KR20170022524A - Method and device for dividing brittle substrate - Google Patents

Method and device for dividing brittle substrate Download PDF

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Publication number
KR20170022524A
KR20170022524A KR1020150117629A KR20150117629A KR20170022524A KR 20170022524 A KR20170022524 A KR 20170022524A KR 1020150117629 A KR1020150117629 A KR 1020150117629A KR 20150117629 A KR20150117629 A KR 20150117629A KR 20170022524 A KR20170022524 A KR 20170022524A
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KR
South Korea
Prior art keywords
brittle substrate
thin film
flexible thin
substrate
brittle
Prior art date
Application number
KR1020150117629A
Other languages
Korean (ko)
Inventor
이 슈 쳉
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰보시 다이야몬도 고교 가부시키가이샤 filed Critical 미쓰보시 다이야몬도 고교 가부시키가이샤
Priority to KR1020150117629A priority Critical patent/KR20170022524A/en
Publication of KR20170022524A publication Critical patent/KR20170022524A/en

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Disclosed is a method of dividing a brittle substrate and a dividing device capable of reducing particles attached to a scribed brittle substrate.
(1) A scribing method comprising: covering a first surface of a brittle substrate with a flexible thin film having a hardness smaller than that of a brittle substrate; passing the flexible thin film; and scribing the first surface of the brittle substrate to form a scribe opening, Braking the brittle substrate along the opening.

Description

[0001] METHOD AND DEVICE FOR DIVIDING BRITTLE SUBSTRATE [0002]

The present invention relates to a dividing method and a dividing apparatus, and more particularly to a dividing method and a dividing apparatus for a brittle substrate.

At present, brittle substrates such as chips and glass substrates are widely used for all parts of electronic products. In a manufacturing process, a brittle substrate such as a wafer or a glass substrate must be divided into small pieces according to various apparatuses.

As shown in Figs. 1A and 1B, in the conventional dividing method, when the brittle substrate 9 is divided, the brittle substrate 9 is placed on the scribing table 13, The brittle substrate 9 is scribed along the line 101 to form a scribe opening 103 as shown in Fig. At this time, usually, the brittle substrate 9 is not yet divided. Thereafter, the brittle substrate 9 is broken into a plurality of products along the scribe openings 103. Then,

2, the scribe device 11 scribes the brittle substrate 9 to form the scribe opening 103. Thereafter, the particles 105 broken from the brittle substrate 9 are transferred to the scribed brittle substrate 9 As shown in FIG. If a subsequent step such as formation of other scribe openings or application of other materials to the brittle substrate 9 is performed, there is a fear that defects are generated in the portion where the particles 105 are attached.

In view of the above, how to reduce the particles adhering to the scribed brittle substrate has become an urgent issue to those skilled in the art.

It is an object of the present invention to provide a dividing method and a dividing device for a brittle substrate capable of reducing particles adhering to a scribed brittle substrate.

The brittle substrate includes a first surface and a second surface opposite the first surface. The method of breaking the present invention is a method of breaking a brittle substrate by covering a first surface of the brittle substrate with a flexible thin film having a hardness smaller than that of the brittle substrate; scribing the flexible thin film and the first surface along a predetermined dividing line on the first surface And forming a scribe opening.

The present invention provides a breaking apparatus comprising a coating apparatus for covering a first thin film of a brittle substrate with a thin film having a hardness smaller than that of a brittle substrate, And a scribe device for scribing to form a scribe opening.

According to the present invention, it is possible to reduce problems that arise when scribing a brittle substrate.

1A is a perspective view showing a conventional brittle substrate cutting method.
1B is a cross-sectional view showing a conventional brittle substrate cutting method.
2 is a view showing a brittle substrate scribed by a conventional dividing method.
3A is a plan view showing a state in which a dicing tape is adhered to a wafer ring by the present invention.
3B is a plan view showing the carrier plate of the present invention.
3C is a sectional view showing the carrier plate of the present invention.
4A is a plan view showing a state in which a brittle substrate is placed on a carrier plate according to the present invention.
4B is a cross-sectional view showing a state in which a brittle substrate is placed on a carrier plate according to the present invention.
5A is a plan view showing a state in which a brittle substrate is covered with a flexible thin film according to the present invention.
5B is a cross-sectional view showing a state in which a brittle substrate is covered with a flexible thin film according to the present invention.
6A is a plan view showing a step of scribing a brittle substrate according to the present invention.
6B is a cross-sectional view showing a step of scribing a brittle substrate according to the present invention.
7 is a view showing the surface of a brittle substrate after scribing the brittle substrate according to the present invention.

(Mode for carrying out the invention)

4B, the brittle substrate 9 includes a first surface 91 and a second surface 92 opposite the first surface 91. As shown in Fig. The brittle substrate 9 is a brittle substrate such as a glass substrate, a wafer, or a ceramic substrate. The breaking method of the brittle substrate 9 of the present invention includes the following steps in order.

The dicing tape 313 is fixed to the wafer ring 311 as shown in Fig. Thereafter, the dicing tape 313 is cut along the rim of the wafer ring 311 to form the carrier plate 31 as shown in Figs. 3B and 3C. However, the present invention can use carrier plates 31 having other structures, and the combination of the dicing tape 313 and the wafer ring 311 illustrated in the drawings is not limited.

4A and 4B, the second surface 92 of the brittle substrate 9 is placed on the carrier plate 31. As shown in Fig. The carrier plate 31 includes a wafer ring 311 and a dicing tape 313 which is tightly pulled and fixed to the wafer ring 311. The brittle substrate 9 is placed on the dicing tape 313 so that the second surface 92 is in surface contact with the dicing tape 313. [ At this time, it is preferable that the first surface 91 is located higher than the top surface of the wafer ring 311. By doing so, there is no fear that the scribe device 35 and the wafer ring 311 will interfere with each other during scribing shown in Fig. 6B. Thereafter, the carrier plate 31 is placed on the scribe table 37. Alternatively, first, the carrier plate 31 may be placed on the scribing table 37, and then the second surface 92 of the brittle substrate 9 may be placed on the carrier plate 31.

The first surface 91 of the brittle substrate 9 is covered with the flexible thin film 33 whose hardness is smaller than that of the brittle substrate 9, as shown in Figs. 5A and 5B. In this process, a flexible thin film 33 is formed on the first surface 91 of the brittle substrate 9 by electroplating or adhered (tacky). The term " adhesion " as used herein is not limited to adhesion by a pressure-sensitive adhesive, but includes other bonding forms. If the flexible thin film 33 is a material which easily generates static electricity such as plastic or the like, the effect of adsorption is generated by using the static electricity of the flexible thin film 33, so that the flexible thin film 33 is bonded to the brittle substrate 9, To the first surface 91 of the substrate. More preferably, the thickness of the flexible thin film 33 is less than 20 占 퐉. Preferred as the material of the flexible thin film 33 is any of PVDC (polyvinylidene chloride), PVC (polyvinyl chloride), PE (polyethylene), or other similar materials.

6A and 6B, when the brittle substrate 9 is divided, the flexible thin film 33 and the brittle substrate 9 are removed along the predetermined dividing line 301 on the first surface 91 The first surface 91 is scribed. A scribe opening 303 as shown in Fig. 7 is formed so that the scribe depth passes through the flexible thin film 33 and reaches the first surface 91 of the brittle substrate 9. When the brittle substrate 9 is scribed by the flexible thin film 33, generation of particles 105 as shown in Fig. 2 can be reduced.

The dividing method of the present invention includes a step of removing the flexible thin film 33 from the first surface 91 of the brittle substrate 9 after the scribe opening 303 is formed by scribing. The first surface 91 of the brittle substrate 9 exposed by peeling off the flexible thin film 33 is shown in Fig. The particles 105 adhered to the flexible thin film 33 which are generated when the brittle substrate 9 is scribed can be removed when the flexible thin film 33 is peeled off.

The dividing method of the present invention is characterized in that after the scribing opening 303 is formed by scribing or after the step of stripping the flexible thin film 33 from the first surface 91 of the brittle substrate 9, And braking the brittle substrate 9 along the brittle substrate 303 to form a plurality of products.

When the brittle substrate 9 is divided by the dividing method of the present invention, the particles 105 (as shown in Fig. 2) generated when scribing the brittle substrate 9 are hardly attached to the brittle substrate 9.

The breaking apparatus of the brittle substrate 9 of the present invention includes a covering apparatus (not shown) and a scribing apparatus 35. The brittle substrate 9 is a brittle substrate such as a glass substrate, a wafer, or a ceramic substrate. 5A and 5B, the first surface 91 of the brittle substrate 9 is bonded to a flexible thin film (hereinafter, referred to as " brittle substrate 9 " 33). The coating apparatus forms or adheres the flexible thin film 33 on the first surface 91 of the brittle substrate 9 by electroplating. If the flexible thin film 33 is a material which easily generates static electricity such as plastic or the like, the coating apparatus generates the adsorption effect by using the static electricity of the flexible thin film 33, so that the flexible thin film 33, To the first surface 91 of the base 9. More preferably, the thickness of the flexible thin film 33 is less than 20 占 퐉. Preferred as the material of the flexible thin film 33 is any of PVDC (polyvinylidene chloride), PVC (polyvinyl chloride), PE (polyethylene), or other similar materials.

6A and 6B, the scribing device 35 is disposed on the first surface 91 of the brittle substrate 9 along the predetermined dividing line 301, The scribing process is performed so that the scribe depth penetrates the flexible thin film 33 and reaches the first surface 91 of the brittle substrate 9 by the scribing step, Thereby forming an opening.

The separating device may further include a separating device (not shown). The peeling apparatus removes the flexible thin film 33 after removing the static electricity by the static electricity removing apparatus, or removes the flexible thin film 33 by clamping it therebetween. The flexible thin film 33 is peeled off from the first surface 91 of the brittle substrate 9 by the peeling apparatus after the scribing device 35 forms the scribe opening 303, The first surface 91 of the substrate 9 and the scribe opening 303 are exposed.

More preferably, the dividing device further comprises a placement device (not shown). Various conventional devices can be used as the placement device and before covering the first surface 91 of the brittle substrate 9 with the flexible thin film 33 by the coating device, as shown in Figs. 4A and 4B, The second surface 92 of the brittle substrate 9 is placed on the carrier plate 31. The carrier plate 31 includes a wafer ring 311 and a dicing tape 313 which is tightly pulled and fixed to the wafer ring 311. The placement device 9 places the brittle substrate 9 on the dicing tape 313 so that the second surface 92 of the brittle substrate 9 comes into surface contact with the dicing tape 313, To the scribe table (37). At this time, it is preferable that the first surface 91 is located higher than the top surface of the wafer ring 311. By doing so, there is no fear that the scribe device 35 and the wafer ring 311 will interfere with each other during scribing shown in Fig. 6B. The carrier plate 31 of any other type can be used in the present invention, and the combination of the dicing tape 313 and the wafer ring 311 illustrated in the drawings is not limited.

The dividing device further comprises a brake device (not shown). As a braking device, a bending substrate 9 is braked by bending the brittle substrate 9 until the brittle substrate 9 is divided, or a stamping device or other various conventional devices to break the brittle substrate 9 along the scribe opening 313, .

(1) After the brittle substrate 9 is scribed, the generation of the particles 105 is effectively suppressed, and the brittle substrate 9 is scribed. . (2) Using the electrostatic property of the flexible thin film 33, the flexible thin film 33 can be bonded to the brittle substrate 9 without using an adhesive. (3) The material of the flexible thin film 33 is easy to obtain, and the same material as a general household wrap can be used. (4) It is not so different from the conventional scribing process. The grooves of the cutter wheel of the scribing device 35 are not clogged by the particles 105 because scribing is performed from the flexible thin film 33 of the scribing device 35. [ (6) After completing the scribing process, the flexible thin film 33 can be easily removed and cleanliness can be maintained.

101:
103: scribe opening
105: particles
11: Scribing device
13: Scribe table
301:
303: scribe opening
31: carrier plate
311: Wafer ring
313: Dicing tape
33: thin film of flexible
35: scribe device
37: scribe table
9: brittle substrate
91: First surface
92: second surface

Claims (20)

A method of breaking a brittle substrate comprising a first surface and a second surface opposite the first surface,
(a) covering the first surface of the brittle substrate with a flexible thin film having a hardness smaller than that of the brittle substrate;
(b) scribing the flexible thin film and the first surface along a predetermined dividing line on the first surface to form a scribe opening. The method according to claim 1,
The method of separation may further comprise, after the step (b)
(c) removing the flexible thin film from the first surface of the brittle substrate. The method according to claim 1,
A method of dividing a brittle substrate by electroplating or sticking the flexible thin film on the first surface of the brittle substrate in the step (a). The method according to claim 1,
Wherein the flexible thin film is attached to the first surface of the brittle substrate by the static electricity of the flexible thin film in the step (a). The method according to claim 1,
Wherein the thickness of the flexible thin film is less than 20 占 퐉. The method according to claim 1,
Wherein the material of the flexible thin film is selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, and polyethylene. The method according to claim 1,
Wherein the brittle substrate is a glass substrate. The method according to claim 1,
The separation method may further comprise, before the step (a)
(a-0) placing the second surface of the brittle substrate on a carrier plate. 9. The method of claim 8,
Wherein said carrier plate comprises a wafer ring and a dicing tape pulled and fixed to said wafer ring, and said step (a-0) further comprises the step of providing said dicing tape on said second surface of said brittle substrate Division method. 3. The method of claim 2,
The separation method may further comprise, after the step (b) or the step (c)
(d) breaking the brittle substrate along the scribe openings to form a plurality of products. A brittle substrate breaking apparatus comprising a first surface and a second surface opposite the first surface,
A covering device for covering the first surface of the brittle substrate with a flexible thin film having a hardness smaller than that of the brittle substrate;
And a scribe device for scribing the flexible thin film and the first surface along a predetermined dividing line on the first surface to form a scribe opening. 12. The method of claim 11,
Wherein the dividing device further comprises a peeling device for peeling the flexible thin film from the first surface of the brittle substrate. 12. The method of claim 11,
Wherein the coating apparatus forms the flexible thin film on the first surface of the brittle substrate by electroplating or adheres to the first surface of the brittle substrate. 12. The method of claim 11,
Wherein the coating apparatus adheres the flexible thin film to the first surface of the brittle substrate by static electricity of the flexible thin film. 12. The method of claim 11,
Wherein the thickness of the flexible thin film is less than 20 mu m. 12. The method of claim 11,
Wherein the material of the flexible thin film is selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, and polyethylene. 12. The method of claim 11,
Wherein the brittle substrate is a glass substrate. 12. The method of claim 11,
Wherein the dividing device further comprises a placement device for placing the second surface of the brittle substrate on a carrier plate. 19. The method of claim 18,
Wherein the carrier plate includes a wafer ring and a dicing tape pulled and secured to the wafer ring, and wherein the placement device places the second surface of the brittle substrate onto the dicing tape. 12. The method of claim 11,
Wherein the dividing device further comprises a braking device that breaks the brittle substrate along the scribe opening to form a plurality of products.
KR1020150117629A 2015-08-21 2015-08-21 Method and device for dividing brittle substrate KR20170022524A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150117629A KR20170022524A (en) 2015-08-21 2015-08-21 Method and device for dividing brittle substrate

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Application Number Priority Date Filing Date Title
KR1020150117629A KR20170022524A (en) 2015-08-21 2015-08-21 Method and device for dividing brittle substrate

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111630651A (en) * 2018-01-31 2020-09-04 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111630651A (en) * 2018-01-31 2020-09-04 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system
CN111630651B (en) * 2018-01-31 2024-01-09 三星钻石工业股份有限公司 Film peeling mechanism and substrate breaking system

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