KR20170069563A - Heat dissipating patch - Google Patents

Heat dissipating patch Download PDF

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Publication number
KR20170069563A
KR20170069563A KR1020150176925A KR20150176925A KR20170069563A KR 20170069563 A KR20170069563 A KR 20170069563A KR 1020150176925 A KR1020150176925 A KR 1020150176925A KR 20150176925 A KR20150176925 A KR 20150176925A KR 20170069563 A KR20170069563 A KR 20170069563A
Authority
KR
South Korea
Prior art keywords
patch
thermally conductive
heat
type
conductive material
Prior art date
Application number
KR1020150176925A
Other languages
Korean (ko)
Inventor
김성엽
곽용
정성해
이병찬
Original Assignee
김성엽
곽용
정성해
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김성엽, 곽용, 정성해 filed Critical 김성엽
Priority to KR1020150176925A priority Critical patent/KR20170069563A/en
Publication of KR20170069563A publication Critical patent/KR20170069563A/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a patch-type heat radiation sheet capable of efficiently conducting heat from a heat-generating electronic component such as a CPU of a computer to a heat sink.
The patch-type heat radiation sheet for conducting heat between the electronic component and the heat sink includes a carbon fiber, a first layer of a gel-type thermally conductive material that surrounds the carbon fiber 110 and maintains a patch shape, And a second layer made of a liquid thermally conductive material applied on both surfaces.
The patch type heat radiation sheet according to the present invention maximizes the contact surface by using thermal grease and has the effect of maximizing heat radiation from electronic parts by using a material having high thermal conductivity. In addition, the patch-type heat-radiating sheet according to the present invention has a patch-shaped structure, which is advantageous in that it can be easily applied and recovered.

Description

[0001] Heat dissipating patch [0002]

The present invention relates to a patch-type heat radiation sheet capable of efficiently conducting heat from a heat-generating electronic component such as a CPU of a computer to a heat sink.

A CPU or a modem used in recent computers or the like is required to have heat dissipation measures because an increase in integration degree and operation at a high speed increase the power consumption and the heat generation amount increases and malfunction or damage of the electronic parts may occur.

Conventionally, a heat sink is mounted on an electronic component such as a CPU to dissipate heat. However, since both the CPU and the heat sink are made of metal, the surface is rough and the contact surface between them is incomplete, and the air with a low thermal conductivity is charged.

To solve this problem, a thermal sheet or thermal grease was used to attach the CPU and the heat sink. However, the use of the thermal sheet has a large contact thermal resistance on the contact surface with the electronic component, so there is a limit to the heat conduction performance. The thermal resistance of the thermal grease is close to that of the liquid, And there is a problem that the workability at the time of application and recovery is poor.

It is an object of the present invention to provide a patch-type heat radiation sheet having a material having a good thermal conductivity in a middle and a thermal grease applied on both sides thereof.

According to an aspect of the present invention, there is provided a patch-type heat dissipating sheet for conducting heat between an electronic component and a heat sink, the sheet including a carbon fiber and a gel- And a second layer made of a liquid thermally conductive material applied on both surfaces of the first layer.

In addition, it may further comprise a vinyl wrapping paper attached to the outer surface of the second layer, wherein the gel or liquid thermally conductive material may be thermal grease or thermally conductive silicone.

The patch type heat radiation sheet according to the present invention maximizes the contact surface by using thermal grease and has the effect of maximizing heat radiation from electronic parts by using a material having high thermal conductivity.

In addition, the patch-type heat-radiating sheet according to the present invention has a patch-shaped structure, which is advantageous in that it can be easily applied and recovered.

1 is a cross-sectional view of a patch-type heat radiation sheet 100 according to an embodiment of the present invention.
2 is a diagram showing the three-dimensional shape of the first layer of the patch-type heat radiation sheet 100 according to the embodiment of the present invention.
FIG. 3 is a view showing an embodiment to which a patch-type heat radiation sheet 100 according to an embodiment of the present invention is applied.
4 is a view showing an example in which a packing cover is attached to both sides of a patch-type heat radiation sheet 100 according to an embodiment of the present invention.

In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

Although the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, But should be understood to include all modifications, equivalents, and alternatives.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description with reference to the accompanying drawings, the same or corresponding elements are denoted by the same reference numerals, and a duplicate description thereof will be omitted.

1 is a cross-sectional view of a patch-type heat radiation sheet 100 according to an embodiment of the present invention.

2 is a diagram showing the three-dimensional shape of the first layer of the patch-type heat radiation sheet 100 according to the embodiment of the present invention.

1, a patch-type heat dissipation sheet 100 according to an embodiment of the present invention includes a thermally-conductive carbon fiber 110, a gel-type thermally conductive material 110 for maintaining a patch shape while surrounding the carbon fiber 110, And a second layer 130 made of a liquid thermal conductive material which is thinly coated on both sides of the first layer to widen the contact surface.

Referring to FIG. 2, the carbon fibers 110 are entangled with each other, and a gel-type thermally conductive material 120 is filled between the entangled carbon fibers 110 to maintain a patch shape as a whole. The gel-type thermally conductive material 120 may be thermal grease or thermally conductive silicone. When using the thermally conductive silicone, the heat conduction efficiency may be better because the thermal conductivity is better than that using the thermal grease.

FIG. 3 is a view showing an embodiment to which a patch-type heat radiation sheet 100 according to an embodiment of the present invention is applied.

Referring to FIG. 3, the patch-type heat radiation sheet 100 performs heat transfer between the electronic product 310 where heat is generated and the heat sink 320. The carbon fiber 110 in the first layer and the gel-type thermally conductive material 120 have a higher thermal conductivity than the conventional product, and the second layer 130 made of a liquid, thermally conductive material coated on both sides of the first layer, It is possible to prevent the phenomenon that the thermal conductivity is lowered by the air by making space that can occur between the first layer and the electronic component or the heat sink having the rough metal surface.

4 is a view showing an example in which a packing cover is attached to both sides of a patch-type heat radiation sheet 100 according to an embodiment of the present invention.

Referring to FIG. 4, since the second layer of the patch-type heat radiating sheet 100 is made of a liquid thermal grease, the outer surface of the second layer can be packed using a plastic material to maintain the patch shape. At this time, the size of the patch-type heat-radiating sheet 100 may be equal to or slightly smaller than the size of Intel's popular I3 or I7 CPU, which is recently used. In some cases, the patch-type heat radiation sheet 100 having various sizes may be manufactured according to the sizes of various CPUs. When the patch-type heat radiation sheet 100 is applied to the surface of the electronic component 310, one of the protrusion surfaces 411 of the plastic package 410 is increased in size to remove the package, The protruding surface 411 of the other plastic package 410 may be pressed to be more convenient and clean by removing the package and attaching the heat sink 320 by increasing the angle.

100: patch type heat radiation sheet
110: carbon fiber
120: Gel type thermally conductive material
130: Liquid-phase thermoconductive material

Claims (4)

A heat dissipation sheet of a patch type for conducting heat between an electronic component and a heat sink,
A first layer comprising a carbon fiber and a gel-type thermally conductive material surrounding the carbon fiber to maintain a patch shape; And
A second layer made of a liquid thermally conductive material coated on both sides of the first layer;
Like heat-radiating sheet. The method according to claim 1,
Further comprising a vinyl wrapping paper attached to an outer surface of the second layer,
Patch heat sink sheet. 3. The method according to claim 1 or 2,
Wherein the gel-type thermally conductive material is a thermal grease or a thermally conductive silicone,
Patch heat sink sheet. 3. The method according to claim 1 or 2,
Wherein the liquid phase thermally conductive material is a thermal grease or a thermally conductive silicone,
Patch heat sink sheet.
KR1020150176925A 2015-12-11 2015-12-11 Heat dissipating patch KR20170069563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150176925A KR20170069563A (en) 2015-12-11 2015-12-11 Heat dissipating patch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150176925A KR20170069563A (en) 2015-12-11 2015-12-11 Heat dissipating patch

Publications (1)

Publication Number Publication Date
KR20170069563A true KR20170069563A (en) 2017-06-21

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ID=59282112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150176925A KR20170069563A (en) 2015-12-11 2015-12-11 Heat dissipating patch

Country Status (1)

Country Link
KR (1) KR20170069563A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210050280A1 (en) * 2018-06-28 2021-02-18 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210050280A1 (en) * 2018-06-28 2021-02-18 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing electronic device

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A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application