KR20190128329A - Carrier for semiconductor package and preparing method thereof - Google Patents

Abstract

The present invention relates to a carrier for a semiconductor package, which is attached to one surface of a core substrate when packaging a semiconductor, increases thickness, and is possible to suppress generation of deflection. The carrier for a semiconductor package implements high heat-resistance and excellent adhesion and transfer properties, allows gas generated during a high temperature process to be easily discharged, and has a silicon adhesive layer with stability of the high temperature process.

Description

Carrier for Semiconductor Package and Manufacturing Method Thereof {CARRIER FOR SEMICONDUCTOR PACKAGE AND PREPARING METHOD THEREOF}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier for a semiconductor package having a silicon adhesive layer that exhibits high heat resistance, excellent adhesion characteristics, and transfer characteristics, and easily discharges gas generated during a high temperature process and has excellent high temperature process stability.

BACKGROUND ART Conventionally, semiconductor packaging processes are generally disposed on a circuit pattern based on a printed circuit board (PCB) and then subjected to post-treatment processes such as an EMC molding process and a baking process.

However, as printed circuit board substrates become thinner and thinner, warpage and packaging defects occur during the packaging process. In order to solve this problem, a method of using a temporary carrier in the form of a reinforcing plate and an adhesive layer that can reinforce the thickness of the thin film-based substrate and proceed a smooth process during the packaging process has emerged. However, such a carrier may achieve a thickness reinforcing effect of the thin film substrate, but residue and contamination may occur during the process of detaching the carrier from the thin film substrate after the packaging process. In addition, when the pressure-sensitive adhesive layer component of the carrier is used as an acrylic pressure-sensitive adhesive, the reflow process of 220 ° C. or higher cannot be performed due to low thermal stability.

Therefore, there is a demand for the development of a new carrier having high heat resistance of 220 ° C. or higher, and excellent adhesion characteristics and contamination after desorption.

The present inventors can form an adhesive film without using a base film, exhibit high heat resistance, high adhesion characteristics and transfer characteristics due to a silicone component, and have a composition that does not cause contamination by low molecular silicon after desorption. The carrier for semiconductor packages provided with the adhesion layer was developed.

On the other hand, when the carrier for a semiconductor package having the silicon adhesive layer described above exhibits high heat resistance and excellent adhesive properties, gas and volatile substances (VC) generated during a high temperature process such as reflow are not easily discharged. It was for the first time recognized that poor quality results such as delamination.

Accordingly, an object of the present invention is to provide a carrier for a semiconductor package that can be effectively removed to remove the gas generated during the high temperature process without contaminant generation, and to continuously exhibit high temperature process stability. do.

In order to achieve the above technical problem, the present invention is a metal laminated plate; A silicon adhesive layer formed on one surface of the metal laminate and including a plurality of embossed or intaglio adhesive patterns spaced at predetermined intervals; And it provides a carrier for a package comprising a base film covering the silicon adhesive layer.

According to the exemplary embodiment of the present invention, the adhesive pattern may include: a pattern width formed along a first direction; A pattern length formed along a second direction crossing the first direction; And a pattern height perpendicular to the first direction and the second direction and formed along a direction perpendicular to the metal laminate, wherein a separation distance between the plurality of adhesive patterns is equal to any one of the pattern width and the pattern length. It can be formed small.

According to one embodiment of the present invention, any one of the pattern width and the pattern length may have a size of 50 to 1000 ㎛.

According to the exemplary embodiment of the present invention, the plurality of embossed or intaglio adhesive patterns have the same pattern height, and the pattern height may be 1 to 50 μm. In the present invention, the pattern height may be replaced by the pattern depth when the intaglio adhesion pattern is present.

According to one embodiment of the invention, the separation distance may be 50 to 1000 ㎛.

According to one embodiment of the present invention, the horizontal cross-sectional shape of the adhesive pattern may be any one of a circle, an oval, a stripe, a rhombus, and a polygon.

According to one embodiment of the present invention, the sum of the areas of the plurality of embossed or intaglio adhesive patterns may be 50 to 100% based on the total area of one surface of the metal laminate.

According to one embodiment of the present invention, the adhesive force of the silicone adhesive layer to the base film (eg, PET film) measured by ASTM D3330 may be 10 ~ 900 gf / inch.

According to the exemplary embodiment of the present invention, the silicon adhesive layer may have a 3% by weight reduction pyrolysis temperature measured by thermogravimetric analysis (TGA) of 330 ° C. or more and a weight reduction ratio of 260 ° C. of 0.5% or less.

According to the exemplary embodiment of the present invention, the silicon adhesive layer, after analysis at 200 ° C. for 5 minutes by gas chromatography mass spectrometry (GC / MS), has a peak due to H ₂ O, and is derived from silicon. There may not be a peak.

According to the exemplary embodiment of the present invention, the silicon adhesive layer may include a silicone polymer having a number average molecular weight (Mn) of 100,000 to 1,200,000 and a low molecular siloxane tackifier having a number average molecular weight (Mn) of 1,000 to 8,000. : It can contain the hardened | cured material of the silicone adhesive composition contained in 0-40 weight ratio.

According to one embodiment of the present invention, the silicon adhesive layer is attached to the printed circuit board after the base film is peeled off and undergoes a reflow (reflow) process at 220 ~ 260 ℃ and detached from the printed circuit board, When the surface of the printed circuit board is analyzed by the FT-IR spectrum, there may be no Si-C peak observed in the 1265 ± 15 cm ⁻¹ region.

According to an embodiment of the present invention, the printed circuit board may be a thin film type printed circuit board having a thickness of 100 μm or less.

According to one embodiment of the invention, the base film may be made of a fluorine-based release film.

According to one embodiment of the present invention, the base film may be an aging treatment for 72 to 200 hours at 40 ~ 80 ℃ before the silicon adhesive layer is formed.

According to the exemplary embodiment of the present invention, the metal laminate may include a single-sided or double-sided metal laminate in which at least one insulating layer and at least one metal layer are stacked.

According to an embodiment of the present invention, the insulating layer is a polyimide film or prepreg, and the metal layer is copper (Cu), iron (Fe), nickel (Ni), titanium (Ti), aluminum (Al). ), Silver (Ag) and gold (Au) may be at least one metal selected from the group consisting of or alloys thereof.

According to one embodiment of the invention, the thickness of the metal layer is 1 to 15㎛, the thickness of the metal laminate may be 25 to 500㎛.

As the carrier for a package of the present invention introduces a silicon adhesive layer having a high heat resistance of 260 ° C. or higher, there is no drop in adhesion during packaging processes such as a reflow process, and transfer characteristics of the silicon adhesive layer after removing the base film. It is excellent in process application.

In addition, since the silicon adhesive layer provided on the carrier for the package is formed in a plurality of islands so as to be spaced apart from each other rather than a general film, gas and volatile substances generated during a high temperature process such as reflow are easily discharged. Excellent high temperature process stability.

In addition, since the residue of the adhesive material does not occur after the reflow process, it is possible to fundamentally prevent problems due to silicon contamination, and to improve the problems related to the thickness step and the rigidity in the post-packaging process such as molding, and to improve the printed circuit. The role as a carrier of a board | substrate (thin-film PCB) base material can be fulfilled.

1 is a schematic cross-sectional view of a carrier for a package according to an embodiment of the present invention.
2 is a schematic cross-sectional view of a carrier for a package according to another embodiment of the present invention.
3 to 6 are plan schematic diagrams illustrating various adhesive pattern forms constituting the silicone adhesive layer of the carrier for a package according to the present invention.
FIG. 7 is a schematic cross-sectional view illustrating a method of manufacturing the carrier for a package of FIG. 1.
8 is a FT-IR analysis graph using a carrier for a package of Example 1. FIG.
9 is a graph of GC / MS analysis using a carrier for a package of Example 1. FIG.
10 is a graph of the FT-IR analysis of the carrier for a package of the present invention with an aging substrate film.
11 is an FT-IR analysis graph of a carrier for a package of the present invention with an aging untreated base film.
12 is a photograph showing the transfer characteristics of the carrier for a package of the present invention with an aging or untreated base film.
FIG. 13 is a thermogravimetric analysis (TGA) graph using a carrier for a package of Example 1. FIG.
14 is a thermogravimetric analysis (TGA) graph using a commercially available silicon adhesive film control.
FIG. 15 is a graph of differential scanning calorimetry (DSC) results before and after a reflow process using a carrier for a package of Example 1. FIG.
FIG. 16 is a scanning acoustic tomography (SAT) image after a reflow process using a silicon adhesive film. FIG.
17 is a SAT image after performing a reflow process using the carrier for a package of Comparative Example 2. FIG.
FIG. 18 is a scanning acoustic tomography (SAT) image after the reflow process using the carrier for a package of Example 1. FIG.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. In addition, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

<Carrier for semiconductor package>

The present invention provides a carrier for a package in which a silicon adhesive layer is formed on at least one surface, and the silicon adhesive layers are patterned in a plurality of embossed or embossed shapes so as to be spaced apart from each other instead of a general film form.

1 is a cross-sectional structural view of a carrier for a package according to an embodiment of the present invention.

Referring to FIG. 1, the package carrier 100 of the present invention includes a metal laminated plate 110; A silicon adhesive layer 120 formed on one surface of the metal laminate 110 and including a plurality of adhesive patterns 121 spaced at predetermined intervals; And a base film 130 covering the silicon adhesive layer 120. Here, the adhesive pattern 121 may be an embossed or intaglio pattern.

Metal laminate

In the carrier 100 for a package according to the present invention, the metal laminate 110 is attached to one surface of the core substrate during semiconductor packaging to increase the thickness and to act as a reinforcing material to suppress the occurrence of warpage (warpage).

The metal laminate 110 may use any one-sided or double-sided metal laminate conventional in the art in which one or more insulating layers and one or more metal layers are stacked. For example, it may be a copper clad laminate (CCL) or a flexible copper clad laminate (FCCL). Specifically, the metal laminate 110 may have a structure in which a metal layer is disposed on at least one insulating layer and at least one surface thereof or at both surfaces thereof.

The metal layer may use a metal or an alloy known in the art, for example, copper (Cu), iron (Fe), nickel (Ni), titanium (Ti), aluminum (Al), silver (Ag), and gold (Au). It may be one or more metals or alloys thereof selected from the group consisting of), preferably copper foil. At this time, examples of the copper foil which can be used include CFL (TZA_B, HFZ_B), Mitsui (HSVSP, MLS-G), Nikko (RTCHP), Furukawa, ILSIN and the like. Moreover, the said copper foil can apply all the copper foil manufactured by the rolling method or the electrolytic method. In addition, the copper foil may be rust-prevented to prevent the surface from being oxidized and corroded.

Surface roughness Rz may be formed on a surface of the metal layer in contact with the insulating layer. At this time, the surface roughness (Rz) range is not particularly limited, but may be 0.6 to 3.0 ㎛. The thickness of the metal layer is not particularly limited, but in consideration of the thickness and mechanical properties of the laminated sheet, it may be 1 to 15 ㎛, preferably 2 to 12 ㎛ range.

The insulating layer may use an insulating film known in the art without limitation, and examples thereof include a polyimide film, an epoxy resin film, and a prepreg (PPG).

In the present invention, the thickness of the metal laminate 110 is not particularly limited, and may be, for example, 25 to 500 μm, preferably 50 to 300 μm.

Meanwhile, in the present invention, the metal laminated plate 110 including at least one insulating layer and at least one metal layer is illustrated, but it is also within the scope of the present invention to use a metal laminated plate made of only the metal layer.

silicon Adhesive layer

In the carrier carrier 100 for packaging according to the present invention, the silicon adhesive layer 120 is formed on one surface of the metal laminate 110 and has a high heat resistance and serves to exhibit excellent adhesion and transfer characteristics.

The package carrier 100 exhibits excellent adhesive properties due to the composition of the silicone adhesive layer 120. In one embodiment, the adhesion of the silicone adhesive layer to the base film, such as PET film, measured by ASTM D3330 may be 10 ~ 900 gf / inch, preferably 10 ~ 400 gf / inch. Here, the measured adhesive force is based on the thickness of the silicon adhesive layer of 5 to 40 ㎛.

In addition, the silicon adhesive layer 120 provided in the carrier 100 for a package of the present invention includes a plurality of embossed or intaglio adhesive patterns 121 regularly arranged while being spaced apart from each other. There are regions in which the silicon adhesive layer is not formed between the adhesive patterns 121. Gases and volatiles generated during a high temperature process may move and be removed to the outside through the empty space. Thereby, high temperature process stability, such as a reflow process, can be exhibited, without generation | occurrence | production of a contaminant and delamination.

Each adhesive pattern 121 of the silicon adhesive layer 120 may include a pattern width formed along a first direction; A pattern length formed along a second direction crossing the first direction; And a pattern height formed in a direction perpendicular to the first direction and the second direction and perpendicular to the metal laminate. For example, one of the pattern width and the pattern length of the adhesive pattern 121 may have a size of 50 to 1000 μm. Preferably from 200 to 700 μm.

The plurality of embossed or intaglio adhesive patterns 121 have substantially the same pattern height. The height of the pattern is not particularly limited, and may be, for example, 1 to 50 μm, and specifically 5 to 20 μm. In this case, when the adhesive pattern is an intaglio pattern, the above-described pattern height may be replaced by the pattern depth.

In addition, a predetermined separation distance is formed between any one of the plurality of adhesive patterns 121 and another adhesive pattern adjacent thereto. In one embodiment, the separation distance may be formed equal to or smaller than any one of the pattern width and the pattern length. Specifically, the separation distance may be 50 to 1,000 ㎛, preferably 50 to 700 ㎛.

The silicon adhesive layer 120 has a regular pattern in which a plurality of embossed or intaglio adhesive patterns 121 and a planarization region in which the pattern is not formed alternate with each other when viewing a horizontal cross-sectional shape. The horizontal cross-sectional shape of the embossed or intaglio adhesive pattern 121 is not particularly limited, and may be, for example, a circle, an ellipse, a stripe, a rhombus, or a polygon of triangle or more. In addition, various pattern shapes can be applied.

In the present invention, in consideration of the adhesive properties of the silicon adhesive layer and high temperature process stability can be formed by adjusting the total area or number of the adhesive pattern 121. For example, the sum of the areas of the plurality of embossed or intaglio adhesive patterns 121 may be 50 to 100% based on the total area of one surface of the metal laminate 110, and preferably 50 to 100. 90%.

On the other hand, the conventional adhesive film using the acrylic composition has a limit in heat resistance, it was difficult to apply to high temperature manufacturing process, such as reflow process (260 ℃, 1-3 minutes). In contrast, in the present invention, since the silicon adhesive layer having a high temperature and heat resistance of 260 ° C. or more is used, the present invention can be applied to a reflow process without deterioration of adhesiveness.

According to the exemplary embodiment of the present invention, the silicon adhesive layer 120 has almost no weight loss at the reflow process temperature (220 to 260 ° C.), and a 3 wt% reduction pyrolysis temperature measured by thermogravimetric analysis (TGA). Is 330 ° C. or higher, preferably 330 ° C.-370 ° C. In addition, the weight loss ratio at 260 ° C. at which the reflow process is performed may be 0.5% or less, and specifically 0.1 to 0.5%. The weight loss ratio near the pyrolysis temperature of 400 ° C. may be 12% or less, and preferably 11% or less.

The silicone adhesive layer 120 may include a silicone adhesive composition including a silicone polymer and a low molecular siloxane tackifier. It may be formed by curing .

The silicone polymer may be a conventional high molecular weight silicone-containing resin known in the art. As an example, an organopolysiloxane resin having a number average molecular weight (Mn) of 100,000 to 1,200,000 can be used, and preferably an organopolysiloxane resin having a number average molecular weight (Mn) of 400,000 to 800,000. When the number average molecular weight (Mn) of the silicone polymer is less than 100,000, the adhesive property may be deteriorated, and even if the adhesive property is given, it may not exhibit stable adhesive force, and residue or contamination by a low molecular weight silicon material (Si by-product) after desorption is achieved. This will occur.

Specifically, the silicon polymer may be represented by the following formula (1).

[Formula 1]

In Chemical Formula 1,

R is the same or different and is each independently selected from the group consisting of a hydroxy group, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms and an aryl group having 6 to 18 carbon atoms,

n is from 100 to 10,000.

In addition, the low molecular siloxane tackifier may use a silicon-containing tackifier resin known in the art, preferably a low molecular weight MQ resin having a number average molecular weight (Mn) of 1,000 to 8,000.

Specifically, the low molecular weight MQ resin may be represented by the following formula (2).

[Formula 2]

In Chemical Formula 2,

R is the same as or different from each other, and each independently may be selected from the group consisting of a hydrogen atom, a monovalent hydrocarbon, a monovalent halogenated hydrocarbon and an alkenyl group,

w and z> 0, x and y ≧ 0, w + x + y + z = 1, and 0 ≦ {(x + y) / 2} ≦ 0.4.

In the present invention, the mixing ratio of the silicone polymer and the low molecular siloxane tackifier (tackifier resin) is not particularly limited, for example 100 to 60: 0 to 40 may be included in the weight ratio. If necessary, the silicone adhesive composition may further include a crosslinking agent and / or a platinum catalyst known in the art. In this case, the amount of the crosslinking agent and / or the platinum catalyst is not particularly limited and may be appropriately controlled within a content range known in the art.

The carrier 100 for a package of the present invention has a structure in which a base film 130, a silicon adhesive layer 120, and a metal laminate 110 are sequentially stacked. When the base film 130 is peeled off from the carrier 100 for the package, the silicon adhesive layer is transferred onto one surface of the metal laminated plate 110, which is a structure of the carrier 101 for the package shown in FIG. 2. Thus, the package carrier 101 from which the base film 130 was peeled off can be used as a package carrier by attaching the surface on which the silicon adhesive layer 120 is formed on one surface of another substrate (eg, a thin film PCB). At this time, the transfer characteristics after removing the base film 130 is excellent.

In addition, other substrates (eg, thin-film PCBs) adhered to the silicon adhesive layer 120 may be subjected to a high temperature process such as reflow if necessary, or to a subsequent packaging process such as molding after the reflow process. The silicon adhesive layer 120 and the metal laminate 110 are then detached from the substrate. At this time, since the residue of the silicon adhesive layer does not exist on the surface of the desorbed substrate (eg, thin film PCB), contamination due to the use of silicon does not occur. In addition, since the gas generated by the high temperature process can be easily removed to the outside, process stability can be exhibited, and generation of thickness steps can be suppressed in subsequent processes such as molding. In addition, by fulfilling a role as a thickness reinforcing material of the thin-film substrate during the packaging process, it is possible to prevent a warpage problem generated during the process, it can be easily removable after the packaging process.

After the high temperature manufacturing process described above is performed, the presence or absence of the residual silicon adhesive layer 120 may be measured by various analytical methods. As an example, FT-IR, EDS, GC / MS, etc. can be mentioned.

According to one embodiment of the present invention, the silicon adhesive layer 120, after peeling off the base film is attached to one surface of the printed circuit board substrate is subjected to a reflow (reflow) process at 220 ~ 260 ℃ desorption, When the surface of the detached printed circuit board substrate is analyzed by the FT-IR spectrum, there is no Si-C peak observed in the 1265 ± 15 cm ⁻¹ region.

The printed circuit board may be a thin film printed circuit board having a thickness of 100 μm or less, and specifically, may be a printed circuit board having a strip shape having a range of 10 to 100 μm.

According to another embodiment of the present invention, the silicon adhesive layer 120, when analyzed by gas chromatography mass spectrometry (GC / MS) after exposure for 5 minutes at 200 ℃, there is a peak due to H ₂ O Then, the peak derived from silicon does not exist (refer FIG. 9).

In addition, according to another embodiment of the present invention, when the surface of the detached substrate is analyzed by Energy Dispersive X-ray Spectroscopy (EDS), the content of silicon (Si) element is not detected.

Base Film

In the carrier 100 for a package according to the present invention, the base film 130 serves to support and protect the silicon adhesive layer 120 while being used as a coating substrate for forming the silicon adhesive layer 120.

The base film 130 is not particularly limited, and a plastic film such as a protective film commonly known in the art may be used without limitation. Non-limiting examples of the base film that can be used include polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate and polyethylene naphthalate (PEN), polyethylene film, polypropylene film, cellophane, diacetylcellulose film , Triacetyl cellulose film, acetyl cellulose butyrate film, polyvinyl chloride film, polyvinylidene chloride film, polyvinyl alcohol film, ethylene-vinyl acetate copolymer film, polystyrene film, polycarbonate film, polymethylpentene film, polysulfone Film, polyether ether ketone film, polyether sulfone film, polyetherimide film, polyimide (PI) film, fluororesin film, polyamide film, acrylic resin film, norbornene-based resin film, cycloolefin resin film Etc. Specific examples may be selected from the group consisting of a polyimide (PI) film, a polyethylene terephthalate (PET) film, a polyethylene naphthalate (PEN) film, a protective film, a carrier film, and a fluorine release film. Preferably, the film may be a fluorine-based release film using a PET film, and specifically, a fluorine-based release agent containing a platinum catalyst, a fluorine-type curing agent, and an adhesive additive is preferably made of a fluorine-based release agent.

In the present invention, the base film 130 may be one that has already been aged before the silicon adhesive layer 120 is formed. In particular, it is preferable to use the aged base film as a coating base material of the silicon adhesive layer 120. In the case of using the aging-treated base film as described above, the chemical bond with the silicon adhesive layer formed thereon may be significantly reduced, and thus the transfer characteristics may be further increased. The aging treatment conditions are not particularly limited, and may be aged at 40 to 80 ° C. for 72 to 200 hours, for example.

According to one embodiment, the aging treatment of the base film 130, FT-IR analysis When the spectrum, to the relative intensities of the Si-H peak is observed in the 800-950 cm ^-1 region formula (1) It may be to satisfy the relationship.

[Equation 1]

I _A / I _N ≤ 0.5

In the above formula, I _A represents the intensity of the 800-950 cm ^-1 peak of the silicon adhesive layer formed on the aging base film, I _N is 800-950 cm ^- of the silicon adhesive layer formed on the aging untreated base film The intensity of ^one peak is shown.

The thickness of the base film 130 is not particularly limited, and may be, for example, 10 to 100 μm, preferably 25 to 75 μm.

Meanwhile, the present invention specifically illustrates a metal laminate, but in addition to the metal laminate, it is also within the scope of the present invention to use a high heat resistant substrate known in the art, for example, a substrate made of high heat resistant resin or engineering plastic having heat resistance of 260 ° C. or higher. Belong.

<Production method of carrier for package>

The carrier for a package of the present invention can be produced by the following two methods. However, the present invention is not limited only to the following methods and can be variously modified.

The first embodiment of the manufacturing method is to use a base film having a negative or embossed pattern. In one embodiment of manufacturing a carrier for a package according to the first embodiment, for example, (i) preparing a base film having a plurality of intaglio or embossed patterns on one surface; (ii) applying and drying the silicone adhesive composition on the intaglio or embossed pattern of the base film; And (iii) laminating and laminating a metal laminate on one surface of the base film.

7 is a cross-sectional view schematically illustrating a method of manufacturing a carrier for a package according to an embodiment. Hereinafter, each manufacturing process will be described in detail with reference to FIG. 7.

First, as shown in FIG. 7A, a base film 310 having a plurality of intaglio patterns formed on one surface thereof is prepared as a coating base material of a silicone adhesive composition.

The base film 310 can be used without limitation, such as a plastic film known in the art, preferably to use an aging fluorine-based release film. In addition, the shape, number, size, etc. of the plurality of intaglio or embossed patterns 311 formed in the base film 310 are not particularly limited, and may be appropriately adjusted in consideration of adhesion characteristics and high temperature process stability of the silicon adhesive layer.

Subsequently, as illustrated in FIG. 7B, a silicon adhesive layer is formed by coating and curing the silicon adhesive composition 320 on one surface of the base film 310, specifically, on one surface on which the intaglio pattern 311 is formed.

At this time, as the method for applying the silicone adhesive composition 320 on the base film 310, a conventional coating method in the art, for example, dip coating method, air knife coating method, curtain coating method, wire bar coating method, gravure The coating method, the comma coating method, the slot coating method, the extrusion coating method, the spin coating method, the slit scanning method, the inkjet method, etc. are mentioned.

Drying and curing processes may be appropriately carried out within conventional conditions known in the art. In one example, curing may be performed at 100 to 250 ° C. for 1 to 10 minutes. The silicone pressure-sensitive adhesive layer formed as described above is in a state of being completely cured and means a degree of curing of 90-100%.

If necessary, as shown in FIG. 7C, a protective film may be disposed on the silicon adhesive layer 320.

Thereafter, as shown in FIG. 7 (d), the metal laminate plate 340 is laminated and laminated on one surface of the base film 310 on which the silicon adhesive layer 320 is formed. The conditions of this lamination step are not particularly limited and may be appropriately adjusted within the range known in the art.

Subsequently, after the metal laminate plate 340 is positioned below the laminated laminate, the substrate film 310 positioned on the upper portion is removed, thereby completing the manufacture of a carrier for a package as shown in FIG. do.

Meanwhile, in the present invention, the manufacturing of a carrier for a package using a base film having an intaglio pattern is described in detail with reference to FIG. 7, but the use of a base film having an embossed pattern is also within the scope of the present invention.

A second embodiment of manufacturing a carrier for a package according to the present invention is to apply a coating method capable of forming a predetermined regular relief embossed adhesive pattern.

In one embodiment of manufacturing a carrier for a package according to the second embodiment, (i) coating a silicone adhesive composition on the first surface of the base film, but forming a plurality of embossed adhesive patterns spaced at predetermined intervals And curing to form a silicon adhesive layer; And (ii) arranging the silicon adhesive layer of the base film and the first surface of the metal laminated plate to be in contact with each other.

Here, it is preferable that the base film used as the coating base material of a silicone adhesive composition uses what was aged.

In the present invention, a method of patterning and applying the silicone adhesive composition onto the base film is not particularly limited, and conventional methods known in the art may be used. For example, a gravure offset, a mask process, a laser processing, a mold punching, an inkjet, or a lithography method may be used.

The drying and curing process may then be appropriately carried out within conventional conditions known in the art. In one example, curing may be performed at 100 to 250 ° C. for 1 to 10 minutes. The silicone pressure-sensitive adhesive layer formed as described above is in a state of being completely cured and refers to a state of curing of 90-100%.

In addition, the lamination step may be appropriately carried out within the conventional range known in the art, it may be carried out under a temperature condition of 20 to 150 ℃. For example, it may be manufactured through a lamination process having a heated roll of the aforementioned temperature conditions.

The carrier for a package manufactured as described above is applicable to various fields requiring high heat resistance and excellent transfer characteristics. For example, the present invention may be applied to a heat-resistant carrier for manufacturing a semiconductor packaging used to reinforce a thin printed circuit board substrate in a semiconductor packaging, and a method for manufacturing a semiconductor packaging using the carrier.

Hereinafter, the present invention will be described in detail with reference to the following Examples. However, the following examples are merely to illustrate the invention, the present invention is not limited by the following examples.

[ Reference Example  1. Selection of silicone (non) adhesive composition]

Specific compositions of the silicone (non) adhesive compositions 1 to 7 used in the Examples and Comparative Examples of the present application are shown in Table 1 below. Here, the silicone pressure-sensitive adhesive composition except for the crude liquid B of the silicone pressure-sensitive adhesive composition 6 is a silicone polymer having a number average molecular weight (Mn) of 100,000 or more, or a low molecular siloxane tackifier having the silicone polymer and the number average molecular weight (Mn) of 1,000 to 8,000. It has a composition comprising a.

In addition, the adhesive properties according to the thickness of the silicone adhesive layer formed using the silicone (non) adhesive compositions 1 to 7 are shown in Table 2 below.

Amount A
(wt%) Crude amount B
(wt%) Detailed composition Silicone Adhesive Composition 1 80 20 Amount A: 7657 (Dow Corning)
Amount B: 7654 (Dow Corning) Silicone Adhesive Composition 2 100 - Amount A: 7657 (Dow Corning) Silicone Adhesive Composition 3 100 - Amount A: 7652 (Dow Corning) Silicone Adhesive Composition 4 100 - Amount A: SG6500A (KCC) Silicone Adhesive Composition 5 80 20 Amount A: 7652 (Dow Corning), Amount B: 7651 (Dow Corning) Silicone Adhesive Composition 6 60 40 Crude A: 4580 (Dow Corning), Crude B: 7646 (Dow Corning, Mn of silicone polymer: less than 100,000) Silicone Non-Adhesive Composition 7 100 - Amount A: SC3300L (KCC)

Silicone (Non) Adhesive Layer Thickness (㎛) Adhesive force of silicone (non) adhesive composition (gf / inch) One 2 3 4 5 6 7 5 30 200 50 250 10 20 0 10 40 300 80 340 20 30 0 20 75 650 120 700 40 50 0 30 90 730 160 800 55 60 0 40 120 820 200 900 75 90 0

[ Example  1-5. For package carrier  Manufacturing (1)]

After curing by coating the silicone adhesive composition 1 on one surface of a base film (Fluorine release film, thickness: 50 ㎛) formed with a plurality of circular intaglio patterns (pattern diameter: 500 ㎛, distance between patterns: 250 ㎛) on one side After the coating layer and the metal laminated plate (PKG core with 12㎛ Cu foil) on which the silicone adhesive composition 1 of the base film was formed were disposed to be in contact with each other, the carrier for the package of Example 1 was prepared by bonding at 100 ° C. using a laminator. It was.

In addition, except that the composition of the silicone pressure-sensitive adhesive composition shown in Table 3 instead of the silicone pressure-sensitive adhesive composition 1 was formed, the silicone pressure-sensitive adhesive layer in the form of a film was formed in the same manner as in Example 1 to package carriers of Examples 2 to 5 (1 ) Were prepared respectively.

Silicone (Non) Adhesive Layer Film form Example 1 Silicone Adhesive Composition 1 Forming a plurality of circular intaglio patterns Example 2 Silicone Adhesive Composition 2 Forming a plurality of circular intaglio patterns Example 3 Silicone Adhesive Composition 3 Forming a plurality of circular intaglio patterns Example 4 Silicone Adhesive Composition 4 Forming a plurality of circular intaglio patterns Example 5 Silicone Adhesive Composition 5 Forming a plurality of circular intaglio patterns Comparative Example 1 Silicone Adhesive Composition 6 General sheet type Comparative Example 2 Silicone Adhesive Composition 1 General sheet type

[ Comparative example  1. Package carrier  Produce]

Silicon adhesive in the form of a film in the same manner as in Example 1 except for using a general sheet-type base film (Fluorine release film) instead of a base film having a plurality of intaglio patterns, and a silicone adhesive composition 6 instead of the silicone adhesive composition 1 The carrier was prepared in Comparative Example 1 by forming a layer.

[ Comparative example  2. Package carrier  Produce]

A carrier of Comparative Example 2 was prepared by forming a silicon adhesive layer in the same manner as in Example 1 except that a general sheet-type base film (Fluorine release film) was used instead of a base film having a plurality of intaglio patterns.

[ Experimental Example  1.silicone Low molecular weight  Pollution Check Assessment (1)]

In order to confirm the contamination degree of the low molecular weight silicon of the carrier for a package, FT-IR analysis was performed.

Specifically, the substrate film (fluorine-based release film) was removed from the package carrier of Example 1, the printed circuit boards were laminated, and a reflow process was applied at 260 ° C. Then, the FT- was removed by removing the printed circuit board. IR analysis confirmed the functional groups on the surface of the printed circuit board.

As a result, the Si-C peak observed at 1250-1280 cm ^-1 was observed in the FT-IR of the package carrier prepared in Example 1, but the Si-C peak was not present in the printed circuit board to which the reflow process was applied. Not found (see FIG. 8).

[ Experimental Example  2. silicone Low molecular weight  Contamination Identification Assessment (2)]

GC / MS analysis was conducted to confirm the degree of contamination of the low molecular silicon of the carrier for the package.

Specifically, the base film was removed from the package carrier of Example 1 and exposed at 260 ° C. for 5 minutes, and then outgassing was confirmed.

As a result of the experiment, it was found that in the silicon adhesive layer of Example 1, only gas generated due to moisture was generated in about 1.65 minutes, and other low-molecular substances such as siloxane did not occur. Accordingly, it could be confirmed that no silicon contamination caused by residual and outgassing occurred (see FIG. 9).

[ Experimental Example  3. Aging  Evaluation of Transcription Characteristics by Processing]

The transfer characteristics of the aging treatment of the fluorine-based release film (substrate film) used as the coating substrate of the silicone adhesive layer were evaluated as follows.

Specifically, the fluorine-based release film (Fluorine release film) after the aging treatment for 7 days at 60 ℃, to form a silicone adhesive layer on one surface of the release film. In addition, a silicone adhesive layer formed on one surface of the aging untreated release film was used as a control. After desorbing the fluorine-based release film from each of the two package carriers described above, FT-IR analysis was performed to measure the unreacted Si-H functional groups present in the fluorine-based release film.

Experimental results showed that the strength of the Si-H functional group was high at 950-980 cm ⁻¹ in the control group without aging treatment (see FIG. 11), while in the embodiment in which the aging treatment was performed at 950-980 cm ⁻¹ . It was found that the strength of the unreacted Si-H functional group was significantly lowered (see FIG. 10).

In addition, in the case of using the aging release film, the transfer of the silicone adhesive layer on the Cu substrate was made clean, while using the aging untreated release film was found that the transfer characteristics of the silicone adhesive layer is reduced (Fig. 12). Reference).

Accordingly, in the present invention, when the aging process is further performed, the bonding strength between the fluorine-based release film and the silicon adhesive layer is lowered, thereby confirming that the transfer characteristics of the silicon adhesive layer may be improved.

[ Experimental Example  4.silicone Adhesive layer High heat resistance  Characteristic evaluation Thermogravimetric analysis ]

In order to evaluate the high heat resistance characteristics of the silicon adhesive layer, a thermogravimetric analyzer (TGA) was performed as follows.

As a sample, a carrier for a package of Example 1 was used, and a commercially available silicone adhesive film was used as a control. The sample of Example 1 is a sample that greatly improved the crosslinking density compared to the commercially available silicone adhesive film, it was expected that the high heat resistance stability is significantly improved than the conventional silicone adhesive film.

Specifically, the 3 wt% reduction temperature was measured while raising the temperature at a rate of 10 ° C./min using the above products, and the weight of pyrolyzed at 400 ° C. was respectively measured.

As a result, in the control group, weight loss began to occur from approximately 260 ° C., and the 3% by weight reduction temperature was 303 ° C. (see FIG. 14). In comparison, in Example 1, weight loss hardly occurred at 300 ° C. or lower, and the 3% by weight reduction temperature was 366 ° C. (see FIG. 13). Accordingly, it was found that the silicone pressure-sensitive adhesive layer of the present invention has high heat resistance characteristics.

[ Experimental Example  5. Silicone Adhesive layer High heat resistance  Characteristic Evaluation-Differential Scanning Calorimetry]

Differential Scanning Calorimetry (DSC) was performed to evaluate the high heat resistance characteristics of the silicon adhesive layer.

Specifically, the silicon adhesive layer was separated from the base film of the carrier for the package, and the reflow process was repeated about five times. Then, the DSC analysis of the silicon adhesive layer was evaluated.

15 (A) is a graph of the DSC results using the package carrier of Example 1 before the reflow process, and FIG. 15 (B) shows the package carrier of Example 1 after five reflow processes at 260 ° C. DSC results graph used.

As a result of the experiment, it was confirmed that the silicone adhesive layer of the present invention had excellent thermal stability even when applied to a high temperature reflow process.

[ Experimental Example  6. Delamination ( Delamination Evaluation of properties]

Delamination characteristics were confirmed using a carrier for a package according to the present invention.

Specifically, after removing the base film from the carrier for the package, the printed circuit board was attached to the silicon adhesive layer and the reflow process was repeated about 5 times, after which the delamination occurred by SAT (Scanning Acoustic Tomography) measurement. Evaluated. At this time, a commercially available silicone adhesive film and a carrier for a package of Comparative Example 2 were used.

FIG. 16 and FIG. 17 are SAT images after performing a reflow process using a commercially available silicone pressure-sensitive adhesive film each having a film-type silicone pressure-sensitive adhesive layer and a carrier for a package of Comparative Example 2. FIG. They all confirmed that delamination occurred after the reflow process. It is believed that the delamination is caused by the gas and volatile substances generated by the high temperature process.

On the other hand, the carrier for a package of the present invention was confirmed to continue to exhibit a stable adhesion characteristics without generating a delamination, even if other processes such as reflow (see Fig. 18).

100, 101: carrier for package
110, 340: metal laminate
120, 320: silicon adhesive layer
121: embossed adhesive pattern
130, 310: base film
311: engraved adhesive pattern
320: silicone adhesive layer composition
330: protective film

Claims (18)

Metal laminate;
A silicon adhesive layer formed on one surface of the metal laminate and including a plurality of embossed or intaglio adhesive patterns spaced at predetermined intervals; And
A base film covering the silicon adhesive layer;
Carrier for a package comprising a. The method of claim 1,
The plurality of embossed or engraved adhesive patterns,
A pattern width formed along the first direction;
A pattern length formed along a second direction crossing the first direction; And
It has a pattern height formed in a direction perpendicular to the first direction and the second direction and perpendicular to the metal laminate,
The separation distance between the plurality of adhesive patterns, the package carrier is formed equal to or smaller than any one of the pattern width and the pattern length. The method of claim 2,
Any one of the pattern width and the pattern length, the carrier for a package having a size of 50 to 1,000 ㎛. The method of claim 1,
The plurality of embossed or intaglio adhesive patterns have the same pattern height,
The pattern height is a carrier for a package of 1 to 50 ㎛. The method of claim 2,
The separation distance is 50 to 1,000 ㎛ carrier for the package. The method of claim 1,
The horizontal cross-sectional shape of the adhesive pattern is a carrier for a package which is any one of circular, oval, stripe, rhombus and polygon. The method of claim 1,
The sum of the areas of the plurality of embossed or intaglio adhesive patterns is 50 to 100% based on the total area of one surface of the metal laminated plate. The method of claim 1,
A carrier for packaging, wherein the adhesive force of the silicone adhesive layer to the base film measured by ASTM D3330 is 10 to 900 gf / inch. The method of claim 1,
The silicone pressure-sensitive adhesive layer, the thermogravimetric analysis (TGA), the measured 3% by weight reduction pyrolysis temperature is 330 ℃ or more, the weight loss ratio at 260 ℃ is a carrier for packages. The method of claim 1,
The silicon adhesive layer, when analyzed by gas chromatography mass spectrometry (GC / MS) after exposure at 200 ° C. for 5 minutes, a peak due to H ₂ O is present, and there is no silicon-derived peak. The method of claim 1,
The silicone adhesive layer may include a silicone polymer having a number average molecular weight (Mn) of 100,000 to 1,200,000 and a low molecular weight siloxane tackifier having a number average molecular weight (Mn) of 1,000 to 8,000 in a range of 100 to 60: 0 to 40 by weight. Carrier for packages containing hardened | cured material of an adhesive composition. The method of claim 1,
The silicone adhesive layer is attached to the printed circuit board after the base film is peeled off, and is subjected to a reflow process at 220 ~ 260 ℃ and detached from the printed circuit board,
When the surface of the detached printed circuit board is analyzed by the FT-IR spectrum, the carrier for a package does not have a Si-C peak observed in the 1265 ± 15 cm ^-1 region. The method of claim 12,
The printed circuit board is a package carrier for a thin film printed circuit board having a thickness of 100 ㎛ or less. The method of claim 1,
The base film is a carrier for a package consisting of a fluorine-based release film. The method of claim 1,
The base film is a carrier for a package that has been aged (aging) for 72 to 200 hours at 40 ~ 80 ℃ before the silicon adhesive layer is formed. The method of claim 1,
The metal laminate plate is a carrier for a package, which is a single-sided or double-sided metal laminated plate laminated with at least one insulating layer and at least one metal layer. The method of claim 16,
The insulating layer is a polyimide film or prepreg,
The metal layer is at least one metal selected from the group consisting of copper (Cu), iron (Fe), nickel (Ni), titanium (Ti), aluminum (Al), silver (Ag), and gold (Au) or A carrier for a package, which is an alloy of these. The method of claim 16,
The thickness of the metal layer is 1 to 15㎛,
The thickness of the metal laminate is a carrier for a package of 25 to 500 ㎛.

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