KR20170029958A - Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same - Google Patents

Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same Download PDF

Info

Publication number
KR20170029958A
KR20170029958A KR1020150127181A KR20150127181A KR20170029958A KR 20170029958 A KR20170029958 A KR 20170029958A KR 1020150127181 A KR1020150127181 A KR 1020150127181A KR 20150127181 A KR20150127181 A KR 20150127181A KR 20170029958 A KR20170029958 A KR 20170029958A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
flexible printed
antenna
base film
Prior art date
Application number
KR1020150127181A
Other languages
Korean (ko)
Inventor
이명하
차승면
김성열
Original Assignee
주식회사 알.에프.텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 알.에프.텍 filed Critical 주식회사 알.에프.텍
Priority to KR1020150127181A priority Critical patent/KR20170029958A/en
Publication of KR20170029958A publication Critical patent/KR20170029958A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Aerials (AREA)

Abstract

Disclosed is a flexible printed circuit board capable of improving the adhesive force between a resin injected into a mold and a method of manufacturing the same. Such a flexible printed circuit board includes a base film, a metal pattern, and a cover film. The base film is formed of a first plastic having a first melting point. The metal pattern is formed on the base film. The cover film is formed of a second plastics material having a second melting point higher than the first melting point, and is attached to the base film to cover the metal pattern.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a flexible printed circuit board for manufacturing an antenna,

The present invention relates to a flexible printed circuit board and a manufacturing method thereof, and more particularly to a flexible printed circuit board for manufacturing an antenna and a manufacturing method thereof.

An antenna is used for a mobile communication terminal such as a mobile phone, and an antenna is installed outside or inside the terminal body to transmit / receive necessary information wirelessly to an external device. Conventionally, a structure is used in which an antenna is exposed to the outside or a length of an antenna is increased or decreased if necessary for smooth wireless communication. However, as the technology related to the antenna is developed, the antenna is embedded in the inside rather than exposed to the outside, and many studies are being carried out in order to perform the function without affecting other parts inside.

Among these studies, antennas that surround a metal antenna radiator with resin are widely used. That is, the antenna radiator was disposed inside the mold, and resin was injected to manufacture such an antenna. Through this method, the antenna is formed integrally with the molded resin member constituting the smart phone, for example.

More specifically, such an antenna radiator of metal is punched out of a metal plate to remove its shape, bending the power supply pad portion inward, placing it in a mold, and injecting resin to form an antenna.

However, since the frequency band used for each country is different and the shape of the metallic antenna pattern changes accordingly, the position of the support pin for supporting the antenna pattern must be changed accordingly. Therefore, even in the case of the same smartphone, A mold is required.

In order to solve this problem, Applicant has proposed a method of manufacturing an antenna using a flexible printed circuit board, as in Application No. 10-2015-0079841. The invention disclosed in the above patent is a method of manufacturing an antenna by disposing a flexible circuit board on which an antenna pattern is formed, and injecting resin. However, there is a disadvantage that the adhesive strength between the resin layer to be injected and the base film of the flexible circuit board is lowered.

Korean Patent Application No. 10-2015-0079841

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a flexible printed circuit board capable of improving the adhesion to a resin injected into a mold.

Another object of the present invention is to provide a method for manufacturing a flexible circuit board.

To solve these problems, a flexible printed circuit board according to an exemplary embodiment of the present invention includes a base film, a metal pattern, and a cover film. The base film is formed of a first plastic having a first melting point. The metal pattern is formed on the base film. The cover film is formed of a second plastics material having a second melting point higher than the first melting point, and is attached to the base film to cover the metal pattern.

A method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present invention includes preparing a base film formed of a first plastic having a first melting point, attaching a metal thin film on the base film, Forming a metal pattern by patterning the metal thin film and attaching a cover film formed of a second plastics material having a second melting point higher than the first melting point to the base film to cover the metal pattern .

For example, the first plastic may include polycarbonate (PC), and the second plastic may include polyimide (PI).

In addition, the metal pattern may be an antenna pattern.

According to the flexible printed circuit board and the method of manufacturing an antenna using the flexible printed circuit board according to the exemplary embodiment of the present invention, it is possible to improve the adhesive force with the resin injected into the mold.

1 is a perspective view illustrating an antenna manufactured by a metal mold according to an exemplary embodiment of the present invention.
2 is a plan view showing a flexible printed circuit board according to an exemplary embodiment of the present invention for the antenna of FIG.
3 is a side view of a flexible printed circuit board that has undergone a bending process.
FIG. 4 is a conceptual diagram showing a state in which a flexible printed circuit board having a bending process is disposed on a mold according to an exemplary embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present invention.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. In the accompanying drawings, the dimensions of the structures may be exaggerated to illustrate the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprising" or "having ", and the like, are intended to specify the presence of stated features, integers, steps, operations, elements, parts, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof. In addition, A and B are 'connected' and 'coupled', meaning that A and B are directly connected or combined, and other component C is included between A and B, and A and B are connected or combined .

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

1 is a perspective view illustrating an antenna manufactured by a metal mold according to an exemplary embodiment of the present invention.

Referring to FIG. 1, an antenna 1000 manufactured by a mold according to an exemplary embodiment of the present invention includes a flexible printed circuit board 100 on which an antenna pattern 110 is formed, Respectively. For example, the resin molded article may constitute a rim or cover of a personal terminal such as a smart phone. Thus, the shape shown is exemplary only and may be made in any other shape.

On the other hand, in consideration of design, the resin molded article may be formed into a round type without edges or edge portions. Accordingly, the flexible printed circuit board 100 is also integrated into the resin molding in a round shape.

FIG. 2 is a plan view of a flexible printed circuit board according to an exemplary embodiment of the present invention for the antenna of FIG. 1, and FIG. 3 is a side view of a flexible printed circuit board subjected to a bending process.

2 and 3, the flexible printed circuit board 100 includes a base film 120, a metal pattern 110 formed on the base film 120, and a base film 120 covering the metal pattern 110. [ 120 of the cover film 130.

The base film 120 is formed of a first plastic having a first melting point. The metal pattern 110 is formed on the base film 120. The base film 120 of the flexible printed circuit board 100 according to an embodiment of the present invention may be made of, for example, polycarbonate (PC).

Meanwhile, the metal pattern 110 may be an antenna pattern for receiving external electromagnetic waves. In the exemplary embodiment of the present invention, since the antenna is manufactured using the flexible printed circuit board 100, the metal pattern 110 is formed of an antenna pattern. However, the flexible printed circuit board may be disposed in a mold, The metal pattern 110 may be any other, if it needs to be manufactured by molding. For example, the metal pattern 110 may be a wiring pattern for passing an electric current. However, in the present embodiment, the flexible printed circuit board 100 is for manufacturing an antenna. The metal pattern 110 is designated as an antenna pattern, and the same reference numerals are used for the antenna pattern.

The antenna pattern 110 is illustrative and may be formed to have various orientations. That is, it can be changed into various shapes so as to have an optimal shape for various countries in which frequencies to be applied are different.

A feed pad portion 111 is formed at one end of the antenna pattern 110. The feed pad unit 111 is a contact point for applying an electrical signal received by the antenna pattern 110 to an electronic component. On the other hand, the flexible printed circuit board 100 is provided with an insertion port A. The position of the insertion port A is formed at a position corresponding to the fixing pin 421 of the mold 400 to be described later with reference to FIG. 4, and the position is not changed even when the shape of the antenna pattern 110 is changed .

If the antenna pattern 110 is changed instead, the position of the insertion port A can be adjusted by changing the position of the flexible printed circuit board 100. For example, when the antenna pattern is formed at a position corresponding to the insertion port A in the drawing, the width of the flexible printed circuit board 100 may be increased and positioned below the antenna pattern.

When the flexible printed circuit board 100 on which the antenna pattern 110 is formed is used instead of the metal antenna radiator as described above, even when the antenna pattern 110 is changed to correspond to various countries having different frequency bands, The antenna 1000 shown in Fig. 1 can be formed.

The cover film 130 prevents the antenna pattern 110 from being oxidized or peeled off from the base film 120. The cover film 130 is formed of a second plastic having a second melting point higher than the first melting point of the base film 120. The cover film 130 covers the antenna pattern 110, Is attached to the film (120). For example, the cover film 130 may be configured to include polyimide (PI). The reason why the base film 120 and the cover film 130 are made of different materials will be described in detail with reference to FIG.

On the other hand, two bending lines (a, b) are present in an end region of the flexible printed circuit board 100 where the power supply pad unit 111 is located. As shown in FIG. 3, the flexible printed circuit board 100 is bent in a U shape along the two bending lines a and b, and then, as shown in FIG. 4, have.

At this time, as shown in FIG. 3, the flexible printed circuit board 110 is bent so that the antenna pattern 110 is located outside. Accordingly, the power supply pad unit 111 faces the antenna pattern 110 in the opposite direction.

FIG. 4 is a conceptual diagram showing a state in which a flexible printed circuit board having a bending process is disposed on a mold according to an exemplary embodiment of the present invention.

Referring to FIG. 4, a mold 400 according to an exemplary embodiment of the present invention includes a lower mold 420 and an upper mold 410.

The lower mold 420 includes a fixing pin 421 inserted into an insertion port (A in FIG. 2) formed in a flexible printed circuit board on which an antenna pattern is formed to fix the flexible printed circuit board.

Although only one insertion port A is shown in FIG. 2 in the flexible printed circuit board 100, one or more insertion ports may be formed. In this case, the lower mold 420 may be formed to include one or more fixing pins 421 to correspond to one or more insertion holes. In this manner, when the at least one fixing pin 421 is formed, rotation of the flexible printed circuit board 100 in the mold 420 is prevented, and the flexible printed circuit board can be prevented from being tilted.

The upper mold 410 includes a receiving groove 411 for receiving the fixing pin 421 when the lower mold 420 is in close contact with the lower mold 420, And a bending cavity 430 in which the flexible printed circuit board bent in a U-shape is accommodated.

The depth h 2 of the receiving groove 411 is formed to a depth sufficient to accommodate the height h 3 when the upper mold 410 and the lower mold 420 are in close contact with each other.

The pushing protrusion 421 may be formed to enclose the receiving groove 411. For example, the pushing protrusion 421 may be formed concentrically with the receiving groove 411 in a planar manner. For example, it is preferable that the inner boundary of the pushing protrusion 421 is formed to coincide with the outer boundary of the receiving groove 411. This is because the portion of the flexible circuit board pressed by the pushing protrusion 421 is not covered with the resin layer, so it is preferable to reduce the size of the pushing protrusion 421 as much as possible.

The protrusion height h 1 of the push protrusion 421 may be the same as the thickness of the resin layer (or plastic layer) of the antenna 1000 shown in FIG. Conversely, since the lower surface of the upper mold 410 and the upper surface of the lower mold 420 are spaced apart from each other by the protrusion height h 1 of the pushing protrusion 421, The thickness of the resin layer is necessarily equal to the thickness of the resin layer.

It is preferable that the pushing protrusion 421 is formed at a portion where the flexible printed circuit board is formed as a curved surface. 1, when the resin molding structure of the antenna 1000 is formed as a curved surface, when the flexible printed circuit board is disposed inside the mold 400, the curved portion is excited. Accordingly, the pushing protrusion 421 pushes such a portion to be corrected.

The depth of the bending cavity 430 is preferably equal to the sum of the resin layer thickness h 1 of the antenna and the thickness h 4 of the flexible printed circuit board.

When the antenna 1000 is manufactured as shown in FIG. 1 by completing the injection molding on the flexible printed circuit board bent in a U-shape, the feeding pad portion of the flexible printed circuit board 100 shown in FIG. 2 111) should be exposed to the outside, and should be immersed in the resin layer and free from flaking.

Accordingly, be the same as the inner height of the resin layer thickness (h 1) of the antenna of the U-shape, and also to prevent a resin from being introduced into the top of the feed pad 111, the depth of the bending cavity 430, antenna The thickness h 1 of the resin layer of the flexible printed circuit board and the thickness h 4 of the flexible printed circuit board.

When the flexible printed circuit board 100 according to the present invention as shown in FIG. 3 is disposed in the mold 400, the base film 120 faces the inside of the cavity in the mold 400, And the cover film 130 is brought into contact with the lower mold 420. However, since the resin to be injected into the cavity is usually made of polycarbonate (PC), it is more advantageous to integrate the base film 120 with polycarbonate (PC) of the same material.

However, when the cover film 130 is made of polycarbonate (PC) having a low melting point, a problem occurs in contact with the high-temperature lower mold 420. Therefore, the cover film 130 is made of polyimide (PI) having a high melting point.

5 is a flowchart illustrating a method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 5, in a method of manufacturing a flexible printed circuit board according to an exemplary embodiment of the present invention, a base film formed of a first plastic having a first melting point is prepared (step S510). As described above, the base film may be made of, for example, polycarbonate (PC).

Next, a metal thin film is deposited on the base film (step S520). For example, after the base film and the metal thin film are disposed to overlap with each other, the metal thin film may be adhered to the upper portion of the base film by pressing while applying heat using a high temperature metal roller. At this time, the metal thin film may include copper.

Next, the metal thin film is patterned to form a metal pattern (step S530). For example, the metal pattern may be formed by forming a mask in a metal thin film and immersing it in an etching solution.

Next, a cover film formed of a second plastics material having a second melting point higher than the first melting point is attached to the base film to cover the metal pattern (step S540). At this time, it can be attached using an adhesive or by using heat fusion.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

1000: Antenna
100: flexible printed circuit board
110: metal pattern (antenna pattern) 120: base film
111: feed pad part 130: cover film
400: mold
410: upper mold 411: receiving groove
412: Push protrusion
420: lower mold 421: fixing pin
430: bending cavity
A:

Claims (6)

A base film formed of a first plastic having a first melting point;
A metal pattern formed on the base film; And
A cover film formed of a second plastic having a second melting point higher than the first melting point and attached to the base film to cover the metal pattern;
And a flexible printed circuit board.
The method according to claim 1,
Wherein the first plastic comprises polycarbonate (PC) and the second plastic comprises polyimide (PI).
The method according to claim 1,
Wherein the metal pattern is an antenna pattern.
Preparing a base film formed of a first plastic having a first melting point;
Attaching a metal thin film on the base film;
Forming a metal pattern by patterning the metal thin film; And
Attaching a cover film formed of a second plastics material having a second melting point higher than the first melting point to the base film to cover the metal pattern;
And a flexible printed circuit board (PCB).
5. The method of claim 4,
Wherein the first plastic comprises polycarbonate (PC), and the second plastic comprises polyimide (PI).
5. The method of claim 4,
Wherein the metal pattern is an antenna pattern.

KR1020150127181A 2015-09-08 2015-09-08 Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same KR20170029958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150127181A KR20170029958A (en) 2015-09-08 2015-09-08 Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150127181A KR20170029958A (en) 2015-09-08 2015-09-08 Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same

Publications (1)

Publication Number Publication Date
KR20170029958A true KR20170029958A (en) 2017-03-16

Family

ID=58497778

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150127181A KR20170029958A (en) 2015-09-08 2015-09-08 Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same

Country Status (1)

Country Link
KR (1) KR20170029958A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150079841A (en) 2013-04-23 2015-07-08 시아오미 아이엔씨. E-map determining method and apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150079841A (en) 2013-04-23 2015-07-08 시아오미 아이엔씨. E-map determining method and apparatus

Similar Documents

Publication Publication Date Title
US8711041B2 (en) Case of electronic device having antenna pattern embedded therein and mold and method for manufacturing the same
US9419326B2 (en) Antenna pattern frame, method and mold for manufacturing the same, method for manufacturing an electronic device case, and electronic device
US9266266B2 (en) Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof
KR101506500B1 (en) The manufacturing method of the built-in antenna
US8442603B2 (en) Method of manufacturing case for mobile communications terminal, case for mobile communications terminal, and mobile communications terminal having the same
CN102280684B (en) Antenna pattern frame, electronic device case and electronic device
JP5655239B2 (en) Electronic device case and mobile communication terminal
CN102244993B (en) Be embedded with the shell of the electronic installation of low-frequency antenna pattern, mould and manufacture method
KR101219004B1 (en) Terminal for communication and method for manufacturing the same
KR101025964B1 (en) Method and device for manufacturing antenna pattern frame
KR20080008633A (en) Mobile communication terminal
KR20070023878A (en) Internal antenna and production method thereof using in-moulding or insert moulding
KR20130033091A (en) Built-in antenna module for mobile device and manufacturing method of the same
KR101423275B1 (en) Insert antenna, method and mould for manufacturing the same
KR101630126B1 (en) Radiator frame having antenna pattern therein and electronic device including the same
KR101960910B1 (en) Antenna module and portable device having the same
KR20170029958A (en) Flexible printed circuit board for manufacturing an antenna and method of manufacturing the same
KR20130051054A (en) Mobile device case with built-in antenna and manufacturing method of the same
KR20100090574A (en) Injection mold for embedded antenna
KR101971108B1 (en) Antenna module and method of manufacturing the same
TWM518416U (en) Composite molding structure of antenna for mobile electronic device
KR20170033523A (en) Mold and method of manufacturing an antenna using the same
JP4706677B2 (en) RFID tag manufacturing method
WO2015190228A1 (en) Chip antenna
US20100134380A1 (en) Antenna device and method of manufacturing the same

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application