KR20130069739A - Thin pcb having induction coil and manufacturing method thereof - Google Patents

Abstract

The present invention provides a novel thin circuit board structure and its manufacturing method. The circuit board includes a magnetic induction board made of organic resin and inorganic powder; An induction coil formed on one surface of the magnetic induction substrate; And a metal wiring layer formed on one surface of the magnetic induction substrate and electrically connected to the induction coil, wherein the induction coil is installed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristics of the magnetic induction substrate. The substrate of the thin circuit board is made of an organic resin material in which electromagnetic wave absorption powder is mixed, so that when designing the induction coil, it has a characteristic of absorbing electromagnetic waves on the substrate, and additional layers and circuit structures necessary for the radio frequency identification tag thereon. Can be prepared.

Description

Thin circuit board with induction coil and its manufacturing method {THIN PCB HAVING INDUCTION COIL AND MANUFACTURING METHOD THEREOF}

The present invention relates to a thin circuit board having an induction coil and a method of manufacturing the same. Specifically, the present invention relates to a thin circuit board in which an induction coil is designed in consideration of electromagnetic wave absorption characteristics and a method of manufacturing the same.

Radio frequency identification technology (RFID) is a communication technology for recognizing specific targets by reading electromagnetic signals and reading and writing related data. In the principle that the radio recognition element works, when an electromagnetic wave is emitted by using an external radio frequency reader (RFID reader) to trigger the radio frequency identification element (for example, radio frequency identification tag RFID tag) in the induction range, The radio frequency identification device generates a current by electromagnetic induction and operates the radio frequency identification chip thereon, and then emits electromagnetic waves to achieve the radio frequency recognition effect in response to the inductor. By recognizing by electromagnetic induction, there is no need for mechanical or optical contact between the radio frequency identification system (eg reader) and the recognition target (eg radio frequency identification tag). Radio frequency identification has many advantages. For example, the effective recognition distance is relatively long, a large amount of information can be stored and transmitted, the recognition speed is fast, the data in the tag can be rewritten, and the stability is good. It is widely used to replace. Radio frequency identification devices are currently used in a number of areas, including retail logistics supply, asset tracking and verification applications.

As shown in FIG. 1, this is a cross-sectional view of a compositional structure of a typical radio frequency identification device 100 having an induction coil according to the prior art. As shown in the figure, a typical RF recognition device 100 is mainly composed of four members, such as a flexible substrate 101, an induction coil 103, a metal wiring layer 105, and a radio frequency identification chip 107, among which a conventional flexible substrate 101 absorbs electromagnetic waves. Since the induction coil 103 is not formed, the magnetic flux characteristics of the flexible substrate 101 may not be considered. The flexible substrate 101 is a component material on which each member of the radio frequency identification device 100 is installed, and is formed of a flexible material such as polyethylene terephthalate (PET), and is light, flexible, and easy to carry. Has The induction coil 103 located on the trademark side of the flexible board 101 receives electromagnetic waves emitted from an external RF reader and generates current by an electromagnetic induction method. A metal wiring layer 105 is formed on the lower surface of the flexible substrate 101, which is electrically connected to the induction coil 103 by the interconnect structure 104. The metallization layer 105 also includes a circuit wiring area of the radio frequency identification element 100 to electrically connect the radio frequency identification chip 107 to the induction coil 103.

According to the related art, a plurality of through holes 109 penetrating the trademark surface and the lower surface of the flexible substrate 101 are formed so that the metallization layer 105 on the lower surface of the flexible substrate 101 and the radio frequency identification chip 107 on the flexible substrate 101 trademark surface are formed. Electrically connected Thus, the electric current generated by the electromagnetic induction coil 103 is transmitted to the RF chip 107 via the metal wiring layer 105 to operate it, and emits electromagnetic waves and responds to the external RF reader to recognize tags or transmit data. And completes operations such as writing.

By using the electromagnetic induction mechanism, the radio frequency recognition device is very sensitive to the use environment such as metal and liquid during high frequency operation, and is particularly adhered to metal surfaces or containers containing liquid. In such an environment, electromagnetic signals emitted from external readers and radio frequency identification devices are susceptible to metal or liquid interference near radio frequency recognition devices, which leads to a problem that the induced signals cannot be read well. In terms of frequency-recognition devices, very severe results are produced. On the other hand, in the application of a general passive RF tag, as shown in Fig. 1, a magnetic induction sticker (also referred to as a ferrite sheet or electromagnetic wave absorption sticker) 106 is installed between the RF element 100 and the metal surface 102. This prevents the problem of inaccurate reading of induced signals by controlling the reception / emission of electromagnetic waves on the metal or liquid surface such as surface waves, cavity resonance waves, reflection waves, and / or electromagnetic interference.

By the way, magnetic induction stickers commonly used in the industry not only occupy a considerable cost in the manufacturing cost of the radio frequency identification device, but also the thickness of the radio frequency identification device becomes difficult because the magnetic induction sticker has a certain thickness. According to the different induction coil design of the recognition device, the magnetic induction sticker must be carefully selected and used so as not to affect its operation and effect. Therefore, in the thin circuit board manufacturing process, the present inventor eliminates the annoyance of selecting and using a magnetic induction sticker when the thin circuit board is used on the metal surface by considering the magnetic flux characteristics of the substrate preliminary design in the induction coil design. In order to be able to apply the RF recognition device to the thinning design, the researcher has developed a thin circuit board structure having the electromagnetic wave absorbing action and a manufacturing method thereof.

The present invention discloses a thin circuit board and a manufacturing method thereof in view of the problems existing in the prior art. The substrate of the thin circuit board according to the present invention is made of an organic resin material in which electromagnetic wave absorption powder is mixed, and has a characteristic of absorbing electromagnetic waves, and also combines the characteristics of a general flexible circuit board. Additional layers and circuit structures required for the formation can be formed.

In one embodiment of the present invention, the thin circuit board includes a constituent member such as a magnetic induction substrate, an induction coil and a metal wiring layer. The induction coil is formed on one surface of the magnetic induction substrate. The metal wiring layer is formed on one surface of the magnetic induction substrate, and is electrically connected to the induction coil. The RF chip is formed on one surface of the magnetic induction board, and is electrically connected to the metal wiring layer. When designing the induction coil, it is installed on the surface of the magnetic induction board considering the magnetic flux characteristics of the magnetic induction board, and the induction coil operates the radio frequency identification chip by providing current generated by electromagnetic induction to the radio frequency identification chip. It is configured to respond to an external inductor by emitting electromagnetic waves.

In another embodiment of the present invention, the induction coil is installed on one surface of the magnetic induction substrate by a stacked design surrounded by a multi-layer winding number, and the magnetic induction layer is sandwiched between induction coils of each layer. Increase the absorption effect. The magnetic induction layer and the magnetic induction substrate are made of the same material.

An object of the present invention is a magnetic induction substrate made of an organic resin and an inorganic powder; An induction coil formed on one surface of the magnetic induction substrate; And a metal wiring layer formed on one surface of the magnetic induction board and electrically connected to the induction coil, wherein the induction coil is a new thin circuit board installed on the surface of the magnetic induction board in consideration of the magnetic flux characteristics of the magnetic induction board. To provide. The structure-supported substrate employed here has an electromagnetic wave absorption function, so that the thin circuit board can obtain excellent radio frequency recognition effect without a separate magnetic induction sticker or electromagnetic wave absorption sticker.

Another object of the present invention is a procedure for forming a magnetic induction substrate made of an organic resin and an inorganic powder; A process of forming an induction coil on one surface of the magnetic induction substrate, and forming the induction coil on the surface of the magnetic induction substrate in consideration of the magnetic flux characteristics of the magnetic induction substrate; and electrically connecting the induction coil to one surface of the magnetic induction substrate To provide a novel method for manufacturing a thin film circuit board comprising a procedure for forming a metal wiring layer. The present invention realizes the design of the multilayer induction coil by increasing the induction coil and the magnetic induction layer, and increases the effective response distance of the induction coil.

Other objects, features and advantages of the present invention will be better understood from reference to the following detailed examples and the accompanying drawings and claims.

DETAILED DESCRIPTION Reference is made to the drawings and descriptions below to better understand the system and method of the present invention. For embodiments not limited in detail herein, reference may be made to the following description of the drawings. The components shown in the figures are not to scale and merely emphasize the principles of the invention. In the drawings, the same reference numerals will be used for the same members.
1 is a cross-sectional view of an exemplary radio frequency identification tag according to the prior art;
2 is a cross-sectional view of a radio frequency identification tag according to an embodiment of the present invention;
3 is a cross-sectional view of another radio frequency identification tag according to an embodiment of the present invention.

Referring to Figure 2, which is a cross-sectional view of a radio frequency identification device 200 according to an embodiment of the present invention. In the embodiment of the present invention, a radio frequency identification device 200 in which a radio frequency identification chip 207 is provided on a thin film circuit board having an induction coil is illustrated. A metal surface 202 is displayed below the radio frequency identification device 200, indicating the installation relationship thereof. As shown in the figure, the RF recognition device 200 of the present invention is mainly composed of four members, including the magnetic induction substrate 201, the induction coil 203, the metal wiring layer 205, and the radio frequency identification chip 207, of which the magnetic induction substrate 201, induction The coil 203 forms a thin circuit board with the metal wiring layer 205. In the present invention, the magnetic induction substrate 201 is a plate having excellent electromagnetic wave absorption characteristics, which is not only a structural substrate to install each member of the radio frequency identification device 200, the radio frequency identification device 200 is a high frequency (for example, 13.56MHz) or When it comes close to a metal or liquid surface in a very high frequency environment (e.g. 900 MHz), it effectively controls the generation of phenomena such as surface waves, cavity resonances, reflections, and / or electron interferences, which causes problems with inadequate reading of induced signals. Prevent it. The present invention can easily adapt the radio frequency identification device 200 to an environment in which a conventional radio frequency identification device (for example, RFID) cannot be used due to the electromagnetic wave absorption function unique to the magnetic induction substrate 201. For example, it is possible to adhere to a metal surface such as a can or a medicine bottle containing liquid, or to install a metal case of a mobile device such as a mobile phone, without having to separately mount an expensive electromagnetic wave absorbing sticker used in the related art, thereby reducing a considerable tag manufacturing cost.

The magnetic induction substrate 201 of the present invention is prepared by mixing two materials, that is, an organic resin and an inorganic powder, wherein the organic resin gives mechanical properties and possibilities in the manufacturing process to the magnetic induction substrate 201, and the inorganic powder is magnetic induction. The substrate 201 has a function of absorbing electromagnetic waves. In one embodiment, the organic resin in the magnetic induction substrate 201 is a PI (polyimide) material widely used in general flexible printed circuit boards. Substrates formed by this material have advantages such as light weight, flexibility, portability, simple manufacturing process, applicable to crimp roll-to-roll, and large-scale manufacturing. Enhance the applicability of the manufactured RF tag. However, in other embodiments, it should be noted that the organic resin of the magnetic induction substrate 201 may be other suitable materials having the same characteristics. For example: polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (PP), polyether sulfone (Polyether sulfone, PES), polyphenylene sulfone (PPSU) Poly-P-phenylenebenzobisoxazole (PBO), Liquid Crystal Polymer (LCP), Acrylic Resin (Acrylate), Polyurethane (PU), or Epoxy Resin And combinations thereof, of course, but not limited to.

On the other hand, the inorganic powder material of the magnetic induction substrate 201 is a material having excellent electromagnetic wave absorption characteristics, which effectively attenuates the signal of the electromagnetic wave and prevents the radio frequency recognition device 200 from receiving electromagnetic interference in reverse direction on the metal body or liquid surface. Can be. In an embodiment of the present invention, the material of the inorganic powder may be, for example, soft ferrite, alloy material, or metal material. Among them, the flexible ferrite may include MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, or mixtures thereof. Iron aluminum alloy may be included, but is not limited thereto, and the metal material may include an alloy such as copper, aluminum, iron, nickel, and the like, but is not limited thereto. In the present invention, the proportion of mixing the organic resin and the inorganic powder is between about 15% to 35% and 85% to 65%, respectively, and after mixing the protons, it is possible to form a material or paint having electromagnetic wave absorption characteristics. It may be further solidified into a solid having a structural support such as a film, a thin film, a plate, a block-shaped substrate, or the like. The magnetic induction substrate 201 mixed and blended according to the proportion is fully applicable to the conventional PI flexible substrate manufacturing process, and can be coated, etch-cleaned, carved and drilled on the magnetic induction substrate 201, and is required for the radio frequency recognition chip. Applicable to high temperature manufacturing processes, for example, it is applicable to flip chip manufacturing processes in surface adhesion techniques.

In the present invention, the magnetic induction substrate 201 serves as a structural support member and an electromagnetic wave absorption member of the radio frequency identification device 200, and through holes and circuit wiring necessary for the radio frequency identification device by the flexible plate manufacturing process thereon. Form circuit structures such as traces and interconnects. As shown in Fig. 2, the induction coil 203 is formed on the trademark surface of the magnetic induction substrate 201, and the induction coil 203 is formed by surrounding the number of turns, and is fired from the external RF reader by this installation. Electromagnetic waves are received in different polarization directions, and current is generated by an electromagnetic induction method such as inductive coupling or back-scatter coupling. In the present invention, the induction coil 203 is used for etching (for example, copper etching and aluminum etching), erragol printing (including stencil printing, relief printing, gravure printing, or inkjet printing), chemically deposited copper, electroplating copper, and the like. Formed by the method. The material, thickness, number of windings, quality factor, and installation of the induction coil 203 are designed or adjusted in accordance with the electromagnetic wave absorption properties of the magnetic induction substrate 201 to perform the necessary impedance matching. Maintain the demand for electron induction upper limit polarization. The working frequency of the induction coil 203 of the present invention is determined by its application environment, and includes, but is not limited to, operating frequency bands such as 125 / 134KHz (low frequency) and 13.56MHz (high frequency).

On the other hand, a metal wiring layer 205 is formed on the lower surface of the magnetic induction substrate 201, which is part of the coil film group of the radio frequency identification device 200. The metal wiring layer 205 is coupled to the induction coils 203 at both ends through the through holes or the interconnection structures 204a and 204b to transmit conductive signals. In another embodiment of the present invention, the metal wiring layer 205 can also be used as a ground plane (ground plane) of the induction coil 203, the induction coil 203 generates excessive vortex due to electromagnetic induction, the outside of the radio frequency identification device 200 To prevent electromagnetic interference from occurring. In the present invention, the metal wiring layer 205 can be used as a signal transmission layer or a circuit wiring layer of the radio frequency identification device 200 at the same time. As shown in FIG. 2, a plurality of through holes 209 are formed on the magnetic induction substrate 201 and penetrate the label surface and the lower surface. The conductive material is filled in the through holes 209 so that the metal on the lower surface of the magnetic induction substrate 201 is formed. Electrical connection is made with the wiring layer 205. The through hole 209 is formed at a position corresponding to the opening position (that is, coil contact position) of the trademark surface of the magnetic induction substrate 201, that is, each connection position of the radio frequency identification chip 207 (for example, a position where a gold bump is present). In the flip chip manufacturing process, conductive paste 211, such as a directional conductive paste (ACP), a directional conductive film (ACF) or / and a non-conductive paste (NCP), is applied to a plurality of coil contact positions. By adhering the coupling position of the coil contact and the radio frequency identification chip 207 through, the coil film group (including the induction coil 203 and the metal wiring layer 205) and the radio frequency identification chip 207 are electrically connected to transmit an induced current. This procedure completes the fabrication of an internal insert (Inlay) of the radio frequency identification device 200 of the present invention.

In the embodiment of the present invention, the radio frequency identification chip 207 receives the induced current generated by the induction coil 203 and emits electromagnetic waves to respond to the external radio frequency recognition reader and complete the recognition operation of the radio frequency device. The RF chip 207 may be formed by combining several functional circuits, including an AC-DC switching circuit for converting a radio frequency signal transmitted from an external reader into a DC power source, which provides a stable power source for the RF chip 207. Constant voltage circuit; A modulation circuit for removing a carrier wave and obtaining a true modulated signal; A microprocessor for encoding a signal transmitted from an external reader and feeding back data to the external reader according to a request thereof; A memory for storing the recognition data in the radio frequency identification device 200; And a modulation circuit for modulating the information sent from the microprocessor and mounting the induction coil to send the card reader to the card reader.

After completing the bonding of the radio frequency identification chip 207, the fabrication of the radio frequency identification device 200 of the present invention is completed. However, in other embodiments, the radio frequency identification element 200 of the present invention is an internal insert (including an induction coil, a magnetic induction substrate, a chip, etc.) of the radio frequency identification tag, and further proceeds with the sticker lamination procedure. The final radio frequency identification tag product can be completed. The tag lamination process is the final manufacturing process where the tag is produced. The manufacturing process is the induction coil 203, which is exposed to the original external environment by heating and compressing the internal insert of the radio frequency identification tag into a tag sticker or ticket card. The induction board 201 is sealed with a sticker packing together with the parts such as the RF chip 207 to form a tag product that can be used by clients. Depending on the demand of the industry, the form of the manufactured radio frequency identification tag is also different, for example, the TAXNICE radio frequency identification tag, the radio frequency identification tag of the 3 layer soft card type, and the radio frequency identification tag of the 5 layer hard card type, etc. There is this. The final product of this type is applicable to electronic money cards, access cards, tag stickers, security chips, etc.

As shown in FIG. 2, the radio frequency identification device 200 is disposed so that the metal wiring layer faces the metal surface 202, and the induction coil portion faces the outside. In practical applications, the metal surface 202 may be an IC circuit board, a battery, a metal carrier or a metal case of a can inside a mobile phone. Since the magnetic induction substrate 201 is interposed between the induction coil 203 and the metal surface 202, this installation method can prevent the electromagnetic wave received or emitted by the induction coil 203 from being affected by the metal surface 202. However, the installation method is only one of the embodiments of the present invention, and in other embodiments, the induction coil 203 and the metal wiring layer 205 of the RF recognition device 200 of the present invention are installed on the same side of the magnetic induction substrate 201. May be

Looking at the design of the radio frequency identification device according to the embodiment of the present invention, matching the electromagnetic wave absorbing material and the substrate, and the desired radio frequency induction recognition effect without the need to install a separate magnetic induction sticker or electromagnetic wave absorption sticker as in the prior art It can be achieved. In addition to saving the cost of the sticker, the radio frequency identification device of the present invention can also empty the space (thickness of about 150 µm to 200 µm) left for installing the magnetic induction sticker. It can provide space. As shown in Figure 3, this is a cross-sectional view of a radio frequency identification tag according to another embodiment of the present invention. In this embodiment, the radio frequency recognition device is almost similar in design to the radio frequency recognition device in FIG. 2, except that the coil structure in which the induction coil 203 is stacked in multiple layers using an altitude space emptied from the radio frequency recognition device. There is a difference. In the present embodiment, the magnetic induction layer 213 is further provided between the induction coils 203 of the respective layers to be used as an isolation layer between the layers to enhance the overall electromagnetic wave absorbing effect inside the radio frequency recognition device. The material of the magnetic induction layer 213 is the same as that of the magnetic induction substrate 201, and has excellent electromagnetic wave absorption characteristics. In the embodiment of the present invention, the magnetic induction coil 203 is first formed on the base induction coil 203 by the coating film addition layer method, and then the induction coil 203 of the other layer is formed thereon. The induction coil 203 of the uppermost layer is electrically connected to the metal wiring layer 205 under the magnetic induction substrate 201 through the through hole or the interconnection structure 215. Advantages of the design of the multilayer induction coil according to the present embodiment are as follows: By installing the multilayer induction coil using the space left in the magnetic induction or electromagnetic wave absorption sticker, and increasing the number of turns of the coil in the same unit area, Significantly reduce the sensing distance of the RF recognition device. The two-layer induction coil in FIG. 3 is merely an exemplary embodiment, and in other embodiments, the induction coil 203 can form a coil structure of more layers upwards to further increase the induction distance of the radio frequency identification device. Please note that.

Looking at the two embodiments of the present invention, the design of the present invention is to produce a radio frequency identification device by a substrate capable of proceeding a complete flexible plate manufacturing process having electromagnetic wave absorption properties, and a separate electromagnetic wave absorption sticker on the device Since there is no need to arrange, it is characterized by reducing a considerable production cost. According to the present invention, the induction coil and the magnetic induction layer can also be designed in a multi-layer, further increasing the induction distance of the radio frequency identification tag.

In the above, the embodiment of the thin circuit board having the induction coil according to the present invention has been described. In the following example, the manufacturing method of the thin circuit board having the induction coil according to the present invention will be described. In this method, a magnetic induction substrate is first provided, and the magnetic induction substrate is made of an organic resin and an inorganic powder, wherein the organic resin imparts mechanical properties and possibilities in the manufacturing process to the magnetic induction substrate, and the inorganic The powder gives the magnetic induction substrate a function of absorbing electromagnetic waves. Subsequently, an induction coil is formed on one surface of the magnetic induction board, and the induction coil is installed on the surface of the magnetic induction board with reference to the magnetic flux characteristics of the magnetic induction board, which is emitted from an external RF reader. By accepting, the current is generated by the electron induction method. Next, a metal wiring layer is formed on one surface of the magnetic induction substrate, and the metal wiring layer is electrically connected to the corresponding induction coil to transmit an electrical signal, or the induction coil generates excessive vortex by electromagnetic induction. It flows out of the substrate to prevent electromagnetic interference.

The method is also configured to attach the integrated circuit to one surface of the magnetic induction substrate, and the integrated circuit is electrically connected to the induction coil via the metal wiring layer. In another method embodiment, one or more induction coils are formed on the magnetic induction substrate, and a magnetic induction layer is formed between each of the induction coils and as an isolation layer between the layers to form an overall electromagnetic wave inside the radio frequency recognition device. Enhance the absorption effect.

In the above embodiment, the magnetic induction substrate or magnetic induction layer is composed of an organic resin and an inorganic powder, and the organic resin and the inorganic powder are about 15 to 35% and 85 to 65 of the magnetic induction substrate and the magnetic induction layer, respectively. Account for weight percent of percent. The organic resin is selected from the following materials or combinations thereof: polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polypropylene (polypropylene, PP), Polyethersulfone (PES), Polyphenylene Sulfone (PPSU), Polyparaphenylene Benzobisoxazole (PBO), Liquid Crystal Polymer (LCP), Acrylic Acrylate, Polyurethane (PU), or Epoxy. The inorganic powder is selected from the following materials or combinations thereof: MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, aluminum 、 Iron 、 or Nickel.

DETAILED DESCRIPTION Referring to the embodiments and drawings described in the specification, a general understanding of the structure of each of the different embodiments of the present invention will be given. The drawings and description are not intended to be exhaustive in all respects to the elements and features in apparatus and systems utilizing the above structures or methods. While referring to the specification of the present invention, one of ordinary skill in the art will be able to come up with many other embodiments of the present invention, and it should be understood that they all belong to the present disclosure. The present invention can be substituted and modified in structure and logic without departing from the scope of the present invention. For example: in the present invention, the induction coil and the metal wiring layer of the radio frequency recognition element can be provided on the same side of the magnetic induction substrate; The magnetic induction board of the radio frequency identification device can also take the design of the multilayer flexible circuit board; The radio frequency identification chip employed or combined with the radio frequency identification element may perform other functions such as constant voltage, rectification, and signal switching in addition to radio frequency recognition. Other manufacturing process procedures may be performed after the radio frequency identification device is manufactured, such as tag lamination and display printing. In addition, the drawings shown in the specification serves only as a city and are not produced in proportion. Some of the drawings are enlarged to serve as emphasis while others are simplified. Therefore, the embodiments and drawings of the present invention are only examples, and do not limit the present invention, and the scope of the present invention should be defined by the claims.

100 RF recognition element
101 Flexible Board
102 Metal Surface
103 Induction coil
104 Interconnect Structure
105 metallization layer
106 Magnetic Induction Stickers
107 radio frequency identification chip
109 through hole
200 RF recognition element
201 Magnetic Induction Board
202 metal surface
203 Induction Coil
204a interconnect structure
204b interconnect structure
205 metallization layer
207 radio frequency identification chip
209 through hole
211 Conductive Paste
213 Induction Layer
215 Interconnect Structure

Claims (16)

A magnetic induction substrate made of organic resin and inorganic powder;
An induction coil formed on one surface of the magnetic induction substrate; And
A metal wiring layer formed on one surface of the magnetic induction substrate and electrically connected to the induction coil;
The induction coil is installed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristics of the magnetic induction substrate.
The method of claim 1,
The induction coil includes one or more coils, a magnetic induction layer is formed between the induction coils of each layer, and the magnetic induction layer is made of an organic resin and an inorganic powder.
The method of claim 1,
Wherein the organic resin and the inorganic powder comprise about 15 to 35% and 85 to 65% by weight of the magnetic induction substrate, respectively.
The method of claim 2,
In the magnetic induction layer, the organic resin and the inorganic powder account for about 15 to 35% and 85 to 65% by weight of the magnetic induction layer, respectively.
The method according to claim 3 or 4,
The organic resin may be polyimide, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyether sulfone, polyphenylene sulfone, polyparaphenylene benzobisoxazole, liquid crystal polymer, acrylic resin, polyurethane, or epoxy resin or these Thin circuit board, characterized in that selected from the combination of.
The method according to claim 3 or 4,
The inorganic powder is MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, aluminum, iron, nickel or combinations thereof Thin circuit board, characterized in that selected from.
The method of claim 1,
An integrated circuit is attached to one surface of the magnetic induction substrate, wherein the integrated circuit is electrically connected to the metal wiring layer.
The method of claim 7, wherein
The integrated circuit is thin circuit board, characterized in that electrically connected with the induction coil.
The method of claim 1,
The thin circuit board is a thin circuit board, characterized in that the radio frequency identification device.
Forming a magnetic induction substrate made of organic resin and inorganic powder;
Forming an induction coil on one surface of the magnetic induction substrate, wherein the induction coil is formed on the surface of the magnetic induction substrate with reference to the magnetic flux characteristics of the magnetic induction substrate; and
And forming a metal wiring layer electrically connected to the induction coil on one surface of the magnetic induction substrate.
The method of claim 10,
The induction coil includes one or more layers of coils, a magnetic induction layer is formed between the induction coils of each layer, and the magnetic induction layer is made of an organic resin and an inorganic powder. .
The method of claim 10,
Wherein the organic resin and the inorganic powder comprise about 15 to 35% and 85 to 65% by weight of the magnetic induction substrate, respectively.
The method of claim 11,
In the magnetic induction layer, the organic resin and the inorganic powder account for about 15 to 35% and 85 to 65% by weight of the magnetic induction layer, respectively.
The method according to claim 12 or 13,
The organic resin may be polyimide, polyethylene terephthalate, polyethylene naphthalate, polypropylene, polyether sulfone, polyphenylene sulfone, polyparaphenylene benzobisoxazole, liquid crystal polymer, acrylic resin, polyurethane, or epoxy resin or these Method for producing a thin circuit board, characterized in that selected from the combination of.
The method according to claim 12 or 13,
The inorganic powder is MnZn ferrite, NiZn ferrite, NiCuZn ferrite, MnMgZn ferrite, MnMgAl ferrite, MnCuZn ferrite, cobalt ferrite, nickel iron alloy, iron silicon alloy, iron aluminum alloy, copper, aluminum, iron, nickel or combinations thereof Method for producing a thin circuit board, characterized in that selected from.
The method of claim 10,
And attaching an integrated circuit to one surface of the magnetic induction board, wherein the integrated circuit is electrically connected to the induction coil via the metal wiring layer.

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