KR20190010991A - Antenna - Google Patents

Abstract

The present invention provides an antenna which can dramatically reduce a thickness of a dielectric layer by utilizing an air bound and minimize transmission loss of a millimeter wave. According to an embodiment of the present invention, the antenna comprises a first dielectric substrate, and a second dielectric substrate arranged under the first dielectric substrate and having the air bound formed on the inside. The first dielectric substrate includes: a dielectric layer; an upper layer arranged on the dielectric layer and including a ground with at least one radiating slot formed therein and a feeding unit; a lower layer arranged under the dielectric layer and being in contact with the second dielectric substrate; and a plurality of vias passing through the first dielectric substrate and the second dielectric substrate, and surrounding the radiating slot arranged on the upper layer and the air bound formed on the second dielectric substrate.

Description

Antenna {ANTENNA}

An embodiment according to the present invention relates to an antenna, and more particularly to a surface-integral-waveguide (SIW) antenna having a waveguide of an air-layer structure.

2. Description of the Related Art Generally, a slot antenna is an antenna in which a slot or slit is formed on a side surface parallel to a front surface of a wide metal plate (waveguide), that is, a slot is slit, Slot or slit antenna.

Such a slot antenna can use a parallel two-wire type or a coaxial feeder line, and a radio wave is radiated from the slot when it is crossed to interfere with the pipe wall current of the waveguide. When supplying power to the coaxial feeder, feed it at the point where it moves slightly from the center to match the end. It is a magnetic dipole, with vertical polarization in the horizontal slot and horizontal polarization in the vertical slot. The directivity is the same as the complementary dipole, which is maximized in the direction perpendicular to the conductor tube, and is unidirectional when a shielding cavity is provided at the rear.

In addition, a slot array antenna is an antenna in which half-wave resonance slots are slanted obliquely to a side parallel to a front surface of a waveguide, and these are arranged as a slot antenna array to obtain necessary directivity and gain. Feed the antenna at the center or one end of the antenna. It is covered with a dielectric radome for waterproofing, prevention, prevention of salting and reinforcement of strength.

On the other hand, the SIW (Surface Integrate Waveguide) antenna has a merit that a conventional metal waveguide structure is implemented on a printed circuit board and a millimeter wave (mm-wave) signal can be transmitted with a low loss. It is a combination of the low loss characteristics of the existing waveguide structure and the easiness of signal processing due to the integration of the printed circuit board, which can be an alternative to overcome the limit of high loss of the millimeter wave band module implementation.

However, the conventional SIW antenna structure is a waveguide structure including a dielectric layer filled with Teflon, which is disadvantageous in that a Teflon material having a certain thickness or more must be used to form the waveguide structure. In addition, the occurrence of millimeter wave loss due to Teflon raw materials is inevitable, and the same restrictions are imposed on the use of expensive low-loss materials due to the characteristics of raw materials.

In the embodiment of the present invention, an antenna capable of minimizing a transmission loss of a millimeter wave while drastically reducing a thickness of a dielectric layer using an air layer is provided.

Also, in the embodiment of the present invention, it is possible to provide an antenna capable of transmitting a signal by an effective permittivity of a permittivity of a dielectric layer such as Teflon and a permittivity of an air layer.

Also, in the embodiment of the present invention, an antenna including a transmission line for signal transmission that minimizes signal loss is provided.

It is to be understood that the technical objectives to be achieved by the embodiments are not limited to the technical matters mentioned above and that other technical subjects not mentioned are apparent to those skilled in the art to which the embodiments proposed from the following description belong, It can be understood.

An antenna according to an embodiment of the present invention includes a first dielectric substrate; And a second dielectric substrate disposed below the first dielectric substrate and having an air layer formed therein, the first dielectric substrate comprising: a dielectric layer; a ground and a dielectric layer disposed on the dielectric layer, A lower layer disposed below the dielectric layer and in contact with the second dielectric substrate; a dielectric layer disposed between the first dielectric substrate and the second dielectric substrate, the radiation slot disposed in the upper layer, And a plurality of vias surrounding the air layer formed on the second dielectric substrate.

Further, the dielectric layer includes Teflon.

Further, the air layer overlaps with the at least one radiation slot formed in the ground of the upper layer in the vertical direction.

The second dielectric substrate includes a first insulating layer, a first metal layer disposed on the first insulating layer, a first adhesive layer disposed on the first metal layer, and a second metal layer disposed on the first adhesive layer. A second insulating layer disposed on the second metal layer, a third metal layer disposed on the second insulating layer, and a second adhesive layer disposed on the third metal layer.

In addition, the first insulating layer and the second insulating layer include FR4, and the first adhesive layer and the second adhesive layer include a prepreg.

Further, the air layer penetrates the first adhesive layer, the second metal layer, the second insulating layer, the third metal layer, and the second adhesive layer.

Further, the thickness of the air layer is thicker than the thickness of the dielectric layer.

A depression is formed at one end of the ground for inserting a first region of the signal transmission line of the feeding portion. The width of the depression is larger than the width of the first region of the signal transmission line, The first region of the line is not in contact with the ground.

The lower layer may include a first slot formed in a region vertically overlapping with the air layer and a second slot formed in a region spaced apart from the first slot by a predetermined distance and vertically overlapping with the first region of the signal transmission line And a second slot.

The second slot may include a first portion formed in a region overlapping with the first region in the vertical direction, a second portion formed by bending vertically from one end of the first portion toward the first slot, And a third portion bent perpendicularly from the other end of the first portion toward the first slot.

Further, the first region of the signal transmission line protrudes from the first portion of the second slot within the vertical direction, and at least a portion thereof is disposed between the second portion and the third portion.

Further, the end portion of the first region is disposed between one end and the other end of each of the second portion and the third portion within the vertical direction.

According to the embodiment of the present invention, the characteristics of the air layer waveguide and the dielectric constant characteristics are combined with each other, so that the signal loss due to the transmission of the millimeter wave to the air layer having a relatively higher thickness than that of the Teflon with a low thickness can be minimized, By implementing the pattern (other than the slot type), the fabrication easiness of the millimeter wave antenna can be improved.

In addition, according to the embodiment of the present invention, not only a structure capable of implementing SIW using a low-thickness Teflon but also an air layer capable of minimizing transmission loss can improve the product reliability.

According to the embodiment of the present invention, the signal is transmitted by the effective permittivity of coupling the permittivity (Er) by the Teflon and the permittivity (Er = 1) of the air layer, .

In addition, according to the embodiment of the present invention, since the signal is transmitted to the waveguide mode (Transverse Electric 10), the energy loss due to the air layer is relatively low compared to the loss coefficient (Df) of the medium of Teflon Lt; / RTI >

In addition, according to the embodiment of the present invention, by embodying the pattern using the upper layer of Teflon, it is possible to overcome the disadvantage of the antenna design having the structure including only the air layer, thereby reducing the difficulty have.

Also, in the present invention, by designing the transmission line for connection between the upper layer of Teflon and the communication element, the insertion loss can be minimized.

2 is a plan view of the upper layer 120 of the first dielectric substrate 100 of FIG. 1, and FIG. 3 is a plan view of the upper layer 120 of the first dielectric substrate 100 of FIG. 1, 1 is a plan view of the lower layer 130 of the dielectric substrate 100, and FIG. 4 is an enlarged view of a region where the second slot of FIG. 3 is formed.
5 is a diagram showing a comparison structure with an embodiment of the present invention.
6 is a graph showing the insertion loss of the structure of the embodiment of the present invention and the comparative structure.
7 is a diagram illustrating signal characteristics according to an embodiment of the present invention.
8 is a view showing radiation characteristics of an antenna according to an embodiment of the present invention.
9 is a diagram illustrating signal loss in an antenna according to an embodiment of the present invention.
10 is a diagram showing signal loss for a comparison structure with an antenna of the present invention.
11 to 15 are views showing various embodiments of the slot according to the embodiment of the present invention.
16 is a view showing the structure of an antenna according to a second embodiment of the present invention.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description with reference to the accompanying drawings, the same reference numerals denote the same elements regardless of the reference numerals, and redundant description thereof will be omitted. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer The terms " on "and " under " encompass both being formed" directly "or" indirectly " The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size of each component does not entirely reflect the actual size. Hereinafter, embodiments will be described with reference to the accompanying drawings.

In the following description, for the sake of convenience of the applicant's understanding and understanding of the present invention, the antenna according to the present invention exemplifies a millimeter wave. In addition, the millimeter wave antenna according to the present invention may be composed of a substrate direct waveguide (SIW: Substrate Integrated Waveguide) serial slot array antenna. However, the scope of the present invention is not limited to the illustrated serial slot array antenna, and various types of antennas, for example, a parallel slot array antenna or a serial / parallel array antenna can be implemented in the same or similar manner, Various types of antennas implemented in this way may also fall within the scope of the present invention.

2 is a plan view of the upper layer 120 of the first dielectric substrate 100 of FIG. 1, and FIG. 3 is a plan view of the upper layer 120 of the first dielectric substrate 100 of FIG. 1, 1 is a plan view of the lower layer 130 of the dielectric substrate 100, and FIG. 4 is an enlarged view of a region where the second slot of FIG. 3 is formed.

Referring to FIGS. 1 to 4, the antenna includes a first dielectric substrate 100 and a second dielectric substrate 200 disposed under the first dielectric substrate 100.

Here, the first dielectric substrate 100 is made of a non-conductive material having a predetermined permittivity Er and a thickness h.

The first dielectric substrate 100 includes a dielectric layer 110, an upper layer 120 disposed over the dielectric layer 110, and a lower layer 130 disposed below the dielectric layer 110.

The dielectric layer 110 may be formed of Teflon.

The upper layer 120 is a metal layer disposed on the dielectric layer 110. The lower layer 130 is a metal layer disposed under the dielectric layer 110.

In other words, the first dielectric substrate 100 including the dielectric layer 110, the upper layer 120, and the lower layer 130 may be a Teflon substrate.

The upper layer 120 includes a ground 122 including a plurality of slots and a feeding part 121 for supplying power. The ground 122 and the feeder 121 may be fabricated using a metal film etching method. Preferably, the ground 122 may be a ground including a slot 1221. The upper layer 120 may further include a plurality of vias 1222 disposed around and surrounding the slots 1221 formed in the ground 122.

The vias 1222 are disposed through the upper layer 120. The vias 1222 are disposed to penetrate the first dielectric substrate 100 including the upper layer 120 and the second dielectric substrate 200 as well as the upper layer 120. [ The one surface of the via 1222 is exposed through the top surface of the first dielectric substrate 100 (the top surface of the top layer 120), and the other surface of the via 1222 is exposed through the second dielectric substrate 200). ≪ / RTI >

The vias 1222 are passages for interlayer electrical connection between the first dielectric substrate 100 and the second dielectric substrate 200 to drill electrically isolated layers to form via holes ), Filling the formed via hole with a conductive material, or plating with a conductive material.

The metal material for forming the vias 1222 may be any one selected from Cu, Ag, Sn, Au, Ni, and Pd. The metal material filling may be performed by electroless plating, electrolytic plating, screen printing Printing, sputtering, evaporation, inkjetting, or dispensing may be used, or a combination thereof may be used.

At this time, the via hole may be formed by any one of mechanical, laser, and chemical processing.

When the via hole is formed by machining, a method such as milling, drilling, and routing can be used. In the case where the via hole is formed by laser machining, UV or Co2 laser method can be used And when it is formed by chemical processing, the first dielectric substrate 100 and the second dielectric substrate 200 can be opened by using a chemical containing aminosilane, ketones, or the like.

On the other hand, the processing by the laser is a cutting method in which a part of a material is melted and evaporated by concentrating optical energy on the surface to take a desired shape, and complicated formation by a computer program can be easily processed. Difficult composite materials can be processed.

In addition, the processing by the laser can have a cutting diameter of at least 0.005 mm, and has a wide range of thickness that can be processed. As the laser processing drill, YAG (Yttrium Aluminum Garnet) laser, CO2 laser or ultraviolet (UV) laser is preferably used. YAG laser is a laser capable of processing both the copper foil layer and the insulating layer, and the CO2 laser is a laser capable of processing only the insulating layer.

The vias 1222 may have a predetermined diameter and may be spaced apart from each other by a predetermined distance. At this time, the diameter of each of the plurality of vias 1222 may be 300 占 퐉, and the distance between the plurality of vias 1222 may be 300 占 퐉.

On the other hand, the ground 122 is not disposed in the entire area of the upper surface of the dielectric layer 110, but may be disposed in only a part of the area. That is, the ground 122 may have a shape of a * b length on the upper surface of the dielectric layer 110. At this time, the size of the ground 122 is smaller than the size of the upper surface of the dielectric layer 110.

A feed part 121 is disposed on the dielectric layer 110. The power feeder 121 may be formed using the upper layer 120 in the same manner as the ground 122. The power feeder 121 connects a communication element (not shown) and the ground 122 of the upper layer 120. Preferably, the feeder 121 transmits a signal transmitted through the communication element to the ground 122.

To this end, the feeder 121 may include a signal transmission line 1211 having a generally used microstrip line structure.

At this time, a depression 1223 depressed inward of the ground 122 is formed at one end of the ground 122, and a first region of the feeder 121 is connected to the recess 122 of the ground 122, (1223).

Here, the width of the depression 1223 is larger than the line width of the signal transmission line 1211. Therefore, the first region of the signal transmission line 1211 is inserted into the depression 1223 without contacting the ground 122.

In other words, the upper surface of the lower dielectric layer 110 is exposed by the depression 1223 between the ground 122 and the first region of the signal transmission line 1211. That is, the dielectric layer 110 may be disposed around the lower portion of the first region of the signal transmission line 1211.

That is, in the present invention, the dielectric layer 110 is disposed so as to surround the lower portion of the first region of the signal transmission line 1211, thereby reducing loss of signal transmitted through the periphery of the first region Minimize it.

The lower layer 130 is disposed on the lower surface of the dielectric layer 110.

The lower layer 130 is electrically connected to the upper layer 120 via the vias 1222. Preferably, the bottom layer 130 is electrically connected to the ground 122 of the top layer 120 via the vias 1222.

A plurality of slots are formed in the lower layer 130. At this time, the plurality of slots are formed in the overlapped region R1 which vertically overlaps with the ground 122 disposed on the dielectric layer 110 among the lower layers 130. [

That is, the second slot 132 is formed in the overlap region R1 of the lower layer 130 at a predetermined distance from the first slot 131 and the first slot 131.

The first slot 131 exposes at least a portion of the lower surface of the dielectric layer 110 which is vertically overlapped with the ground 122. At this time, the first slot 131 is vertically overlapped with the air layer C formed on the second dielectric substrate 200. The air layer (C) may be referred to as a gap, and is a passage through which the signal is transmitted. Clearly, the air layer C may be referred to as an air cavity.

 The lower surface of the dielectric layer 110 exposed through the first slot 131 is disposed in the air layer C of the second dielectric substrate 200.

The first slot 131 may have a "□" shape and may have a size smaller than that of the air layer C formed on the second dielectric substrate 200.

The second slot 132 is formed on the lower layer 130 at a predetermined distance from the first slot 131. The second slot 132 is disposed in the overlap area.

Preferably, at least a portion of the second slot 132 is formed in a region that overlaps the first region of the signal transmission line 1211 vertically.

In other words, the second slot 132 includes a first portion 1321 having a shape of a rectangle and a second portion 1321 formed at one end of the first portion 1321 in a direction perpendicular to the first portion 132 132 and a third portion 1323 formed at the other end of the first portion 132 in a direction perpendicular to the first portion 132 and parallel to the second portion 132.

That is, the combination shape of the first portion 1321, the second portion 1322, and the third portion 1323 of the second slot 132 has a U-shape.

The second slot 132 has a U-shape as described above, and is formed to overlap at least a part with the signal transmission line 1211 in the vertical direction. Accordingly, in the present invention, in the signal waveguide structure having the air layer C, the feeding part 121 and the upper layer 120 of the first dielectric substrate 100 can be connected without insertion loss.

The relationship between the second slot and the signal transmission line 1211 will be described in more detail with reference to FIG.

The second slot 132 is vertically overlapped with the first portion 1321 of the signal transmission line 1211. Preferably, at least a portion of the first portion 1321 of the second slot 132 is located in a region that overlaps the first region vertically. At this time, the left-right width of the first portion 1321 is larger than the left-right width of the first region of the signal transmission line 1211.

Therefore, the first portion 1321 includes a portion overlapping with the first region of the signal transmission line 1211 in the vertical direction, and a portion not overlapping with the signal transmission line 1211, respectively.

The second portion 1322 is bent in a vertical direction at one end of the first portion 1321. The second portion 1322 is vertically bent at one end of the first portion 1321 toward the direction in which the first slot 131 is formed.

The third portion 1323 is bent and arranged in the vertical direction at the other end of the first portion 1321. The third portion 1323 is vertically bent at the other end of the first portion 1321 toward the direction in which the first slot 131 is formed.

Meanwhile, the first region of the signal transmission line 1211 includes a region overlapping with the first portion 1321 of the second slot 132 in the vertical direction, and in addition to the overlap region, And is disposed so as to protrude into a region between the second portion 1322 and the third portion 1323 in the vertical direction.

At this time, the end of the first region of the signal transmission line 1211 is disposed in the region between the second portion 1322 and the third portion 1323 in the vertical direction. That is, a large difference in insertion loss occurs depending on the positional relationship between the second slot 132 and the signal transmission line 1211 in the vertical direction.

5 is a diagram showing a comparison structure with an embodiment of the present invention.

As described above, in the present invention, the end of the first region of the signal transmission line 1211 is disposed in the region between the second portion 1322 and the third portion 1323 in the vertical direction.

5 (A), the end of the first region of the signal transmission line 1211 is located within the region between the second portion 1322 and the third portion 1323 in the vertical direction But may be disposed only on the first portion 1311 without being disposed. This means that the length of the first region of the signal transmission line 1211 is shorter than that of the embodiment of the present invention.

5B, the end of the first region of the signal transmission line 1211 is connected to the region between the second portion 1322 and the third portion 1323 in the vertical direction, And may extend to a position outside the area between the second portion 1322 and the third portion 1323. [ This means that the length of the first area of the signal transmission line 1211 is longer than that of the embodiment of the present invention.

6 is a graph showing the insertion loss of the structure of the embodiment of the present invention and the comparative structure.

In the graph of Fig. 6, A shows the insertion loss caused by the structure of Fig. 5 (A), B shows the insertion loss caused by the structure of Fig. 5 (B) The insertion loss caused by the structure of the embodiment of the present invention is shown.

As shown in FIG. 6, in the frequency band of 76.5 GHz, the A structure showed an insertion loss of 0.91 dB, and the B structure showed an insertion loss of 0.84 dB. It was confirmed that the insertion loss of 0.13 dB is clearly distinguished from the A and B structures.

Meanwhile, a second dielectric substrate 200 is disposed under the first dielectric substrate 100. The second dielectric substrate 200 is a waveguide that transmits a millimeter wave signal transmitted from the first dielectric substrate 100.

In other words, the second dielectric substrate 200 receives the signal from the first dielectric substrate 100 and transmits the signal through the internal air layer C. At this time, the signal is generated by the dielectric constant of Teflon of the dielectric layer 110 and the permittivity (Er = 1) of the air layer C of the second dielectric substrate 200 to the air layer C ).

The second dielectric substrate 200 includes a first dielectric layer 210, a first metal layer 220 disposed on the first dielectric layer 210, and a second metal layer 220 disposed on the first metal layer 220. A second metal layer 240 disposed on the first adhesive layer 230; a second insulating layer 250 disposed on the second metal layer 240; A third metal layer 260 disposed on the first metal layer 250 and a second adhesive layer 270 disposed on the third metal layer 260.

The first adhesive layer 230 may be a prepreg and includes a first insulating layer 210 on the upper surface of which the first metal layer 220 is disposed and a second insulating layer 210 on the lower surface of which the second metal layer 240 is disposed. To provide an adhesive force between the layers 220 so that they can be coupled to each other.

The second adhesive layer 270 may provide an adhesive force between the second dielectric layer 250 on which the third metal layer 260 is disposed and the first dielectric substrate 100 to be coupled to each other.

The first insulating layer 210 and the second insulating layer 250 are formed to secure the air layer C having a predetermined thickness. At this time, if the thickness of the air layer (C) can be secured by one insulating layer, the insulating layer may be formed as one layer instead of two layers as in the present invention. In addition, the insulating layer may be formed of not only two layers but also three or more layers as in the present invention.

The first insulating layer 210 and the second insulating layer 250 may be formed using epoxy, duroid, bakelite, high resistance silicon, glass, alumina, LTCC and air form. Preferably FR-4, which is relatively inexpensive.

The first metal layer 220, the second metal layer 240, and the third metal layer 260 include a circuit pattern serving as a wiring between the respective layers.

Meanwhile, the second adhesive layer 270, the third metal layer 260, the second insulating layer 250, the second metal layer 240, and the first adhesive layer 230 are formed in the second dielectric substrate 200, An air layer C penetrating therethrough is formed.

The air layer C is disposed in a region vertically overlapping with the ground 122 formed on the first dielectric substrate 100. Preferably, the position of the air layer C may be determined by the position of the vias 1222 constituting the ground 122.

The air layer C is formed at a position vertically overlapping with an inner region enclosed by the vias 1222. Accordingly, the vias 1222 are disposed through the second dielectric substrate 200. Since the air layer C is disposed in the inner region of the vias 1222, the vias 1222 and the air layer C are spaced apart from each other in the second dielectric substrate 200 by a predetermined distance.

The thickness of the air layer (C) is preferably larger than the thickness of the first dielectric substrate (100), preferably, the thickness of the dielectric layer (110).

According to the embodiment of the present invention, the characteristics of the air layer waveguide and the dielectric constant characteristics are combined with each other, so that the signal loss due to the transmission of the millimeter wave to the air layer having a relatively higher thickness than that of the Teflon with a low thickness can be minimized, By implementing the pattern (other than the slot type), the fabrication easiness of the millimeter wave antenna can be improved.

In addition, according to the embodiment of the present invention, not only a structure capable of implementing SIW using a low-thickness Teflon but also an air layer capable of minimizing transmission loss can improve the product reliability.

According to the embodiment of the present invention, the signal is transmitted by the effective permittivity of coupling the permittivity (Er) by the Teflon and the permittivity (Er = 1) of the air layer, .

In addition, according to the embodiment of the present invention, since the signal is transmitted to the waveguide mode (Transverse Electric 10), the energy loss due to the air layer is relatively low compared to the loss coefficient (Df) of the medium of Teflon Lt; / RTI >

In addition, according to the embodiment of the present invention, by embodying the pattern using the upper layer of Teflon, it is possible to overcome the disadvantage of the antenna design having the structure including only the air layer, thereby reducing the difficulty have.

Also, in the present invention, by designing the transmission line for connection between the upper layer of Teflon and the communication element, the insertion loss can be minimized.

7 is a diagram illustrating signal characteristics according to an embodiment of the present invention.

Referring to FIG. 7, the ratio of the input signal to the reflected signal according to the embodiment of the present invention is -21.47 dB at 76.50 GHz, which indicates that the signal loss is minimized.

8 is a view showing radiation characteristics of an antenna according to an embodiment of the present invention.

As shown in FIG. 8, it was confirmed that a signal gain of 13.2925 dB was formed at a frequency of 76.5 GHz based on a curve of 0 degree, and a signal gain of 12.4109 dB was formed at a frequency of 76.5 GHz based on a curve of 90 degrees .

9 is a diagram illustrating signal loss in an antenna according to an embodiment of the present invention.

As shown in Fig. 9, it was confirmed that the signal loss of the antenna structure including the air layer C of the present invention at a frequency of 76.5 GHz is 0.17 dB.

10 is a diagram showing signal loss for a comparison structure with an antenna of the present invention.

FIG. 10A shows the signal loss in the case of implementing the SIW antenna using only the general Teflon layer, and FIG. 10B shows the signal loss in the conventional micro-strip line.

As shown in FIG. 10A, a signal loss of 0.72 dB occurs when the SIW antenna is implemented using only a general Teflon layer, and a signal loss of 1.08 dB is generated in the conventional micro-strip line, as shown in FIG. I can confirm that it appears.

11 to 15 are views showing various embodiments of the slot according to the embodiment of the present invention.

11 is a typical and widely used waveguide array antenna structure, in which a slot array antenna that is equivalent to a parallel connection is illustrated.

Here, all the radiating slots 301 to 404 have a length and an offset corresponding to resonance, and have various parallel susceptances depending on offset distances away from the center of the waveguide.

In addition, each radiating slot is arranged at a distance of a half wavelength (? G / 2) of the guide wavelength, and the phase of the electric field vector induced in each radiating slot is the same, can do.

12 is a diagram illustrating a serial slot array antenna structure having a crossover angle in the context of the present invention.

The single radiating slot in Fig. 12 has a length corresponding to the resonance and has various series resistances depending on the rotation angle.

Here, each of the radiating slots 401 to 404 is disposed at a half wavelength distance from the waveguide tube guide wavelength.

Fig. 13 is a diagram for explaining a serial slot array antenna structure having the same rotation angle, in the context of the present invention.

The single radiating slot in Fig. 13 has a length corresponding to the resonance and has various series resistances according to the rotation angle.

Here, each of the radiating slots 501 to 502 is spaced apart by a wavelength of the wavelength in the waveguide tube, and all the radiating slots have the same overall phase information.

Therefore, the directions of the electric field vectors induced in the respective radiation slots 501 to 502 are the same, so that linearly polarized waves with high purity can be generated.

FIG. 14 is a diagram illustrating a traveling-wave serial slot array antenna structure according to the present invention.

The traveling wave serial slot array antenna of Fig. 14 has a structure in which the intervals between the radial slots are not constant but have different intervals.

In addition, the progressive wave array antennas 601 to 604 of FIG. 14 are terminated at the last slot 404, that is, at the slot array end, by the characteristic impedance load of the waveguide.

15 is a diagram illustrating a slot pair serial slot array antenna structure according to the present invention.

The radar antenna of Fig. 15 is an antenna structure in which two radiating slots form one pair and are arranged in series.

In the radar antenna shown in FIG. 15, the spacing between the radiating slots 701 to 702 and 703 to 704 is very narrow, so mutual coupling impedance must be taken into consideration. Only through the iterative calculation, Its design is very tricky.

16 is a view showing the structure of an antenna according to a second embodiment of the present invention.

Referring to FIG. 16, the antenna includes a first dielectric substrate 100 and a second dielectric substrate 200 disposed under the first dielectric substrate 100.

Here, the first dielectric substrate 100 is made of a non-conductive material having a predetermined permittivity Er and a thickness h. The first dielectric substrate 100 includes a dielectric layer 110, an upper layer 120 disposed over the dielectric layer 110, and a lower layer 130 disposed below the dielectric layer 110.

The dielectric layer 110 may be formed of Teflon. The upper layer 120 is a metal layer disposed on the dielectric layer 110. The lower layer 130 is a metal layer disposed under the dielectric layer 110.

In other words, the first dielectric substrate 100 including the dielectric layer 110, the upper layer 120, and the lower layer 130 may be a Teflon substrate.

The vias 1222 are disposed through the upper layer 120. The vias 1222 are disposed to penetrate the first dielectric substrate 100 including the upper layer 120 and the second dielectric substrate 200 as well as the upper layer 120. [ The one surface of the via 1222 is exposed through the top surface of the first dielectric substrate 100 (the top surface of the top layer 120), and the other surface of the via 1222 is exposed through the second dielectric substrate 200). ≪ / RTI >

The vias 1222 are passages for interlayer electrical connection between the first dielectric substrate 100 and the second dielectric substrate 200 to drill electrically isolated layers to form via holes ), Filling the formed via hole with a conductive material, or plating with a conductive material.

The metal material for forming the vias 1222 may be any one selected from Cu, Ag, Sn, Au, Ni, and Pd. The metal material filling may be performed by electroless plating, electrolytic plating, screen printing Printing, sputtering, evaporation, inkjetting, or dispensing may be used, or a combination thereof may be used.

On the other hand, the ground 122 is not disposed in the entire area of the upper surface of the dielectric layer 110, but may be disposed in only a part of the area. That is, the ground 122 may have a shape of a * b length on the upper surface of the dielectric layer 110. At this time, the size of the ground 122 is smaller than the size of the upper surface of the dielectric layer 110.

A second dielectric substrate 200 is disposed under the first dielectric substrate 100. The second dielectric substrate 200 is a waveguide that transmits a millimeter wave signal transmitted from the first dielectric substrate 100.

In other words, the second dielectric substrate 200 receives the signal from the first dielectric substrate 100 and transmits the signal through the internal air layer C. At this time, the signal is generated by the dielectric constant of Teflon of the dielectric layer 110 and the permittivity (Er = 1) of the air layer C of the second dielectric substrate 200 to the air layer C ).

The second dielectric substrate 200 includes a first dielectric layer 210, a first metal layer 220 disposed on the first dielectric layer 210, and a second metal layer 220 disposed on the first metal layer 220. A second metal layer 240 disposed on the first adhesive layer 230; a second insulating layer 250 disposed on the second metal layer 240; A third metal layer 260 disposed on the first metal layer 250 and a second adhesive layer 270 disposed on the third metal layer 260.

The first adhesive layer 230 may be a prepreg and includes a first insulating layer 210 on the upper surface of which the first metal layer 220 is disposed and a second insulating layer 210 on the lower surface of which the second metal layer 240 is disposed. To provide an adhesive force between the layers 220 so that they can be coupled to each other.

The second adhesive layer 270 may provide an adhesive force between the second dielectric layer 250 on which the third metal layer 260 is disposed and the first dielectric substrate 100 to be coupled to each other.

The first insulating layer 210 and the second insulating layer 250 are formed to secure the air layer C having a predetermined thickness. At this time, if the thickness of the air layer (C) can be secured by one insulating layer, the insulating layer may be formed as one layer instead of two layers as in the present invention. In addition, the insulating layer may be formed of not only two layers but also three or more layers as in the present invention.

The first insulating layer 210 and the second insulating layer 250 may be formed using epoxy, duroid, bakelite, high resistance silicon, glass, alumina, LTCC and air form. Preferably FR-4, which is relatively inexpensive.

The first metal layer 220, the second metal layer 240, and the third metal layer 260 include a circuit pattern serving as a wiring between the respective layers.

Meanwhile, the second adhesive layer 270, the third metal layer 260, the second insulating layer 250, the second metal layer 240, and the first adhesive layer 230 are formed in the second dielectric substrate 200, An air layer C penetrating therethrough is formed.

The air layer C is disposed in a region vertically overlapping with the ground 122 formed on the first dielectric substrate 100. Preferably, the position of the air layer C may be determined by the position of the vias 1222 constituting the ground 122.

The air layer C is formed at a position vertically overlapping with an inner region enclosed by the vias 1222. Accordingly, the vias 1222 are disposed through the second dielectric substrate 200. Since the air layer C is disposed in the inner region of the vias 1222, the vias 1222 and the air layer C are spaced apart from each other in the second dielectric substrate 200 by a predetermined distance.

In addition, in the antenna of the second embodiment, a barrier layer 290 is further formed in the air layer (C). The blocking layer 290 is formed on the inner wall and the bottom surface of the air layer C so that signal loss to the outside of the air layer C is blocked.

According to the embodiment of the present invention, the characteristics of the air layer waveguide and the dielectric constant characteristics are combined with each other, so that the signal loss due to the transmission of the millimeter wave to the air layer having a relatively higher thickness than that of the Teflon with a low thickness can be minimized, By implementing the pattern (other than the slot type), the fabrication easiness of the millimeter wave antenna can be improved.

In addition, according to the embodiment of the present invention, not only a structure capable of implementing SIW using a low-thickness Teflon but also an air layer capable of minimizing transmission loss can improve the product reliability.

According to the embodiment of the present invention, the signal is transmitted by the effective permittivity of coupling the permittivity (Er) by the Teflon and the permittivity (Er = 1) of the air layer, .

In addition, according to the embodiment of the present invention, since the signal is transmitted to the waveguide mode (Transverse Electric 10), the energy loss due to the air layer is relatively low compared to the loss coefficient (Df) of the medium of Teflon Lt; / RTI >

In addition, according to the embodiment of the present invention, by embodying the pattern using the upper layer of Teflon, it is possible to overcome the disadvantage of the antenna design having the structure including only the air layer, thereby reducing the difficulty have.

Also, in the present invention, by designing the transmission line for connection between the upper layer of Teflon and the communication element, the insertion loss can be minimized.

Claims (12)

A first dielectric substrate; And
And a second dielectric substrate disposed under the first dielectric substrate and having an air layer formed therein,
Wherein the first dielectric substrate comprises:
A dielectric layer,
An upper layer disposed on the dielectric layer, the upper layer including a ground and a feed part formed with at least one radiation slot,
A lower layer disposed below the dielectric layer and in contact with the second dielectric substrate,
And a plurality of vias passing through the first dielectric substrate and the second dielectric substrate and surrounding the radiating slots disposed in the upper layer and the air layer formed in the second dielectric substrate
antenna. The method according to claim 1,
Wherein,
Containing teflon
antenna. The method according to claim 1,
The air-
And at least one radiation slot formed in the ground of the upper layer,
antenna. The method according to claim 1,
Wherein the second dielectric substrate comprises:
A first insulating layer,
A first metal layer disposed on the first insulating layer,
A first adhesive layer disposed on the first metal layer,
A second metal layer disposed on the first adhesive layer,
A second insulating layer disposed on the second metal layer,
A third metal layer disposed on the second insulating layer,
And a second adhesive layer disposed over the third metal layer
antenna. 5. The method of claim 4,
Wherein the first insulating layer and the second insulating layer are made of a single-
FR4,
Wherein the first adhesive layer and the second adhesive layer are formed on the substrate,
Containing prepreg
antenna. 5. The method of claim 4,
The air-
The first metal layer, the second metal layer, the third metal layer, and the second adhesive layer
antenna. The method according to claim 1,
The thickness of the air layer,
The thickness of the dielectric layer
antenna. The method according to claim 1,
At one end of the ground,
A depressed portion into which the first region of the signal transmission line of the feeding part is inserted is formed,
The width of the depression,
The width of the first region of the signal transmission line is larger than the width of the first region of the signal transmission line,
Wherein the first region of the signal transmission line comprises:
Contact with the ground
antenna. 9. The method of claim 8,
The lower layer comprises:
A first slot formed in a region vertically overlapping with the air layer,
And a second slot formed at a region spaced apart from the first slot by a predetermined distance and vertically overlapping with the first region of the signal transmission line
antenna. 10. The method of claim 9,
The second slot
A first portion formed in a region overlapping with the first region in a vertical direction,
A second portion bent perpendicularly from one end of the first portion toward the first slot,
And a third portion bent perpendicularly from the other end of the first portion toward the first slot
antenna. 11. The method of claim 10,
Wherein the first region of the signal transmission line comprises:
And at least a portion protruding from the first portion of the second slot in the vertical direction is disposed between the second portion and the third portion
antenna. 12. The method of claim 11,
The end of the first region
Within the vertical direction, between the one end and the other end of each of the second portion and the third portion
antenna.

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