KR20140148421A - Method for manufacturing connecting body, and method for connecting electronic component - Google Patents

Method for manufacturing connecting body, and method for connecting electronic component Download PDF

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Publication number
KR20140148421A
KR20140148421A KR1020147029148A KR20147029148A KR20140148421A KR 20140148421 A KR20140148421 A KR 20140148421A KR 1020147029148 A KR1020147029148 A KR 1020147029148A KR 20147029148 A KR20147029148 A KR 20147029148A KR 20140148421 A KR20140148421 A KR 20140148421A
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South Korea
Prior art keywords
connection
irradiation
electronic component
substrate
light
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KR1020147029148A
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Korean (ko)
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KR102028466B1 (en
Inventor
게이스께 이나세
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데쿠세리아루즈 가부시키가이샤
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Publication of KR20140148421A publication Critical patent/KR20140148421A/en
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Publication of KR102028466B1 publication Critical patent/KR102028466B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
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    • H01L24/27—Manufacturing methods
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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Abstract

A step of disposing the electronic part 18 on the substrate 12 through the photo-curable adhesive 3 and a step of irradiating the adhesive 3 with light to cure the substrate 12, 18 are divided into a plurality of connection regions CH1 to CH5, and the timing of initiation of light irradiation is shifted for each of the connection regions CH1 to CH5 to be cured. Curing shrinkage of the photocurable adhesive is suppressed, and connection defects of the electronic parts are improved.

Figure P1020147029148

Description

[0001] METHOD FOR MANUFACTURING CONNECTING BODY, AND METHOD FOR CONNECTING ELECTRONIC COMPONENT [0002]

The present invention relates to a manufacturing method of a connection member to which an electronic component or the like is connected using a photocurable adhesive, and a connection method for connecting an electronic component or the like by using a photocurable adhesive.

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2012-68140, filed on March 23, 2012, the entirety of which is hereby incorporated by reference.

Conventionally, liquid crystal display devices are widely used as various display means such as a television, a PC monitor, a mobile phone, a portable game machine, a tablet PC, or a vehicle-mounted monitor. In recent years, in such a liquid crystal display device, from the viewpoint of fine pitching, lightweight and thinning, so-called COG (chip on glass) in which a liquid crystal driving IC is directly mounted on a substrate of a liquid crystal display panel, Called FOG (film on glass) in which a flexible substrate on which a driving circuit is formed is directly mounted on a substrate of a liquid crystal display panel is employed.

For example, as shown in Fig. 11, the liquid crystal display device 100 adopting the COG mounting method has a liquid crystal display panel 104 serving as a main function for liquid crystal display, and the liquid crystal display panel 104, Has two transparent substrates 102 and 103 opposed to each other including a glass substrate and the like. In the liquid crystal display panel 104, the two transparent substrates 102 and 103 are bonded to each other by the frame-shaped seal 105 and the space surrounded by the transparent substrates 102 and 103 and the seal 105 A panel display portion 107 in which the liquid crystal 106 is sealed is provided.

The transparent substrates 102 and 103 are formed so that a pair of striped transparent electrodes 108 and 109 including ITO (indium tin oxide) or the like cross each other on both inner surfaces opposed to each other. The transparent substrates 102 and 103 of the two transparent electrodes 108 and 109 constitute a pixel as a minimum unit of liquid crystal display.

One of the transparent substrates 103 and 103 has a larger planar dimension than that of the other transparent substrate 102. The edge 103a of the transparent substrate 103 is formed with a transparent electrode A terminal portion 109a of the terminal portion 109 is formed. Alignment films 111 and 112 subjected to a predetermined rubbing treatment are formed on both transparent electrodes 108 and 109 so that the initial alignment of the liquid crystal molecules is regulated by the alignment films 111 and 112. A pair of polarizers 118 and 119 are disposed outside the transparent electrodes 108 and 109. The polarizers 118 and 119 sandwich the polarizers 118 and 119 in the direction of vibration of the transmitted light from the light source 120 such as a backlight Is regulated.

A liquid crystal driving IC 115 is thermally bonded onto the terminal portion 109a via an anisotropic conductive film 114. [ The anisotropic conductive film 114 is made of a thermosetting type binder resin mixed with conductive particles to form a film. The anisotropic conductive film 114 is heated and pressed between the two conductors to electrically conduct the conductors to each other, / RTI > The liquid crystal driving IC 115 can selectively perform liquid crystal display by partially changing the orientation of the liquid crystal by selectively applying a liquid crystal driving voltage to the pixels. As an adhesive constituting the anisotropic conductive film 114, a thermosetting adhesive which is usually the most reliable is used.

When the liquid crystal driving IC 115 is connected to the terminal portion 109a via the anisotropic conductive film 114, an anisotropic conductive film 114 is firstly shown on the terminal portion 109a of the transparent electrode 109 It is pressurized by a pressurizing means. Subsequently, after the liquid crystal driving IC 115 is mounted on the anisotropic conductive film 114, the liquid crystal driving IC 115 is heated by the thermocompression bonding means 121 such as a thermocompression head as shown in Fig. 12, Together with the anisotropic conductive film 114, toward the terminal portion 109a while heating the thermocompression means 121. The anisotropic conductive film 114 causes a thermal curing reaction by the heat generated by the thermocompression means 121 so that the liquid crystal driving IC 115 is held on the terminal portion 109a via the anisotropic conductive film 114 .

However, in the connection method using such an anisotropic conductive film, the thermal pressurization temperature is high, and the thermal shock to the electronic components such as the liquid crystal driving IC 115 and the transparent substrate 103 becomes large.

Thus, a connection method using an ultraviolet curable adhesive instead of the anisotropic conductive film 114 using such a thermosetting adhesive has been proposed. In the connection method using an ultraviolet curing type adhesive, the adhesive flows softly by heat, and is sufficient to sandwich the conductive particles between the terminal portions 109a of the transparent electrodes 109 and the electrodes of the liquid crystal driving IC 115 And the adhesive is cured by irradiation with ultraviolet rays.

However, also in the connection method using such an ultraviolet curable adhesive, shrinkage of the adhesive occurs due to curing by ultraviolet irradiation. The gap between the transparent substrates 102 and 103 in the panel display portion 107 is reduced due to the occurrence of warping in the IC connection portion of the transparent substrate 103 that supports and supports the liquid crystal 106 due to the contraction, And the alignment of the liquid crystal is disturbed, which may cause problems such as display unevenness. In addition, there is a concern that defective connection to the IC connection portion of the transparent substrate 103 may cause connection failure of the liquid crystal driving IC 115.

WO00 / 46315

Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of bonding an electronic component at a low temperature by using an ultraviolet curable adhesive and suppressing deformation due to curing shrinkage of the adhesive, A method of manufacturing a connecting body, and a connecting method of an electronic part.

In order to solve the problems described above, a method of manufacturing a connector according to the present invention includes the steps of disposing an electronic component on a substrate via a photo-curable adhesive, and curing the adhesive by irradiating the adhesive with light, A region to which the substrate and the electronic component are connected is divided into a plurality of connection regions and a timing for starting irradiation of the light is shifted for each of the connection regions.

According to another aspect of the present invention, there is provided a method of connecting an electronic component, comprising the steps of disposing an electronic component on a substrate via a photo-curable adhesive, and irradiating the adhesive with light to cure the substrate, The area to be connected is divided into a plurality of connection areas, and the timing of starting irradiation of the light is staggered for each of the connection areas.

According to the present invention, by staggering the light irradiation timing, the curing start timing is different for each connection region, and connection between the electronic component and the substrate can be achieved while absorbing deformation due to curing shrinkage in each connection region sequentially .

1 is a cross-sectional view showing a mounting process to which the present invention is applied.
2 is a sectional view showing an anisotropic conductive film.
3 is a perspective view showing a connection region formed by connecting an electronic component and a glass substrate.
4A to 4D are plan views showing the start timing of the ultraviolet ray irradiation to which the present invention is applied.
5A and 5B are plan views showing another embodiment of the present invention.
6A to 6E are plan views showing another embodiment of the present invention.
7A to 7C are plan views showing another embodiment of the present invention.
8 is a plan view showing another embodiment of the present invention.
9 is a view for explaining a method of measuring a warpage of a glass substrate according to an embodiment and a comparative example.
10 is a view for explaining a method of measuring conduction resistance according to the embodiment and the comparative example.
11 is a cross-sectional view showing a conventional liquid crystal display panel.
12 is a cross-sectional view showing a COG mounting process of a conventional liquid crystal display panel.

Hereinafter, a manufacturing method and a connection method of a connector to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications may be made without departing from the gist of the present invention. Also, the drawings are schematic, and the ratios and the like of the respective dimensions may be different from the reality. The specific dimensions and the like should be judged based on the following description. Needless to say, the drawings also include portions having different dimensional relationships or ratios with each other.

Hereinafter, a case where an electronic part is connected to a board as a connection object and a board to be connected is described as an example, but the present technique can be applied to other than a connection between a board and an electronic part. For example, a so-called COG (chip on glass) mounting in which a liquid crystal driving IC chip is mounted on a glass substrate of a liquid crystal display panel is performed. 1, the liquid crystal display panel 10 includes two transparent substrates 11 and 12 opposed to each other including a glass substrate and the like. These transparent substrates 11 and 12 are sealed in a frame- 13, respectively. In the liquid crystal display panel 10, the liquid crystal 14 is sealed in a space surrounded by the transparent substrates 11 and 12 to form the panel display portion 15. [

The transparent substrates 11 and 12 are formed so that a pair of striped transparent electrodes 16 and 17 including ITO (indium tin oxide) or the like cross each other on both inner surfaces facing each other. The transparent electrodes 16 and 17 are arranged such that the intersection of the transparent electrodes 16 and 17 constitutes a pixel as a minimum unit of liquid crystal display.

One of the transparent substrates 12 of the two transparent substrates 11 and 12 is formed to have a larger planar dimension than the other of the transparent substrates 11. The edge 12a of the transparent substrate 12, A FOG mounting portion 22 in which a COG mounting portion 20 in which an electronic component 18 such as an IC is mounted and a flexible substrate 21 in which a liquid crystal driving circuit is formed is mounted in the vicinity of the outside of the COG mounting portion 20 ).

In addition, the liquid crystal driving IC and the liquid crystal driving circuit can selectively perform liquid crystal display by partially changing the orientation of the liquid crystal by selectively applying the liquid crystal driving voltage to the pixels.

A terminal portion 17a of the transparent electrode 17 is formed in each of the mounting portions 20 and 22. On the terminal portion 17a, an electronic component 18 such as a liquid crystal driving IC or a flexible substrate 21 is connected by using an anisotropic conductive film 1 as a conductive adhesive. The anisotropic conductive film 1 contains the conductive particles 4. The anisotropic conductive film 1 is formed of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 and the electrodes of the electronic component 18 and the flexible substrate 21 And the terminal portions 17a are electrically connected via the conductive particles 4. [ This anisotropic conductive film 1 is an ultraviolet curable adhesive and is fluidized by thermocompression bonding by a heating and pressing head 30 to be described later so that the conductive particles 4 are adhered to the terminal portions 17a and the electronic components 18 and the flexible substrate 21 And is irradiated with ultraviolet rays by the ultraviolet ray irradiator 31, whereby the conductive particles 4 are cured in a crushed state. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 with the electronic component 18 or the flexible substrate 21. [

An alignment film 24 subjected to a predetermined rubbing treatment is formed on both of the transparent electrodes 16 and 17. The initial alignment of the liquid crystal molecules is regulated by the alignment film 24. [ A pair of polarizers 25 and 26 are disposed outside the transparent substrates 11 and 12 and the polarizers 25 and 26 sandwich the transparent substrates 11 and 12, The vibration direction is regulated.

[Anisotropic conductive film]

As shown in Fig. 2, the anisotropic conductive film (ACF) 1 generally has a conductive particle-containing layer 3 formed on a release film 2 to be a substrate. 1, the anisotropic conductive film 1 is provided between the transparent electrode 17 formed on the transparent substrate 12 of the liquid crystal display panel 10 and the electronic component 18 or the flexible substrate 21 Containing layer 3 is used to connect the liquid crystal display panel 10 and the electronic component 18 or the flexible substrate 21 and to conduct them.

As the release film 2, for example, a substrate such as a polyethylene terephthalate film which is generally used in an anisotropic conductive film can be used.

The conductive particle-containing layer (3) is formed by dispersing conductive particles (4) in a binder. The binder contains a film-forming resin, a curing resin, a curing agent, a silane coupling agent and the like, and is the same as the binder used in a conventional anisotropic conductive film.

As the film-forming resin, a resin having an average molecular weight of about 10,000 to 80,000 is preferable. Examples of the film-forming resin include various resins such as phenoxy resin, epoxy resin, modified epoxy resin and urethane resin. Among them, a phenoxy resin is particularly preferable from the viewpoints of film formation state, connection reliability, and the like.

The curable resin is not particularly limited, and examples thereof include an epoxy resin and an acrylic resin.

The epoxy resin is not particularly limited and may be appropriately selected depending on the purpose. Specific examples thereof include, for example, naphthalene type epoxy resins, biphenyl type epoxy resins, phenol novolak type epoxy resins, bisphenol type epoxy resins, steel type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins, Type epoxy resins, dicyclopentadiene type epoxy resins, and triphenylmethane type epoxy resins. These may be used singly or in combination of two or more.

The acrylic resin is not particularly limited and may be appropriately selected according to the purpose. Specific examples of the acrylic resin include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate , Diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2,2-bis (Acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) ethyl acrylate, ) Isocyanurate, urethane acrylate, and epoxy acrylate. These may be used singly or in combination of two or more.

The curing agent is not particularly limited as long as it is a photo-curing type, and it can be appropriately selected according to the purpose. When the curable resin is an epoxy resin, a cationic curing agent is preferable and when the curable resin is an acrylic resin, a radical curing agent is preferable.

The cationic curing agent is not particularly limited and may be appropriately selected depending on the purpose. Examples thereof include a sulfonium salt and an onium salt, and among them, an aromatic sulfonium salt is preferable. The radical curing agent is not particularly limited and may be appropriately selected depending on the purpose, and examples thereof include organic peroxides.

Examples of the silane coupling agent include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

As the conductive particles (4), there can be enumerated any known conductive particles used in the anisotropic conductive film. Examples of the conductive particles 4 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold, metal oxide, carbon, graphite, Plastics or the like coated with a metal, or a surface of these particles further coated with an insulating thin film. When the surface of the resin particle is coated with a metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile · styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, Styrene-based resin, and the like.

[Manufacturing method]

Next, a manufacturing process of a connection member in which the electronic component 18 and the flexible substrate 21 are connected to the transparent electrode 17 of the transparent substrate 12 via the anisotropic conductive film 1 will be described. First, the anisotropic conductive film 1 is pressed on the transparent electrode 17. The anisotropic conductive film 1 is pressed onto the transparent electrode 17 of the transparent substrate 12 of the liquid crystal display panel 10 such that the conductive particle containing layer 3 is on the transparent electrode 17 side, (1).

Then, after the conductive particle-containing layer 3 is disposed on the transparent electrode 17, the conductive particle-containing layer 3 is heated and pressed by the heating and pressing head 30 from the side of the release film 2, Only the conductive particle containing layer 3 is peeled from the conductive particle containing layer 3 on the transparent electrode 17 by separating the pressing head 30 from the peeling film 2 and peeling the release film 2 from the conductive particle containing layer 3 on the transparent electrode 17 . The pressing by the heating and pressing head 30 heats the upper surface of the peeling film 2 while pressing it to the side of the transparent electrode 17 at a slight pressure (for example, about 0.1 MPa to 2 MPa). However, the heating temperature is a temperature (for example, about 70 to 100 캜) at which the epoxy resin or acrylic resin or other thermosetting resin in the anisotropic conductive film 1 is not cured.

The electronic component 18 is arranged so that the transparent electrode 17 of the transparent substrate 12 and the electrode terminal of the electronic component 18 are opposed to each other via the conductive particle containing layer 3. [

Subsequently, ultraviolet rays are irradiated by the ultraviolet ray irradiator 31 disposed under the transparent substrate 12 to cure the conductive particle containing layer 3, and the electronic component 18 is connected to the transparent substrate 12. At this time, in this connection step, the region where the terminal portion 17a of the transparent electrode 17 and the electronic component 18 are connected is divided into a plurality of connection regions as shown in Fig. 3, And the timing of initiation is staggered.

The region where the electrode terminal of the electronic component 18 is connected to the terminal portion 17a of the transparent electrode 17 is appropriately divided into a plurality of connection regions and the electrode terminal of the electronic component 18 and the transparent electrode 17, And is divided for each channel when multiple channels are formed. Alternatively, the region where the electrode terminal of the electronic component 18 is connected to the terminal portion 17a of the transparent electrode 17 can divide the entire region into a plurality of regions with an even area. As an example in Fig. 3, the electronic component 18 and the terminal portion 17a of the transparent electrode 17 are provided with five first to fifth connection regions CH1 to CH5 constituting a channel . The first to fifth connection regions CH1 to CH5 are formed to extend substantially in the entire width of the region where the terminal portion of the electronic component 18 and the terminal portion 17a of the transparent electrode 17 are connected via the anisotropic conductive film 1, .

The ultraviolet irradiator 31 is provided with first to fifth ultraviolet irradiation portions 31a to 31e corresponding to the first to fifth connection regions CH1 to CH5, for example. The ultraviolet ray irradiator 31 can individually control the irradiation of the ultraviolet ray irradiators 31a to 31e so that the timing of ultraviolet ray irradiation can be changed in each connection region in this connection process and can be cured. Each of the ultraviolet irradiators 31a to 31e is overlapped with the adjacent ultraviolet irradiators in a part of the irradiation range so that there is no part not irradiated with ultraviolet rays.

By thus shifting the timings of ultraviolet irradiation, the timing of initiation of curing differs for each connection region, and the electronic component 18 and the transparent substrate 12 Connection can be planned. This is because, by making the timing of initiation of curing different for each connection region, when the connection region irradiated with the ultraviolet ray initially starts to harden and the curing shrinkage of the binder occurs, in the connection region in which the ultraviolet ray adjacent to the connection region is not irradiated The binder is not cured and has fluidity. Therefore, it is considered that the deformation due to the curing shrinkage in the connection region of the ultraviolet ray irradiation can be absorbed by flowing to the connection region side irradiated with ultraviolet rays.

Specifically, as shown in Fig. 4A, in the first to fifth connection regions CH1 to CH5 shown in Fig. 3, the irradiation of ultraviolet rays is started from the third ultraviolet ray irradiating portion 31c, Curing is performed from the connection region (CH3). Subsequently, as shown in Fig. 4B, after the start of irradiation from the third ultraviolet ray irradiating section 31c, for example, one second after the lapse of a predetermined time, the adjacent second and fourth ultraviolet ray irradiating sections 31b and 31d, And the second and fourth connection regions CH2 and CH4 are cured. Lastly, as shown in Fig. 4C, after the start of irradiation from the second and fourth ultraviolet irradiators 31b and 31d, for example, one second after the lapse of a predetermined time, the first and fifth ultraviolet irradiators Ultraviolet rays are irradiated from the first and second connection regions 31a and 31e to cure the first and fifth connection regions CH1 and CH5.

As described above, according to this connection step, the irradiation timing of the ultraviolet rays to the first to fifth connection regions (CH1 to CH5) is made different, and the deformation in the curing of the third connection region (CH3) Is absorbed by the uncured binder of the adjacent second and fourth connection regions (CH2 and CH4), and deformation at the time of curing of the second and fourth connection regions (CH2 and CH4) is absorbed by the adjacent first and fifth connections Is absorbed as an uncured binder in the regions (CH1, CH5).

On the other hand, when the ultraviolet rays are simultaneously irradiated to the first to fifth connection regions CH1 to CH5, since the connection regions CH1 to CH5 simultaneously start to harden, it is possible to absorb the deformation of the adjacent connection regions none. Therefore, according to this connection step, deformation of the transparent substrate 12 can be suppressed and defective connection of the electronic component 18 can be prevented.

In the case of irradiating ultraviolet rays to a connection region not adjacent to a connection region in which ultraviolet rays are not irradiated, it is possible to minimize deformation due to curing shrinkage of the bonding agent by irradiating a minimum irradiation dose necessary for ultraviolet curing.

Specifically, in this connection step, after the irradiation amount of the minimum necessary for ultraviolet curing is irradiated to the first and fifth connection regions (CH1 and CH5) to which ultraviolet rays are ultimately irradiated, the total connection regions (CH1 to CH5) Ultraviolet irradiation can be stopped. For example, the ultraviolet ray irradiator 31 irradiates ultraviolet rays as shown in Fig. 4D after a predetermined time elapses, for example, two seconds after the start of irradiation from the first and fifth ultraviolet ray irradiators 31a and 31e, The irradiation from the irradiation units 31a to 31e is stopped.

As described above, since the first and fifth connection regions (CH1 and CH5) to which ultraviolet rays are ultimately irradiated do not exist in the adjacent region having an uncured binder that absorbs the curing shrinkage, the minimum amount of irradiation necessary for ultraviolet curing The deformation due to the curing shrinkage of the binder can be suppressed to the minimum.

In this connecting step, the timing of starting the ultraviolet ray irradiation may be set to be staggered, and it is not necessarily required that the end of the ultraviolet ray irradiation is constant in each connection region (CH1 to CH5).

Called FOG (film) in which the flexible substrate 21 is mounted on the transparent electrode 17 of the transparent substrate 12 after the electronic component 18 is connected to the transparent electrode 17 of the transparent substrate 12, On glass) mounting is performed. This makes it possible to manufacture a connection body in which the transparent substrate 12, the electronic component 18, and the flexible substrate 21 are connected via the anisotropic conductive film 1. These COG mounting and FOG mounting may be performed at the same time.

As described above, the COG mounting for mounting the liquid crystal driving IC directly on the glass substrate of the liquid crystal display panel and the FOG mounting for mounting the flexible substrate directly on the substrate of the liquid crystal display panel have been described as an example. However, It can be used for various other connections.

[Other Timing 1]

In addition, the region where the ultraviolet ray irradiation is firstly started may not be one, or the ultraviolet ray irradiation may be started simultaneously at a plurality of locations which are not adjacent to each other. For example, as shown in Fig. 5A, ultraviolet ray irradiation can be started from the second and fourth connection regions CH2 and CH4.

Also in this case, the uncured binder in the connection region adjacent to the connection region irradiated with ultraviolet rays, for example, the first, third, and fifth connection regions CH1, CH3, and CH5, (CH2, CH4), it is possible to absorb deformation in the second and fourth connection regions (CH2, CH4) irradiated with ultraviolet rays. Also in this case, as shown in Fig. 5B, ultraviolet rays are irradiated to the connection regions not irradiated with ultraviolet rays such as the first, third, and fifth connection regions CH1, CH3, and CH5, In the case of irradiating, the irradiation amount of the minimum necessary for ultraviolet curing is irradiated, so that the deformation due to the curing shrinkage of the binder can be minimized.

[Other Timing 2]

In this connection step, ultraviolet rays may be irradiated from one end of the plurality of divided connection regions. For example, as shown in Fig. 6A, the ultraviolet irradiator 31 starts irradiating ultraviolet light from the first ultraviolet irradiator 31a to the first connection area CH1, and after a predetermined time elapses, for example, 1 (Fig. 6B), and sequentially emits ultraviolet rays from the second ultraviolet ray irradiating section 31b to the second connecting region CH2 until reaching the fifth connecting region CH5 every one second elapses (Fig. 6C to Fig. 6E).

Also in this case, the uncured binder in the connection region adjacent to the connection region irradiated with ultraviolet rays, for example, the second connection region CH2 adjacent to the first connection region CH1, It is possible to absorb deformation in the first connection region CH1 irradiated with ultraviolet rays. Also in this case, when irradiating ultraviolet rays to a connection region that is not adjacent to the connection region not irradiated with ultraviolet rays, for example, a connection region (CH5), irradiation amount of the minimum necessary for ultraviolet curing is irradiated, The deformation due to the hardening shrinkage can be minimized.

[Other Timing 3]

Further, in this connection step, ultraviolet rays can be irradiated from a plurality of end portions of the plurality of divided connection regions. 7A, the ultraviolet irradiator 31 starts irradiating ultraviolet light from the first ultraviolet irradiator 31a to the first connection area CH1, and from the fifth ultraviolet irradiator 31e Irradiation of ultraviolet light to the fifth connection region CH5 is started. After a predetermined time elapses, for example, one second, the ultraviolet irradiation from the second ultraviolet irradiation portion 31b to the second connection region CH2 is started as shown in Fig. 7B, and the fourth ultraviolet irradiation portion 31d ) To the fourth connection region CH4. After a lapse of a predetermined time, for example, one second, ultraviolet ray irradiation from the third ultraviolet ray irradiating section 31c to the third connecting region CH3 is started as shown in Fig. 7C.

In this case as well, un-curing in the connection regions adjacent to the connection regions irradiated with ultraviolet rays, for example, in the second and fourth connection regions (CH2 and CH4) adjacent to the first and fifth connection regions (CH1 and CH5) The coupling agent flows into the first and fifth connection regions CH1 and CH5 to absorb the deformation in the first and fifth connection regions CH1 and CH5 irradiated with ultraviolet rays. Also in this case, when the ultraviolet rays are irradiated to the third connection region CH3 which is not adjacent to the connection region where the ultraviolet rays are not irradiated, the irradiation amount of the minimum necessary for ultraviolet curing is irradiated, The deformation can be suppressed to a minimum.

[Other Timing 4]

In the above description, the region where the terminal portion 17a of the transparent electrode 17 and the electronic component 18 are connected is divided into connection regions arranged in a line. However, as shown in Fig. 8, The connection area may be divided into a plurality of connection areas. In this case, too, the deformation due to the curing shrinkage of the binder can be absorbed by staggering the initiation timing of the irradiation of the ultraviolet rays for each connection region, such as from the center to the end, from the end to the end or from the plurality of ends.

Although ultraviolet curing type binders are used in the above description, light other than ultraviolet rays may be used in the present invention as long as the binder can be cured by irradiation. In the above description, the anisotropic conductive film 1 having a film shape as the conductive adhesive has been described, but there is no problem even in the paste state. In the present application, a film-like conductive adhesive film such as an anisotropic conductive film (1) containing conductive particles (4) or paste conductive paste is defined as an " adhesive ".

Example

Next, an embodiment of the present invention will be described. In this embodiment, the transparent electrodes provided on the glass substrate and the electrode terminals provided on the IC chip are connected to form the connection body samples provided with the first to fifth connection regions (CH1 to CH5) constituting the five channels 3). For each of the connector samples, the connection state between the IC chip and the substrate was evaluated by the conduction resistance value?, And the display unevenness was substituted for evaluation by measuring the amount of deflection (μm) of the substrate.

The anisotropic conductive film used for connection includes an adhesive layer containing a conductive particle-containing layer (ACF layer) having a thickness of 18 mu m. The ACF layer

Phenoxy resin (YP-70: manufactured by Shin-Nittsu Chemical Co., Ltd.); 20 parts by mass

Liquid epoxy resin (EP-828, manufactured by Mitsubishi Chemical Corporation); 30 parts by mass

Solid epoxy resin (YD014: manufactured by Shin-Nittsu Chemical Co., Ltd.); 20 parts by mass

Conductive particles; (AUL704: manufactured by Sekisui Chemical Co., Ltd.): 30 parts by mass

Cationic curing agent (LW-S1: manufactured by Mitsubishi-Afra Kagaku Co., Ltd.); 5 parts by mass

Was melted in a solvent to prepare a mixed solution. The mixed solution was applied on a PET film, and dried in an oven to form a film.

The ACF was adjusted to have a thickness of 18 탆 and laminated to obtain an anisotropic conductive film. The anisotropic conductive films used in Examples and Comparative Examples are 4.0 mm wide × 40.0 mm long.

As an evaluation element

Appearance; 1.8 mm x 34.0 mm

thickness; 0.5mm

, And a wiring for conduction measurement was formed.

As the evaluation substrate to which the evaluation IC was connected, a glass substrate having a glass thickness of 0.5 mm and on which wiring for conductivity measurement was formed was used.

An evaluation IC was disposed on the glass substrate via the anisotropic conductive film, and the connection IC sample was formed by thermal pressurization with a heating and pressing head and ultraviolet irradiation. The heat pressing surface of the heating pressing head is 10.0 mm x 40.0 mm, and the heat pressing surface of the heating pressing head is subjected to fluorine resin processing with a thickness of 0.05 mm as a buffer material. All the temperature conditions of the heating and pressing head are 110 ° C, and the pressurizing conditions are all 70 MPa, 5 seconds.

Ultraviolet irradiation was performed for 5 seconds after the start of heat pressurization of the evaluation IC by the heating pressurizing head set at a predetermined temperature. Irradiation was started after elapse of a predetermined time from the start of heat pressurization for each connection region, The irradiation was uniformly stopped 5 seconds after the start of the heat pressurization by the < RTI ID = 0.0 > Table 1 shows the elapsed time from the start of heat pressurization of the evaluation IC by the heating and pressing head to the ultraviolet irradiation to the connection regions (CH1 to CH5) according to Examples and Comparative Examples.

Figure pct00001

In the first embodiment, the elapsed time until the ultraviolet irradiation to the third connection region CH3 is set to 0 second and the ultraviolet ray irradiation to the first, second, fourth, and fifth connection regions CH1, CH2, CH4, Were all 1 second. That is, in the first embodiment, the ultraviolet ray irradiation time of the third connection region CH3 is 5 seconds and the ultraviolet ray irradiation time of the first, second, fourth and fifth connection regions CH1, CH2, CH4 and CH5 is 4 seconds to be.

In Example 2, the elapsed time to the ultraviolet irradiation to the third to fifth connection regions (CH3 to CH5) is set to 1 second, the elapsed time to the ultraviolet irradiation to the second connection region (CH2) is set to 2 seconds, 1 < / RTI > connection area (CH1) was 3 seconds. That is, in the second embodiment, the ultraviolet ray irradiation time of the third to fifth connection regions CH3 to CH5 is 4 seconds, the ultraviolet ray irradiation time of the second connection region CH2 is 3 seconds, The irradiation time is 2 seconds.

In Example 3, the elapsed time until the ultraviolet irradiation to the third connection region CH3 is set to 1 second, the elapsed time to the ultraviolet irradiation to the second and fourth connection regions CH2 and CH4 is set to 2 seconds, 1 and the fifth connection regions CH1 and CH5 was set to 3 seconds. That is, in the third embodiment, the ultraviolet ray irradiation time of the third connection region CH3 is 4 seconds, the ultraviolet ray irradiation time of the second and fourth connection regions CH2 and CH4 is 3 seconds, (CH1, CH5) had an ultraviolet irradiation time of 2 seconds.

In Example 4, the elapsed time to the ultraviolet irradiation to the first and fifth connection regions CH1 and CH5 is set to 1 second, and the elapsed time to the ultraviolet irradiation to the second and fourth connection regions (CH2 and CH4) 3 seconds, and the elapsed time to the ultraviolet irradiation in the third connection region CH3 was 4 seconds. That is, in the fourth embodiment, the ultraviolet ray irradiation time of the first and fifth connection regions CH1 and CH5 is 4 seconds, the ultraviolet ray irradiation time of the second and fourth connection regions CH2 and CH4 is 2 seconds, The ultraviolet irradiation time of the connection region CH3 is 1 second.

In Comparative Example 1, the elapsed time from ultraviolet irradiation to the first to fifth connection regions (CH1 to CH5) was uniformly set to 0 second. That is, in Comparative Example 1, the ultraviolet ray irradiation time of the first to fifth connection regions (CH1 to CH5) is uniformly 5 seconds.

In Comparative Example 2, the elapsed time until irradiation of ultraviolet rays to the first to fifth connection regions (CH1 to CH5) was uniformly set to 4 seconds. That is, in Comparative Example 2, the ultraviolet irradiation time of the first to fifth connection regions (CH1 to CH5) is uniformly 1 second.

Table 2 shows the relationship between the ultraviolet irradiation time and the curing shrinkage ratio of the anisotropic conductive film according to Examples and Comparative Examples. The term "hardening shrinkage" refers to the rate at which an anisotropic conductive film shrinks due to ultraviolet curing,

Cure shrinkage ratio = (specific gravity of cured product of adhesive layer - specific gravity of resin solution of adhesive layer) / specific gravity of cured product of adhesive layer x 100

.

Under the above conditions, heating and pressurization and ultraviolet irradiation were conducted to form connection samples connected to the glass substrate for evaluation IC, and the magnitude of warpage (μm) and the resistance value (Ω) of conductivity were measured for each sample.

As shown in Fig. 9, the stylus 41 is scanned from the lower surface of the glass substrate 40 of the bonded body sample using a contact surface roughness meter (SE-3H, manufactured by Kosaka Kousyu Co., Ltd.) , And the amount of warpage (μm) of the glass substrate surface after connection of the evaluation IC was measured.

The conduction resistance value was measured by conducting a high temperature and high humidity test in which the connecting body sample was left for 500 hours under the environment of 85 ° C and 85% RH. Then, as shown in FIG. 10, the glass connected to the bump 42 of the evaluation IC The conduction resistance value was measured when the ammeter A and the voltmeter V were connected to the metal wiring 43 of the substrate 40 and a current of 1 mA was passed through the so-called four-terminal method. The results are shown in Table 2.

Figure pct00002

As shown in Table 2, in each of the embodiments, the irradiation timings of the ultraviolet rays are staggered and staggered over the first to fifth connection regions (CH1 to CH5). Therefore, at the time of hardening the connection region where ultraviolet ray irradiation is performed Is absorbed by the uncured binder of the adjacent connection region. Therefore, according to each example, the amount of warpage also reached 11.3 占 퐉 at the maximum, and the maximum connection resistance was 12.4 ?. Therefore, according to this connection step, it is understood that deformation of the glass substrate can be suppressed, and defective connection of the evaluation IC can be prevented.

On the other hand, in Comparative Example 1 in which irradiation of ultraviolet light was started simultaneously with the heat application to the first to fifth connection regions (CH1 to CH5), curing was simultaneously started in the connection regions (CH1 to CH5) And the curing shrinkage rate was as large as 2.7%, the deformation of adjacent connection regions could not be absorbed, the amount of warpage was as large as 14.5 占 퐉, and the connection resistance became 15.1 ?.

Further, in Comparative Example 2 in which irradiation of ultraviolet light was started four seconds after the thermal pressurization with respect to the first to fifth connection regions (CH1 to CH5), the warpage was suppressed to 5.0 占 퐉 because the curing shrinkage rate was as small as 1.1% And the connection resistance after the high temperature and high humidity test was 110.8?.

In Examples 3 and 4, irradiation was started from the central third connection region CH3, and ultraviolet rays were sequentially irradiated toward the end portions. In Example 3, irradiation of ultraviolet rays from the connection regions (CH1 and CH5) The warping amount and the connection resistance were comparatively good in Example 4 to be examined. This is because the connection region where ultraviolet rays are irradiated is always provided with a connection region in which ultraviolet rays are not irradiated, so that the deformation in the curing can be absorbed by the uncured bonding agent in the adjacent connection region in many connection regions I think.

Among them, in Example 3, ultraviolet irradiation to the connection regions (CH1 and CH5) at the ends is ended, and the irradiation time is short and the hardening shrinkage rate is also low. Since the warpage of the glass substrate increases toward the outside from the center portion, the warpage of Example 3 in which the outside (end) hardening shrinkage rate is lowered can be suppressed to the greatest.

1: Anisotropic conductive film
2: peeling film
3: Conductive particle-containing layer
4: conductive particles
10: liquid crystal display panel
11: transparent substrate
12: transparent substrate
13: seal
14: liquid crystal
15: Panel display
16: Transparent electrode
17: Transparent electrode
17a:
18: Electronic parts
20: COG mounting part
21: Flexible substrate
22: FOG mounting part
24:
25: polarizer
26: polarizer
30: heating pressure head
31: ultraviolet irradiator

Claims (9)

A step of disposing an electronic component on a substrate via a photo-curable adhesive,
Irradiating the adhesive with light to cure the adhesive,
A method of manufacturing a connection body to which the electronic component is connected on the substrate in which the region where the substrate and the electronic component are connected are divided into a plurality of connection regions and the timing of irradiation initiation of the light is staggered, . The method according to claim 1, further comprising: starting irradiation of the light from any one or a plurality of the connection regions divided into a plurality,
And the irradiation of the light to the connection region other than the arbitrary one or plurality of connection regions is started after a predetermined time elapses. 3. The method according to claim 2, wherein irradiation of light to the entire connection region is stopped after irradiating a minimum necessary irradiation dose for photocuring in the connection region to which the light is finally irradiated. The electronic component according to claim 2 or 3, wherein the irradiation of the light is started from a connection region in the center of a region to which the electronic component and the substrate are connected,
And the irradiation of the light to the connection region other than the central connection region is started after a lapse of a predetermined time. 5. The method according to claim 4, wherein the timing for starting irradiation of the light is gradually delayed from the central connection region toward the connection region at the end of the region where the electronic component and the substrate are connected. The electronic component according to claim 2 or 3, wherein irradiation of the light is started from the connection area at one or a plurality of ends of an area where the substrate and the electronic part are connected,
And the irradiation of the light is started to a connection region other than the connection region of the one or more ends after a lapse of a predetermined time. The electronic component mounting method according to claim 6, further comprising: starting irradiation of the light from the connection region at one end of the region where the substrate and the electronic component are connected,
Thereby delaying the timing of starting irradiation of the light stepwise toward the connection region at the other end of the region where the substrate and the electronic component are connected. The electronic component mounting method according to claim 6, further comprising: starting irradiation of the light from the connection region at a plurality of end portions of a region where the substrate and the electronic component are connected,
Thereby delaying timing of starting irradiation of the light stepwise toward the connection region at the center of the region where the substrate and the electronic component are connected. A step of disposing an electronic component on a substrate via a photo-curable adhesive,
Irradiating the adhesive with light to cure the adhesive,
An electronic component connecting method for connecting the electronic component on the substrate, wherein an area where the substrate and the electronic part are connected are divided into a plurality of connection areas and a timing for starting irradiation of the light is staggered for each of the connection areas .
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