulating through the cooling passage CL.

The coupling cover 16 covers the side and upper surfaces of the rim 14 and includes a through hole 18 corresponding to an inlet position and an outlet position.

The inlet port IO and the outlet port OP are configured to have a nozzle 100 and a support 102, respectively.

The nozzle 100 is configured such that one end penetrates the inlet position or the outlet position of the side of the rim 14 to reach the cooling flow path CL, and the other end penetrates the sidewall of the coupling cover 16 and has a length that can be exposed. And may be configured as a tube through which the refrigerant flows.

The support 102 may be formed in a plate shape that protrudes from the outer wall of the nozzle 100 and is in close contact with the side surface of the rim 14. The support 102 serves to fix the positions of the inlet port IO and the outlet port OP by being interposed between the side wall of the rim 14 and the side wall of the coupling cover 16.

The coupling cover 16 has an accommodation space 19 for interposing the support, that is, accommodation, and the accommodation space 19 is formed on the inner surface of the position where the through hole 18 of the coupling cover 16 is formed, and the support 102 ) Is formed to have a volume that can accommodate.

The state in which the rim 14 is assembled with the manifold 30 may be supported by the coupling of the coupling cover 16 and the manifold 30, and the manifold 30 is the coupling cover 16 as described above. Likewise, it may be coupled using a bolt and a nut (not shown) or a separate clamp (not shown).

According to the above-described configuration, in the embodiment of the present invention, the rim 14 of the outer tube 10 is cooled by a refrigerant such as gas flowing along the cooling flow path CL, and the heat of the upper portion of the outer tube 10 is Transmission to the O-ring (OR) of the manifold 30 via the rim 14 can be suppressed. Therefore, the O-ring OR configured between the manifold 30 and the rim 14 of the outer tube 10 can be protected from thermal damage.

Further, by the above-described configuration, heat from the outer tube 10 is suppressed from being transferred to the manifold 30. That is, in the embodiment of the present invention, there is no need to cool the manifold 30 to maintain a low temperature. Therefore, the manifold 30 can be prevented from maintaining an excessively low temperature. Accordingly, the low temperature of the manifold 30 can prevent the generation of powder on the inner wall of the manifold 30 according to the process.

In addition, the embodiment of the present invention may be implemented as shown in FIG. 5 to supply the refrigerant at different flow rates in response to different temperature environments.

The embodiment of FIG. 5 is configured to include a refrigerant supply device and a temperature monitor 300.

The temperature monitor 300 may be understood as a monitoring facility that measures the temperature of the O-ring (OR) through a temperature tom chip (RC).

The refrigerant supply device is configured to include two or more supply switches for switching the supply of the refrigerant at different flow rates in response to different temperature environments, and supplies the refrigerant at a flow rate corresponding to the temperature environment to the inlet position through the selected supply switch. Can be configured to

More specifically, the refrigerant supply device may include a first refrigerant supply source 200 and a second refrigerant supply source 202 as an example, and the first refrigerant supply source 200 corresponds to a normal process in a first temperature environment. It is configured to include a supply controller 210 for adjusting the supply speed of the refrigerant at the first flow rate and, if selected, a first supply switch 220 for supplying the refrigerant at the first flow rate to the cooling passage CL, and a second refrigerant supply source 202 is a supply controller 212 for controlling a supply rate of the refrigerant at a second flow rate corresponding to a high-temperature process in a second temperature environment that is higher than the first temperature environment, and if selected, the refrigerant at the second flow rate is transferred to the cooling channel CL. It is configured to include a second supply switch 222 to supply to).

Accordingly, the refrigerant supply device may supply the refrigerant having a flow rate corresponding to the temperature environment to the inlet position of the rim 14 through the selected supply switch (the first supply switch 220 or the second supply switch 222 ).

For example, when the wafer process is in progress or waiting, the heating block is heated to 600°C, and in the case of the cleaning process, the heating block is heated to 800°C.

The embodiment of the present invention can be operated by dividing into a first temperature environment when the heating block is heated to 600°C and a second temperature environment when the heating block is heated to 800°C. The first supply switch 220 may supply the refrigerant, and in the second temperature environment, the second supply switch 222 may supply the refrigerant.

Control of the first supply switch 220 and the second supply switch 222 may be variously implemented, such as automatic control according to receiving a control signal from the temperature monitor 300 or manual control by an operator.

In addition, reference numeral 400 not described in FIG. 5 may be understood as a cartridge block heater that can be used as an auxiliary, and the cartridge block heater 400 has a manifold 30 at a certain temperature or higher (e.g., 180° C. or higher). It can be installed if there is a need to be maintained and is for controlling the temperature of the manifold 30.

As described above, in the present invention, high temperature can be suppressed from being transmitted to the O-ring OR of the manifold 30 by the rim of the outer tube 10 in which the cooling flow path CL is formed, and as a result, the O-ring OR It can be protected from this thermal damage, and the reliability of the substrate processing apparatus can be improved.

In addition, it is possible to prevent the manifold from maintaining an excessively low temperature, and as a result, it is possible to prevent powder from being generated on the inner wall of the manifold depending on the process, and as a result, process reliability may be improved.

Claims (14)

It has an edge forming an entrance at the bottom,
A cooling passage for the flow of refrigerant is formed in the inside of the rim,
The tube of the substrate processing apparatus, characterized in that the heat from the upper part is suppressed from being transferred to the lower part of the rim by the refrigerant. The method of claim 1,
The rim is assembled to be in contact with the lower manifold,
The cooling passage is a tube of the substrate processing apparatus that is formed on an upper portion overlapping with an O-ring for sealing between the manifold and the tube. The method of claim 1,
An inlet port penetrating a side surface of the rim and supplying the refrigerant to the cooling passage from the outside;
An outlet port passing through a side surface of the rim at a position close to the inlet port and discharging the refrigerant circulating through the cooling passage; And
And a coupling cover that covers at least a side surface of the rim and has through holes through which the inlet port and the outlet port are drawn out,
The tube of the substrate processing apparatus supported by the coupling cover when the inlet port and the outlet port are coupled to the rim. The method of claim 3,
The inlet port and the outlet port,
A nozzle through which the refrigerant flows; And
It has a; a support protruding from the outer wall of the nozzle and in close contact with the side surface of the rim,
An accommodation space for accommodating the support is formed on the inner surface of the coupling cover at the position where the through hole is formed,
The tube of the substrate processing apparatus in which the inlet port and the outlet port are supported by the coupling cover by inserting the support into the accommodation space. The method of claim 3,
The coupling cover is configured in a ring shape in which a cover side in contact with a side surface of the frame and a cover top surface in contact with an upper surface of the frame are integrally formed,
The tube of the substrate processing apparatus is supported by the coupling of the coupling cover and the manifold when the rim is assembled with the manifold. The method of claim 1,
A tube of a substrate processing apparatus in which gas is supplied as the refrigerant. Inner tube;
An outer tube forming an inlet at a lower portion, having an edge formed with a cooling passage for the flow of refrigerant therein, and accommodating the inner tube; And
And a manifold assembled under the rim of the outer tube. The method of claim 7,
The cooling flow path is a substrate processing apparatus formed on an upper portion overlapping with an O-ring for sealing between the manifold and the tube. The method of claim 7,
An inlet port penetrating a side surface of the rim and supplying the refrigerant to the cooling passage from the outside;
An outlet port passing through a side surface of the rim at a position close to the inlet port and discharging the refrigerant circulating through the cooling passage; And
And a coupling cover that covers at least a side surface of the rim and has through holes through which the inlet port and the outlet port are drawn out,
When the inlet port and the outlet port are coupled to the edge, the substrate processing apparatus is supported by the coupling cover. The method of claim 9,
The inlet port and the outlet port,
A nozzle through which the refrigerant flows; And
It has a; a support protruding from the outer wall of the nozzle and in close contact with the side surface of the rim,
An accommodation space for accommodating the support is formed on the inner surface of the coupling cover at the position where the through hole is formed,
The substrate processing apparatus in which the inlet port and the outlet port are supported by the coupling cover by inserting the support into the accommodation space. The method of claim 9,
The coupling cover is configured in a ring shape in which a cover side in contact with a side surface of the frame and a cover top surface in contact with an upper surface of the frame are integrally formed,
When the rim is assembled with the manifold, the substrate processing apparatus is supported by the coupling of the coupling cover and the manifold. The method of claim 7,
A substrate processing apparatus in which gas is supplied as the refrigerant. The method of claim 7,
Further comprising a refrigerant supply device including two or more supply switches for switching the supply of the refrigerant at different flow rates in response to different temperature environments, wherein the refrigerant supply device includes a flow rate corresponding to the temperature environment through a selected supply switch The substrate processing apparatus for supplying the refrigerant of the inlet to the inlet position. The method of claim 13,
The refrigerant supply device
A first supply switch for supplying the refrigerant at a first flow rate corresponding to a normal process in a first temperature environment; And
And a second supply switch for supplying the refrigerant at a second flow rate faster than the first flow rate in response to a high-temperature process in a second temperature environment that is higher than the first temperature environment.

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