KR20200042289A - Powder trap apparatus in manufacturing semiconductor - Google Patents

Abstract

Disclosed in the present invention is a powder trap apparatus used for a semiconductor manufacturing process, which can remove powder from exhaust gas discharged from a processing chamber of a semiconductor manufacturing process. In particular, the powder trap apparatus used for a semiconductor manufacturing process of an embodiment of the present invention is a powder trap apparatus which is installed at the front end or the rear end of a vacuum pump connected to the processing chamber of the semiconductor manufacturing process in order to remove powder from exhaust gas discharged from the processing chamber. To this end, the present invention may comprise: a housing which is configured in a hollow cylindrical shape, wherein an inlet is formed at the lower portion of a side surface and an outlet is formed on an upper surface; a first flexion unit which is composed of a plurality of vertical plates which are installed to face the direction of the inlet in the housing such that bigger particles of powder may be removed from introduced exhaust gas; a second flexion unit which is located at the upper side of the first flexion unit, and allows the exhaust gas having passed through the first flexion unit to be rotated while being moved in a zigzag pattern such that smaller particles of the powder may be removed therefrom; and a filtering unit which collects the remaining powder from the exhaust gas which is firstly purified in the first and second flexion units.

Description

Powder trap device used in semiconductor manufacturing process {POWDER TRAP APPARATUS IN MANUFACTURING SEMICONDUCTOR}

Disclosed is a powder trap device used in a semiconductor manufacturing process for removing powder from exhaust gas discharged from a process chamber in a semiconductor manufacturing process.

In general, semiconductor manufacturing processes oxidize a wafer to form an oxide film on a wafer surface, an oxidation process to form a desired pattern on a wafer surface, an etching process to selectively remove a wafer surface on which a photosensitive film pattern is formed, a molecule or a wafer on the wafer. Various processes such as a deposition process to deposit atomic unit materials to have electrical properties are performed.

However, since these processes are performed at high temperature using various harmful gases, various ignitable gases and harmful gases containing corrosive foreign substances and toxic components are generated inside the process chamber, and when these gases discharged from the process chamber are lowered in temperature, It is changed to a solid powder (Power) and affects piping or vacuum pumps. Therefore, in order to solve this problem, a trap device for removing powder is generally provided between the process chamber and the vacuum pump, and a scrubber is installed at the rear end of the vacuum pump.

A related art is a semiconductor by-product trap device disclosed in Korean Registered Utility Model No. 20-03975247.

The semiconductor by-product trap device according to the prior art has a first connection port 14 for connection with a process chamber (process chamber), a second connection port 16 for connection with a vacuum pump, and a cooling line along the inner wall surface. An installed hollow cooling chamber 10 and a heating chamber 20, which is installed spaced apart from the inner wall surface of the cooling chamber 10 in the hollow portion of the cooling chamber 10, and reactant by-products are introduced from the process chamber And, the cooling chamber is characterized in that a plurality of perforations 12 are formed, the first plate 18 is layered and arranged side by side.

KR 20-0397524 Y1

The purpose of the disclosed contents is to install the powder at the front end or rear end of the vacuum chamber to remove the powder from the exhaust gas discharged from the process chamber, and the manufacturing cost and maintenance cost are low and the semiconductor manufacturing process can significantly remove the powder from the exhaust gas. It is to provide a powder trap device used in.

The technical problem to be achieved by the present embodiment is not limited to the above-mentioned problems, and other problems that are not mentioned will be clearly understood by a person skilled in the art from the following description.

A powder trap device used in a semiconductor manufacturing process according to an embodiment is installed at a front end or a rear end of a vacuum pump connected to a process chamber of a semiconductor manufacturing process to remove powder from exhaust gas discharged from the process chamber. A trap device comprising: a housing formed of a hollow cylindrical shape, wherein an inlet is formed at a lower side and an outlet is formed at an upper surface; A first flexure portion composed of a plurality of vertical plates installed opposite to the direction of the inlet port in the housing to remove large particles of powder from the inflow exhaust gas; A second flexure portion located above the first flexure portion and allowing the exhaust gas that has passed through the first flexure portion to move in a zigzag manner while being rotated, thereby removing small particles of powder; It may include; a filtering unit for collecting the residual powder from the exhaust gas primarily purified from the first and second flexure units.

Here, the plurality of vertical flexures of the first flexure portion is made of a rectangular flat plate, but the lower end is in contact with the lower surface of the housing and the upper end is made to contact the lower end of the second flexure portion, and is located at a point d1 from the inlet. A pair of first vertical plates in which a first slit is formed between both ends and the housing, and a pair of spaced apart from each other so that a second slit is formed in the center, but is located at a distance d2 from the inlet, which is a farther point than d1. The second vertical plate may include a third vertical plate positioned at a distance d3 from the inlet, which is a farther point than d2, but with a third slit formed between the housing.

In addition, the second flexure portion, a plurality of partition walls formed of a disk body and radially formed on the basis of a central axis between the first and second horizontal plates, which are spaced vertically and horizontally, and the first horizontal plate and the second horizontal plate A first through hole is formed in the first horizontal plate so that exhaust gas flows in from the first flexure part, and the partition wall includes a pair of first partition walls formed on both sides of the first through hole, and the one A pair of second partition walls formed on opposite sides of the pair of first partition walls and a plurality of third partition walls formed between the first partition wall and the second partition wall may be formed.

Here, the inner end of the first partition wall is in contact with the central axis, the outer end is spaced from the inner periphery of the housing, the inner end of the second partition wall is spaced from the central axis, and the outer end is in contact with the inner periphery of the housing , In the plurality of third partition walls, a partition wall having an inner end contacting the central axis and an outer end spaced apart from the housing, and a partition wall having an inner end spaced apart from the central axis and an outer end contacting the housing are arranged in order. It is characterized by being.

In addition, the second flexure portion, a plurality of radially formed on the basis of the central axis between the third horizontal plate and the second horizontal plate and the third horizontal plate are disposed parallel to each other on top of the second horizontal plate It characterized in that it comprises a partition wall.

In addition, a second through hole is formed in the second horizontal plate so that exhaust gas moved zigzag between the first and second horizontal plates is moved between the second and third horizontal plates, and in the third horizontal plate, It characterized in that the third through hole is formed so that the exhaust gas moved in the zigzag between the second and third horizontal plates can be moved to the filtering unit.

On the other hand, the filtering unit is located on the upper side of the reflection portion and communicates with the outlet, and includes a filter casing with an open bottom surface and a hollow cylindrical shape with a bottom surface closed, and a collection filter installed vertically inside the filter casing. can do.

Here, the collecting filter is characterized in that the polyamide-based synthetic fibers are laminated by a heat fusion method.

According to the disclosed contents, powder can be effectively removed from the exhaust gas, and there is an effect of reducing manufacturing cost and maintenance cost by simplifying the internal configuration.

The effects of the present embodiments are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a semiconductor by-product trap device according to the prior art.
2 is a powder trap device used in a semiconductor manufacturing process according to an embodiment.
3 is an exemplary view showing an installation state of a powder trap device used in a semiconductor manufacturing process according to an embodiment.
4 is a longitudinal sectional view of a powder trap device used in a semiconductor manufacturing process according to one embodiment.
Figure 5 is a perspective view of the first and second flexure portion of the configuration of the powder trap device used in the semiconductor manufacturing process according to an embodiment.
6 is a perspective view showing the first and second flexure portions shown in FIG. 5 in the other direction.
7 is a cross-sectional view of the first flexure portion shown in FIGS. 4 and 5.
8 is an exemplary view for showing the exhaust gas flow in the first flexure portion of the configuration of the powder trap device used in the semiconductor manufacturing process according to an embodiment.
9 is an exemplary view for showing the configuration of the powder trap device used in the semiconductor manufacturing process according to an embodiment, the configuration in the second flexure and the exhaust gas flow.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the "powder trap device used in the semiconductor manufacturing process" (hereinafter abbreviated as "powder trap device") according to a preferred embodiment. For reference, in the description of the present invention, if it is determined that detailed descriptions of related well-known functions or configurations may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted.

2 is a powder trap device according to an embodiment, FIG. 3 is an exemplary view showing an installation state of a powder trap device according to an embodiment, and FIG. 4 is a longitudinal sectional view of the powder trap device according to an embodiment. 5 and 6 are perspective views of one side and the other side of the first and second flexure portions of the configuration of the powder trap device according to an embodiment, and FIG. 7 is a cross-sectional view of the first flexure portion shown in FIGS. 4 and 5, and 8 is an exemplary view for showing the exhaust gas flow in the first flexion unit, and FIG. 9 is an exemplary view for showing the configuration and the exhaust gas flow in the second flexion unit.

Powder trap apparatus 100 according to an embodiment, as shown in Figure 3 (a), the pipe between the process chamber 10 and the vacuum pump 30 to make the process chamber 10 in a vacuum state (20), that is, a pipe between the process chamber 10 or a scrubber 50 for purifying exhaust gas discharged from the process chamber 10 as shown in (b) or installed in the front end of the process chamber 10, that is, the process chamber It can be installed at the rear end of (10).

2 and 4, the powder trap device 100 according to an embodiment is made of a hollow cylindrical shape, but the housing 120 is formed with an inlet 121 at the lower side and an outlet 123 at the upper surface. ), A first flexure portion composed of a plurality of vertical plates installed opposite to the direction of the inlet 121 inside the housing 120, and located above the first flexure portion and the exhaust gas passing through the first flexure portion rotates It may include a second reflection portion to be moved to the zigzag to remove the small particles of the powder, and a filtering portion for collecting the residual powder from the exhaust gas primarily purified from the first and second reflection portions.

The housing 120 may be formed in various shapes, but may preferably be formed in a cylindrical shape, and the upper surface may be integrally manufactured with the side surface or may be configured to be combined with the side surface by being made of the upper cap 122, and the lower surface has an inlet port ( 121) the top cap 122, the outlet 123 may be formed. At this time, the exhaust gas discharged from the process chamber 10 is introduced into the inlet 121 at a high pressure by the pump pressure. The introduced exhaust gas passes through the reflection parts 130 and 140 and the filtering part 160, which will be described later, and then exits. 123.

A plurality of fins 126 are provided at the bottom of the housing 120 to facilitate movement, and a housing fixing member 128 may be provided on one side of each wheel 126.

In the inside of the housing 120, the first flexure 130, the second flexure 140, and the filtering part 160 are positioned to remove powder from the exhaust gas. 130), the second reflection unit 140 and the filtering unit 160 may be sequentially positioned.

The first flexure unit 130 may be composed of a plurality of vertical plates 132, 134, and 136 that are installed to face the direction of the inlet 121 (the inflow direction of exhaust gas). At this time, each of the vertical plates (132, 134, 136) is made of a square plate, but the lower end is in contact with the lower surface of the housing 120, the upper end of the second reflection unit 140, specifically, the second reflection unit (described later) 140) may be made to contact the first horizontal plate 142.

In a preferred embodiment, a plurality of vertical plates (132, 134, 136), as shown in Figure 7, is located at a distance d1 from the inlet 121, the first end between the housing 120 and both ends The first vertical plate 132 on which the slit s1 is formed and a pair of second which are located at a distance d2 from the inlet, which is a remote point from the d1, but are spaced apart from each other so that the second slit s2 is formed in the center. It may include a vertical plate 134 and a third vertical plate 136 positioned at a distance d3 from the inlet, which is a farther point than d2, but with a third slit s3 formed between the housing 120. .

Referring to FIG. 8, when looking at the flow of the exhaust gas from the first flexure unit 130, first, the exhaust gas introduced through the inlet 121 is front to the first vertical plate 132 positioned opposite to the inlet 121. It collides with and branches to both sides. The exhaust gas branched to both sides is moved along the first vertical plate 132, respectively, and then bent in the first slits s1 located at both sides of the first vertical plate 132, and then a pair of second vertical plates 134 After colliding with and converging at the center, it passes through the second slit s2. The exhaust gas that has passed through the second slit s2 once again collides with the third vertical plate s3 in front of it to branch to both sides, and the exhaust gas branched to both sides moves along the third vertical plate s3. After bending in the slit s3, the final converging space 137 between the housing 120 and the third vertical plate 136 converges.

According to the configuration of this embodiment, the exhaust gas introduced through the inlet 121 collides with the first to third vertical plates 132, 134, and 136 several times in front, and at the same time after the collision, the vertical plates 132, 134, and 136 By moving along the large particles of the powder can be attached and removed to the vertical plate (132, 134, 136).

In addition, the exhaust gas that has passed through the plurality of vertical plates 132, 134, and 136 converges to the final converging space 137 located on the opposite side from the inlet 121, and then the first horizontal plate of the second reflection part 140 described later ( It is possible to move naturally to the second flexure part 140 located above the first flexure part 130 along the first through hole 142a formed in 142). At this time, in order to increase the powder removal rate in the first flexure portion 130, the first and second vertical plates 132 and 134 are positioned inside based on the diameter d of the cross-section circle of the housing 120 facing the inlet. Can be.

4 to 6 and 9, the second flexure portion 140 is composed of a disk body, the first and second horizontal plates 142 and 143 spaced apart vertically, and the first and second horizontal plates ( Between 142, 143 may include a plurality of partition walls (145; 145-1, 145-2, 145-3) formed radially with respect to the central axis (141). Here, the central axis 141 may be formed of a cylindrical member that is inserted into and coupled to a through hole (not shown) formed in the first and second horizontal plates 142 and 143.

Here, a first through hole 142a may be formed in the first horizontal plate 142 so that exhaust gas flows in from the first reflection part 130. At this time, the first through hole 142a may be formed in various shapes, but may be preferably formed in a fan shape to correspond to the arrangement of the partition walls 145.

The partition wall 145 positioned between the first and second horizontal plates 142 and 143 includes a pair of first partition walls 145-1 formed on both sides of the first through hole 142a, and a pair of first The second partition wall 145-2 formed on the opposite side of the partition wall 145-1, and the third partition wall formed on both sides of the plurality of first partition walls 145-1 and the second partition wall 145-2 ( 145-3).

By such a configuration, the exhaust gas introduced through the first through hole 142a rides on the pair of first partition walls 145-1.

It is divided into left and right to move. At this time, the exhaust gas moved to the left and right is moved in a zigzag manner by a plurality of second partition walls 145-2 located on the left and right sides of the first partition wall 145-1, and then a pair of second partition walls 145 -2) converge between. Here, the converged exhaust gas moves upward through the second through hole 143a located in the second horizontal plate 143.

As a specific embodiment of the second flexure portion 140, the inner end of the first partition wall 145 is in contact with the central axis 141 and the outer end is spaced apart from the inner periphery of the housing 120, and the second partition wall 145 The inner end of -2) is spaced apart from the central axis, and the outer end may be configured to contact the inner periphery of the housing 120.

In addition, the plurality of third partition walls 145-3 has an inner end contacting the central axis, an outer end partitioning the housing 120 from the partition wall 145-3, an inner end spaced apart from the central axis, and an outer end said The partition walls 145-3 contacting the inner periphery of the housing 120 may be configured in order.

On the other hand, the second flexure unit 140 may be composed of a single layer by the first horizontal plate 142 and the second horizontal plate 143 described above, but preferably by adding separate horizontal plates and partition walls It can also be composed of multiple layers.

To this end, the second flexure unit 140 includes a third horizontal plate 144 and a second horizontal plate 143 and a third horizontal plate 144 spaced apart from each other on top of the second horizontal plate 143. ) May include a plurality of partition walls 146 formed radially with respect to the central axis.

In addition, the second horizontal plate 143 has a second through hole so that the exhaust gas moved zigzag between the first and second horizontal plates 142 and 143 is moved between the second and third horizontal plates 142 and 143. 143a) is formed, and the third horizontal plate 144 has a third through hole to allow the exhaust gas moved in a zigzag manner between the second and third horizontal plates 143 and 144 to be moved to the filtering unit 160 ( 144a) may be formed. At this time, the second through hole 143a may be located on the opposite side to the first through hole 142a, and the third through hole 144a may be located on the opposite side from the second through hole 143a. For reference, the configuration of the partition wall 146 positioned between the second horizontal plate 143 and the third horizontal plate 144 is a partition wall positioned between the first horizontal plate 143 and the second horizontal plate 143 ( 145) and 180 degrees of symmetrical arrangement, but the detailed description will be omitted.

According to the configuration of the present embodiment, the exhaust gas moved from the first flexure part 130 is rotated clockwise or counterclockwise in the second flexure part 140 composed of a single or multiple layers, but a plurality of partition walls 145 and 146 ) By moving in a zigzag manner to make contact with the plurality of partition walls 145 and 146, the powder of small particles that have not been removed from the first flexure unit 130 can be attached to and removed from the plurality of partition walls 145 and 146. have.

Meanwhile, referring to FIG. 4, the filtering unit 160 may include a filter casing 162 and a collection filter 164. The filter casing 162 is located on the upper side of the reflection portion 140, and preferably is formed in a hollow cylindrical shape and is configured to open when the exhaust gas is introduced from the reflection portion 140.

In addition, the filter casing 162 may be closely coupled to the upper end of the top cap 122 of the housing 120 in which the outlet is formed, and may be preferably coupled by a screwing method or a fitting method.

The collecting filter 164 may be formed in a hollow cylindrical shape with a closed bottom surface, and may be installed vertically inside the filter casing 162. In addition, the central axis 161 is the central axis of the filter casing 162 so that a uniform separation space can be formed along the outer circumference of the collection filter 164 between the collection filter 164 and the filter casing 162 ( 161) and the diameter may be smaller than the diameter of the filter casing 162.

The collection filter 164 may be manufactured in various ways, but may be preferably produced by laminating olefinic composite resins or polyamide-based synthetic fibers or by mixing and laminating them. At this time, as the forming method, a fusion method may be preferably used.

Conventional filters used in the trap device are formed by molding acrylic fiber with a binder, but in this case, there is a problem in that the production process is long and the cost is considerable. In order to compensate for this disadvantage, the present embodiment has an advantage of low manufacturing cost because the components of the filter are made of a relatively inexpensive polyamide-based composite resin or a polyamide-based synthetic fiber and manufactured by lamination molding by heat fusion.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the embodiments described in the specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention and represent all technical spirits of the present invention. It should be understood that there may be various equivalents and modifications that can replace them at the time of application.

100: powder trap device
120: housing
121: inlet 122: top cap
123: outlet
126: wheel
130: first flexion unit
132, 134, 136: vertical plate
140: second flexion unit
142, 143, 144: first to third horizontal plates
142a, 143a, 144a: first through third through holes
145, 146: bulkhead
160: filtering unit
162: filter casing
164: collection filter
s1 to s3: first to third slits

Claims (8)

A powder trap device that is installed at the front end or the rear end of a vacuum pump connected to a process chamber in a semiconductor manufacturing process to remove powder from exhaust gas discharged from the process chamber,
A housing formed of a hollow cylindrical shape, but having an inlet opening at a lower side and an outlet opening at an upper surface;
A first flexure portion composed of a plurality of vertical plates installed opposite to the direction of the inlet port in the housing to remove large particles of powder from the inflow exhaust gas;
A second flexure portion located above the first flexure portion and allowing the exhaust gas passing through the first flexure portion to move in a zigzag manner while being rotated to remove small particles of the powder;
And a filtering unit for collecting residual powder from the exhaust gas primarily purified from the first and second flexure units, wherein the powder trap device is used in a semiconductor manufacturing process.
According to claim 1,
The plurality of vertical flexures of the first flexure portion,
It is made of a square plate but the bottom is made to contact the bottom of the housing and the top is made to contact the bottom of the second flexure,
A first vertical plate positioned at a distance d1 from the inlet but having a first slit between both ends and the housing, and a second slit in the center located at a distance d2 from the inlet, which is a greater distance than d1. A pair of second vertical plates that are installed to be spaced apart from each other and a third vertical plate which is located at a distance d3 from the inlet, which is a remote point from the d2, but is formed with a third slit between the housing. Characterized in that, the powder trap device used in the semiconductor manufacturing process.
The second flexure portion,
It comprises a first and second horizontal plates made of a disk body spaced vertically and horizontally, and a plurality of partition walls formed radially with respect to a central axis between the first horizontal plate and the second horizontal plate,
A first through hole is formed in the first horizontal plate so that exhaust gas flows in from the first reflection part,
The partition wall includes a pair of first partition walls formed on both sides of the first through hole, a pair of second partition walls formed opposite to the pair of first partition walls, and a plurality of first partition walls and the second partition walls. A powder trap device used in a semiconductor manufacturing process, characterized in that it comprises a third partition formed between partition walls.
The method of claim 3,
The inner end of the first partition wall is in contact with the central axis, the outer end is spaced from the inner periphery of the housing, the inner end of the second partition wall is spaced from the central axis, and the outer end is in contact with the inner periphery of the housing,
In the plurality of third partition walls, a partition wall having an inner end contacting the central axis and an outer end spaced apart from the housing, and a partition wall having an inner end spaced apart from the center axis and an outer end contacting the housing, are configured in order. Characterized in that, the powder trap device used in the semiconductor manufacturing process.
The method of claim 3,
The second flexure portion,
It characterized in that it comprises a third horizontal plate spaced apart from the top of the second horizontal plate and a plurality of partition walls formed radially with respect to the central axis between the second horizontal plate and the third horizontal plate. , Powder trap device used in semiconductor manufacturing process.
The method of claim 5,
On the second horizontal plate,
A second through hole is formed so that the exhaust gas moved zigzag between the first and second horizontal plates is moved between the second and third horizontal plates,
A powder trap used in a semiconductor manufacturing process is characterized in that a third through hole is formed in the third horizontal plate so that exhaust gas moved zigzag between the second and third horizontal plates can be moved to the filtering unit. Device.
According to claim 1,
The filtering unit,
Characterized in that it comprises a filter casing which is located on the upper side of the flexion part and communicates with the outlet and has a lower surface with an open filter casing, and a lower surface with a closed hollow cylindrical shape and installed vertically inside the filter casing. Powder trap device used in semiconductor manufacturing process.
The method of claim 7,
The collection filter,
A powder trap device used in a semiconductor manufacturing process, characterized in that the polyamide-based synthetic fibers are laminated by a heat fusion method.

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