KR20180117561A - Fingerprint sensor package - Google Patents

Abstract

One embodiment of the present invention provides a fingerprint sensor package. The fingerprint sensor package includes: a base substrate; a sensor part provided on the base substrate and sensing a fingerprint; a counterfeit fingerprint sensing part disposed adjacent to the sensor part and having an antenna part and an electrode part for sensing whether a subject is a counterfeit fingerprint; and a molding part for covering the sensor part and the counterfeit fingerprint sensing part.

Description

Fingerprint sensor package {FINGERPRINT SENSOR PACKAGE}

FIELD OF THE INVENTION The present invention relates to a fingerprint sensor package, and more particularly to a fingerprint sensor package configured to discriminate a counterfeit fingerprint.

Recently, as security problems have arisen, security for personal mobile devices such as smart phones and tablet PCs is becoming more important. For example, when a user purchases an item in an electronic commerce using a mobile device, payment processing for the item is performed through user authentication. Various kinds of biometric information such as fingerprints, irises, facial expressions, voices and blood vessels are used for such user authentication.

Among the biometric information authentication technologies, fingerprint authentication technology is widely used in mobile devices, and fingerprint sensors are widely used in mobile lock / unlock, personal information security, and financial transactions.

However, recently, when a fingerprint of another person is copied to a specific material and used for fingerprint authentication, there is a problem that the fingerprint sensor can not distinguish the fingerprint from the biometric fingerprint. That is, when a fingerprint authentication is performed by attaching a forged fingerprint made by using a material such as silicon-graphite or poly-vinyl, the fingerprint recognition sensor discriminates the forged fingerprint There is a problem that can not be done.

In other words, it is possible to make the above-mentioned counterfeit fingerprint similar to the electrical characteristics and the optical characteristics of a human hand, so that when the counterfeit fingerprint is thinned and the fingerprint authentication is performed while being attached to the finger of a person, I will not be able to do it.

To solve such a problem, a counterfeit fingerprint discrimination device must be separately installed in a mobile device, but it is difficult to install a counterfeit fingerprint discrimination device on a mobile device due to the ultra-thin structure of a mobile device.

Accordingly, it is urgent to develop a fingerprint sensor package having a forgery fingerprint discriminating device capable of distinguishing a forged fingerprint attached to a finger, which is applicable to a mobile device with a small size and has a fast response speed.

Prior Art 1: Korean Patent Registration No. 10-1436786 (Aug.

SUMMARY OF THE INVENTION The present invention provides a fingerprint sensor package for discriminating a counterfeit fingerprint.

According to an aspect of the present invention, there is provided a semiconductor device comprising: a base substrate; A sensor unit provided on the base substrate and sensing a fingerprint; A counterfeit fingerprint sensing unit disposed adjacent to the sensor unit and having an antenna unit and an electrode unit for sensing whether the subject is a counterfeit fingerprint; And a molding unit covering the sensor unit and the counterfeit fingerprint sensing unit.

In one embodiment of the present invention, the apparatus may further include a forgery fingerprint determination unit that determines whether the subject is a counterfeit fingerprint based on the feedback signal received from the counterfeit fingerprint sensing unit.

In one embodiment of the present invention, the base substrate may have a groove or a hole into which the antenna unit is inserted.

In one embodiment of the present invention, a groove is formed in the base substrate, and the antenna unit may be connected to a connect pad provided on an upper surface of the base substrate.

In one embodiment of the present invention, a hole is formed in the base substrate, and the antenna unit may be connected to a land portion or a main substrate provided on a lower surface of the base substrate.

In one embodiment of the present invention, holes formed in the base substrate may be formed through the molding portion.

In one embodiment of the present invention, the forgery fingerprint sensing unit includes an antenna unit for generating an RF signal; And an electrode unit disposed adjacent to the antenna unit and having a first electrode and a second electrode electrically connected to the antenna unit.

In an embodiment of the present invention, the conductive member may be further provided on the first electrode and the second electrode, and the upper surface of the conductive member may be exposed to the outside of the molding unit.

One embodiment of the present invention is a semiconductor device comprising: a base substrate; A sensor unit provided on the base substrate and sensing a fingerprint; A counterfeit fingerprint sensing unit disposed adjacent to the sensor unit and including an antenna module having an antenna unit for sensing whether the subject is a counterfeit fingerprint; And a molding unit covering the sensor unit and the counterfeit fingerprint sensing unit.

In one embodiment of the present invention, the apparatus may further include a forgery fingerprint determination unit that determines whether the subject is a counterfeit fingerprint based on the feedback signal received from the counterfeit fingerprint sensing unit.

In one embodiment of the present invention, the base substrate may be formed with a groove or a hole into which the antenna module is inserted.

In one embodiment of the present invention, the antenna module includes: a module substrate on which the antenna insertion holes and the via holes are formed; An antenna unit inserted into the antenna insertion hole; A conductive material provided in the via hole; A first metal pad provided on an upper surface of the module substrate and connecting the antenna portion and an upper portion of the conductive material; And a second metal pad connected to a lower portion of the conductive material.

In one embodiment of the present invention, a shield portion may be provided on the inner surface of the antenna insertion hole.

According to an embodiment of the present invention, the antenna module further includes an encapsulant provided at an upper portion of the antenna module.

In one embodiment of the present invention, the fake fingerprint determination unit can determine whether the fingerprint is fingerprinted on the subject from the contact impedance obtained according to the contact of the subject and the reference impedance.

In one embodiment of the present invention, the fake fingerprint determination unit may determine whether the fingerprint is fingerprinted on the subject from the contact impedance and the inherent impedance obtained according to the contact of the subject.

In one embodiment of the present invention, the fake fingerprint determination unit may determine whether a fingerprint is fingerprinted on the object from the contact resonance frequency obtained according to the contact of the subject and the reference resonance frequency.

In one embodiment of the present invention, the fake fingerprint determination unit can determine whether the fingerprint is fingerprinted on the subject from the contact resonance frequency and the natural resonance frequency obtained according to the contact of the subject.

In one embodiment of the present invention, the fake fingerprint determination unit may determine whether the fingerprint is fingerprinted on the subject through the capacitance of the electrode unit obtained in accordance with the contact of the subject.

In one embodiment of the present invention, the feedback signal may be one or more of an external feature, a magnetic feature, and an electrical feature of the subject.

In one embodiment of the present invention, the antenna unit may be a coil.

According to an embodiment of the present invention, a protective layer may be further provided on the molding part.

In one embodiment of the present invention, the capacity of the antenna unit may be in the range of 1 to 100 uH.

In one embodiment of the present invention, the intrinsic resonance frequency of the forgery fingerprint sensing unit may be in the range of 5 to 100 MHz.

In one embodiment of the present invention, the frequency of the AC signal of the fake fingerprint sensing unit may be in the range of 1 to 110 MHz.

In an embodiment of the present invention, the distance between the upper surface of the antenna portion and the upper surface of the protective layer may be within 10 μm to 2 mm.

Effects of the fingerprint sensor package according to the present invention described above will be described below.

According to the present invention, the fingerprint sensor package includes an antenna unit and an electrode unit for generating an RF signal, so that the counterfeit fingerprint determination unit can more accurately and quickly discriminate whether the fingerprint is true or false during fingerprint authentication.

According to the present invention, the antenna portion is inserted into the hole or groove formed in the base substrate, so that the thickness of the fingerprint sensor package can be minimized. That is, the fingerprint sensor package can be made compact.

According to the present invention, since the antenna module having the antenna portion forms a modular form rather than a device, it is easy to manufacture the fingerprint sensor package.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a schematic perspective view of a fingerprint sensor package according to a first embodiment of the present invention.
2 is an exemplary view of a fingerprint sensor package according to a first embodiment of the present invention.
3 is a bottom view of the fingerprint sensor package according to the first embodiment of the present invention.
4 is an exemplary view showing a manufacturing process of the fingerprint sensor package according to the first embodiment of the present invention.
5 is an exemplary view of a fingerprint sensor package according to a second embodiment of the present invention.
6 is an exemplary view showing a manufacturing process of a fingerprint sensor package according to a second embodiment of the present invention.
7 is an exemplary view of a fingerprint sensor package according to a third embodiment of the present invention.
8 is an exemplary view showing a manufacturing process of the fingerprint sensor package according to the third embodiment of the present invention.
9 is an exemplary view of a fingerprint sensor package according to a fourth embodiment of the present invention.
10 is an exemplary view showing an antenna module of the present invention.
11 is an exemplary view showing a manufacturing process of a fingerprint sensor package according to a fourth embodiment of the present invention.
12 is an exemplary view of a fingerprint sensor package according to a fifth embodiment of the present invention.
13 is an exemplary view showing a state where a subject is in contact with the fingerprint sensor package of the present invention.
FIG. 14 is a graph showing the results of the fake fingerprint determination unit of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

In addition, since the sizes and thicknesses of the respective components shown in the drawings are arbitrarily shown for convenience of explanation, the present invention is not necessarily limited to those shown in the drawings.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when a part is referred to as "comprising ", it means that it can include other components as well, without excluding other components unless specifically stated otherwise.

In the present invention, the upper part and the lower part mean that they are located above or below the object member, and does not necessarily mean that they are located at the upper or lower part with respect to the gravity direction.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic perspective view of a fingerprint sensor package according to a first embodiment of the present invention, FIG. 2 is an illustration of a fingerprint sensor package according to a first embodiment of the present invention, and FIG. FIG. 4 is an exemplary view showing a manufacturing process of the fingerprint sensor package according to the first embodiment of the present invention.

1 to 4, the fingerprint sensor package 1000 includes a base substrate 100, a sensor unit 200, a counterfeit fingerprint sensing unit 300, a molding unit 400, and a counterfeit fingerprint determination unit 500, . ≪ / RTI >

The fingerprint sensor package 1000 includes electronic parts including a sensor unit 200 for sensing a fingerprint. The fingerprint sensor package 1000 may include any device capable of transmitting a driving signal for sensing a fingerprint and receiving a sensing signal from a finger .

The base substrate 100 may be a rigid substrate or a flexible substrate, to which an electrical signal can be applied.

The base substrate 100 may have a hole 101 or a groove into which the antenna unit 310 provided in the forged fingerprint sensing unit 300 is inserted.

As the holes 101 or grooves are formed in the base substrate 100, the alignment of the base substrate 100 and the antenna unit 310 can be performed easily. The thickness of the fingerprint sensor package 1000 can be minimized as the antenna portion 310 is inserted into the hole 101 or the groove of the base substrate 100.

In the first embodiment of the present invention, it is assumed that the holes 101 are formed in the base substrate 100. [

On the other hand, the sensor unit 200 is provided on the base substrate 100. The sensor unit 200 senses a fingerprint of a finger contacting the fingerprint sensor package 1000. The sensor unit 200 may be electrically coupled to the base substrate 100 through a surface mounting technology (SMT) or the like.

Here, the sensor unit 200 may detect fingerprints by any one of various known methods such as a capacitive method, an optical method, and an ultrasonic method. For example, the capacitive sensor unit 200 scans an image of a fingerprint based on a difference in electrostatic capacitance formed between ridges and valleys of the fingerprint.

The counterfeit fingerprint sensing unit 300 may include an antenna unit 310 and an electrode unit 320.

The counterfeit fingerprint sensing unit 300 can detect whether or not the subject is a counterfeit fingerprint when the subject touches the fingerprint sensor package 1000 (i.e., when the subject is positioned on the counterfeit fingerprint sensing unit 300) .

The detection of the forged fingerprint may be performed together or continuously when the user scans an image of the fingerprint through the sensor unit 200. For this purpose, Position. That is, the hole 101 into which the antenna unit 301 is inserted may be formed at a position adjacent to the sensor unit 200.

The antenna unit 310 is configured to generate a radio frequency (RF) signal for detecting a counterfeit fingerprint.

The antenna unit 310 may be a coil, but is not limited thereto. Any antenna unit capable of generating an RF signal can be used as the antenna unit 310.

Meanwhile, the electrode unit 320 may be provided at a position adjacent to the antenna unit 310.

The electrode unit 320 includes a first electrode 321 and a second electrode 322. The first electrode 321 and the second electrode 322 are electrically connected to the ends of the antenna unit 310, do.

The first electrode 321 and the second electrode 322 may be electrically connected to the antenna unit 310 through the land 110 provided on the lower surface of the base substrate 100. Accordingly, the electrode unit 320 and the antenna unit 310 can transmit and receive electrical signals with each other.

Here, the land portion 110 is exposed to the outside through an exposure operation of PSR (Photo Solder Resist) applied to the base substrate 100. The thickness t2 of the PSR may be less than 30 占 퐉, for example.

The antenna unit 310 may be electrically connected to the land portion 110 exposed through the bottom surface of the base substrate 100 through an exposure operation. Here, the antenna unit 310 and the land unit 110 are coupled to each other so that the antenna unit 310 is coupled to the land unit 110 without protruding from the bottom surface of the base substrate 100. Therefore, when coupling the base substrate 100 and the main substrate 600 (see FIG. 8), interference due to the antenna unit 310 does not occur.

Meanwhile, the electrode unit 320 may further include a conductive member 323 on the upper portion thereof. That is, the conductive member 323 may be provided on the first electrode 321 and the second electrode 322. At this time, the conductive member 323 may be integrally coupled to the first electrode 321 and the second electrode 322.

The conductive member 323 is electrically connected to the first electrode 321 and the second electrode 322 while protecting the first electrode 321 and the second electrode 322. The conductive member 323 may be made of various conductive materials. For example, the conductive member 323 may be made of a conductive epoxy.

The counterfeit fingerprint sensing unit 300 having the antenna unit 310 and the electrode unit 320 receives the feedback signal reflecting the external features, magnetic characteristics, and electrical characteristics of the subject to the counterfeit fingerprint determination unit 500 A concrete method of this will be described later.

The molding unit 400 covers the sensor unit 200, the antenna unit 310, the electrode unit 320, and the counterfeit fingerprint determination unit 500, and protects the respective components from the outside. The molding part 400 may be made of an epoxy molding compound (EMC), but is not limited thereto.

It is preferable that the molding part 400 has a minimum thickness so that the RF signal sensitivity of the antenna part 310 is not degraded. For example, the molding part 400 may be formed so that the thickness t1 from the upper end of the antenna part 310 to the upper surface of the molding part 400 is less than 100 占 퐉. Further, the molding part 400 may be formed such that the upper part of the antenna part 310 is exposed to the outside.

The upper end of the electrode part 320 may be exposed to the outside of the molding part 400. That is, the molding part 400 covers the various elements provided on the base substrate 100 and the base substrate 100, and may not cover the upper surface of the electrode part 320. When the conductive member 323 is provided on the upper portion of the electrode unit 320, the upper surface of the conductive member 323 is exposed to the outside of the molding unit 400.

Since the electrode unit 320 can be brought into contact with the lower surface of the protective layer 700 provided on the molding unit 400, the capacitance formed between the electrode unit 320 and the finger can be increased have. As the capacitance formed between the electrode unit 320 and the finger increases, the first capacitance formed in the first electrode 321 and the second electrode 322 included in the electrode unit 320, 2 Capacitance can more accurately reflect the external features of the finger.

On the other hand, the fingerprint sensor package 1000 may further include a protection layer 700.

The protective layer 700 is provided on the upper portion of the molding part 400 to embody the color of the fingerprint sensor package 1000 or to reinforce the strength of the fingerprint sensor package 1000. That is, the protective layer 700 may be made of a material having excellent durability and appearance. For example, the protective layer 700 may include at least one of glass, sapphire, zirconium, and transparent resin. When the protective layer 700 is made of glass, various glass substrates such as a soda lime glass substrate, a non-alkali glass substrate, and a tempered glass substrate may be included. As the transparent resin, acrylic or the like may be included.

On the other hand, the counterfeit fingerprint determination unit 500 can apply an AC signal to the counterfeit fingerprint sensing unit 300 and discriminate whether the fingerprint is true or false based on the feedback signal received from the counterfeit fingerprint sensing unit 300 . In this case, the AC signal applied to the counterfeit fingerprint sensing unit 300 may be applied from a separately provided signal source.

The counterfeit fingerprint determination unit 500 may be provided on the base substrate 100 or may be provided on the main substrate 600 coupled to the base substrate 100.

Hereinafter, a method of distinguishing whether the fingerprint is authentic or not will be described in detail with reference to the counterfeit fingerprint detection unit 300 and the counterfeit fingerprint detection unit 500.

When a finger contacts the fingerprint sensor package 1000, a capacitance may be formed between the electrode part 320 and the finger. Specifically, a first electrostatic capacitance may be formed between the first electrode 321 and the finger, and a second electrostatic capacitance may be formed between the second electrode 322 and the finger.

If the finger is simultaneously covering the first electrode 321 and the second electrode 322, the first electrostatic capacitance and the second electrostatic capacitance may be electrically connected to each other with the finger therebetween. At this time, The antenna unit 310 and the electrode unit 320 included in the antenna 300 form a closed circuit together with the fingers. Such a closed loop may be a resonant circuit having a specific resonant frequency.

Hereinafter, a closed circuit formed as described above will be referred to as a contact closed circuit by contacting any subject to the fingerprint sensor package 1000. The closed circuit formed by the fake fingerprint sensing unit 300 in a state in which no subject is in contact with the fingerprint sensor package 1000 will be referred to as a non-contact closed circuit.

Specifically, the contact closed circuit may be a circuit including a first capacitance, a second capacitance, an inductance of the antenna portion 310, and an impedance of a finger.

If the values of the constituent elements constituting the contact closed circuit are different from each other when the biometric fingerprint is brought into contact with the fingerprint sensor package 1000 and when the subject other than the biometric fingerprint is in contact with the fingerprint sensor package 1000, ) Can distinguish the authenticity of the fingerprint.

On the other hand, the first electrostatic capacity and the second electrostatic capacity included in the contact closed circuit may be values reflecting the external features of the subject in contact with the fingerprint sensor package 1000.

Specifically, when the subject is a finger, the electrostatic capacity formed between the electrode unit 320 and the finger has a small value at the portion where the finger's bone is located and a large value at the portion where the finger is located. For example, if both the bone and the acid are located on the first electrode 321, the first capacitance may be the capacitance of the portion where the bone is located and the capacitance of the portion where the acid is located.

If a subject such as a fingerprint is contacted with the fingerprint sensor package 1000, the first electrostatic capacity and the second electrostatic capacity formed on the first electrode 321 and the second electrode 322, respectively, The fingerprint sensor package 1000 has a different value from that when the finger formed is in contact with the fingerprint sensor package 1000. [

In addition, even when a subject having a bone and an acid, such as a fingerprint, is contacted with the fingerprint sensor package 1000, the first electrode 321 and the second electrode 322, when the distribution ratio of the bone and the acid is different from that of the living body fingerprint, The first electrostatic capacitance and the second electrostatic capacitance formed in each of them have different values from the biometric fingerprint.

With this principle, the first electrostatic capacitance and the second electrostatic capacitance value can reflect the external features of the subject. Since the feedback signal transmitted from the counterfeit fingerprint sensing unit 300 to the counterfeit fingerprint sensing unit 500 is a signal reflecting the first electrostatic capacitance and the second electrostatic capacitance, The external feature of the subject can be grasped based on the feedback signal received from the controller 300.

Meanwhile, the antenna unit 310 may generate an RF signal for detecting a counterfeit fingerprint. The RF signal may be formed in a predetermined region according to the frequency of the AC power applied from the counterfeit fingerprint determining unit 500 to the counterfeit fingerprint sensing unit 300. At this time, the RF signal may be a magnetic field formed in an area around the antenna unit 310.

At this time, when the subject in contact with the fingerprint sensor package 1000 is in the conductive state, an eddy current is generated to a certain depth from the surface of the subject by the RF signal generated by the antenna unit 310.

This eddy current can again generate another magnetic field from the inside of the subject to the antenna portion 310 by electromagnetic induction. At this time, the direction of the magnetic field generated in the subject will be formed in a direction opposite to the magnetic field formed by the antenna unit 310. The object magnetic field in the reverse direction offsets the magnetic field formed by the antenna unit 310.

The inductance L, the impedance Z and the counter electromotive force V of the contact closed circuit formed by the subject in contact with the counterfeit fingerprint sensing unit 300 and the fingerprint sensor package 1000 are changed.

Since the intensity of the eddy current and the backward object magnetic field generated here vary depending on the type of the subject, the biometric fingerprint and the counterfeit fingerprint have different values of inductance, impedance, and counter electromotive force.

This difference is reflected in the feedback signal provided by the counterfeit fingerprint sensing unit 300 to the counterfeit fingerprint sensing unit 500 so that the counterfeit fingerprint sensing unit 500 receives feedback from the counterfeit fingerprint sensing unit 300 The magnetic characteristics of the subject can be grasped based on the signal.

Meanwhile, in order to obtain different eddy currents and reverse subject magnetic fields depending on the type of the subject, RF signals generated from the antenna unit 310 must be applied to the subject at a proper ratio.

For example, in order to obtain an eddy current and a reverse subject magnetic field depending on the type of a subject, a thin forged fingerprint having a thickness of about 500 mu m is put on a finger and contacted with the fingerprint sensor package 1000, It is preferable that the majority of the RF signal is concentrated within the area where the forgery fingerprint is located, that is, within 500 mu m. For this, the distance between the upper part of the antenna part 310 and the upper surface of the protective layer 700 may be within 10 μm to 2 mm.

At this time, the penetration depth of the RF signal generated from the antenna unit 310 may vary according to the frequency of the AC signal applied to the antenna unit 310.

Further, in order to generate the eddy current and the backward subject magnetic field having an intensity enough to distinguish the type of the subject, an RF signal of an appropriate density or more must be generated in the area where the forged fingerprint is located. In order to satisfy such a condition, the antenna unit 310 may have a capacity of 1 to 100 uH.

Also, when the capacitance of the antenna unit 310 is in the range of 1 to 100 uH, the intrinsic resonance frequency of the counterfeit fingerprint sensing unit 300 can be set within a range of 5 to 100 MHz. Thus, the RF signal can be formed in a concentrated manner in the area where the counterfeit fingerprint is located.

On the other hand, the feedback signal provided by the fake fingerprint sensing unit 300 to the fake fingerprint determination unit 500 may be a signal including electrical characteristics of the subject. This is because the first electrostatic capacity and the second electrostatic capacity formed on the first electrode 321 and the second electrode 322 are electrically connected to each other with the object therebetween.

With this principle, the feedback signal provided by the fake fingerprint sensing unit 300 to the fake fingerprint determination unit 500 may be a signal reflecting all of the external features, magnetic characteristics, and electrical characteristics of the subject. If any of the external features, magnetic characteristics, and electrical characteristics of the subject is different from the biometric fingerprint, a difference occurs in the feedback signal.

Therefore, the counterfeit fingerprint determining unit 500 can determine whether or not the subject in contact with the fingerprint sensor package 1000 is a biometric fingerprint based on the received feedback signal.

Hereinafter, a method for determining whether a biometric fingerprint of a contacted object based on a feedback signal received from the counterfeit fingerprint sensing unit 300 by the counterfeit fingerprint determination unit 500 will be described.

The counterfeit fingerprint determination unit 500 may apply an AC signal including at least one frequency to the counterfeit fingerprint sensing unit 300. [ For example, the AC signal may be a frequency-variable signal whose frequency varies with time, and the counterfeit fingerprint determination unit 500 may apply the AC signal to the counterfeit fingerprint sensing unit 300 for a predetermined period of time. When the capacitance of the antenna unit 310 is in the range of 1 to 100 uH and the intrinsic resonance frequency of the counterfeit fingerprint sensing unit 300 is set in the range of 5 to 100 MHz as described above, To 110 MHz.

On the other hand, the feedback signal means a signal generated by passing the AC signal applied by the counterfeit fingerprint determining unit 500 through the counterfeit fingerprint sensing unit 300, that is, the contact closing circuit or the non-contact closing circuit. Also, when the AC signal applied to the counterfeit fingerprint sensing unit 300 is a signal whose frequency varies with time, the feedback signal also changes with time.

Accordingly, the counterfeit fingerprint determination unit 500 may apply the frequency variable AC signal to the counterfeit fingerprint sensing unit 300 for a predetermined time, and receive a response signal therefrom as a feedback signal. This feedback signal may be a signal indicative of an impedance characteristic varying according to the frequency applied to the contact closed loop or the non-contact closed loop.

On the other hand, the counterfeit fingerprint determination unit 500 receives a feedback signal in a state where the subject is in contact with the fingerprint sensor package 1000 to form a contact closed loop, and the subject is contacted with the fingerprint sensor package 1000 The resonance frequency and the impedance value at the resonance frequency can be obtained.

In addition, the counterfeit fingerprint determination unit 500 receives a feedback signal in a state where the biometric fingerprint is in contact with the fingerprint sensor package 1000 to form a contact closed loop, and the biometric fingerprint is read from the fingerprint sensor package 1000, The resonance frequency and the impedance at the resonance frequency can be obtained.

Hereinafter, the resonance frequency when the subject is in contact with the fingerprint sensor package 1000 is referred to as a contact resonance frequency, and the impedance value obtained at the contact resonance frequency will be referred to as a contact impedance. In addition, the resonance frequency when the biometric fingerprint is brought into contact with the fingerprint sensor package 1000 is referred to as a reference resonance frequency, and the impedance value obtained from the reference resonance frequency is referred to as a reference impedance.

The reference resonance frequency and the reference impedance can be obtained at the time of registration of the fingerprint. Since the biometric fingerprint of the registered user will be contacted with the fingerprint sensor package 1000 at the time of registration of the fingerprint, the reference resonance frequency and the reference impedance are values reflecting the external features, electrical characteristics, and magnetic characteristics of the biometric fingerprint possessed by the registered user .

In addition, the reference resonance frequency and the reference impedance may be set to predetermined values at the time of manufacturing the fingerprint sensor package 1000.

On the other hand, the counterfeit fingerprint determining unit 500 can determine whether or not the counterfeit fingerprint is generated by comparing the contact impedance and the reference impedance. For example, when the difference between the contact impedance and the reference impedance deviates from a preset threshold value, the fake fingerprint determination unit 500 can determine the subject as a fake fingerprint.

Further, the counterfeit fingerprint determination unit 500 may determine whether or not the counterfeit fingerprint is generated by comparing the contact resonance frequency and the reference resonance frequency. For example, when the difference between the contact resonance frequency and the reference resonance frequency deviates from a preset threshold value, the counterfeit fingerprint determination unit 500 can determine the subject as a counterfeit fingerprint.

Furthermore, when the counterfeit fingerprint determination unit 500 determines the counterfeit fingerprint, a comparison of the contact resonance frequency and the reference resonance frequency as well as the comparison of the contact impedance and the reference impedance may be performed together. In such a case, the counterfeit fingerprint determining unit 500 can determine whether or not the counterfeit fingerprint is more accurate for the subject.

On the other hand, the counterfeit fingerprint determination unit 500 may determine the counterfeit fingerprint by utilizing the resonance frequency obtained from the non-contact closed circuit in a state where the subject does not touch the fingerprint sensor package 1000, and the impedance at the resonance frequency .

Hereinafter, the resonance frequency obtained in a state where the subject does not contact the fingerprint sensor package 1000 is referred to as a natural resonance frequency, and the impedance obtained at a natural resonance frequency is referred to as an inherent impedance.

For example, the counterfeit fingerprint determination unit 500 compares a value obtained by subtracting the intrinsic impedance from the contact impedance with a value obtained by subtracting the intrinsic impedance from the reference impedance. If the comparison result is out of the predetermined threshold, the counterfeit fingerprint determination unit 500 can determine the subject as a counterfeit fingerprint have.

The counterfeit fingerprint determination unit 500 compares the value obtained by subtracting the natural resonance frequency at the contact resonance frequency from the value obtained by subtracting the natural resonance frequency from the reference resonance frequency. If the comparison result is out of the preset threshold value, .

Furthermore, when the counterfeit fingerprint determining section 500 determines the counterfeit fingerprint, the fingerprint fingerprint determining section 500 compares the value obtained by subtracting the intrinsic impedance from the contact impedance and the value obtained by subtracting the intrinsic impedance from the reference impedance, A comparison between a calibrated value and a value obtained by subtracting the inherent resonance frequency at the reference resonance frequency may be made together. In such a case, the counterfeit fingerprint determining unit 500 can determine whether or not the counterfeit fingerprint is more accurate for the subject.

Referring to FIG. 4, the process of manufacturing the fingerprint sensor package 1000 will be described. First, the antenna unit 310 is inserted into the hole 101 formed in the base substrate 100. At this time, the end of the antenna unit 310 is connected to the land portion 110 formed on the lower surface of the base substrate 100 electrically connected to the electrode unit 320.

Next, the electrode unit 320, the sensor unit 200, and the counterfeit fingerprint determination unit 500 are coupled onto the base substrate 100. A method of electrically connecting the electrode unit 320 and the sensor unit 200 to the base substrate 100 may be variously performed. In the present invention, the electrode unit 320 and the sensor unit 200 are electrically connected to the base substrate 100. FIG.

Next, the conductive member 323 is coupled to the upper portion of the first electrode 321 and the second electrode 322. The conductive member 323 protects a part of the wire bonding w that electrically connects the first electrode 321 and the second electrode 322 to the base substrate 100.

Next, the molding unit 400 covers the sensor unit 200, the electrode unit 320, the antenna unit 310, and the counterfeit fingerprint determination unit 500 provided on the base substrate 100. The molding part 400 can be subjected to polishing processing as required. At this time, the conductive member 323 provided at the upper end of the electrode part 320 may be exposed from the molding part 400.

Finally, the protective layer 700 is bonded to the upper portion of the molding part 400.

FIG. 5 is an exemplary view of a fingerprint sensor package according to a second embodiment of the present invention, FIG. 6 is an exemplary view showing a manufacturing process of a fingerprint sensor package according to a second embodiment of the present invention, and FIGS. The configurations denoted by the same reference numerals as those of the reference numerals have the same functions, and a detailed description thereof will be omitted.

Referring to FIGS. 5 and 6, the antenna unit 310 is inserted into the groove 102 formed in the base substrate 100 in the second embodiment.

The fingerprint sensor package 1100 may include a base substrate 100, a sensor unit 200, a counterfeit fingerprint sensing unit 300, a molding unit 400, and a counterfeit fingerprint determination unit 500.

A groove 102 may be formed in the base substrate 100 and an antenna unit 310 may be inserted into the groove 102 formed in the base substrate 100. Thus, the thickness of the fingerprint sensor package 1100 can be minimized. In addition, since the grooves 102 are formed in the base substrate 100, the alignment of the base substrate 100 and the antenna unit 310 can be performed easily.

On the other hand, the sensor unit 200 is provided on the base substrate 100. The sensor unit 200 senses a fingerprint of a finger contacting the fingerprint sensor package 1100.

On the other hand, the fake fingerprint sensing unit 300 can detect whether the subject is a counterfeit fingerprint when the subject touches the fingerprint sensor package 1100. The fake fingerprint sensing unit 300 may be formed at a position adjacent to the sensor unit 200.

The fake fingerprint sensing unit 300 may include an antenna unit 310 and an electrode unit 320.

The antenna unit 310 may be inserted into the groove 102 formed in the base substrate 100. Here, the groove 102 formed in the base substrate 100 may be formed adjacent to the sensor unit 200.

The end of the antenna unit 310 may be electrically connected to the connect pad 120 provided on the base substrate 100. Accordingly, the antenna unit 310 and the base substrate 100 can be electrically connected.

Meanwhile, the electrode unit 320 may be provided at a position adjacent to the antenna unit 310.

The electrode unit 320 includes a first electrode 321 and a second electrode 322. The first electrode 321 and the second electrode 322 are connected to the base substrate 100 through wire bonding w, As shown in FIG. Therefore, the electrode unit 320 coupled to the base substrate 100 and the antenna unit 310 can be electrically connected. A conductive member 323 may be provided on the electrode part 320.

The counterfeit fingerprint determination unit 500 may be provided on the base substrate 100 or may be provided on the main substrate 600 coupled to the base substrate 100. In the second embodiment of the present invention, the counterfeit fingerprint determination unit 500 is provided on the base substrate 100 as an example. A detailed description of the fake fingerprint determining unit 500 will be omitted.

The fingerprint sensor package 1100 may further include a protection layer 700. The protective layer 700 is provided on the upper part of the molding part 400.

Referring to FIG. 6, the antenna unit 310 is inserted into a groove 102 formed in the base substrate 100. Referring to FIG. At this time, the end of the antenna unit 310 is electrically connected to the connect pad 120 provided on the base substrate 100.

Next, the electrode unit 320 and the sensor unit 200 are coupled to the base substrate 100. The electrode unit 320 and the sensor unit 200 may be electrically connected to the base substrate 100 by wire bonding (w).

Next, the conductive member 323 is coupled to the upper portion of the first electrode 321 and the second electrode 322.

Next, the molding unit 400 covers the sensor unit 200, the electrode unit 320, the antenna unit 310, and the counterfeit fingerprint determination unit 500 provided on the base substrate 100. The molding part 400 can be subjected to polishing processing as required. At this time, the conductive member 323 provided at the upper end of the electrode part 320 is exposed from the molding part 400.

Finally, the protective layer 700 is bonded to the upper portion of the molding part 400.

FIG. 7 is an exemplary view of a fingerprint sensor package according to a third embodiment of the present invention, FIG. 8 is an exemplary view showing a manufacturing process of a fingerprint sensor package according to a third embodiment of the present invention, and FIGS. The configurations denoted by the same reference numerals as those of the reference numerals have the same functions, and a detailed description thereof will be omitted.

Referring to FIGS. 7 and 8, the antenna 310 is coupled to the main board 600 in the third embodiment.

The fingerprint sensor package 1200 includes a base substrate 100, a sensor unit 200, a counterfeit fingerprint sensing unit 300, a molding unit 400, a counterfeit fingerprint determination unit 500, and a main substrate 600 .

The fingerprint sensor package 1200 may be combined with the main substrate 600 and the fingerprint sensor module 800 in which the base substrate 100, the sensor unit 200, and the molding unit 400 form one module .

The fingerprint sensor module 800 may include a hole 801 through which the antenna unit 310 is inserted. That is, the holes 801 are formed to communicate with the molding part 400 and the base substrate 100 by avoiding the sensor part 200. Therefore, when the fingerprint sensor module 800 and the main substrate 600 are coupled, the antenna unit 310 coupled to the main substrate 600 can be inserted into the hole 801. [

On the other hand, the forgery fingerprint sensing unit 300 can detect whether the subject is a counterfeit fingerprint when the subject touches the fingerprint sensor package 1200. The fake fingerprint sensing unit 300 may be formed at a position adjacent to the sensor unit 200.

The fake fingerprint sensing unit 300 may include an antenna unit 310 and an electrode unit 320.

The antenna unit 310 may be inserted into the hole 108 formed in the fingerprint sensor module 800. Here, the hole 108 formed in the fingerprint sensor module 800 may be formed adjacent to the sensor unit 200.

Meanwhile, the electrode unit 320 may be provided at a position adjacent to the antenna unit 310.

The electrode unit 320 includes a first electrode 321 and a second electrode 322. The first electrode 321 and the second electrode 322 are connected to the base substrate 100 through wire bonding w, As shown in FIG. Therefore, the electrode unit 320 coupled to the base substrate 100 and the antenna unit 310 can be electrically connected. A conductive member 323 may be provided on the electrode part 320.

The counterfeit fingerprint determination unit 500 may be provided on the base substrate 100 or may be provided on the main substrate 600 coupled to the base substrate 100. A detailed description of the fake fingerprint determining unit 500 will be omitted.

The fingerprint sensor package 1200 may further include a protective layer 700. The protective layer 700 is provided on the upper part of the molding part 400.

8, the base substrate 100, the sensor unit 200, and the molding unit 400 may include a fingerprint sensor module 800, which is in the form of a single module, . In the fingerprint sensor module 800, a hole 801 penetrating the base substrate 100 and the molding part 400 is formed.

Next, the antenna unit 310 is coupled to the main board 600. Here, the main board 600 and the antenna unit 310 can be electrically connected through various methods.

Next, the fingerprint sensor module 800 is coupled to the main board 600. At this time, the fingerprint sensor module 800 and the main board 600 are coupled with each other by aligning the hole 801 formed in the fingerprint sensor module 800 and the antenna 310.

Finally, the protective layer 700 is bonded to the upper portion of the molding part 400.

FIG. 9 is an exemplary view showing a fingerprint sensor package according to a fourth embodiment of the present invention, FIG. 10 is an exemplary view showing an antenna module according to the present invention, and FIG. 11 is a perspective view of a fingerprint sensor package according to a fourth embodiment of the present invention. The constitution referred to by the same reference numerals as those shown in Figs. 1 to 4 has the same function, and a detailed description thereof will be omitted.

9 to 11, the antenna module 900 is inserted into a groove or a hole formed in the base substrate 100 in the fourth embodiment.

The fingerprint sensor package 1300 may include a base substrate 100, a sensor unit 200, a counterfeit fingerprint sensing unit 300 ', a molding unit 400, and a counterfeit fingerprint determination unit 500.

A sensor unit 200 for sensing a fingerprint of a finger contacting the fingerprint sensor package 1300 may be coupled to the base substrate 100. The base substrate 100 may have a groove or hole 103 through which the antenna module 900 provided in the forged fingerprint sensing unit 300 'is inserted.

In the fourth embodiment of the present invention, a hole 103 is formed in the base substrate 100. The hole 103 may be formed adjacent to the sensor unit 200.

The antenna module 900 having the antenna portion 310 is inserted into the hole 103. The antenna module 900 may be electrically connected to the main substrate 600 or the base substrate 100. In the fourth embodiment of the present invention, the antenna module 900 is coupled to the main board 600. [

The antenna module 900 may include a module substrate 910, a first metal pad 920, a second metal pad 930, and a conductive material 940.

Here, the module substrate 910 may have an antenna insertion hole 901 and a via hole 902, and the antenna unit 310 may be inserted into the antenna insertion hole 901. The conductive material 940 may be filled in the via hole 902 or only on the inner surface of the via hole 902. The conductive material 940 electrically connects the first metal pad 920 and the second metal pad 930.

On the other hand, the first metal pad 920 is provided on the upper surface of the module substrate 910. The first metal pad 920 is electrically connected to the upper end of the antenna unit 310 and the upper portion of the conductive material 940.

The second metal pad 930 is provided on the lower surface of the module substrate 910. The second metal pad 930 is electrically connected to the lower portion of the conductive material 940. The second metal pad 930 may be coupled to the main substrate 600. For example, the second metal pad 930 and the main substrate 600 may be electrically connected by surface mount technology (SMT) or the like.

Therefore, the base substrate 100 electrically connected to the main substrate 600 and the antenna module 900 can be electrically connected to each other.

The antenna module 900 may further include an encapsulation part 950 and a shield part 960.

The sealing part 950 may be provided on the upper part of the antenna module 900. The sealing portion 950 covers the module substrate 910, the antenna portion 310, and the first metal pad 920, and protects each configuration from the outside. The sealing portion 950 may be made of the same material as the molding portion 400.

For example, when the antenna module 900 is provided with the sealing portion 950, the upper surface of the molding portion 400 may be formed to have the same height as the upper surface of the sealing portion 950. Alternatively, when the antenna module 900 is not provided with the sealing portion 950, the molding portion 400 may be formed to cover the entire upper portion of the antenna module 900.

The shield portion 960 may be provided on the inner surface of the antenna insertion hole 901. The shield portion 960 guides the moving direction of the magnetic force lines generated from the antenna portion 310. That is, the shielding portion 960 moves the magnetic force lines more intensively toward the upper side of the antenna module 900, so that the counterfeit fingerprint sensing portion 300 'can more accurately detect whether or not the object is a counterfeit fingerprint. The shield portion 960 may be made of a nickel material.

The first metal pad 920, the second metal pad 930 and the conductive material 940 included in the antenna module 900 are the same as the electrode portions 320 of the first to third embodiments, Role. Accordingly, the antenna module 900 itself functions as the counterfeit fingerprint sensing unit 300 '.

On the other hand, the counterfeit fingerprint determination unit 500 may be provided on the base substrate 100 or may be provided on the main substrate 600. A detailed description of the fake fingerprint determining unit 500 will be omitted.

The fingerprint sensor package 1300 may further include a protection layer 700. The protective layer 700 is provided on the upper part of the molding part 400.

Referring to FIG. 11, the antenna module 900 is inserted into a hole 103 formed in the base substrate 100. Referring to FIG. The second metal pad 930 of the antenna module 900 may be coupled to the main substrate 600 provided below the base substrate 100 although not shown in the figure.

Next, the sensor unit 200 is coupled onto the base substrate 100. The sensor unit 200 is electrically connected to the base substrate 100 by wire bonding (w).

Next, the molding part 400 covers various elements provided on the base substrate 100.

Finally, the protective layer 700 is bonded to the upper portion of the molding part 400.

Fig. 12 is an illustration of a fingerprint sensor package according to a fifth embodiment of the present invention. The components denoted by the same reference numerals as those shown in Figs. 1 to 11 have the same functions. A description thereof will be omitted.

As shown in FIG. 12, the fourth embodiment is a form in which a separate groove or hole is not formed in the base substrate 100.

The fingerprint sensor package 1400 may include a counterfeit fingerprint sensing unit 300 or an antenna module 900 on the base substrate 100.

12 (a) shows a configuration in which the antenna unit 310 is provided on the base substrate 100, and FIG. 12 (b) shows a configuration in which the antenna module 900 is mounted on the base substrate 100 FIG. The antenna unit 310 or the antenna module 900 may be provided on the base substrate 100, unlike the first to fourth embodiments.

In the case where the antenna unit 310 or the antenna module 900 is provided on the base substrate 100 as described above, when the thickness of the antenna unit 310 or the antenna module 900 is thinner than the thickness of the molding unit 400 Lt; / RTI > That is, even if the antenna unit 310 or the antenna module 900 is provided on the base substrate 100, the overall thickness of the fingerprint sensor package 1400 is not affected.

Since the fingerprint sensor package 1400 does not need to form a separate groove or hole in the base substrate 100, the manufacturing process of the fingerprint sensor package 1400 can be simplified.

FIG. 13 is an exemplary view showing a state where a subject is in contact with the fingerprint sensor package of the present invention, and FIG. 14 is a graph showing a measurement result of the fake fingerprint determination unit of the present invention.

FIG. 14 is a graph showing the measurement result of the fake fingerprint determining unit 500. As shown in FIG. 13 (a), the measurement result is a value obtained by dividing the thickness of the silicon- The fingerprint authentication is performed on the fingerprint sensor packages 1000, 1100, 1200, 1300, and 1400 in a state where a fake fingerprint manufactured using the same material is applied to the finger of a person, The fingerprint authentication is performed in a state in which the finger of the fingerprint sensor package 1000 is directly in contact with the fingerprint sensor package 1000 and the direct contact of the subject with the fingerprint sensor package 1000, 1100, 1200, 1300, The fingerprint authentication is performed in a state in which the fingerprint authentication is not performed, that is, in a state of being in contact with air.

The measurement result graph of the counterfeit fingerprint determination unit 500 shows the contact impedance and the contact resonance frequency for the feedback signal transmitted from the counterfeit fingerprint sensing unit 300 to the counterfeit fingerprint determination unit 500.

14, it can be seen that there is a difference between the contact impedance transmitted to the fake fingerprint determining part 500 and the contact resonance frequency according to the subject contacting the fingerprint sensor packages 1000, 1100, 1200, 1300, and 1400 . That is, a live contact impedance in which a human finger (biological fingerprint) is directly brought into contact with the fingerprint sensor packages 1000, 1100, 1200, 1300 and 1400 is used to transmit a forged fingerprint, such as silicone or vinyl acetate, 1000, 1100, 1200, 1300, 1400).

It is found that the contact resonance frequency in the live state is distinguished from the contact resonance frequency in the case of using a forged fingerprint such as silicon or vinyl acetate.

In this manner, the fake fingerprint determination unit 500 can discriminate whether or not the fingerprint is fingerprinted on the subject from the contact impedance obtained according to the subject and the value of the contact resonance frequency.

Specifically, the counterfeit fingerprint determination unit 500 may determine whether the fingerprint is fingerprinted on the subject through the contact impedance obtained according to the subject and the reference impedance. Here, the reference impedance may be an impedance value for a biometric fingerprint of a pre-registered user, or may be a preset value at the time of manufacturing the fingerprint sensor packages 1000, 1100, 1200, 1300, and 1400.

That is, if the reference impedance is an impedance value for a biometric fingerprint of a pre-registered user, the counterfeit fingerprint determining unit 500 may determine whether the fingerprint is fingerprinted on the subject based on whether the obtained contact impedance is similar to the reference impedance. If the reference impedance is a preset value at the time of manufacturing the fingerprint sensor packages 1000, 1100, 1200, 1300, and 1400, the counterfeit fingerprint determination unit 500 determines that the difference between the obtained contact impedance and the reference impedance is a predetermined threshold value If it is released, the subject may be judged as a counterfeit fingerprint.

Alternatively, the counterfeit fingerprint determination unit 500 may compare the value obtained by subtracting the intrinsic impedance from the contact impedance with the value obtained by subtracting the intrinsic impedance from the reference impedance, and if the comparison result is out of the predetermined threshold value, determine the subject as a counterfeit fingerprint .

The counterfeit fingerprint determination unit 500 may determine whether the fingerprint is fingerprinted on the subject through the contact resonance frequency obtained according to the subject and the reference resonance frequency. Alternatively, the counterfeit fingerprint determination unit 500 may determine whether the fingerprint is fingerprinted on the subject through the contact resonance frequency and the natural resonance frequency obtained according to the subject.

A method for determining whether or not a fake fingerprint is determined for a subject through the resonance frequency is performed by a method of determining whether the fake fingerprint determination unit 500 is a counterfeit fingerprint for a subject through the impedance described above A detailed description thereof will be omitted.

On the other hand, the counterfeit fingerprint determining unit 500 also determines whether or not the object is a counterfeit fingerprint through the first electrostatic capacity and the second electrostatic capacity formed by the first electrode 321 and the second electrode 322 obtained according to the subject It is possible. The method for determining whether or not the fake fingerprint determining unit 500 is a counterfeit fingerprint for the object through the capacitance is described above, and a detailed description thereof will be omitted.

In this manner, the counterfeit fingerprint determination unit 500 receives a feedback signal reflecting all of the external features, magnetic characteristics, and electrical characteristics of the subject from the counterfeit fingerprint sensing unit 300, thereby accurately determining whether or not the subject is a counterfeit fingerprint can do.

It should be understood, however, that the scope of the present invention is not limited by the scope of the present invention.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be.

It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100: base substrate 200: sensor unit
300, 300 ': forgery fingerprint sensing unit 310: antenna unit
320: electrode part 321: first electrode
322: second electrode 323: conductive member
400: molding part 500: forged fingerprint determination part
600 main substrate 700 protective layer
800: fingerprint sensor module 900: antenna module
1000, 1100, 1200, 1300, 1400: fingerprint sensor package

Claims (26)

A base substrate;
A sensor unit provided on the base substrate and sensing a fingerprint;
A counterfeit fingerprint sensing unit disposed adjacent to the sensor unit and having an antenna unit and an electrode unit for sensing whether the subject is a counterfeit fingerprint; And
And a molding unit covering the sensor unit and the fake fingerprint sensing unit.
The method according to claim 1,
And a counterfeit fingerprint determination unit for determining whether or not the subject is a counterfeit fingerprint based on the feedback signal received from the counterfeit fingerprint sensing unit.
The method according to claim 1,
Wherein the base substrate is provided with a groove or a hole into which the antenna unit is inserted.
The method of claim 3,
A groove is formed in the base substrate,
Wherein the antenna unit is connected to a connect pad provided on an upper surface of the base substrate.
The method of claim 3,
Holes are formed in the base substrate,
Wherein the antenna unit is connected to a land or a main board provided on a lower surface of the base substrate.
The method of claim 3,
Wherein the hole formed in the base substrate passes through the molding portion.
The method according to claim 1,
The counterfeit fingerprint sensing unit may include:
An antenna unit for generating an RF signal; And
And an electrode portion disposed adjacent to the antenna portion and having a first electrode and a second electrode electrically connected to the antenna portion.
8. The method of claim 7,
Wherein a conductive member is further provided on the first electrode and the second electrode, and the upper surface of the conductive member is exposed to the outside of the molding part.
A base substrate;
A sensor unit provided on the base substrate and sensing a fingerprint;
A counterfeit fingerprint sensing unit disposed adjacent to the sensor unit and including an antenna module having an antenna unit for sensing whether the subject is a counterfeit fingerprint; And
And a molding unit covering the sensor unit and the fake fingerprint sensing unit.
10. The method of claim 9,
And a counterfeit fingerprint determination unit for determining whether or not the subject is a counterfeit fingerprint based on the feedback signal received from the counterfeit fingerprint sensing unit.
10. The method of claim 9,
Wherein the base substrate is provided with a groove or a hole into which the antenna module is inserted.
10. The method of claim 9,
The antenna module includes:
A module substrate on which the antenna insertion holes and the via holes are formed;
An antenna unit inserted into the antenna insertion hole;
A conductive material provided in the via hole;
A first metal pad provided on an upper surface of the module substrate and connecting the antenna portion and an upper portion of the conductive material; And
And a second metal pad connected to a lower portion of the conductive material.
13. The method of claim 12,
And a shield portion is provided on an inner surface of the antenna insertion hole.
10. The method of claim 9,
Further comprising an encapsulating portion provided on an upper portion of the antenna module.
11. The method according to claim 2 or 10,
Wherein the counterfeit fingerprint determination unit determines whether or not a fingerprint is fingerprinted on the subject from the contact impedance obtained based on the contact of the subject and the reference impedance.
11. The method according to claim 2 or 10,
Wherein the counterfeit fingerprint determination unit determines whether or not the counterfeit fingerprint is applied to the subject based on the contact impedance and the inherent impedance acquired in accordance with the contact of the subject.
11. The method according to claim 2 or 10,
Wherein the counterfeit fingerprint determining unit determines whether or not a fingerprint is fingerprinted on the subject from the touch resonance frequency obtained in accordance with the contact of the subject and the reference resonance frequency.
11. The method according to claim 2 or 10,
Wherein the counterfeit fingerprint determining unit determines whether or not a fingerprint is fingerprinted on the subject from the contact resonance frequency and the natural resonance frequency obtained in accordance with the contact of the subject.
11. The method according to claim 2 or 10,
Wherein the counterfeit fingerprint determination unit determines whether or not the fingerprint is fingerprinted on the subject through the electrostatic capacity of the electrode unit obtained in accordance with the contact of the subject.
11. The method according to claim 2 or 10,
Wherein the feedback signal is at least one of an external feature, a magnetic feature, and an electrical feature of the subject.
10. The method of claim 1 or 9,
Wherein the antenna unit comprises a coil.
10. The method of claim 1 or 9,
And a protective layer provided on an upper portion of the molding portion.
10. The method of claim 1 or 9,
Wherein the antenna unit has a capacitance ranging from 1 to 100 uH.
10. The method of claim 1 or 9,
Wherein the intrinsic resonance frequency of the forgery fingerprint sensing unit is in the range of 5 to 100 MHz.
10. The method of claim 1 or 9,
Wherein the frequency of the AC signal of the counterfeit fingerprint sensing unit is in the range of 1 to 110 MHz.
23. The method of claim 22,
Wherein a distance between an upper portion of the antenna portion and an upper surface of the protective layer is within a range of 10 mu m to 2 mm.

Images