KR20130026629A - Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof - Google Patents

Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof Download PDF

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Publication number
KR20130026629A
KR20130026629A KR20110089910A KR20110089910A KR20130026629A KR 20130026629 A KR20130026629 A KR 20130026629A KR 20110089910 A KR20110089910 A KR 20110089910A KR 20110089910 A KR20110089910 A KR 20110089910A KR 20130026629 A KR20130026629 A KR 20130026629A
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KR
South Korea
Prior art keywords
chip
polyvinyl chloride
layer
inlaid
dimension
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KR20110089910A
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Korean (ko)
Inventor
박성하
성재완
김대진
장기재
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(주)엘지하우시스
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Priority to KR20110089910A priority Critical patent/KR20130026629A/en
Priority to JP2014528300A priority patent/JP2014529696A/en
Priority to US14/343,014 priority patent/US20140213132A1/en
Priority to CN201280043037.1A priority patent/CN103781629A/en
Priority to PCT/KR2012/007092 priority patent/WO2013036022A2/en
Publication of KR20130026629A publication Critical patent/KR20130026629A/en

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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/04—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by a layer being specifically extensible by reason of its structure or arrangement, e.g. by reason of the chemical nature of the fibres or filaments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/30—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being formed of particles, e.g. chips, granules, powder
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
    • E04F15/102—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials of fibrous or chipped materials, e.g. bonded with synthetic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/04—Coating on the layer surface on a particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0228—Vinyl resin particles, e.g. polyvinyl acetate, polyvinyl alcohol polymers or ethylene-vinyl acetate copolymers
    • B32B2264/0242—Vinyl halide, e.g. PVC, PVDC, PVF or PVDF (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/554—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2471/00—Floor coverings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30—Woven fabric [i.e., woven strand or strip material]

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)
  • Synthetic Leather, Interior Materials Or Flexible Sheet Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: An inlaid floor material of polyvinyl chloride chip and a manufacturing method thereof are provided to enhance not only durability but also dimensional stability as well as balance of product, and adhesive force of construction bottom surface than before. CONSTITUTION: Polyvinyl chloride chip inlaid floor material comprises inlaid chip layer formed in a chip of polyvinyl chloride; ultraviolet paint layer formed and coated on top surface of inlaid chip layer; and a dimension reinforcing layer comprised of fabric, attached, and high pressured in bottom side of inlaid chip layer. A dimension enforcement layer is comprised of plain weave manufactured through a refining process of high temperature. A dimension enforcement layer comprises lattice of width and length 1x1 mm size. A manufacturing method of inlaid floor material of polyvinyl chloride chip comprises a step of transferring dimension reinforcing member(160) consisting of fabric; a step of coating polyvinyl chloride chip(170) in upper side of dimension reinforcing member; a step of preheating formed center molding material(180); a step of compressing center molding material with top and bottom; a step of solidifying after doing coating ultraviolet stiffening paint on upper side of formed final molding material(190). A dimension reinforcing member consisting of fabric manufactured through refining process of high temperature. [Reference numerals] (160) Dimension reinforcing member; (AA) High temperature oven pre-heating; (BB) Surface UV coating; (CC) Surface UV hardening; (DD) Winding process; (EE) Compression

Description

폴리염화비닐 칩 인레이드 바닥재 및 그 제조방법{INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF}Polyvinyl chloride chip inlaid flooring and its manufacturing method {INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF}

본 발명은, 폴리염화비닐 칩 인레이드 바닥재 및 그 제조방법에 관한 것으로서, 보다 상세하게는, 폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어의 하부에 평직 형태의 치수 보강 레이어를 구비함으로써, 종래보다 내구성을 증가시킬 수 있을 뿐만 아니라 제품의 치수 안정성과 밸런스를 구현하고 시공 바닥면과의 접착력을 향상시킬 수 있는 폴리염화비닐 칩 인레이드 바닥재 및 그 제조방법에 관한 것이다.The present invention relates to a polyvinyl chloride chip inlaid flooring material and a method for manufacturing the same, and more particularly, by providing a dimensional reinforcement layer in the form of a plain weave in the lower portion of the inlaid chip layer in which polyvinyl chloride is formed in a chip form, The present invention relates to a polyvinyl chloride chip inlaid flooring material and a method of manufacturing the same, which can increase the durability as well as improve the dimensional stability and balance of the product and improve adhesion to the construction floor.

도 1은 종래 폴리염화비닐(PVC) 칩 인레이드 바닥재(이하, '바닥재'라 한다)를 나타내는 단면도이다.1 is a cross-sectional view showing a conventional polyvinyl chloride (PVC) chip inlaid flooring (hereinafter referred to as "floor").

도 1에 도시한 바와 같이, 종래 바닥재(10)는 비발포 타입의 바닥재로서, 하측으로부터 상측 방향으로 시공 바닥면에 접착되는 이면층(11), 이면층(11)의 상측에 구비되며 유리 섬유 재질로 이루어지는 치수보강층(12), 치수보강층(12)의 상측에 구비되는 폴리염화비닐 칩층(13), 폴리염화비닐 칩층(13)의 표면에 도포되는 자외선 경화 도료층(14)이 순차적으로 적층된 구조를 갖고 있다.As shown in FIG. 1, the conventional flooring material 10 is a non-foaming type flooring material, and is provided on the back layer 11 and the back layer 11 that are attached to the construction bottom surface from the bottom side to the top direction, and are glass fibers. The dimensional reinforcement layer 12 made of a material, the polyvinyl chloride chip layer 13 provided on the upper side of the dimensional reinforcement layer 12, and the ultraviolet curable coating layer 14 applied to the surface of the polyvinyl chloride chip layer 13 are sequentially stacked. Has a structure.

이러한 바닥재(10)는 일반 PVC 바닥재에 비해 상대적으로 큰 내구성을 갖는 폴리염화비닐 칩층(13)을 구비하고 있으며 제품 표면이 마모되어도 폴리염화비닐 칩층(13)은 최대한 동일한 표면 형상을 유지하는 것이 가능하므로, 현재 사람의 이동이 빈번하게 이루어지는 병원, 매장 등 의료 및 상업용 공간과 같이 제품의 내구성이 중요한 장소에 주로 적용되고 있다. 한편, 폴리염화비닐 칩층(13)의 두께가 증가할수록 바닥재(20)의 내구성 증가에는 도움이 되지만, 현실적으로 바닥재의 시공상 폴리염화비닐 칩층(13)의 두께 증가에는 일정의 한계가 있다. The flooring material 10 has a polyvinyl chloride chip layer 13 having a relatively greater durability than the general PVC floor material, and even if the product surface is worn, the polyvinyl chloride chip layer 13 can maintain the same surface shape as possible. Therefore, it is currently mainly applied to places where the durability of the product is important, such as medical and commercial spaces, such as hospitals and stores where people move frequently. On the other hand, as the thickness of the polyvinyl chloride chip layer 13 increases, it helps to increase the durability of the flooring material 20, but in reality, there is a certain limit in increasing the thickness of the polyvinyl chloride chip layer 13 in construction of the flooring material.

이를 보완하기 위한 종래 기술의 다른 예가 도 2에 도시되어 있다. Another example of the prior art to compensate for this is shown in FIG.

도 2에 도시한 바와 같이, 종래 바닥재(20)의 다른 예는, 마찬가지로 비발포 타입의 바닥재로서, 폴리염화비닐 칩층(21) 및 폴리염화비닐 칩층(21)의 표면에 도포되는 자외선 경화 도료층(22)을 구비한 구조를 갖고 있다. As shown in FIG. 2, another example of the conventional flooring material 20 is similarly a non-foaming type flooring material, and is an ultraviolet curable coating layer applied to the surfaces of the polyvinyl chloride chip layer 21 and the polyvinyl chloride chip layer 21. It has a structure provided with (22).

한편, 도 1과 같이 치수보강층(13)이 구비된 구조는 Hetero Homegeous type이라 칭하며, 도 2에 도시된 바와 같이 폴리염화비닐 칩층(21)으로만 구성된 구조는 Homegeous type이라 칭한다. Meanwhile, the structure having the dimension reinforcing layer 13 as shown in FIG. 1 is referred to as a hetero homegeous type, and as shown in FIG. 2, the structure composed of only the polyvinyl chloride chip layer 21 is referred to as a homegeous type.

도 1에 도시된 Hetero Homegeous type의 바닥재(10)는 제품 내구성과 직결되는 폴리염화비닐 칩층(13)의 두께가 대략 1.25mm 정도로 얇게 형성되어 내구성은 대략 10년 정도를 가지게 되는 단점이 있지만, 치수보강층(12)이 구비되어 제품 치수 안정성과 밸런스 구현에 유리한 이점이 있으며, 시공 및 취급성이 용이한 장점을 갖고 있다. Hetero Homegeous type flooring material shown in Figure 1 has a disadvantage that the thickness of the polyvinyl chloride chip layer 13, which is directly connected to product durability, is formed as thin as approximately 1.25mm, so that the durability has about 10 years. The reinforcement layer 12 is provided, which is advantageous in terms of product dimensional stability and balance, and has an advantage of easy construction and handling.

반면에, 도 2에 도시된 Homegeous type의 바닥재(20)는 Hetero Homegeous type의 바닥재(10)에 비해 폴리염화비닐 칩층(21)의 두께가 크게 형성되므로 상대적으로 15년 정도의 우수한 내구성을 갖게 되지만, 치수 안정성이 약하며 딱딱한 재질의 폴리염화비닐 칩층(21)이 시공 바닥면과 직접적으로 접촉하므로 시공 및 취급성이 떨어지는 단점이 있다.
On the other hand, since the thickness of the polyvinyl chloride chip layer 21 is greater than that of the homegeous type flooring material 20 illustrated in FIG. 2, the thickness of the polyvinyl chloride chip layer 21 is relatively superior to about 15 years. In addition, since the dimensional stability is weak and the polyvinyl chloride chip layer 21 of hard material is in direct contact with the construction bottom surface, construction and handling are inferior.

본 발명의 목적은, 폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어의 하부에 평직 형태의 치수 보강 레이어를 구비함으로써, 종래보다 내구성을 증가시킬 수 있을 뿐만 아니라 제품의 치수 안정성과 밸런스를 구현하고 시공 바닥면과의 접착력을 향상시킬 수 있는 폴리염화비닐 칩 인레이드 바닥재 및 그 제조방법을 제공하는 것이다.An object of the present invention, by providing a woven reinforcement layer of the plain weave in the lower portion of the inlaid chip layer in which polyvinyl chloride is formed in the form of a chip, not only can increase the durability than conventional, but also realizes the dimensional stability and balance of the product And to provide a polyvinyl chloride chip inlaid flooring and a method of manufacturing the same that can improve the adhesion to the construction floor.

본 발명의 해결과제는 이상에서 언급된 것들에 한정되지 않으며, 언급되지 아니한 다른 해결과제들은 아래의 기재로부터 당업자에게 명확하게 이해되어 질 수 있을 것이다.
The solution to the problem of the present invention is not limited to those mentioned above, and other solutions not mentioned can be clearly understood by those skilled in the art from the following description.

상기 목적은, 본 발명에 따라, 폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어; 상기 인레이드 칩 레이어의 상부 표면에 코팅되어 형성되는 자외선 도료 레이어; 및 상기 인레이드 칩 레이어의 하면에 고온 압착되어 부착되며 직물로 이루어지는 치수 보강 레이어를 포함하는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재에 의해서 달성된다.According to the present invention, the polyvinyl chloride is formed in the form of a chip inlaid chip layer; An ultraviolet coating layer formed by coating an upper surface of the inlaid chip layer; And a dimensional reinforcement layer made of fabric and hot pressed to the bottom surface of the inlaid chip layer.

여기서, 상기 치수 보강 레이어는 고온의 정련 공정을 거쳐 제조된 평직으로 이루어질 수 있다.Here, the dimensional reinforcement layer may be made of plain weave manufactured through a high temperature refining process.

상기 치수 보강 레이어는 가로, 세로 1*1 mm 크기의 격자를 구비할 수 있다.The dimensional reinforcement layer may have a grid of 1 * 1 mm size.

상기 목적은, 본 발명에 따라, (a) 직물로 이루어지는 치수 보강 부재를 이송하는 단계; (b) 상기 치수 보강 부재의 상측에 폴리염화비닐 칩을 도포하는 단계; (c) 상기 (b)단계를 거쳐 형성된 중간 성형 부재를 예열하는 단계; (d) 상기 중간 성형 부재를 상하 압착하는 단계; 및 (e) 상기 (d)단계를 거쳐 형성된 최종 성형 부재의 상면에 자외선 경화 도료를 코팅한 후 경화시키는 단계를 포함하는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재의 제조방법에 의해서 달성된다.The object is, according to the present invention, the method comprising the steps of: (a) conveying a dimensional reinforcing member made of fabric; (b) applying a polyvinyl chloride chip on top of the dimension reinforcing member; (c) preheating the intermediate molding member formed through the step (b); (d) pressing the intermediate molding member up and down; And (e) coating and curing the UV curable paint on the upper surface of the final molded member formed through the step (d).

상기 치수 보강 부재는 고온의 정련 공정을 거쳐 제조된 평직으로 이루어질 수 있다.
The dimensional reinforcing member may be made of plain weave manufactured through a high temperature refining process.

본 발명에 따른 폴리염화비닐 칩 인레이드 바닥재 및 그 제조방법에 따르면, 폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어의 하부에 평직 형태의 치수 보강 레이어를 구비함으로써, 종래보다 내구성을 증가시킬 수 있을 뿐만 아니라 제품의 치수 안정성과 밸런스를 구현하고 시공 바닥면과의 접착력을 향상시킬 수 있다.According to the polyvinyl chloride chip inlaid flooring according to the present invention and a method of manufacturing the same, by providing a woven reinforcing layer in the form of a plain weave in the lower portion of the inlade chip layer in which polyvinyl chloride is formed in a chip form, it is possible to increase the durability than conventional In addition, it can realize the dimensional stability and balance of the product and improve the adhesion to the construction floor.

본 발명의 효과는 이상에서 언급된 것들에 한정되지 않으며, 언급되지 아니한 다른 효과들은 아래의 기재로부터 당업자에게 명확하게 이해되어 질 수 있을 것이다.
The effects of the present invention are not limited to those mentioned above, and other effects that are not mentioned will be clearly understood by those skilled in the art from the following description.

도 1 및 도 2는 종래 기술에 따른 바닥재를 나타내는 단면도이다.
도 3은 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재를 나타내는 단면도이다.
도 4는 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재에서 치수 보강 레이어를 나타내는 사시도이다.
도 5는 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재의 제조방법을 나타내는 공정도이다.1 and 2 are cross-sectional views showing a flooring according to the prior art.
3 is a cross-sectional view showing a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention.
4 is a perspective view showing a dimensional reinforcement layer in a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention.
5 is a process chart showing a method of manufacturing a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention.

본 발명과 본 발명의 동작상의 이점 및 본 발명의 실시에 의하여 달성되는 목적을 충분히 이해될 수 있도록, 본 발명의 바람직한 실시 예가 첨부 도면들을 참조하여 설명된다.BRIEF DESCRIPTION OF THE DRAWINGS Preferred embodiments of the present invention are described with reference to the accompanying drawings so that the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention can be fully understood.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시 예를 상세히 설명하며, 각 도면에서 동일한 참조부호(도면부호)는 동일한 구성을 나타낸다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which the same reference numerals refer to the same components.

도 3은 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재를 나타내는 단면도이고, 도 4는 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재에서 치수 보강 레이어를 나타내는 사시도이며, 도 5는 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재의 제조방법을 나타내는 공정도이다.Figure 3 is a cross-sectional view showing a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention, Figure 4 is a perspective view showing a dimensional reinforcement layer in a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention, Figure 5 Is a process chart showing a method of manufacturing a polyvinyl chloride chip inlaid flooring according to an embodiment of the present invention.

이들 도면에 도시된 바와 같이, 본 발명의 바람직한 일 실시 예에 따른 폴리염화비닐(PVC) 칩(chip) 인레이드(inlaid) 바닥재(100, 이하 '바닥재'라 한다)는, 폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어(110)와, 인레이드 칩 레이어(110)의 상부 표면에 코팅되어 형성되는 자외선 도료 레이어(120)와, 인레이드 칩 레이어(110)의 하면에 부착되는 치수 보강 레이어(130)를 포함한다.As shown in these figures, polyvinyl chloride (PVC) chip inlaid flooring (100, hereinafter referred to as "floor") according to an embodiment of the present invention, polyvinyl chloride chip Inlaid chip layer 110 is formed in the form, the UV coating layer 120 is formed on the upper surface of the inlaid chip layer 110, and the dimensional reinforcement attached to the lower surface of the inlaid chip layer 110 Layer 130.

먼저, 도 3에 도시한 바와 같이, 인레이드 칩 레이어(110)는, 치수 보강 레이어(130)의 상부에 일정 또는 불일정한 형태의 칩들이 도포되어 형성된다. 본 실시예에서, 인레이드 칩 레이어(110)는 종래에 비해 대략 50% 증가된 1.8~ 2.0 mm의 두께(t)를 갖도록 형성된다. 이러한 인레이드 칩 레이어(110)는 실질적으로 바닥재(100)의 내구성을 좌우하는 구성으로서, 본 실시예에서는 인레이드 칩 레이어(110)의 두께를 종래에 비해 크게 증가시킴으로써 바닥재(100)의 내구성을 크게 향상시킬 수 있게 된다. 본 실시예에서, 인레이드 칩 레이어(110)의 두께(t)는 종래 Homegeous type 바닥재의 폴리염화비닐 칩층(21) 두께와 동일하거나 그 이상일 수 있다.First, as shown in FIG. 3, the inlaid chip layer 110 is formed by coating chips of a predetermined or irregular shape on top of the dimensional reinforcement layer 130. In this embodiment, the inlaid chip layer 110 is formed to have a thickness (t) of 1.8 to 2.0 mm, which is approximately 50% increased compared to the prior art. The inlaid chip layer 110 is a configuration that substantially determines the durability of the flooring material 100, and in this embodiment, the durability of the flooring material 100 is increased by greatly increasing the thickness of the inlaid chip layer 110 as compared with the related art. It can be greatly improved. In the present embodiment, the thickness t of the inlaid chip layer 110 may be equal to or greater than the thickness of the polyvinyl chloride chip layer 21 of the conventional homegeous type flooring.

자외선 도료 레이어(120)는 인레이드 칩 레이어(110)의 상부 표면에 자외선 도료가 코팅되어 형성되며, 액상 오염물이 표면 내부인 인레이드 칩 레이어(110) 측으로 침투하는 것을 방지할 수 있으며 표면 오염 발생시 이의 제거를 용이하게 하는 이점을 갖고 있다.The ultraviolet paint layer 120 is formed by coating an ultraviolet paint on the upper surface of the inlaid chip layer 110, and can prevent liquid contaminants from penetrating into the inlaid chip layer 110 inside the surface. It has the advantage of facilitating its removal.

본 실시예에서는, 도 3 및 도 4에 도시한 바와 같이, 인레이드 칩 레이어(110)의 하면에 고온 압착 공정을 통해 부착되어 바닥재(100)의 치수 안정성과 내구성을 동시에 만족시킬 수 있는 치수 보강 레이어(130)를 더 포함한다. 이러한 치수 보강 레이어(130)는 직물 형태로 마련됨으로써 시공 바닥면에 대한 바닥재(100)의 접착성을 보다 향상시킬 수 있다.In the present embodiment, as shown in Figures 3 and 4, the reinforcement is attached to the lower surface of the inlaid chip layer 110 through a high-temperature pressing process to satisfy the dimensional stability and durability of the flooring material 100 at the same time The layer 130 further includes. The dimension reinforcement layer 130 may be provided in the form of a fabric to further improve the adhesion of the flooring material 100 to the construction floor surface.

한편, 치수 보강 레이어(130)는 좌우 방향 및 전후 방향 연신율을 가짐으로써 바닥재(100)가 시공 바닥면에 시공된 상태에서 시공 바닥면과 바닥재(100) 사이에서 미끄러지는 현상이 발생하는 것을 방지하도록, 본 실시예에서는 보다 구체적으로 평직(plain weave) 형태로 적용되는 것이 바람직하다. 예를 들어, 치수 보강 레이어(130)가 편조에 의해 형성된 편물일 경우, 전술한 바와 같은 미끄럼 발생으로 시공 바닥면상에서 미끄럼이 발생할 확률이 증가하게 된다.On the other hand, the dimensional reinforcement layer 130 has an elongation in the horizontal direction and the front and rear directions to prevent the sliding phenomenon between the construction floor surface and the flooring material 100 in the state in which the flooring material 100 is installed on the construction floor surface In this embodiment, it is preferable to apply in the form of plain weave. For example, when the dimensional reinforcement layer 130 is a knitted fabric formed by braiding, the probability of slipping on the construction floor is increased due to the slip generation as described above.

덧붙여, 일반적인 평직 형태는 열에 취약하여 수축율에 악영향을 미치므로, 본 실시예에서의 치수 보강 레이어(130)는 고온의 정련 공정을 거쳐 제조된 평직으로 이루어지는 것이 더 바람직하다. 또한, 도 4에 도시한 바와 같이, 치수 보강 레이어(130)는 25 mesh 정도의 밀도, 구체적으로 가로, 세로 1*1 mm 크기의 격자를 구비하도록 형성된다.In addition, since the general plain weave form is vulnerable to heat and adversely affects the shrinkage rate, the dimension reinforcing layer 130 in this embodiment is more preferably made of plain weave manufactured through a high temperature refining process. In addition, as shown in Figure 4, the dimensional reinforcement layer 130 is formed to have a grid of a density of about 25 mesh, specifically, 1x1 mm horizontally and vertically.

정리하자면, 전술한 바와 같이 치수 보강 레이어(130)가 고온의 정련 공정을 거친 평직으로 이루어지며, 대략 25 mesh 정도의 밀도를 갖도록 형성됨으로써, 바닥재(100)의 치수 안정성을 증가시킴과 더불어 시공시 바닥재(100)의 좌우 및 전후 방향의 밸런스를 향상시킬 수 있다. 또한, 치수 보강 레이어(130)가 직물 형태인 평직으로 이루어짐으로써, 시공 바닥면과의 접촉 마찰력을 증가시켜 시공 바닥면에 대한 바닥재(100)의 접착력을 향상시킬 수 있다. 여기서, 전술한 '치수 안정성'이라 함은 설정된 크기에 대한 바닥재(100)의 치수 변화 정도를 말한다.In summary, as described above, the dimensional reinforcement layer 130 is made of plain weave that has undergone a high temperature refining process, and is formed to have a density of about 25 mesh, thereby increasing the dimensional stability of the flooring 100 and at the time of construction. The balance of the left and right and front and rear directions of the flooring 100 can be improved. In addition, the dimensional reinforcement layer 130 is made of a plain weave in the form of a fabric, it is possible to improve the adhesion of the flooring material 100 to the construction floor by increasing the contact friction force with the construction floor surface. Here, the above-mentioned 'dimension stability' refers to the degree of dimensional change of the flooring material 100 with respect to the set size.

이하, 아래 표 1을 참조하여 본 실시예에 따른 바닥재(100)와 종래 Homogeneous Type의 바닥재(20)와의 치수 안정성과 시공바닥면에 대한 접착 강도를 비교하기로 한다. 참고로, 치수 안정성을 테스트하기 위해서는, 대략 가로, 세로 각각 30cm 정도의 시험편을 80℃ 정도의 건조 오븐에 6시간 정도 방치한 후 치수 변화정도를 측정하였다. 또한, 접착 강도를 테스트하기 위해서는, 대략 가로, 세로 25cm 정도의 시험편을 수성 아크릴계 본드를 이용하여 슬레이트 판에 부착 경화시킨 후 인장기를 이용하여 인장시켰을때의 박리 강도를 측정하였다.Hereinafter, with reference to Table 1 below, the dimensional stability of the flooring material 100 according to the present embodiment and the conventional flooring material 20 of the Homogeneous Type and compare the adhesive strength to the construction floor surface. For reference, in order to test the dimensional stability, the specimens of approximately 30 cm in length and width, respectively, were left in a drying oven at about 80 ° C. for about 6 hours and the degree of dimensional change was measured. In addition, in order to test adhesive strength, the peeling strength at the time of tension | tensile_strength using the tensioner was measured after attaching and hardening the test piece of about 25 cm in width and length to the slate board using the aqueous acrylic bond.

[실시예] [Example]

상측으로부터 하측으로 자외선 도료 레이어(120), 인레이드 칩 레이어(110) 및 고온정련 공정을 통해 제조된 평직로 이루어지는 치수 보강 레이어(130)가 순차적으로 적층된 바닥재(100)를 이용하여 치수 안정성과 접착 강도를 측정하였다.From the upper side to the lower side, the dimensional stability layer 130 and the dimensional reinforcement layer 130 made of a plain weave fabricated through the UV coating layer 120, the inlaid chip layer 110 and the high-temperature refining process is laminated sequentially Adhesive strength was measured.

[비교예][Comparative Example]

도 2에 도시한 바와 같이, 상측으로부터 하측으로 자외선 경화 도료층(22) 및 폴리염화비닐 칩층(21)이 순차적으로 적층된 바닥재(20)를 이용하여 치수 안정성과 접착 강도를 측정하였다.As shown in FIG. 2, the dimensional stability and adhesive strength were measured using the flooring material 20 in which the ultraviolet curing paint layer 22 and the polyvinyl chloride chip layer 21 were sequentially laminated from the upper side to the lower side.

항목Item 비교예(Homogeneous Type)Comparative Example (Homogeneous Type) 실시예Example 치수 안정성(%)Dimensional stability (%) 0.60.6 0.30.3 접착 강도(Kgf)Adhesive Strength (Kgf) 5151 8282

상기 표 1을 참조하면, 본 실시예에 따른 바닥재(100)는 종래 Homogeneous Type의 바닥재(20)에 비해 작은 치수 변화정도와 높은 접착 강도를 가지는 것을 확인할 수 있다.Referring to Table 1, it can be seen that the flooring 100 according to the present embodiment has a small degree of dimensional change and a high adhesive strength as compared to the flooring 20 of the conventional Homogeneous Type.

이하, 본 발명의 실시예에 따른 폴리염화비닐 칩 인레이드 바닥재 제조방법(이하, '제조방법'이라 한다)을 설명하기로 한다.Hereinafter, a method of manufacturing a polyvinyl chloride chip inlaid flooring material according to an embodiment of the present invention (hereinafter, referred to as a 'manufacturing method') will be described.

도 5에 도시한 바와 같이, 본 실시예에 따른 제조방법은, (a) 직물로 이루어지는 치수 보강 부재(160)를 이송하는 단계; (b) 치수 보강 부재(160)의 상측에 폴리염화비닐 칩(170)을 도포하는 단계; (c) 상기 (b)단계를 거쳐 형성된 중간 성형 부재(180)를 예열하는 단계; (d) 중간 성형 부재(180)를 상하 압착하는 단계; 및 (e) 상기 (d)단계를 거쳐 형성된 최종 성형 부재(190)의 상면에 자외선 경화 도료를 코팅한 후 경화시키는 단계를 포함한다. 상기 (e) 단계 후에는 최종 성형된 최종 성형 부재(190)를 권취하는 권취 공정이 추가된다.As shown in Figure 5, the manufacturing method according to the present embodiment, (a) transferring the dimensional reinforcement member 160 made of a fabric; (b) applying the polyvinyl chloride chip 170 on the dimension reinforcing member 160; (c) preheating the intermediate molding member 180 formed through the step (b); (d) pressing the intermediate molding member 180 up and down; And (e) coating and curing the ultraviolet curable paint on the upper surface of the final molding member 190 formed through the step (d). After step (e), a winding step of winding the final molded member 190 is added.

여기서, 치수 보강 부재(160)는 전술한 바와 같이 치수 안정성과 접착 강도를 증가를 위해, 고온의 정련 공정을 거쳐 제조된 평직으로 이루어지는 것이 바람직하다.Here, the dimensional reinforcing member 160 is preferably made of a plain weave manufactured through a high temperature refining process in order to increase the dimensional stability and adhesive strength as described above.

본 실시예 및 본 명세서에 첨부된 도면은 본 발명에 포함되는 기술적 사상의 일부를 명확하게 나타내고 있는 것에 불과하며, 본 발명의 명세서 및 도면에 포함된 기술적 사상의 범위 내에서 당업자가 용이하게 유추할 수 있는 변형 예와 구체적인 실시 예는 모두 본 발명의 권리범위에 포함되는 것이 자명하다고 할 것이다.
The embodiments and drawings attached to this specification are merely to clearly show some of the technical ideas included in the present invention, and those skilled in the art can easily infer within the scope of the technical ideas included in the specification and drawings of the present invention. Modifications that can be made and specific embodiments will be apparent that both are included in the scope of the invention.

100: 바닥재 110: 인레이드 칩 레이어
120: 자외선 도료 레이어 130: 치수 보강 레이어
160: 치수 보강 부재 170: 폴리염화비닐 칩
180: 중간 성형 부재 190: 최종 성형 부재100: flooring 110: inlaid chip layer
120: UV paint layer 130: dimension reinforcement layer
160: dimensional reinforcement member 170: polyvinyl chloride chip
180: intermediate molded member 190: final molded member

Claims (5)

폴리염화비닐이 칩 형태로 형성되는 인레이드 칩 레이어(110);
상기 인레이드 칩 레이어(110)의 상부 표면에 코팅되어 형성되는 자외선 도료 레이어(120); 및
상기 인레이드 칩 레이어(110)의 하면에 고온 압착되어 부착되며 직물로 이루어지는 치수 보강 레이어(130)를 포함하는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재.An inlaid chip layer 110 in which polyvinyl chloride is formed in a chip form;
An ultraviolet paint layer 120 formed by coating an upper surface of the inlaid chip layer 110; And
Polyvinyl chloride chip inlaid flooring material, characterized in that it comprises a dimensional reinforcement layer 130 is made of a fabric that is adhered to the lower surface of the inlaid chip layer 110 by a high temperature. 제1항에 있어서,
상기 치수 보강 레이어(130)는 고온의 정련 공정을 거쳐 제조된 평직으로 이루어지는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재.The method of claim 1,
The dimensional reinforcement layer 130 is polyvinyl chloride chip inlaid flooring, characterized in that made of a plain weave manufactured through a high-temperature refining process. 제1항에 있어서,
상기 치수 보강 레이어(130)는 가로, 세로 1*1 mm 크기의 격자를 구비하는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재.The method of claim 1,
The dimension reinforcement layer 130 is a polyvinyl chloride chip inlaid flooring, characterized in that the grid having a horizontal, vertical size of 1 * 1 mm. (a) 직물로 이루어지는 치수 보강 부재(160)를 이송하는 단계;
(b) 상기 치수 보강 부재(160)의 상측에 폴리염화비닐 칩(170)을 도포하는 단계;
(c) 상기 (b)단계를 거쳐 형성된 중간 성형 부재(180)를 예열하는 단계;
(d) 상기 중간 성형 부재(180)를 상하 압착하는 단계; 및
(e) 상기 (d)단계를 거쳐 형성된 최종 성형 부재(190)의 상면에 자외선 경화 도료를 코팅한 후 경화시키는 단계를 포함하는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재의 제조방법.(a) conveying the dimension reinforcing member 160 made of fabric;
(b) applying a polyvinyl chloride chip 170 on the dimension reinforcing member 160;
(c) preheating the intermediate molding member 180 formed through the step (b);
(d) pressing the intermediate molding member 180 up and down; And
(E) a method of manufacturing a polyvinyl chloride chip inlay de flooring comprising the step of curing after coating the ultraviolet curable coating on the upper surface of the final forming member 190 formed through the step (d). 제4항에 있어서,
상기 치수 보강 부재(160)는 고온의 정련 공정을 거쳐 제조된 평직으로 이루어지는 것을 특징으로 하는 폴리염화비닐 칩 인레이드 바닥재의 제조방법.5. The method of claim 4,
The dimensional reinforcement member 160 is a method of manufacturing a polyvinyl chloride chip inlaid flooring, characterized in that made of a plain weave manufactured through a high temperature refining process.
KR20110089910A 2011-09-06 2011-09-06 Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof KR20130026629A (en)

Priority Applications (5)

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KR20110089910A KR20130026629A (en) 2011-09-06 2011-09-06 Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof
JP2014528300A JP2014529696A (en) 2011-09-06 2012-09-05 PVC chip inlaid flooring material and method for producing the same
US14/343,014 US20140213132A1 (en) 2011-09-06 2012-09-05 Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof
CN201280043037.1A CN103781629A (en) 2011-09-06 2012-09-05 Inlaid type floor sheet having polyvinyl chloride chip and method of manufacturing thereof
PCT/KR2012/007092 WO2013036022A2 (en) 2011-09-06 2012-09-05 Inlaid type floor sheet having polyvinyl chloride chip and the method of manufacturing thereof

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US20140213132A1 (en) 2014-07-31
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WO2013036022A2 (en) 2013-03-14

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