KR20150048492A - user interface apparatus - Google Patents

Abstract

The present invention relates to a user interface apparatus having a structure which includes a dielectric layer for improving the sensitivity of a sensor module. A user interface according to one embodiment of the present invention comprises: a sensor module which senses a radio frequency (RF) signal occurred by contacting human body and perceives the RF signal by converting the same into an electrical signal; and a dielectric layer formed on the upper part of the sensor module.

Description

[0001] USER INTERFACE APPARATUS [0002]

The present invention relates to an interface device for an electronic device, and more particularly, to an interface device having an improved structure for enhancing sensing sensitivity.

Examples of the pointing device, which is an example of the user interface, include a pointing device such as a mouse and the like. The pointing device includes a mobile pointing device (hereinafter referred to as a 'pointing device') directly mounted on a mobile phone body.

The pointing device can move the pointer on the screen according to the displacement value of a moving object (e.g., a finger) on the surface of the pointing device.

The pointing device may use an electric field or the like to detect and track the movement of the subject. The pointing device may include a fingerprint recognition sensor module that recognizes the user fingerprint using an electric field and senses the movement of the finger .

Meanwhile, as mobile devices such as mobile phones have recently become smart, user demands for security and convenience have increased, and mobile electronic devices that are considering mounting of the fingerprint recognition sensor module are increasing.

Generally, the fingerprint sensor module includes a sensor module for sensing an RF (Radio Frequency) signal (e.g., fingerprint information), a separate connector for electrically connecting the sensor module to the electronic device, . ≪ / RTI >

In the case of the fingerprint recognition sensor module, since it is manufactured in a COF (Chip on Flex) type, it is advantageous to be employed in a mobile electronic device which is reduced in size and weight. However, in the process of implementing the structure for supporting and protecting the sensor module mechanically in manufacturing the COF type product, there is a problem that the sensing sensitivity is lowered due to the thickness of the layer that mechanically surrounds the sensor module.

In order to mechanically support and protect the sensor module, a structure having a certain thickness or more should be realized. However, there is a problem that the sensing sensitivity is lowered. On the contrary, if the structure for supporting and protecting the sensor module is thin for the purpose of improving the sensing sensitivity, it is difficult to obtain an apparently flat surface due to the sensor module enclosing the structure.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a user interface device having a structure including a dielectric layer to improve the sensitivity of a sensor module.

According to an aspect of the present invention, there is provided a user interface device including a sensor module for sensing an RF (Radio Frequency) signal generated in contact with a human body, And a dielectric layer formed on the upper portion.

Further, the dielectric layer may be a resin layer containing at least one filler selected from the group including polymers, metals and ceramics.

The ceramic filler may include at least one selected from the group consisting of BaTiO3 (barium titanate), lead magnesium niobate-lead titanate (PMN-PT), barium strontium titanate (BST) or lead zirconium titanate (PZT).

In addition, the dielectric constant of the dielectric layer may range from 3 to 97.

The sensor module may further include an integrated circuit electrically connected to the at least one sensor electrode, a first circuit substrate positioned above the integrated circuit and below the dielectric layer, the first circuit substrate having at least one sensor electrode, A second circuit board positioned below the integrated circuit, a molding layer provided under the first circuit board to protect the integrated circuit from the outside and surrounding the integrated circuit, and a connection part electrically connecting the first circuit board and the second circuit board, . ≪ / RTI >

Also, the sensor module may include at least one sensor electrode, an integrated circuit electrically connected to the at least one sensor electrode, at least one signal transfer path for transferring signals sensed by the at least one sensor electrode to the integrated circuit, A connecting member located between the integrated circuit and the first circuit board for electrically connecting the integrated circuit and the first circuit board, and an integrated circuit provided below the first circuit board for protecting the integrated circuit from the outside, And a molding layer surrounding the connecting member.

The display device may further include a coating layer provided on an upper end of the dielectric layer to provide various colors and patterns.

As described above, the user interface device according to one aspect of the present invention can provide the following effects.

First, the present invention maximizes the recognition rate of the user interface device by increasing the sensitivity of the sensor layer by increasing the dielectric constant of the resin layer surrounding the sensor module.

In addition, it is possible to compensate for the surface curvature or level difference of the sensor module or the structure supporting the sensor module without deteriorating the sensor sensitivity, so that an apparently flat surface can be obtained.

1 is a cross-sectional view illustrating a user interface device according to an exemplary embodiment of the present invention.
FIG. 2 is a graph showing a change in the dielectric constant depending on the amount of filler added.
FIG. 3 is a view showing the types of fillers used in the dielectric constant measurement experiment for deriving the results of FIG. 2. FIG.
4 is a view showing a user interface device according to another embodiment including a paint layer.
5 is a cross-sectional view illustrating a user interface device according to another embodiment.
6 is a cross-sectional view illustrating a user interface device according to another embodiment.
7 is a perspective view showing an electronic device including a user interface device according to an embodiment.
8 is an enlarged view of a part of the electronic apparatus shown in Fig.

The embodiments described herein and the configurations shown in the drawings are merely exemplary embodiments of the present invention, and various modifications may be made at the time of filing of the present application to replace the embodiments and drawings of the present specification.

In this specification, a dielectric layer refers to a resin layer to which a high dielectric constant material is added, and it is defined that the dielectric layer and the resin layer are the same structure.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a user interface device according to an exemplary embodiment of the present invention.

As shown in FIG. 1, the user interface device according to an exemplary embodiment includes a sensor module for sensing an RF (Radio Frequency) signal generated in contact with a human body and converting the RF signal into an electrical signal, .

The sensor module includes an integrated circuit 10, a first circuit substrate 20, a second circuit substrate 30, a molding layer 40, and a connection 50.

The integrated circuit 10 computes a signal sensed by at least one sensor electrode 21 included in the first circuit board 20.

The first circuit substrate 20 is located on top of the integrated circuit 10 and may include at least one sensor electrode 21. [ At least one sensor electrode 21 senses an electrostatic signal derived from a ridge and a valley of the fingerprint to detect a user's fingerprint. The electrostatic signal sensed by the at least one sensor electrode 21 is converted into an electrical signal and amplified through an amplifier (not shown), and the electrostatic signal amplified by the connector (50) or the second circuit board 30 (Not shown) of the user interface device 1 through a connector (not shown).

The first circuit board 20 may have a structure in which a plurality of circuit layers 24, 25 and 26 are laminated. The plurality of circuit layers 24, 25, and 26 included in the first circuit board 20 are arranged such that a signal sensed by at least one sensor electrode 21 through rearrangement is placed under the first circuit board 20 To the integrated circuit (10). The driving element (not shown) of the integrated circuit 10, which is liable to be damaged by an external impact, constitutes the first circuit board 20 from the surface of the first circuit board 20, 25, 26 by the thickness of the plurality of circuit layers 24, 25, 26 that are formed on the first circuit substrate 20.

At least one signal transfer path 23 may be formed on the first circuit board 20 so that signals sensed by at least one sensor electrode 21 may be transmitted to the integrated circuit 10. [ At least one signal travel path 23 may include a first circuit layer 24, a second circuit layer 25, and a micro via 27.

At least one sensor electrode 21 may be located in the first circuit layer 24 and at least one electrode 28 may be located in the second circuit layer 25 provided under the first circuit layer 24. [ can do. The first circuit layer 24 and the second circuit layer 25 may be electrically connected by a microvias 27.

The at least one signal travel path 23 may further comprise at least one third circuit layer 26. At least one third circuit layer 26 may be located between the first circuit layer 24 and the second circuit layer 25. The first circuit layer 24, the at least one third circuit layer 26 and the second circuit layer 25 may have a stacked structure in the direction of the integrated circuit 10, Electrically connects the circuit layer 24, the at least one third circuit layer 26, and the second circuit layer 25 to each other.

The number of the plurality of circuit layers 24, 25, 26 included in the first circuit substrate 20 is equal to the number of the first circuit layer 24, the at least one third circuit layer 26 and the second circuit layer 25, The number of the plurality of circuit layers 24, 25, and 26 may be counted based on the number of the metal layers provided.

The first circuit substrate 20 may contain ceramic or metal fillers for durability reinforcement, stiffness reinforcement, thermal expansion coefficient complements, and dielectric constant control.

The second circuit board 30 may be provided under the integrated circuit 10 and may be electrically connected to the first circuit board 20. The signal sensed by the at least one sensor electrode is transmitted to the integrated circuit 10 through at least one signal path 23 formed in the first circuit board 20, Is transferred to the second circuit board (30). The signal transmitted to the second circuit board 30 can be transmitted to another electronic component through an output terminal (not shown) formed at one end of the second circuit board 30. [

The second circuit board 30 includes a printed circuit board, a flexible printed circuit board, a rigid flex board (a board having both a hard portion and a flexible portion) and a rigid flex separated bonded board A substrate on which a hard substrate and a soft substrate are bonded and a hard portion and a soft portion coexist) may be included. The molding layer 40 is provided under the first circuit board 20 to protect the integrated circuit 10 from external environments such as external shocks and changes in temperature and humidity. The molding layer 40 may wrap the integrated circuit 10.

The molding layer 40 may contain a ceramic or metal filler for stiffening reinforcement, complementing the coefficient of thermal expansion of the molding layer 40, and controlling the dielectric constant.

The connection portion 50 can electrically connect the first circuit board 20 and the second circuit board 30. [ The connection part 50 may include a through mold via which the first circuit board 20 and the second circuit board 30 are electrically connected to each other through the molding layer 40. The connection portion 50 may be filled with a conductive material so that the signal of the integrated circuit 10 can be transmitted to the second circuit board 30. [

The connection 50 may be bonded to the second circuit board 30 by one of gold tin eutectic bonding, ACA / NCA bonding, solder bonding and gold-gold bonding. Solder joints may include through-hole soldering and hot-bar soldering.

A resin layer including at least one filler selected from the group including polymers, metals, and ceramics may be formed on the sensor module in order to increase the sensing sensitivity of the contact surface contacting the human body. The resin layer formed above the sensor module includes a filler having a high dielectric constant to increase the sensing sensitivity. Hereinafter, a resin layer having improved permittivity is defined as a dielectric layer.

FIG. 2 is a graph showing the change of the dielectric constant depending on the amount of filler added, and FIG. 3 is a view showing the kind of filler used in the dielectric constant measurement experiment for deriving the result of FIG. In FIG. 2, the horizontal axis represents the amount of filler (unit vol%) added for the measurement of the dielectric constant, and the vertical axis represents the dielectric constant change according to the amount of the filler added.

For measurement of dielectric constant change, BaTiO3 (BT) and SrTiO3 (ST) were added to ECFs (Epoxy / BaTiO3 composite embedded capacitor films) resin. In FIG. 2, B5 denotes the size of the BT particle, and FIGS. 3 (a) to 3 (e) indicate B1 to B5, which means larger particles from B1 to B5. 3 (f) corresponds to S1 in Fig. 2 and means ST particles.

Referring to FIG. 2, it can be seen that the permittivity rises with the addition of BT and ST. More specifically, the dielectric constant rapidly increases as the amount of the filler added increases, and the amount of the filler reaches a maximum value (in the range of 30-70 in the dielectric constant) when it reaches 55-60 vol%. In addition, the permittivity decreases sharply as the filler is added at the peak of 30-70.

The reason for the decrease in the dielectric constant in the range of 55 to 60 vol% or more of the filler is that bubbles are generated inside the ECFs beyond the maximum packing density of the ECFs when a filler of 55-60 vol% or more is added in the process. Therefore, the amount of the filler to be added should be appropriately controlled, and the amount of the filler to be added is preferably determined within the range of 40-60 vol%, depending on the type of the filler.

As the filler included in the dielectric layer, various types can be used as described above, and ceramic fillers among these fillers can be mainly used. More specifically, the ceramic filler may include at least one selected from the group consisting of BaTiO3 (barium titanate), lead magnesium niobate-lead titanate (PMN-PT), barium strontium titanate (BST) or lead zirconium titanate .

The polymer, metal, and ceramic filler may be formed into various shapes including acicular, spherical, plate, and flake.

The user interface device of the present invention can maximize the recognition rate by increasing the dielectric constant of the resin layer formed on the sensor module by adding a filler having a high dielectric constant, and can increase the thickness of the resin layer according to the increased dielectric constant. More specifically, it is advantageous to compensate for the surface curvature and level difference of the sensor module without deteriorating the sensitivity of the sensor module, so that a more flat interface surface can be obtained.

4 is a view showing a user interface device 1b according to another embodiment including the coating layer L2. As shown in FIG. 1, the user interface device 1b may further include a painting layer L2. In FIG. 4, redundant description of the above-described components will be omitted.

The coating layer L2 may be provided on the dielectric layer, and various colors and patterns may be formed. The various patterns or patterns formed on the coating layer L2 can be displayed by at least one of printing, engraving and laser processing, and can be attached to the coating layer L2 in the form of a sticker.

5 is a cross-sectional view illustrating a user interface device according to another embodiment.

5, the user interface device 1c may include an integrated circuit 10a, a first circuit board 20a, a connecting member 60a, and a molding layer 40a. In FIG. 9, the same description of the components described above will be omitted.

The integrated circuit 10a processes signals sensed by at least one sensor electrode 21a and is electrically connected to at least one sensor electrode 21a.

The first circuit board 20a is located at an upper portion of the integrated circuit 10a and includes at least one signal movement path 23a for transmitting a signal sensed by the at least one sensor electrode 21a to the integrated circuit 10a. Can be formed. The first circuit board 20a may have a structure in which a plurality of circuit layers are arranged so that signals sensed by the at least one sensor electrode 21a are transmitted to the integrated circuit 10a, and the rigid- And a flexible separated bonded substrate.

At least one sensor electrode 21a may be provided inside the first circuit board 20a so as to be close to the surface of the first circuit board 20a in contact with the dielectric layer.

The first circuit board 20a may be bent so as to face each other with the integrated circuit 10a therebetween. More specifically, one end of the first circuit board 20a is provided with a receiving groove (not shown) formed on the bottom surface of the molding layer 40a provided below the first circuit board 20a to protect the integrated circuit 10a from the outside, Lt; / RTI > An output terminal (not shown) is formed at one end of the first circuit board 20a accommodated in the receiving groove (not shown) so that a signal sensed by the at least one sensor electrode 21a can be transmitted to other electronic devices . The first circuit substrate 20a provided on the upper and lower portions of the integrated circuit 10a is integrated with the first circuit substrate 20a provided on the upper and lower sides of the integrated circuit 10a, The connection can be omitted.

The integrated circuit 10a and the first circuit board 20a can be electrically connected by the connecting member 60a. The connection member 60a may be provided between the integrated circuit 10a and the first circuit board 20a located above the integrated circuit 10a. The connecting member 60 may include a solder bump.

6 is a cross-sectional view showing a user interface device 1d according to another embodiment of the present invention.

6, the user interface device 1d may include an integrated circuit 10b, a first circuit board 20b, a connecting member 60b, and a molding layer 40b. In FIG. 6, the same description of the components described above will be omitted.

The first circuit board 20b is disposed on the integrated circuit 10b and at least one sensor electrode 21b is disposed in the first circuit board 20b so that a signal sensed by the at least one sensor electrode 21b is transmitted to the integrated circuit 10b. A signal movement path 23b can be formed.

The molding layer 40b is provided under the first circuit board 20b to protect the integrated circuit 10b from the outside and includes a connection member 60b for electrically connecting the integrated circuit 10b and the first circuit board 20b, The integrated circuit 10b can be covered.

One end of the first circuit board 20b may be bent in the direction away from the integrated circuit 10b along the molding layer 40b. When one end of the first circuit board 20b is bent away from the integrated circuit 10b, a separate receiving groove (not shown) may not be formed on the bottom surface of the molding layer 40b.

FIG. 7 is a perspective view showing an electronic device 100 including a user interface device 1 according to an embodiment of the present invention. FIG. 8 is an enlarged view of a part of the electronic device 100 shown in FIG. Fig.

As shown in FIGS. 7 and 8, the electronic device 100 has a bar-shaped body. However, the body of the electronic device 100 is not limited to a bar shape, and can be applied to various structures such as a slide type, a folder type, a swing type, and a swivel type in which bodies are relatively movably coupled.

The body includes a casing forming the appearance. The body may be composed of a front casing 101, a rear casing 102 and a battery cover (not shown). Various electronic components are embedded in the space formed between the front casing 101 and the rear casing 102. At least one intermediate casing may be additionally disposed between the front casing 101 and the rear casing 102. [

The casings may be formed by injection molding a synthetic resin or may be formed to have a metal material such as stainless steel (STS), aluminum (Al), titanium (Ti) or the like.

A display module 104, an acoustic output unit 105, a camera 106, a user input unit 107, a microphone (not shown), an interface (not shown), and the like are disposed in the front casing 101 .

The display module 104 occupies most of the main surface of the front casing 101. A sound output unit 105 and a camera 106 are disposed in an area adjacent to one end of both ends of the display module 104 and a user input unit 107 and a microphone (not shown) are disposed in an area adjacent to the other end. The user input portion 107 may be disposed on the side surfaces of the front casing 101 and the rear casing 102. [

The user input unit 107 is operated to receive a command for controlling the operation of the electronic device 100 and may include a plurality of operation units (not shown). The operating units may also be referred to as a manipulating portion and may be employed in any manner as long as the user is operating in a tactile manner with a tactile impression.

The user input unit 107 may include a home key 108 in which the user interface device 1 of the present invention is embedded. At least one sensor electrode is provided in the user interface device 1, and at least one sensor electrode senses a difference in electrostatic capacity (an electrostatic signal) generated due to a difference in electrical characteristics between the finger and the bone of the fingerprint. The electrostatic signal is converted into an electrical signal, amplified through an amplifier (not shown), and transmitted to a microcomputer of the electronic device 100 through a connector such as a printed circuit board (not shown).

The user interface device 1 may be used as a home key 108 itself without any separate packaging process and may be used to support a user authentication mode using an electric field, a capacitor, a thermistor, .

In more detail, the user authentication mode refers to a mode of performing user authentication by contacting a body part such as a finger with a user interface device. For example, when the user places a finger on the user interface device, the user interface device recognizes the fingerprint of the user and compares the fingerprint data with the stored fingerprint data to verify whether the user is the authorized user or the authorized user having the right to use the content.

The user interface device may be provided in any device requiring an authentication procedure. For example, electronic devices, medical devices, and ATMs including information terminals, smart phones, game machines, PMPs, tablet PCs, and cameras can be included.

The foregoing has shown and described specific embodiments. However, it should be understood that the present invention is not limited to the above-described embodiment, and various changes and modifications may be made without departing from the technical idea of the present invention described in the following claims .

1 (1a, 1b, 1c, 1d): user interface device 10 (10a, 10b): integrated circuit
20 (20a, 20b): first circuit board 21 (21a, 21b): sensor electrode
23 (23a, 23b): Signal transfer path 24: First circuit layer
25: second circuit layer 26: third circuit layer
27: microvia 28: electrode
30: second circuit board 40 (40a, 40b): molding layer
50: connecting portion 60 (60a, 60b): connecting member
L2: Coating layer 100: Electronic device
101: front casing 102: rear casing
104: Display module 105: Acoustic output section
106: camera 107: user input
108: Home key 29: Resin layer

Claims (7)

A sensor module that senses an RF (Radio Frequency) signal generated in contact with a human body, and converts the RF signal into an electrical signal and recognizes the RF signal; And
And a dielectric layer formed on the sensor module. The method according to claim 1,
Wherein the dielectric layer is a resin layer including at least one filler selected from the group consisting of polymers, metals, and ceramics. 3. The method of claim 2,
Wherein the ceramic filler comprises at least one selected from the group consisting of BaTiO3 (barium titanate), lead magnesium niobate-lead titanate (PMN-PT), barium strontium titanate (BST) or lead zirconium titanate (PZT) User interface device. The method according to claim 1,
Wherein the dielectric constant of the dielectric layer has a range of 3-97. The method according to claim 1,
The sensor module includes:
An integrated circuit electrically connected to at least one sensor electrode;
A first circuit board positioned above the integrated circuit and below the dielectric layer, the at least one sensor electrode being provided;
A second circuit board electrically connected to the first circuit board and positioned under the integrated circuit;
A molding layer provided under the first circuit substrate to protect the integrated circuit from the outside, the molding layer surrounding the integrated circuit; And
And a connection unit electrically connecting the first circuit board and the second circuit board to each other. The method according to claim 1,
The sensor module includes:
An integrated circuit electrically connected to at least one sensor electrode;
A first circuit board located at an upper portion of the integrated circuit and having at least one signal movement path formed therein so that a signal sensed by the at least one sensor electrode is transmitted to the integrated circuit;
A connection member positioned between the integrated circuit and the first circuit board to electrically connect the integrated circuit and the first circuit board; And
And a molding layer provided under the first circuit substrate to protect the integrated circuit from the outside, the molding layer surrounding the integrated circuit and the connection member. The method according to claim 1,
And a coating layer provided on an upper end of the dielectric layer to provide various colors and patterns.

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