KR20200131200A - Laser head module of laser debonding equipment - Google Patents

Abstract

According to the present invention, a laser head module of a laser debonding apparatus, in regard to a laser debonding apparatus for debonding an electronic component from a substrate by selectively melting a soldering of at least one electronic component arranged on the substrate, includes: a ring-shaped housing; an optical lens module provided in the housing to enlarge or reduce a beam generated from a laser oscillator; a fixing bracket combined with the outer circumference surface of the housing; a clamp member combined with the outer circumference surface of the housing; a blowing means provided on one side of the clamp member to spray air toward an electronic component of a substrate; and a suction means provided on the other side of the clamp member to be opposite to the blowing means to suck the electronic component separated from the substrate by the blowing means.

Description

Laser head module of laser debonding equipment

The present invention relates to a laser debonding apparatus, and more particularly, to a laser head module of a laser debonding apparatus capable of removing an electronic component in which soldering is melted by laser irradiation without contamination of a substrate.

Micro laser processing is an application field with micron (㎛) precision in industrial laser processing, and is widely used in the semiconductor industry, display industry, printed circuit board (PCB) industry, and smartphone industry. Memory chips used in all electronic devices have developed a technology that minimizes the circuit spacing in order to realize the integration, performance and ultra-high communication speed, but now the required technology level is achieved simply by reducing the circuit line width and line width interval. It is difficult to do so, so it has reached the level of stacking memory chips in a vertical direction. The stacking technology up to 128 layers has already been developed by TSMC, and the technology of stacking up to 72 layers is being applied to mass production at Samsung Electronics and SK Hynix.

In addition, technological developments for mounting memory chips, microprocessor chips, graphic processor chips, wireless processor chips, and sensor processor chips in one package are being intensively researched and developed, and a considerable level of technologies are already being applied in practice.

However, in the process of development of the aforementioned technology, since more and more electrons have to participate in the signal processing process inside the ultra-high-speed/ultra-high-capacity semiconductor chip, the power consumption increases, and the issue of cooling treatment for heat generation has been raised. In addition, a technical issue has been raised that a large amount of electrical signals must be transmitted at an ultra-high speed in order to achieve the requirements of ultra-high-speed signal processing and ultra-high frequency signal processing for more signals. In addition, since the number of signal lines must be increased, the signal interface lines to the outside of the semiconductor chip can no longer be processed with a one-dimensional lead wire method, but the Fan-In BGA method is processed in a two-dimensional manner under the semiconductor chip. Or Fan-in Wafer-Level-Package (FIWLP)), and a Signal Layout Redistribution Layer under the ultrafine BGA layer under the chip, and a second fine BGA layer under the chip. The method (referred to as Fan-Out BGA or Fan-Out Wafer-Level-Package (FOWLP) or Fan-Out Panel-Level-Package) has been successfully applied.

Recently, in the case of semiconductor chips, products with a thickness of 200 μm or less including an EMC (Epoxy-Mold Compound) layer have appeared. In order to attach a micron-class ultra-thin semiconductor chip with a thickness of only a few hundred microns to an ultra-thin PCB, mass reflow is the same as the conventional surface mount technology (SMT) standard process, Thermal Reflow Oven technology. When applying MR) process, semiconductor chips are exposed in an air temperature environment of 100 to 300 degrees Celsius (℃) for hundreds of seconds, so chip-boundary warpage, PCB due to differences in coefficient of thermal expansion (CTE) -Various types of soldering bonding defects such as PCB-Boundary Warpage and Random-Bonding Failure by Thermal Shock may occur.

Accordingly, in the past, localized heating technology has been developed to rework soldering defects of various types of electronic components that occur during the soldering process, including the above causes, among which the most actively studied field. Is a soldering debonding technology by laser beam irradiation.

Conventional debonding technology by laser beam irradiation has the advantage of being non-contact, and since the method in which the laser light is directly absorbed by the semiconductor chip is the primary heat absorption mechanism, it has the advantage that there is no thermal shock due to the difference in the thermal expansion coefficient, and is very local. Since phosphorus heating is performed only for the necessary time, it has several advantages such as low power consumption, minimization of total heat input, minimization of thermal shock, and minimization of process time.

On the other hand, the laser head module of a conventionally known laser bonding device is a method of bonding by irradiating a laser while pressing the bonding object (semiconductor chip or integrated circuit IC) for several seconds, and corresponding to the size of the semiconductor chip or integrated circuit (IC). Bonding is performed by irradiating a surface light source type laser.

For such a pressurized laser head module, referring to Korean Patent No. 10-1245356 (hereinafter referred to as'priority literature'), a surface light source type laser is irradiated to the semiconductor chip while adsorbing the semiconductor chip by vacuum. The adsorption module and the pressure head configuration including the same are described.

However, in the conventional pressurized laser head module as described above, since the pressurizing head and the laser irradiation unit are manufactured and driven as one module, when bonding a plurality of semiconductor chips such as a semiconductor strip, a surface light source is formed while pressing one semiconductor chip The operation of irradiating the laser of a must be repeatedly performed as many as the number of semiconductor chips.

Due to this, not only the total working time for bonding a plurality of semiconductor chips is increased, but also the cost of the entire equipment is rapidly increased as the heating head is additionally mounted.

On the other hand, even if the laser head module by laser beam irradiation is applied to the debonding device instead of the above-described pressurization head method, at present, the electronic parts separated by the laser are manually removed by the operator using a tool or a separate ejector device As it is removed by using, there is a problem that the substrate is contaminated by the heated and melted solder liquid, and there is also a risk that the operator may suffer a safety accident due to the high heat of the laser head module.

Accordingly, the present invention has been invented to solve the above problems, and the present invention allows the electronic component in which soldering is melted by laser irradiation to be immediately removed from the spot without contamination of the substrate by air blowing and suction method. An object of the present invention is to provide a laser head module of a laser debonding device.

In order to achieve the above object, the present invention provides a laser debonding apparatus for debonding an electronic component from a substrate by selectively melting soldering of at least one electronic component disposed on a substrate, comprising: an annular housing; An optical lens module provided in the housing to enlarge or reduce the beam generated from the laser oscillator; A fixing bracket coupled to the outer peripheral surface of the housing; A clamp member coupled to the outer peripheral surface of the housing; Blow-wong means provided on one side of the clamp member to inject air toward an electronic component of the substrate; And a suction means provided on the other side of the clamp member to face the blowing means and sucks the electronic component separated from the substrate by the blowing means.

In addition, a beam shaper that selectively converts the shape of the beam generated from the laser oscillator and transmits it to the optical lens module is further provided in the housing.

In addition, the beam shaper converts a circular laser beam generated from a laser oscillator into a square-shaped beam.

In addition, the blowing means, a fixing plate fixedly coupled to the clamp member; A support frame hinged to one end of the fixing plate; And an air nozzle coupled to the support frame to inject air supplied from the compressor.

In addition, the suction means, a fixing plate fixedly coupled to the clamp member; A support frame hinged to one end of the fixing plate; And a funnel member that is coupled to the support frame and sucks the electronic component by the suction force of the compressor.

In addition, the clamp member is integrally formed to have a conical shape that gradually narrows downward at the lower end of the fixing bracket, so that air flow paths constituting the blowing means and the suction means are respectively inclined downwardly on the left and right sides of the body around the hollow. .

In addition, opposite ends of the air flow passages constituting the blowing means and the suction means are formed to have a nozzle shape and a funnel shape, respectively.

In addition, an electronic component collection container is further connected to a part of the suction path of the suction means.

In addition, air injection by the blowing means and air suction by the suction means are simultaneously performed by one compressor.

In addition, in a state in which the housing, the optical lens module, and the fixing bracket are provided in plural and divided and arranged, at least a portion of the laser beam irradiated from the optical lens module is overlapped and irradiated in a predetermined area of the substrate, and the clamp member The means and the suction means are provided in any one of the plurality of housings.

In the present invention as described above, since the present invention forms a dual square beam and irradiates the soldering of an electronic component, a temperature deviation of 10 to 20 degrees is reduced compared to the case of irradiating a single round beam in a conventional laser debonding device. As it can be improved, there is an effect of preventing problems such as burning or melting of the thin flexible substrate FPCB due to thermal damage during the debonding process.

1 is a conceptual diagram of a single beam module of a laser debonding apparatus according to an embodiment of the present invention
2 is an image of an FPCB substrate irradiated with a single laser beam by a debonding device according to an embodiment of the present invention
3 is a conceptual diagram of a configuration of a laser debonding apparatus according to an embodiment of the present invention
4 is a conceptual diagram of the configuration of a laser optical system according to an embodiment of the present invention
5 is an external perspective view of a laser head module according to an embodiment of the present invention
6 is a partial cross-sectional view of a laser head module according to another embodiment of the present invention

The terms used in the present specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present specification, terms such as "include" or "have" to "include" are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the present specification. It is to be understood that the possibility of the presence or addition of other features, numbers, steps, actions, components, parts, or combinations thereof, or other features beyond that is not preliminarily excluded.

Unless otherwise defined in the specification, all terms including technical or scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs.

Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this specification. Shouldn't.

1 is a conceptual diagram of a single beam module of a laser debonding apparatus according to an embodiment of the present invention, and FIG. 2 is an FPCB irradiated with a single laser beam by a debonding apparatus according to an embodiment of the present invention. It is an image of the substrate.

Referring to FIG. 1, the laser debonding apparatus of the present invention includes a single laser module 310 according to an embodiment, and thus, irradiates a single laser beam onto an FPCB substrate. At this time, referring to FIG. 2, the laser beam irradiated by the first laser module 310 is irradiated on the substrate in a state deformed into a square beam shape.

That is, as the laser beam irradiated by the laser module 310 selectively heats the temperature of the defective soldering part to the debonding temperature at which the melting of the soldering occurs, the electronic component becomes a state in which it can be removed from the substrate, and then a certain type of ejector By means of an apparatus (refer to FIGS. 5 and 6), the defective electronic component in which the soldering is melted is sucked and removed from the substrate.

Hereinafter, a dual beam configuration and operation relationship according to the present invention will be described in detail according to an embodiment with reference to FIGS. 3 and 4.

3 is a schematic diagram of a configuration of a laser debonding apparatus according to an embodiment of the present invention.

In FIG. 3, the laser module 310 of the laser irradiation unit is a laser oscillator 311 having a cooling device 316, a beam shaper 312, an optical lens module 313, a driving device 314, and a control device. It is configured to include 315 and a power supply unit 317.

The laser oscillator 310 generates a laser beam having a wavelength and output power in a predetermined range. The laser oscillator is, for example, a diode laser (Laser Diode, LD) having a wavelength of '750nm to 1200nm' or '1400nm to 1600nm' or '1800nm to 2200nm' or '2500nm to 3200nm', or a rare earth medium fiber laser (Rare-Earth- Doped Fiber Laser) or rare-earth-doped crystal laser (Rare-Earth-Doped Crystal Laser), alternatively, a medium for emitting alexandrite laser light having a wavelength of 755 nm, or Nd Yag (Nd) having a wavelength of 1064 nm or 1320 nm. :YAG) It may be implemented including a medium for emitting laser light.

The beam shaper 312 converts a spot-shaped laser generated in the laser oscillator 310 and transmitted through an optical fiber into an area beam having a flat top. The beam shaper 312 may be implemented by including a Square Light Pipe, a Diffractive Optical Element (DOE), or a Micro-Lens Array (MLA).

The optical lens module 313 adjusts the shape and size of the laser beam converted to the surface light source form by the beam shaper to irradiate the electronic component or the irradiation area mounted on the PCB substrate. The optical lens module constitutes an optical system by combining a plurality of lenses.

The driving device 314 moves the distance and position of the laser module with respect to the irradiation surface, and the control device 315 controls the driving device 314 to control the beam shape and the beam area size when the laser beam reaches the irradiation surface. , Adjust the beam sharpness and beam irradiation angle. The control device 315 may also integrally control the operation of each unit of the laser module 310 in addition to the driving device 314.

Meanwhile, the laser power adjustment unit 370 controls the amount of power supplied to the laser module 310 from the power supply unit 317 corresponding to the laser module 310 according to a program received through a user interface or a preset program. The laser output adjustment unit 370 receives information on the state of debonding for each part, area, or all on the irradiation surface from one or more camera modules 350 and controls the power supply unit 317 based thereon. In contrast, control information from the laser output control unit 370 is transmitted to the control device 315 of the laser module 310, and a feedback signal for controlling the corresponding power supply unit 317 in the control device 315 It is also possible to provide.

Through this function, bonding between the electronic components in the irradiation surface and the substrate can be performed or the bonding can be removed by adjusting the laser beam size and output. In particular, in the case of removing damaged electronic components on the substrate, the application of heat by the laser beam to other adjacent electronic components or normal electronic components existing on the substrate can be minimized by minimizing the area of the laser beam to the corresponding electronic component area. Thus, it is possible to remove only the damaged electronic component to be removed.

On the other hand, when a plurality of laser modules are configured to emit laser beams having different wavelengths, the laser irradiation unit absorbs a plurality of material layers (e.g., EMC layer, silicon layer, solder layer) included in the electronic component well. It can be composed of individual laser modules having a wavelength of.

Accordingly, the laser debonding device according to the present invention selectively increases the temperature of the electronic component and the temperature of the intermediate bonding material such as solder, which is a connection material between the printed circuit board or the electrode of the electronic component. Bonding) or separation (detaching or debonding) process may be performed.

Specifically, by transmitting both the EMC mold layer and the silicon layer of the electronic component, all the energy of each laser beam is absorbed into the solder layer, or the laser beam does not penetrate the EMC mold layer and heats the surface of the electronic component to It is also possible to conduct heat to the bonding portion of.

4 is a conceptual diagram of a configuration of an optical laser system according to an embodiment of the present invention.

4 is an optical system having the simplest structure applicable to the present invention. When the laser beam emitted from the beam transmission optical fiber 410 is focused through the convex lens 420 and enters the beam shaper 430, the beam shaper ( At 430), the laser beam in the form of a spot is converted into a surface light source A1 in the form of a flat-top, and the square laser beam A1 output from the beam shaper 430 is desired through the concave lens 440. The image-forming surface S is irradiated with a surface light source A2 that is enlarged and enlarged in size.

Hereinafter, the configuration and operation relationship of the laser head module according to the present invention will be described in detail with reference to FIGS. 5 and 6. First, the laser head module 600 of the present invention is described below in some configurations excluding the laser oscillator 311, the cooling device 316, the driving device 314, and the like in the above-described laser module.

5 is an external perspective view of a laser head module according to an embodiment of the present invention.

5, the laser head module 600 is first provided with an annular housing 610, and the laser beam generated from the laser oscillator 311 is at the upper end of the housing 610 into the housing 610. The beam transmission optical fiber 410 is connected to be transmitted.

A beam shaper 430 for converting a round beam generated from a laser oscillator 311 into a square beam is provided in the housing 610, and a square beam is irradiated through the beam shaper under the beam shaper 430 An optical lens module 313 that expands or contracts accordingly is inserted and disposed.

The present invention is characterized in that when the soldering of an electronic component is melted by the laser beam irradiated from the laser head module 600, a configuration of an ejector device for removing it is integrally added.

To this end, the present invention is a fixing bracket 650 for fixing and installing the housing on the outer circumferential surface of the housing 610 as shown in FIG. 5 and a clamp member 620 is coupled to the lower portion of the fixing bracket, and the clamp member ( A blown means for injecting air toward the electronic component of the substrate is mounted on the left side of the 620, and a suction means for sucking the electronic component separated from the substrate by the blowing means is mounted on the right side of the clamp member 620 It can be configured by mounting.

In the blowing means, more specifically, the fixing plate 631 is fixedly coupled to the clamp member 620, and the support frame 632 is hinged to one end of the fixing plate 631, so that the support frame is It is configured to be able to arbitrarily adjust the angle. In addition, an air nozzle 633 is coupled to the support frame 632 by, for example, a screw fastening method, so that the air supplied from an external compressor (not shown) can be sprayed toward the electronic components of the board. do.

In addition, the suction means has a configuration similar to that of the blowing means, for example, a fixing plate 641 is coupled to the clamp member 620 by a screw fastening method, and a support frame 642 at one end of the fixing plate 641 This hinge is coupled, and a funnel member 643 is mounted on the support frame 642 to suck electronic components by the suction force of an external compressor (not shown).

At this time, the air injection by the blowing means and the air intake by the suction means may be driven by separate compressors, respectively, but for a compact device configuration, the blowing by using the same compressor (not shown) It is desirable to design so that the means and the suction means can be driven simultaneously.

Meanwhile, FIG. 6 is a partial cross-sectional view of a laser head module according to another embodiment of the present invention.

Referring to FIG. 6 below, the blowing means and the suction means are not mounted on the outside of the clamp member as in the embodiment of FIG. 5 described above, but the air flow paths constituting the blowing means and the suction means are inside the body of the clamp member. It is possible to configure even if each intaglio is formed integrally with it.

In this case, as an example, referring to FIG. 6, the clamp member 621 is integrally formed to have a conical shape that gradually narrows downward at the lower end of the fixing bracket 650 that is attached to the outer circumferential surface of the housing.

At this time, a hollow 621a is formed in the center of the clamp body, so that the laser beam irradiated from the laser oscillator 311 passes through the beam shaper 312 and the optical lens module 313 inside the housing, and the hollow 621a It is understandable that it is irradiated to the substrate through ).

In addition, the air flow paths 621b and 621c constituting the blowing means and the suction means are respectively inclined downwardly on the left and right sides of the body of the clamp member 621 around the hollow 621a.

In this case, more preferably, the opposite ends of the air flow paths constituting the blowing means and the suction means are formed to have a nozzle shape and a funnel shape, respectively, and the air injected through the air flow path 621b of the blowing means is electron After separating the component from the substrate, it is sucked and removed through the air flow path 621c of the suction means.

On the other hand, as the electronic parts collecting container 700 in the form of a sieve is further connected to the suction path of the suction means, the operator is configured to take out and recycle the electronic parts collected in the electronic parts collecting container 700 from time to time.

In addition, the laser head module according to the present invention may be configured as a dual beam laser debonding device having, for example, two laser modules, not a single laser module of the above-described embodiment. For the configuration of such a dual beam laser debonding device, for example, two laser head modules each having a housing, an optical lens module, and a fixing bracket are provided, and the laser head modules are divided and arranged at regular intervals. This is possible. In this case, the laser beams irradiated from each optical lens module provided in the two laser head modules are irradiated so that some of them overlap in a predetermined area of the substrate.

In the case of driving two laser head modules as described above, for example, in the case of distributing one laser light source and inputting it to each laser head module, the laser power adjustment unit has a function to simultaneously adjust the output and phase of each distributed laser beam. It may be provided in 370. In this case, the beam flatness can be remarkably improved by controlling the phase to induce destructive interference between the respective laser beams, thereby further increasing energy efficiency.

On the other hand, in the case of implementing the multi-position simultaneous processing mode as described above, the laser power adjustment unit 370 is used to determine the beam shape, beam area size, and beam of each laser beam so that some or all of the laser beams from each laser head module are different. Controls one or more of sharpness, beam irradiation angle, and beam wavelength. Even at this time, when a single laser light source is distributed and input to each laser head module, a function for simultaneously adjusting the output and phase of each distributed laser beam may be provided in the laser output adjustment unit 370.

Through this function, by adjusting the laser beam size and output, it is possible to perform bonding between the electronic components in the irradiation surface and the substrate or remove the bonding more easily than in the case of a single beam. In particular, in the case of removing damaged electronic components on the substrate, the application of heat by the laser beam to other adjacent electronic components or normal electronic components existing on the substrate can be minimized by minimizing the area of the laser beam to the corresponding electronic component area. Thus, it is possible to remove only the damaged electronic component to be removed.

On the other hand, in the configuration of the debonding device of the dual laser head module as described above, it is not necessary to have an ejecting device in all of the laser head modules, for example, the ejecting device may be configured only in one housing of the plurality of laser head modules. I can. To this end, even when the clamp member constituting the ejecting device, the blow-wong means, and the suction means are mounted on only one of the two laser head modules, the function of removing the debonded electronic parts according to the blowing and suction can be sufficiently performed. Yes is understandable.

In addition, the present invention is not limited only by the above-described embodiment, and since the same effect can be created even when the detailed configuration, number, and arrangement structure of devices are changed, those of ordinary skill in the art can create the present invention. It is stated that various configurations can be added, deleted, and modified within the scope of the technical idea of

600: laser head module 610: housing
620, 621: clamp member 621b: blowing flow path
621c: suction flow path 631, 641: fixing plate
632, 642: support frame 633: nozzle
643: funnel member 650: fixing bracket

Claims (1)

In the laser debonding apparatus for debonding electronic components from a substrate,
An annular housing;
An optical lens module provided in the housing to enlarge or reduce the beam generated from the laser oscillator;
A fixing bracket coupled to one side of the outer peripheral surface of the housing;
A clamp member coupled to the other side of the outer peripheral surface of the housing;
A blown means provided on one side of the clamp member to inject air toward an electronic component of the substrate; And
Comprising a suction means provided on the other side of the clamp member facing the blowing means to suck the electronic component separated from the substrate by the blowing means,
Laser head module of the laser debonding device.

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