KR20150053161A - Deposition apparatus, method for manufacturing organic light emitting display apparatus using the same - Google Patents

Abstract

One embodiment of the present invention provides a deposition apparatus for depositing a thin-film on a substrate, which comprieses: a first loading part which combines the substrate and a mask for depositing a first pattern layer; a first deposition unit connected to the first loading part, having a first deposition part which radiates deposition material and a first transferring part which transfers the substrate; and a first unloading part connected to the first deposition unit, separating the substrate and the mask for depositing the first pattern layer from each other. The first transferring part transfers the substrate in a first direction, and transfers the same in a second direction different from the first direction, and then in a third direction different from the first and second directions.

Description

[0001] The present invention relates to a deposition apparatus and an organic light emitting display apparatus using the same,

Embodiments of the present invention relate to a deposition apparatus and a method of manufacturing an organic light emitting display device using the same.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

The organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer can be formed by various methods, one of which is the independent deposition method. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of an organic layer to be formed is closely contacted to a substrate surface on which an organic layer or the like is to be formed, A material is deposited to form an organic layer of a predetermined pattern.

The above-described background technology is technical information that the inventor holds for the derivation of the present invention or acquired in the process of deriving the present invention, and can not necessarily be a known technology disclosed to the general public prior to the filing of the present invention.

Embodiments of the present invention provide a deposition apparatus and a method of manufacturing an organic light emitting display device using the deposition apparatus.

According to an embodiment of the present invention, there is provided a deposition apparatus for depositing a thin film on a substrate, the deposition apparatus comprising: a first loading unit for coupling the substrate and the first pattern layer deposition mask; A first deposition unit connected to the first loading unit and including a first deposition unit for emitting a deposition material and a first transfer unit for transferring the substrate; And a first unloading unit connected to the first deposition unit and separating the substrate from the first pattern layer deposition mask, wherein the first transfer unit transports the substrate in a first direction, And then transferred in a second direction different from the first direction, and then transferred in a third direction different from the first direction and the second direction.

The apparatus may further include a first return unit for transferring the first pattern layer deposition mask separated from the first unloading unit to the first loading unit.

In the present embodiment, the first transfer unit may be formed in the shape of a 'U' character.

In the present embodiment, the length of the first return portion may be shorter than the length of the first transfer portion.

In the present embodiment, a second loading unit for coupling the substrate and the second pattern layer deposition mask; A second deposition unit connected to the second loading unit, the second deposition unit including a second deposition unit for emitting a deposition material, and a second transfer unit for transferring the substrate; And a second unloading unit connected to the second deposition unit and separating the substrate from the mask for depositing the second pattern layer, the second transfer unit transferring the substrate in a first direction, And then transferred in a second direction different from the first direction, and then transferred in a third direction different from the first direction and the second direction.

The apparatus may further include a second return unit for transferring the second pattern layer deposition mask separated by the second unloading unit to the second loading unit.

In the present embodiment, the first unloading unit may further include a first connecting unit connecting the first unloading unit and the second loading unit.

In this embodiment, the third loading unit may be configured to combine the substrate with the third pattern layer deposition mask. A third deposition unit connected to the third loading unit, the third deposition unit including a third deposition unit for emitting a deposition material, and a third transfer unit for transferring the substrate; And a third unloading unit connected to the third deposition unit for separating the substrate from the mask for depositing the third pattern layer, wherein the third transfer unit transports the substrate in the first direction, And then transferred in a second direction different from the first direction, and then transferred in a third direction different from the first direction and the second direction.

The third loading unit may further include a third return unit for transferring the third pattern layer deposition mask separated from the third unloading unit to the third loading unit.

The second loading unit may further include a second connecting unit connecting the second unloading unit and the third loading unit.

In the present embodiment, the first direction and the second direction may be formed substantially perpendicular.

In this embodiment, it is provided with a plurality of chambers, and the chambers may be separable.

In this embodiment, the first evaporation unit may include a deposition material that forms one of a red light emitting layer, a green light emitting layer, and a blue light emitting layer.

In this embodiment, the second evaporation unit includes an evaporation material that forms one of the red emission layer, the green emission layer, and the blue emission layer, which is different from the layer formed in the first evaporation unit.

In this embodiment, the third evaporation portion may be formed by depositing a deposition material which forms one of the red deposition layer, the green emission layer, and the blue emission layer other than the first deposition portion and the second deposition portion Device.

According to another embodiment of the present invention, there is provided a method of manufacturing an organic light emitting display device using a deposition apparatus for forming an organic layer on a substrate, the method comprising: fixing the substrate in a first pattern layer deposition mask in a first loading section; In the first deposition unit, the substrate is relatively moved with respect to the first deposition unit by the first transfer unit while the substrate fixed to the pattern layer deposition mask is spaced apart to a predetermined degree, Depositing a divergent deposition material on the substrate to form an intermediate layer; Separating the substrate on which the deposition is completed in the first unloading portion in the first pattern layer deposition mask; And transferring the first pattern layer deposition mask separated from the first return portion from the first unloading portion to the first loading portion, wherein the step of forming the intermediate layer comprises: And the intermediate layer is transported in a second direction different from the first direction and then transported in a third direction different from the first direction and the second direction to form the intermediate layer. , A method of manufacturing an organic light emitting display device is disclosed.

In the present embodiment, the evaporation material may be patterned on the substrate in a predetermined shape.

In the present embodiment, the step of forming the intermediate layer may include forming a pattern layer of any one of a red light emitting layer, a green light emitting layer, and a blue light emitting layer on the substrate.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

The space efficiency and the manufacturing efficiency are improved by the deposition apparatus according to the embodiments of the present invention and the manufacturing method of the organic light emitting display device using the same.

1 is a plan view of a system configuration schematically showing a deposition apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of a system configuration schematically showing the first deposition unit of FIG. 1; FIG.
Fig. 3 is a conceptual diagram of a system configuration schematically showing the first deposition unit of Fig. 1. Fig.
4 is a plan view of a system configuration schematically showing a deposition apparatus according to another embodiment of the present invention.
5 is a partial cross-sectional view of an active matrix organic light emitting display device manufactured using the deposition apparatus of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms. In the following embodiments, the terms first, second, and the like are used for the purpose of distinguishing one element from another element, not the limitative meaning. Also, the singular expressions include plural expressions unless the context clearly dictates otherwise. Also, the terms include, including, etc. mean that there is a feature, or element, recited in the specification and does not preclude the possibility that one or more other features or components may be added. Also, in the drawings, for convenience of explanation, the components may be exaggerated or reduced in size. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

FIG. 1 is a plan view of a system configuration schematically showing a deposition apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a system configuration schematically showing a first vapor deposition unit of FIG. 1, 1 is a conceptual diagram of a system configuration schematically showing a first deposition unit.

Referring to FIGS. 1 to 3, a deposition apparatus 1000 according to an embodiment of the present invention includes a first deposition assembly 100, a second deposition assembly 200, a third deposition assembly 300, 10, an outlet portion 20, a first connection portion 30, and a second connection portion 40.

The first deposition assembly 100 includes a first loading unit 110, a first deposition unit 120, a first unloading unit 150, and a first return unit 160.

In the first loading part 110, the substrate 50 introduced from the inlet part 10 and the first pattern layer deposition mask 5a are engaged. The first pattern layer deposition mask 5a is closely adhered to the surface of the substrate 50 to be deposited in order to deposit the deposition material in a pattern formed on the first pattern layer deposition mask 5a on the substrate 50 in detail. do.

The first deposition unit 120 includes a first transfer unit 130 for transferring the substrate 50 and a first deposition unit 140 for depositing and heating the deposition material and radiating the deposition material. The first deposition unit 120 is connected to one side of the first loading unit 110 and receives the substrate 50 from the first loading unit 110 to deposit a predetermined deposition material on the substrate 50 Role.

The first transfer unit 130 may include a first direction transfer unit 131, a second direction transfer unit 132 and a third direction transfer unit 133. Each transfer unit may include a plurality of chambers. The first direction (A), the second direction (B), and the third direction (C) indicate the moving direction of the substrate and can be expressed in different directions. For example, the first direction A and the second direction B may be orthogonal, and the second direction B and the third direction C may be orthogonal. In the first direction A and the second direction B, The three directions C may be formed in parallel in the opposite direction. The first conveying unit 130 may be formed in a U-shape by combining the first direction conveying unit 131, the second direction conveying unit 132, and the third direction conveying unit 133. Although the embodiment of the present invention has shown that the substrate is transported along the first direction, the second direction and the third direction, the present invention is not limited thereto, and the structure of the first transfer part 130, The number of conveyance portions in accordance with the conveyance direction or direction of the substrate 50 can be changed in accordance with the arrangement of the conveyance portions 120. [

Although the first transfer part 130 is formed in a roller shape and the substrate 50 to which the first pattern layer deposition mask 5a is coupled is shown to be transferred by the rotational driving of the rollers, Various members capable of linearly moving the first pattern layer deposition mask 5a such as a linear motor guide and a magnetic levitation member may be applicable as the first transfer unit 130. [

The first transfer unit 130 may include a first rotation unit 134a for transferring the substrate 50 along the first direction transfer unit 131 and then transferring the substrate 50 to the second direction transfer unit 132. [ The first rotation part 134b may be provided to transfer the substrate 50 along the second direction transfer part 132 and then transfer the substrate 50 to the third direction transfer part 133. [ The rotation unit 134 may be formed of a member capable of changing the moving direction of the substrate 50. For example, it may be formed of a roller or a magnetic levitation member to change the moving direction of the substrate 50. Further, the rotation unit 134 may change the moving direction of the substrate 50 by forming a robot structure.

In the first deposition unit 140, the deposition material is radiated through a nozzle (not shown), and deposition is performed on the substrate 50 as the deposition material is vaporized. In addition, an organic material for forming an organic layer (light emitting layer, etc.) of the organic light emitting display device may be contained as an evaporation material. Here, it is appropriate that all configurations of the first deposition unit 140 are maintained at a proper degree of vacuum. This is to ensure the straightness of the deposition material.

In the first deposition unit 140, a plurality of deposition chambers 141, 142, and 149 having deposition materials are disposed below the first transfer unit 130. Nine deposition chambers of the first deposition chamber 141 and the second deposition chamber 142 to the ninth deposition chamber 149 are provided, but the number may be changed according to the deposition material and the deposition conditions.

In the first unloading unit 150, the substrate 50 on which the deposition is completed while passing through the first deposition unit 120 is separated from the first pattern layer deposition mask 5a. Or a process of separating the substrate 50 and the first pattern layer deposition mask 5a from the first unloading section 150 in order to redeposit the deposited substrate 50 while passing through the first deposition unit 120 Can be omitted.

The first return unit 160 is configured to return the first pattern layer deposition mask 5a separated from the substrate 50 on which deposition is completed to the first loading unit 110 while passing through the first deposition unit 120 Can be performed. The substrate 50 which is not separated from the first pattern layer deposition mask 5a in the first unloading portion 150 is formed in the first unloading portion 150 in order to redeposit the deposited substrate 50 while passing through the first deposition unit 120. [ To the first loading unit 110. [0033] The first return portion 160 is formed of a member capable of moving the substrate 50. For example, a roller-shaped structure, a shuttle structure, or a robot-shaped structure.

The length of the first return unit 160 is determined by the distance between the first loading unit 110 and the first unloading unit 150. That is, the first return unit 160 performs the function of returning the substrate 50 or the first pattern layer deposition mask 5a from the first unloading unit 150 to the first loading unit 110, 1 distance between the loading unit 110 and the first unloading unit 150 determines the length of the first return unit 160. [

The first loading unit 110 and the first unloading unit 150 are connected to each other by the first deposition unit 120. The first loading unit 110 and the first unloading unit 150 are connected by the first deposition unit 120, The length is determined. The length of the first transfer unit 130 and the length of the first return unit 160 are equal to each other when the first transfer unit 130 of the first deposition unit 120 is formed only in an in- do. The length of the first return unit 160 is increased to return the substrate 50 or the first pattern layer deposition mask 5a from the first unloading unit 150 to the first loading unit 110. [

In the case of the structure in which the substrate 50 starts to be conveyed in the first loading part 110 and then returns to the first loading part 110 along the first conveying part, the length of the first return part 160 is shortened . The first transfer unit 130 of the first deposition unit 120 is provided with the first direction transfer unit 131, the second direction transfer unit 132 and the third direction transfer unit 133, and the first transfer unit 130 of each of the transfer units 131, 132, The first returning unit 110 and the first unloading unit 150 are shortened in length, so that the length of the first return unit 160 is shortened .

1, when the first direction transfer unit 131 and the third direction transfer unit 133 are disposed in parallel to each other, the length of the first return unit 160 is set to be shorter than the length of the second direction transfer unit 132, Lt; / RTI >

The second deposition unit 200 includes a second loading unit 210, a second deposition unit 220, a second unloading unit 250 and a second return unit 260, The second transfer unit 230 and the second deposition unit 240 are provided. The configuration of the second deposition assembly 200 is the same as or similar to that of the first deposition assembly 100, so that the same or similar parts as those described above will be omitted or outlined.

The second loading part 210 is connected to the first connecting part 30 and the first unloading part 150 connected to one side and the second deposition unit 220 is connected to the other side of the second loading part 210 . The substrate 50 separated from the first pattern layer deposition mask 5a in the first unloading portion 150 flows into the second loading portion 210 along the first connection portion 30. [ In the second loading unit 210, the second pattern layer deposition mask 5b and the substrate 50 are coupled. The second pattern layer deposition mask 5b is closely adhered to the surface of the substrate 50 to be deposited in order to deposit the deposition material in a pattern formed on the second pattern layer deposition mask 5b on the substrate 50 in detail. do.

The second unloading unit 250 is separated from the second pattern layer deposition mask 5b after the deposition of the substrate 50 is completed while the second unloading unit 250 passes through the second deposition unit 220. The separation process of the substrate 50 and the second pattern layer deposition mask 5b in the second unloading unit 250 is performed in order to redeposit the deposited substrate 50 while passing through the second deposition unit 220 Can be omitted.

In the second return unit 260, the second pattern layer deposition mask 5b separated from the substrate 50 passing through the second deposition unit 220 and being deposited is returned to the second loading unit 210 Can be performed. Or the substrate 50 that is not separated from the second pattern layer deposition mask 5c in the second unloading portion 250 in order to redeposit the deposited substrate 50 while passing through the second deposition unit 220, To the second loading unit 210. In this case,

The third deposition assembly 200 includes a third loading unit 310, a third deposition unit 320, a third unloading unit 350 and a third return unit 360, and the third deposition unit 320 Includes a third transfer part 330 and a third deposition part 340. The configuration of the third deposition assembly 300 is the same as or similar to the configuration of the first deposition assembly 100 or the second deposition assembly 200, so that the same or similar parts as those described above will be omitted or outlined.

The third loading unit 310 is connected to the second connecting unit 40 and the third unloading unit 350 connected to the third loading unit 310 and the third deposition unit 320 is connected to the other loading unit 310 . The substrate 50 separated from the second pattern layer deposition mask 5b in the second unloading unit 250 flows into the third loading unit 310 along the second connection unit 40. [ In the third loading unit 310, the substrate 50 is joined to the mask pattern 5c of the third pattern layer. The third pattern layer deposition mask 5c is closely adhered to the surface of the substrate 50 to be deposited in order to deposit the deposition material in the pattern formed on the third pattern layer deposition mask 5c on the substrate 50 in detail. do.

In the third unloading unit 350, the substrate 50, which has been deposited while passing through the third deposition unit 320, is separated from the third pattern layer deposition mask 5c. The separation process of the substrate 50 and the third pattern layer deposition mask 5c in the third unloading section 350 is performed in order to redeposit the deposited substrate 50 while passing through the third deposition unit 320, Can be omitted.

The third return unit 360 is configured to return the third pattern layer deposition mask 5c separated from the substrate 50 which has been deposited while passing through the third deposition unit 320 to the third loading unit 310 Can be performed. Or the substrate 50 that is not separated from the third pattern layer deposition mask 5c in the third unloading portion 350 in order to redeposit the deposited substrate 50 through the third deposition unit 320, To the third loading unit (310).

The substrate 50 on which the third pattern layer deposition mask 5c is separated from the third unloading portion 350 is discharged through the outlet portion 20. [

4 is a plan view of a system configuration schematically showing a deposition apparatus according to another embodiment of the present invention.

Referring to FIG. 4, a deposition apparatus 2000 according to another embodiment of the present invention may include a first deposition assembly 100 ', a second deposition assembly 200', and a third deposition assembly 300 ' have. The deposition apparatus 2000 according to another embodiment of the present invention is a deposition apparatus that further includes an extension deposition unit 135 'in the deposition apparatus 1000 according to an embodiment of the present invention described above. Therefore, the same or similar parts as those described above will be omitted or outlined.

The first transfer part 130 'may be formed of a plurality of detachable chambers. In one embodiment of the present invention, the first direction transfer unit 131 'and the third direction transfer unit 133' are respectively provided with three chambers and the second direction transfer unit 132 'is provided with one chamber. Since the chambers can be separated from each other, it is possible to add or reduce the deposition material to be deposited in the first transfer part 130 '.

That is, to add a new deposition material, the chamber forming the first transfer part 130 'is separated, and the extension unit 135' having the new deposition material is added and then reconnected to the first transfer part 130 ' Can be formed. In order to remove the existing deposition material, the chamber including the deposition material to be removed may be removed and reconnected to form the first transfer part 130 '.

For example, the extended deposition unit 135 'may be additionally disposed by separating the first direction transfer unit 131' and the rotation unit 134a 'of the first transfer unit 130'. In addition, the extended deposition unit 135 'may be additionally disposed by separating the third direction transfer unit 133' and the rotation unit 134b 'of the first transfer unit 130'.

It is also possible to add extension deposition units 235 'and 335' having a new deposition material in the second transfer unit 230 'and the third transfer unit 330', and in order to remove the existing deposition material, The chamber can be removed. This is the same as or similar to the one described above, and thus a detailed description thereof will be omitted.

5 is a partial cross-sectional view of an active matrix organic light emitting display device manufactured using the deposition apparatus of FIG. 1

Referring to FIG. 5, various components of an organic light emitting display device are formed on a substrate 50. The substrate 50 may be formed of a transparent material such as a glass material, a plastic material, or a metal material.

A common layer such as a buffer layer 51, a gate insulating film 53 and an interlayer insulating film 55 may be formed on the entire surface of the substrate 50 on the substrate 50 and the channel region 52a, A patterned semiconductor layer 52 including a source contact region 52b and a drain contact region 52c may be formed and a gate electrode 54 serving as a constituent of the thin film transistor TFT together with the patterned semiconductor layer, An electrode 56 and a drain electrode 57 may be formed.

A protective film 58 covering the thin film transistor TFT and a planarizing film 59 positioned on the protective film 58 and having a substantially flat upper surface may be formed on the entire surface of the substrate 50. [

On the planarizing film 59 are provided a patterned pixel electrode 61, a counter electrode 62 substantially corresponding to the entire surface of the substrate 50, and a light emitting layer interposed between the pixel electrode 61 and the counter electrode 62 The organic light emitting device OLED including the intermediate layer 63 of a multi-layered structure is disposed. The pixel electrode 61 may be electrically connected to the thin film transistor TFT via a via hole. Of course, the pixel defining layer 60 covering the edge of the pixel electrode 61 and having an opening defining each pixel region may be formed on the planarization layer 59 so as to approximately correspond to the entire surface of the substrate 50.

For example, the intermediate layer 63 may be formed using a deposition apparatus according to the above-described embodiments or a manufacturing method of an organic light emitting display device to be described later. For example, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL) An electron injection layer (EIL) or the like may be formed using a deposition apparatus according to the above-described embodiments or a manufacturing method of an organic light emitting display device to be described later.

A method of manufacturing an organic light emitting display device using the deposition apparatus 1000 shown in FIGS. 1 and 2 will now be described.

Each of the nine deposition chambers shown in FIG. 2 may be used to deposit an intermediate layer each including a light emitting material that emits red light of the organic light emitting display device.

As an example of the arrangement of the nine deposition chambers, the first deposition chamber 141 and the second deposition chamber 142 have a deposition material for a hole injection layer (HIL), and the third deposition chamber 143 ), The fourth deposition chamber 144 and the fifth deposition chamber 145 have a deposition material for a hole transport layer (HTL), the sixth deposition chamber 146 has a deposition material for a red emission layer The seventh deposition chamber 147 and the eighth deposition chamber 148 are provided with an electron transport layer (ETL) deposition material and the ninth deposition chamber 149 has an electron injection layer (EIL) ) Deposited on the substrate. Of course, the arrangement of such deposition assemblies will vary. In addition, the deposition assembly not used for deposition may not be filled with the deposition material.

In addition, the nine deposition chambers can be used to form an intermediate deposition layer including a luminescent material that emits green light of the organic light-emitting display device by forming a second deposition portion. At this time, the sixth deposition chamber (not shown) of the second deposition section may be replaced with a deposition chamber having the deposition material for the green emission layer.

In addition, the nine deposition chambers may be used to deposit an intermediate layer comprising a luminescent material that emits blue light of the organic light emitting display device by forming a third deposition portion. At this time, the sixth deposition chamber (not shown) of the third deposition section may be replaced with a deposition chamber having a deposition material for the blue emission layer.

In the first loading portion, the substrate 50 introduced through the inlet portion 10 and the first pattern layer deposition mask 5a are engaged. That is, the substrate 50 is aligned and bonded to the first pattern layer deposition mask 5a in order to deposit the red light emitting layer deposition material on the substrate 50 in a pattern.

The substrate 50 is transferred to the first transfer unit 130 of the first deposition unit 120 and is deposited by evaporation in nine deposition chambers of the first deposition unit 140 disposed under the first transfer unit 130 The material is deposited on the substrate 50. At this time, the deposition material for the red light emitting layer is laminated on the substrate while passing through the sixth deposition chamber 146 having the deposition material for the red light emitting layer to form an intermediate layer for emitting red light.

The substrate 50 and the first pattern layer deposition mask 5a are separated in the first unloading section 150 and the substrate 50 is transferred to the second loading section 210 through the first connection section 30. [ And the first pattern layer deposition mask 5a is returned to the first loading unit 110 through the first return unit 160. [

In the second loading portion 210, the substrate 50 is engaged with the second pattern layer deposition mask 5b. That is, the substrate 50 and the second pattern layer deposition mask 5b are aligned and bonded in order to deposit the green emission layer deposition material on the substrate 50 in a pattern.

The substrate 50 is transferred to the second transfer part 230 of the second deposition unit 220 and is deposited by evaporation in nine deposition chambers of the second deposition part 240 disposed under the second transfer part 230 The material is deposited on the substrate 50. At this time, the deposition material for the green light emitting layer is laminated on the substrate while passing through the sixth deposition chamber (not shown) of the second deposition unit 240 having the deposition material for the green light emitting layer to form an intermediate layer which emits green light.

The substrate 50 and the second pattern layer deposition mask 5b are separated from each other in the second unloading unit 250 and the substrate 50 is transferred to the third loading unit 310 through the second connection unit 40 And the second pattern layer deposition mask 5b is returned to the second loading unit 210 through the second return unit 260. [

In the third loading portion 310, the substrate 50 is engaged with the third pattern layer deposition mask 5c. That is, the substrate 50 and the third pattern layer deposition mask 5c are aligned and bonded in order to deposit the deposition material for the blue light emitting layer on the substrate 50 in a pattern.

The substrate 50 is transferred to the third transfer section 330 of the third deposition unit 320 and is deposited in the deposition chamber 340 of the third deposition section 340 disposed under the third transfer section 330, The material is deposited on the substrate 50. At this time, the deposition material for the blue light emitting layer is deposited on the substrate 50 by passing through the sixth deposition chamber (not shown) of the third deposition unit 340 having the deposition material for the blue light emitting layer to form an intermediate layer which emits blue light .

The substrate 50 and the third pattern layer deposition mask 5c are separated in the third unloading section 350 and the substrate 50 is transferred to the outlet section 20 through the third connection section 40, And the third pattern layer deposition mask 5c is returned to the third loading unit 310 through the third return unit 360. [

Therefore, by using the deposition apparatus 1000 according to an embodiment of the present invention shown in FIGS. 1 and 2, a plurality of sub-pixels are formed by using the pattern layer deposition mask 5, The organic light emitting display device of the RGB type having sub-pixels emitting red, green and blue sub-pixels can be manufactured.

When the deposition material is deposited on the substrate 50 by using the pattern layer deposition mask 5 according to the color of the light emitted from the light emission layer, the kind of the mask 5, the type of the mask 5, ) Can be minimized to reduce the operation cost of the manufacturing facility, thereby improving the operation rate and yield of the deposition facility. In addition, since the patterns can be deposited with different pattern shapes and pattern sizes according to the pattern layer deposition mask 5, it is possible to operate the flexible deposition system.

The shape of the transfer parts 130, 230, and 330 for depositing the evaporation material may be U-shaped to minimize the return period of the pattern layer deposition mask 5, thereby ensuring an efficient installation space of the deposition apparatus. Further, unlike the conventional in-line facility or cluster-type deposition facility, when a deposition material is to be added later, the transfer unit 130, 230, or 330 is separated and a deposition chamber having a deposition material to be added is added, .

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the exemplary embodiments, and that various changes and modifications may be made therein without departing from the scope of the present invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

5: Pattern layer vapor deposition mask
50: substrate
100, 100 ": first deposition assembly
110: first loading section
120: first deposition unit
130: First transfer part
134:
135 ', 235', 335 ': extension deposition unit
140: first deposition unit
150: First unloading section
160: first return portion
200, 200 ': a second deposition assembly
210: a second loading section
220: second deposition unit
230: Second transfer part
240: second deposition unit
250: second unloading portion
260: second return portion
300, 300 ': third deposition assembly
310: Third loading section
320: third deposition unit
330: Third transfer section
340: Third deposition unit
350: third unloading section
360: third return section
1000, 2000: Deposition device

Claims (18)

A deposition apparatus for depositing a thin film on a substrate,
A first loading unit coupling the substrate and the first pattern layer deposition mask;
A first deposition unit connected to the first loading unit and including a first deposition unit for emitting a deposition material and a first transfer unit for transferring the substrate; And
And a first unloading portion connected to the first deposition unit for separating the substrate from the first pattern layer deposition mask.
Wherein the first transfer unit transfers the substrate in a first direction and transfers the substrate in a second direction different from the first direction and then transfers the substrate in a third direction different from the first direction and the second direction. Deposition apparatus. The method according to claim 1,
And a first returning part for transferring the first pattern layer deposition mask separated from the first unloading part to the first loading part. The method according to claim 1,
Wherein the first transfer unit is in the form of a " U " character. 3. The method of claim 2,
Wherein a length of the first return portion is shorter than a length of the first transfer portion. The method according to claim 1,
A second loading unit coupling the substrate and the second pattern layer deposition mask;
A second deposition unit connected to the second loading unit, the second deposition unit including a second deposition unit for emitting a deposition material, and a second transfer unit for transferring the substrate; And
And a second unloading unit coupled to the second deposition unit for separating the substrate from the second pattern layer deposition mask.
Wherein the second transfer unit transfers the substrate in a first direction and transfers the substrate in a second direction different from the first direction and then transfers the substrate in a third direction different from the first direction and the second direction. Deposition apparatus. 6. The method of claim 5,
And a second return unit for transferring the second pattern layer deposition mask separated by the second unloading unit to the second loading unit, 6. The method of claim 5,
And a first connection part connecting the first unloading part and the second loading part, 6. The method of claim 5,
A third loading unit for coupling the substrate and the third pattern layer deposition mask;
A third deposition unit connected to the third loading unit, the third deposition unit including a third deposition unit for emitting a deposition material, and a third transfer unit for transferring the substrate; And
And a third unloading unit connected to the third deposition unit for separating the substrate from the mask for depositing the third pattern layer,
Wherein the third transfer unit transfers the substrate in a first direction and transfers the substrate in a second direction different from the first direction and then transfers the substrate in a third direction different from the first direction and the second direction. Deposition apparatus. 9. The method of claim 8,
And a third returning part for transferring the third pattern layer deposition mask separated by the third unloading part to the third loading part, 9. The method of claim 8,
And a second connecting portion connecting the second unloading portion and the third loading portion, The method according to claim 1,
Wherein the first direction and the second direction are substantially perpendicular. The method according to claim 1,
The first transfer unit
Wherein the chamber is provided with a plurality of chambers, and the chamber is separable. 9. The method of claim 8,
The first deposition unit may include:
And a deposition material for forming any one of a red luminescent layer, a green luminescent layer, and a blue luminescent layer. 9. The method of claim 8,
The second vapor-
And a deposition material for forming any one of the red, green, and blue light emitting layers other than the one formed in the first evaporation portion. 9. The method of claim 8,
The third deposition unit may include:
And a deposition material for forming any one of the red emission layer, the green emission layer, and the blue emission layer, which is different from the first deposition portion and the second deposition portion. A method of manufacturing an organic light emitting display device using a deposition apparatus for forming an organic layer on a substrate,
Fixing the substrate to the first pattern layer deposition mask in a first loading portion;
In the first deposition unit, the substrate is relatively moved with respect to the first deposition unit by the first transfer unit while the substrate fixed to the pattern layer deposition mask is spaced apart to a predetermined degree, Depositing a divergent deposition material on the substrate to form an intermediate layer;
Separating the substrate on which the deposition is completed in the first unloading portion in the first pattern layer deposition mask; And
And transferring the first pattern layer deposition mask separated from the first return portion from the first unloading portion to the first loading portion,
The step of forming the intermediate layer may include transferring the substrate in a first direction along the direction of the first transfer unit and transferring the substrate in a second direction different from the first direction, And the intermediate layer is transported in a third direction to form the intermediate layer. 17. The method of claim 16,
Wherein the deposition material is patterned to have a predetermined shape on the substrate. 17. The method of claim 16,
The step of forming the intermediate layer may include:
Wherein at least one of a red light emitting layer, a green light emitting layer, and a blue light emitting layer is formed as a pattern layer on the substrate.

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