KR20210029936A - Adhesive Chuck Using Adhesive with Pattern or Structure - Google Patents
Adhesive Chuck Using Adhesive with Pattern or Structure Download PDFInfo
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- KR20210029936A KR20210029936A KR1020190111231A KR20190111231A KR20210029936A KR 20210029936 A KR20210029936 A KR 20210029936A KR 1020190111231 A KR1020190111231 A KR 1020190111231A KR 20190111231 A KR20190111231 A KR 20190111231A KR 20210029936 A KR20210029936 A KR 20210029936A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 65
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 239000012790 adhesive layer Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000000126 substance Substances 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 5
- 230000002209 hydrophobic effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000059 patterning Methods 0.000 description 18
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 11
- 239000010410 layer Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000008571 general function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D9/00—Containers having bodies formed by interconnecting or uniting two or more rigid, or substantially rigid, components made wholly or mainly of wood or substitutes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
- B65D25/02—Internal fittings
- B65D25/10—Devices to locate articles in containers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/38—Packaging materials of special type or form
- B65D65/40—Applications of laminates for particular packaging purposes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Wood Science & Technology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
본 발명은 디스플레이, 반도체 등을 제조 공정에서 기판을 지지 및 고정, 핸들링 하는 척에 대한 것으로 특히, 기판탈착(디척킹) 시 약점착 층이 기판으로 뜯겨 나가거나, 전이되는 현상을 줄이거나 없애고, 척킹(Chucking), 디척킹(De-Chucking) 시 기판의 스트레스를 줄여 기판 파손 요인을 감소시켜 양산성을 효과적으로 향상시킬 수 있는 방안에 대한 것이다.The present invention relates to a chuck that supports, fixes, and handles a substrate in a manufacturing process of a display, a semiconductor, etc., and in particular, reduces or eliminates the phenomenon that the weakly adhesive layer is torn off or transferred to the substrate when the substrate is detached (dechucked), This is a method for effectively improving mass productivity by reducing the stress of the substrate during chucking and de-chucking to reduce substrate damage factors.
디스플레이 산업에서 척의 일반적인 기능은 진공 장비 내부에서 패널 기판을 지지 및 고정하는 목적으로 사용되며, 실제 양산 제조 공정 시 사용 중이다. 기판 지지 운반체는 척 또는 트레이 등이 있으며 이 중 척은 점착 척, 마그넷 척, 정전 척 등 다양한 척킹 수단에 따라 분류 된다.The general function of the chuck in the display industry is used to support and fix the panel substrate inside the vacuum equipment, and is being used in the actual mass production process. The substrate support carrier includes a chuck or a tray, among which chuck is classified according to various chucking means such as adhesive chuck, magnet chuck, and electrostatic chuck.
대면적 유리 기판을 생산하기 위해 다양한 운송방식 중 현재 가장 양산화된 기술은 점착 척으로써, 점착 척의 경우, 본 출원인에 의해 출원되어 있다(대한민국 등록특허 제10-0541856호 참조). Among the various transportation methods for producing large-area glass substrates, the currently most mass-produced technology is an adhesive chuck, and in the case of an adhesive chuck, an application has been filed by the present applicant (refer to Korean Patent Registration No. 10-0541856).
종래 기술의 기판 홀딩 장치의 경우, 진공 흡입력을 이용하여 기판을 당겨 기판 면이 점착 척의 상면의 점착제에 닿아 부착되는 구조를 설명하고 있다. 기판의 부착 단계 이후 안전적인 부착 상태를 유지하여야 하며, 외부 요인에 상관없이 항시 안정적인 척킹과 디척킹이 이루어질 수 있는 효율적인 척킹 시스템은 필수적이다.In the case of a conventional substrate holding apparatus, a structure in which the substrate surface is attached to and adheres to the adhesive on the upper surface of the adhesive chuck by pulling the substrate by using a vacuum suction force is described. It is necessary to maintain a safe attachment state after the attaching step of the substrate, and an efficient chucking system capable of stable chucking and dechucking at all times regardless of external factors is essential.
상기 특허공보에 기재된 기판 홀딩 장치의 경우, 기판을 진공 흡입력을 이용하여 기판과 점착 척 상면의 점착제와 결합하는 구조에 대해 설명하고 있다. 상기와 같은 기판 홀딩 장치는 기판과 점착제가 결합 되었다가 디척킹(De-Chucking)되는 과정에서 기판이 분리 되는데, 이때 점착층의 점착물질이 기판으로 전이, 전사되어 기판 표면을 소수성으로 만들어 후공정 진행을 방해하여 생산 불량을 발생 시키며, 반복적인 결합-분리 과정을 거치면서 점착제층이 기판으로 전이, 전사 됨에 따라 점착제 수명에 악영향을 끼치게 된다.In the case of the substrate holding device described in the above patent publication, a structure in which the substrate is bonded to the adhesive on the upper surface of the adhesive chuck by using a vacuum suction force is described. In the substrate holding device as described above, the substrate is separated from the substrate in the process of de-chucking the substrate and the adhesive. At this time, the adhesive material of the adhesive layer is transferred and transferred to the substrate to make the surface of the substrate hydrophobic. Production defects occur by interfering with the process, and as the adhesive layer is transferred and transferred to the substrate through repeated bonding-separation processes, the life of the adhesive is adversely affected.
또한, 척킹(Chucking), 디척킹(De-Chucking)되는 과정에서 기판의 변형에 따른 스트레스는 기판 파손에 기여하며, 기판 파손은 생산 불량 및 생산라인 가동에 큰 차질을 발생시킨다.In addition, during the chucking and de-chucking process, the stress caused by the deformation of the substrate contributes to the damage of the substrate, and the damage of the substrate causes production defects and large disruptions in the operation of the production line.
이에 따라 점착제층의 점착층의 전이, 전사가 적거나 없으며, 또한 기판 스트레스를 줄이고, 나아가 점착층의 수명을 향상시켜 보다 효율적인 양산공정을 진행 할 수 있는 방안이 필요한 실정이다.Accordingly, there is little or no transfer or transfer of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive layer, and there is a need for a way to perform a more efficient mass production process by reducing the substrate stress and further improving the life of the pressure-sensitive adhesive layer.
본 발명의 목적은 디척킹(De-Chucking) 시 발생되는 상부 점착제층의 기판 전이, 전사 현상과 척킹(Chucking), 디척킹(De-Chucking) 시 기판의 변형 스트레스를 줄여 전-후공정의 생산 손실(Loss)을 효율적으로 줄일 수 있는 점착 척을 제공하고자 하는 것이다.An object of the present invention is to reduce the deformation stress of the substrate during transfer, transfer and chucking, and de-chucking of the upper pressure-sensitive adhesive layer that occurs during de-chucking to produce pre- and post-processes. It is intended to provide an adhesive chuck that can efficiently reduce loss.
상기 목적에 따라 본 발명은 상부 점착층이 기판으로의 전이, 전사되는 현상을 줄이거나 없애고, 기판의 스트레스를 줄여 생산성을 올리기 위해 다음과 같은 해결방안을 제공한다. In accordance with the above object, the present invention provides the following solutions to reduce or eliminate the phenomenon in which the upper adhesive layer is transferred or transferred to the substrate, and to increase productivity by reducing the stress of the substrate.
즉, 본 발명은 종래에 사용되던 평탄면의 상부 약 점착층을 가진 점착제의 표면을 일자형(Stripe), 격자형(Mesh) 등의 다양한 형태로 패터닝하여 기판과 점착되는 면적을 줄인 점착척을 제공하여, 디척킹(De-Chucking) 시 점착제의 전이 및 전사되는 현상을 줄이거나 없애고, 계단형(Stair), 경사형(Slope) 등의 구조를 가진 점착층을 이용하여 기판의 파손 요인중의 하나인 기판 변형 스트레스를 줄여 공정의 용이성을 확보한다.That is, the present invention provides an adhesive chuck that reduces the area adhered to the substrate by patterning the surface of a pressure-sensitive adhesive having a weak adhesive layer on a flat surface that has been used in the past in various forms such as a stripe and a mesh. Therefore, it is one of the causes of damage to the substrate by using an adhesive layer having a structure such as a step type (Stair) and a slope type (Slope) to reduce or eliminate the phenomenon of transfer and transfer of the adhesive during de-chucking. Ease of the process is secured by reducing the stress on the phosphorus substrate.
상부 점착층의 패턴 및 구조는 일자형(Stripe), 격자형(Mesh), 계단형(Stair), 경사형(Slope) 등 다양하게 적용이 가능하며, 패턴 및 구조를 구성하는 방안으로는 약 점착제 원료 도포 시 단일 노즐이 아닌 여러 개의 노즐을 이용하여 패터닝 하는 방법과 기 도포된 점착층 표면을 칼날, 레이져(LASER), 화학 식각액 등을 사용하여 물리적, 화학적인 방법 등으로 2차 가공처리하는 방법이 있다.The pattern and structure of the upper adhesive layer can be applied in various ways, such as a stripe, a mesh, a staircase, and a slope. The method of patterning using multiple nozzles instead of a single nozzle during application, and the method of secondary processing by physical and chemical methods using a knife, laser, or chemical etching solution on the surface of the previously applied adhesive layer are different. have.
즉, 본 발명은, That is, the present invention,
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재로서,As an adhesive chuck member provided on a chuck plate holding a substrate,
기판과 접촉하는 약 점착층은 요철을 형성하는 패턴을 구비한 것을 특징으로 하는 점착척 부재를 제공한다.The weak adhesive layer in contact with the substrate provides an adhesive chuck member comprising a pattern for forming irregularities.
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재로서,As an adhesive chuck member provided on a chuck plate holding a substrate,
기판과 접촉하는 약 점착층은 계단형 또는 경사형 구조를 구비한 것을 특징으로 하는 점착척 부재를 제공한다.The weak adhesive layer in contact with the substrate provides an adhesive chuck member, characterized in that it has a stepped or inclined structure.
상기에 있어서, 요철을 형성하는 패턴은 스트라이프형 또는 메쉬형을 포함하는 것을 특징으로 하는 점착척 부재를 제공한다.In the above, the pattern for forming the unevenness provides an adhesive chuck member, characterized in that it includes a stripe shape or a mesh shape.
상기에 있어서, 계단형 또는 경사형 구조는 전체적으로 점착척 부재의 중심부로 갈수록 높은 형상을 나타내는 것을 특징으로 하는 점착척 부재를 제공한다.In the above, the stepped or inclined structure provides an adhesive chuck member, characterized in that the overall shape is higher toward the center of the adhesive chuck member.
또한, 본 발명은, In addition, the present invention,
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재 중 기판과 직접 접촉하는 약점착제 층에 패턴을 형성함에 있어서,In forming a pattern on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided on the chuck plate for holding the substrate,
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 양각부와 음각부를 갖는 패턴을 일체형으로 형성하거나,When applying the raw material of the weakly adhesive layer to the first substrate on which the weakly adhesive layer is formed, a pattern having an embossed portion and an engraved portion is integrally formed using several nozzles, or
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 패턴을 식각하는 것을 특징으로 하는 점착 척 부재 패턴 형성 방법을 제공한다.A method for forming an adhesive chuck member pattern is provided, wherein the weakly adhesive layer is formed on a first substrate as a flat surface, and then the pattern is etched by a physical or chemical method.
기판을 홀딩하는 척 플레이트에 구비되는 점착 척 부재 중 기판과 직접 접촉하는 약점착제 층에 구조를 형성함에 있어서,In forming a structure on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided on the chuck plate for holding the substrate,
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 계단형 구조 또는 경사형 구조를 일체형으로 형성하거나,When applying the raw material of the weakly adhesive layer to the first substrate on which the weakly adhesive layer is formed, a stepped structure or an inclined structure is integrally formed using several nozzles, or
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 식각하여 계단형 구조 또는 경사형 구조를 만드는 것을 특징으로 하는 점착 척 부재 구조 형성 방법을 제공한다.It provides a method for forming an adhesive chuck member structure, characterized in that a weakly adhesive layer is formed on a first substrate as a flat surface and then etched by a physical or chemical method to form a stepped structure or an inclined structure.
상기에 있어서, 양각부와 음각부의 두께와 폭, 계단형 구조를 이루는 각 계단의 두께와 폭, 또는 경사형 구조의 경사도를 조절하여 패턴 또는 구조 형상을 다양화하는 것을 특징으로 하는 점착 척 부재 패턴 형성 방법을 제공한다.In the above, the adhesive chuck member pattern, characterized in that the pattern or structural shape is diversified by adjusting the thickness and width of the embossed portion and the concave portion, the thickness and width of each step constituting the stepped structure, or the inclination of the inclined structure. Provides a method of formation.
본 발명에 따르면, 본래의 점착 척의 순기능인 대면적 기판을 지지 및 고정하는 기능은 동일하게 수행하되 기판을 부착/탈착하는 척킹(Chucking), 디척킹(De-Chucking) 시 기판 스트레스를 줄여 기판 파손 요인을 줄일 수 있으며, 디척킹(De-Chucking) 시 점착층이 뜯겨져 나가 기판으로 전이 및 전사되는 현상을 줄이거나 없애고, 또한 점착층이 기판과 붙는 면적이 줄어듦으로 기판 표면이 소수성으로 변하는 면적을 상대적으로 줄여 이 부분에 적용되는 공정의 불량감소 및 안정성을 높일 수 있다. According to the present invention, the function of supporting and fixing a large-area substrate, which is the pure function of the original adhesive chuck, is performed in the same manner, but the substrate is damaged by reducing the stress of the substrate during chucking and de-chucking of attaching/detaching the substrate. Factors can be reduced, and the adhesive layer is torn off during de-chucking, which reduces or eliminates the phenomenon of transfer and transfer to the substrate, and the area where the surface of the substrate becomes hydrophobic by reducing the area where the adhesive layer adheres to the substrate It is possible to reduce defects and increase the stability of the process applied to this part by relatively reducing it.
나아가 점착제의 수명을 증가시켜 점착층 교체 등에 소비되는 시간과 비용을 줄일 수 있게 한다.Furthermore, it is possible to reduce the time and cost spent on replacing the adhesive layer by increasing the life of the adhesive.
또한, 상부 약 점착제의 점착 면적이 줄어들 경우 점착층의 전이 및 전사영역이 줄어들게 되어 그 영역에 적용되는 후공정(인쇄 등)에서 발생하는 불량을 효율적으로 줄일 수 있으며, 점착제의 수명을 높일 수 있는 효과가 있다.In addition, when the adhesive area of the upper weak adhesive decreases, the transition and transfer area of the adhesive layer decreases, so that defects occurring in post-processing (printing, etc.) applied to the area can be effectively reduced, and the life of the adhesive can be increased. It works.
또한, 계단형(Stair), 경사형(Slope) 등의 구조는 척킹(Chucking) 시 진공 흡입력에 의해 발생되는 기판의 변형 스트레스를 완화 시키고, 디척킹(De-Chucking) 시 기판과 점착제가 분리될 때 점착제의 경사면을 따라 필오프(Peel Off)현상이 보다 쉽게 발생하여 기판이 분리되기 때문에 기판이 받는 변형 스트레스가 줄어 기판 파손을 방지 할 수 있다.In addition, structures such as a step shape and a slope type alleviate the deformation stress of the substrate caused by the vacuum suction force during chucking, and the substrate and the adhesive can be separated during de-chucking. When a peel-off phenomenon occurs along the inclined surface of the pressure-sensitive adhesive more easily, the substrate is separated, and thus the deformation stress received by the substrate is reduced, thereby preventing the substrate from being damaged.
도 1은 종래 기술에 따른 점착척 부재의 구성을 보여주는 단면도이다.
도 2는 본 발명에 따라 상면이 패터닝 된 구조를 갖는 점착척 부재의 구성을 보여주는 단면도이다.
도 3은 본 발명에 따라 상면의 패터닝이 스트라이프형으로 구성된 점착척 부재의 평면도와 사시도 이다.
도 4는 본 발명에 따라 상면의 패터닝이 메쉬형으로 구성된 점착척 부재의 평면도와 사시도 이다.
도 5는 본 발명에 따라 상면의 패터닝이 계단형으로 구성된 점착척 부재의 단면도 및 평면도이다.
도 6은 본 발명에 따라 상면의 패터닝이 계단형으로 구성된 점착척 부재의 사시도이다.
도 7은 본 발명에 따라 상면의 패터닝이 경사형으로 구성된 점착척 부재의 단면도이다.
도 8은 본 발명에 따라 상면의 패터닝이 경사형으로 구성된 점착척 부재의 평면도와 사시도 이다. 1 is a cross-sectional view showing the configuration of an adhesive chuck member according to the prior art.
2 is a cross-sectional view showing the configuration of an adhesive chuck member having a structure in which an upper surface is patterned according to the present invention.
3 is a plan view and a perspective view of an adhesive chuck member having a stripe patterned upper surface according to the present invention.
4 is a plan view and a perspective view of an adhesive chuck member having an upper surface patterned in a mesh shape according to the present invention.
5 is a cross-sectional view and a plan view of an adhesive chuck member having a stepped patterning of an upper surface according to the present invention.
6 is a perspective view of an adhesive chuck member having a stepped patterning of the upper surface according to the present invention.
7 is a cross-sectional view of an adhesive chuck member having an inclined patterning of the upper surface according to the present invention.
8 is a plan view and a perspective view of an adhesive chuck member having an inclined patterning of an upper surface according to the present invention.
이하, 첨부도면을 참조하여 본 발명의 바람직한 실시예에 대해 상세히 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따라 상면이 패터닝 된 구조를 갖는 점착척 부재의 구성을 보여주는 단면도이다. 2 is a cross-sectional view showing a configuration of an adhesive chuck member having a structure in which an upper surface is patterned according to the present invention.
본 발명의 점착척 부재는 패터닝 점착제 층(300)이 강접 시이트(200) 상에 합지되어 구성된다. The pressure-sensitive adhesive chuck member of the present invention is configured by laminating the patterning pressure-sensitive
패터닝 점착제 층(300)은 제1 기재의 하면에는 강 점착층이 형성되고 제1 기재 상면에는 약 점착층이 형성되어 있다. 종래와 달리 약 점착층은 패터닝되어 요철 구조를 갖는다. 제1 기재의 강 점착층은 강접 시이트(200)에 합지되며, 강접 시이트는 제2 기재의 상하면 모두 강 점착층이 형성된 시이트이다. In the patterning
도 3은 패터닝 점착제 층(300)의 상면 패터닝이 스트라이프형 패턴(400)으로 구성된 스트라이프형 점착척 부재(500)를 보여준다. 약점착층이 스트라이프형(Stripe) 패터닝 양각부(401)와 음각부(402)가 교대로 반복되면서 요철을 형성하고 이를 통해 기판과의 접촉면적이 줄어들고 비접촉부가 교대로 존재하여 디척킹시 점착제가 기판에 전이 및 전사되는 현상을 줄이거나 없애고, 기판의 파손 요인중의 하나인 기판 변형 스트레스를 감소시킬 수 있다. 3 shows a stripe-type
도 4는 상면의 패터닝이 메쉬형으로 구성된 점착척 부재의 평면도와 사시도이다.4 is a plan view and a perspective view of an adhesive chuck member in which the patterning of the upper surface is formed in a mesh shape.
패터닝 점착제 층이 메쉬형 패턴(600)을 구비한 점착척 부재(700)으로, 양각부(601)와 음각부(602)가 균일하게 형성된다. 스트라이프형에 비해 좀 더 균일하게 점착력을 발휘하면서도 디척킹도 용이하게 이루어질 수 있다. The patterning pressure-sensitive adhesive layer is an
도 5는 패터닝 점착제 층 상면의 패터닝이 계단형으로 구성된 점착척 부재(1000)의 단면도와 평면도이고 도 6은 그 사시도이다.5 is a cross-sectional view and a plan view of the pressure-sensitive
약점착층이 계단형(Stair) 구조(900)로 형성되며, 중심부가 가장 높은 계단의 정상부를 이루며 외곽으로 갈수록 한계단씩 낮아지는 형상을 갖는다. 이러한 계단형 구조(900)의 약 점착층은 기판의 중심부를 가장 강하게 척킹하여 기판의 처짐 현상을 효율적으로 방지하면서 디척킹도 용이하게 이루어질 수 있다. The weakly adhesive layer is formed in a
도 7은 경사면 구조(1200)를 형성한 점착척 부재(1300)를 보여준다. 7 shows an
이 경우도 도 5의 것과 같은 효과를 나타내며, 계단형 구조가 아닌 경사형 구조이기 때문에 척킹 및 디척킹 시 기판변형 스트레스 측면에서 더 우수할 수 있다. This case also exhibits the same effect as in FIG. 5, and since it is an inclined structure rather than a stepped structure, it may be more excellent in terms of substrate deformation stress during chucking and dechucking.
패턴 또는 계단형, 경사면 구조는 다양한 사이즈의 패턴으로 형성될 수 있다. 예를 들면, 스트라이프형 패턴은 직선 외에 물결형과 같은 곡선으로 형성될 수도 있고, 메쉬 패턴은 양각부의 단면 형상이 원형, 타원형, 다각형을 포함할 수 있다. A pattern or a stepped or inclined surface structure may be formed in a pattern of various sizes. For example, the stripe pattern may be formed in a curved shape such as a wave shape in addition to a straight line, and the mesh pattern may include a circular, elliptical, or polygonal cross-sectional shape of the embossed portion.
한편, 양각부의 두께, 폭, 음각부의 두께, 폭 또한 자유자재로 변경 가능하다.On the other hand, the thickness and width of the embossed portion, the thickness and width of the engraved portion can also be freely changed.
계단형(Stair), 경사형(Slope) 등의 구조의 경우 각 층의 두께, 폭, 경사의 각도 또한 자유자재로 변경이 가능하다. In the case of a structure such as a staircase or a slope, the thickness, width, and angle of slope of each layer can also be changed freely.
상기 패턴 또는 구조들은 모두 척킹과 디척킹의 용이성 및 기판에 대한 점착제 전이 방지, 점착척의 수명 장기화, 기판 스트레스 완화 등의 효과를 나타낸다.All of the above patterns or structures exhibit effects such as ease of chucking and dechucking, prevention of adhesive transfer to the substrate, prolonging the life of the adhesive chuck, and relieving substrate stress.
약점착제 층에 상술한 패턴 또는 계단형 또는 경사형 구조를 형성하는 방법은 다음과 같다.A method of forming the above-described pattern or stepped or inclined structure on the weak adhesive layer is as follows.
제1기재에 약점착층의 원재료를 도포(주입) 할 때, 여러 노즐을 사용하여 패터닝 구조를 원바디로 형성하거나, 평탄한 구조의 약점착 층을 형성한 다음, 칼날, 레이저(LASER), 화학 식각액 등을 사용하여 물리적, 및/또는 화학적인 방법으로 패터닝 또는 구조를 형성할 수 있다.When applying (injecting) the raw material of the weakly adhesive layer to the first substrate, use several nozzles to form a patterning structure into a single body, or form a weakly adhesive layer of a flat structure, and then use a blade, laser, or chemical. Patterning or structures may be formed by physical and/or chemical methods using an etchant or the like.
본 발명의 권리는 위에서 설명된 실시 예에 한정되지 않고 청구범위에 기재된 바에 의해 정의되며, 본 발명의 분야에서 통상의 지식을 가진 자가 청구범위에 기재된 권리범위 내에서 다양한 변형과 개작을 할 수 있다는 것은 자명하다.The rights of the present invention are not limited to the embodiments described above and are defined by what is described in the claims, and that a person having ordinary knowledge in the field of the present invention can make various modifications and adaptations within the scope of the rights described in the claims. It is self-explanatory.
100: 기존 점착제 층
200: 강접 시이트
300, 1100: 패터닝 점착제 층
400: 스트라이프형 패턴
500: 스트라이프형 점착척 부재
401, 601: 양각부
402, 602: 음각부
600: 메쉬형 패턴
700, 1000, 1300: 점착척 부재
900: 계단형(Stair) 구조
1200: 경사면 구조100: existing adhesive layer
200: strong contact sheet
300, 1100: patterning adhesive layer
400: stripe pattern
500: stripe type adhesive chuck member
401, 601: embossed part
402, 602: intaglio
600: mesh pattern
700, 1000, 1300: adhesive chuck member
900: Stair structure
1200: slope structure
Claims (7)
기판과 접촉하는 약 점착층은 요철을 형성하는 패턴을 구비한 것을 특징으로 하는 점착척 부재.As an adhesive chuck member provided on a chuck plate holding a substrate,
An adhesive chuck member, characterized in that the weak adhesive layer in contact with the substrate has a pattern for forming irregularities.
기판과 접촉하는 약 점착층은 계단형 또는 경사형 구조를 구비한 것을 특징으로 하는 점착척 부재.As an adhesive chuck member provided on a chuck plate holding a substrate,
An adhesive chuck member, characterized in that the weak adhesive layer in contact with the substrate has a stepped or inclined structure.
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 양각부와 음각부를 갖는 패턴을 일체형으로 형성하거나,
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 패턴을 식각하는 것을 특징으로 하는 점착 척 부재 패턴 형성 방법.In forming a pattern on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided on the chuck plate for holding the substrate,
When applying the raw material of the weakly adhesive layer to the first substrate on which the weakly adhesive layer is formed, a pattern having an embossed portion and an engraved portion is integrally formed using several nozzles, or
A method of forming an adhesive chuck member pattern, comprising forming a weakly adhesive layer on the first substrate as a flat surface and then etching the pattern by a physical or chemical method.
약점착층이 형성되는 제1 기재에 약점착층의 원재료를 도포할 때, 여러 개의 노즐을 사용하여 계단형 구조 또는 경사형 구조를 일체형으로 형성하거나,
제1 기재에 약점착층을 평탄면으로 형성한 다음, 물리적 또는 화학적 방법으로 식각하여 계단형 구조 또는 경사형 구조를 만드는 것을 특징으로 하는 점착 척 부재 구조 형성 방법.In forming a structure on a weak adhesive layer in direct contact with the substrate among the adhesive chuck members provided on the chuck plate for holding the substrate,
When applying the raw material of the weakly adhesive layer to the first substrate on which the weakly adhesive layer is formed, a step-like structure or an inclined structure is integrally formed using several nozzles, or
A method for forming an adhesive chuck member structure, comprising forming a weakly adhesive layer on a first substrate as a flat surface and then etching by a physical or chemical method to create a stepped structure or an inclined structure.
The method according to claim 5 or 6, wherein the pattern or structural shape is diversified by adjusting the thickness and width of the embossed portion and the concave portion, the thickness and width of each step constituting the stepped structure, or the slope of the inclined structure. A method of forming an adhesive chuck member pattern as described above.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1020190111231A KR102402434B1 (en) | 2019-09-09 | 2019-09-09 | Adhesive Chuck Using Adhesive with Pattern or Structure |
| CN202021586742.4U CN213139417U (en) | 2019-09-09 | 2020-08-03 | Adhesive chuck member and substrate chucking system |
| CN202010768218.7A CN112455857B (en) | 2019-09-09 | 2020-08-03 | Adhesive chuck member, pattern forming method thereof, substrate chucking method and system |
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| KR1020190111231A KR102402434B1 (en) | 2019-09-09 | 2019-09-09 | Adhesive Chuck Using Adhesive with Pattern or Structure |
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| KR20210029936A true KR20210029936A (en) | 2021-03-17 |
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| KR102402434B1 (en) * | 2019-09-09 | 2022-05-26 | 주식회사 야스 | Adhesive Chuck Using Adhesive with Pattern or Structure |
| CN113629217A (en) * | 2021-07-19 | 2021-11-09 | 武汉华星光电半导体显示技术有限公司 | Preparation method of display panel |
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| KR20130000985U (en) * | 2011-08-02 | 2013-02-13 | (주)에스에스이엔지 | Adhesion pad and glass transporting apparatus having the same |
| KR101317790B1 (en) * | 2011-06-07 | 2013-10-15 | 주식회사 에스에프에이 | Adhesive Chuck and Method for Manufacturing the same |
| JP2018078132A (en) * | 2016-11-07 | 2018-05-17 | 信越ポリマー株式会社 | Holding jig for precision part, and method for manufacturing the same |
| KR20190033835A (en) * | 2017-09-22 | 2019-04-01 | 주식회사 야스 | Efficient Adhesive Cuck and Dechuck System |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4334883B2 (en) * | 2003-02-20 | 2009-09-30 | 大日本印刷株式会社 | Adhesive sheet |
| JP4447386B2 (en) * | 2004-03-29 | 2010-04-07 | 日東電工株式会社 | Method for removing phosphor on partition wall upper surface of plasma display panel rear substrate, and method for manufacturing plasma display panel rear substrate |
| US10109612B2 (en) * | 2013-12-13 | 2018-10-23 | Taiwan Semiconductor Manufacturing Company | Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices |
| KR102402434B1 (en) * | 2019-09-09 | 2022-05-26 | 주식회사 야스 | Adhesive Chuck Using Adhesive with Pattern or Structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101317790B1 (en) * | 2011-06-07 | 2013-10-15 | 주식회사 에스에프에이 | Adhesive Chuck and Method for Manufacturing the same |
| KR20130000985U (en) * | 2011-08-02 | 2013-02-13 | (주)에스에스이엔지 | Adhesion pad and glass transporting apparatus having the same |
| JP2018078132A (en) * | 2016-11-07 | 2018-05-17 | 信越ポリマー株式会社 | Holding jig for precision part, and method for manufacturing the same |
| KR20190033835A (en) * | 2017-09-22 | 2019-04-01 | 주식회사 야스 | Efficient Adhesive Cuck and Dechuck System |
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| Publication number | Publication date |
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| CN112455857A (en) | 2021-03-09 |
| CN112455857B (en) | 2023-04-28 |
| CN213139417U (en) | 2021-05-07 |
| KR102402434B1 (en) | 2022-05-26 |
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