KR20130018070A - Light emitting module and light unit having the same - Google Patents

Abstract

PURPOSE: A light emitting module and a lighting unit including the same are provided to connect a light emitting diode by arranging a wiring layer of a module substrate at the bottom. CONSTITUTION: A module substrate(32) includes multiple electrode patterns at the bottom. Multiple light emitting diodes are arranged on the module substrate. Multiple electrode patterns are arranged at a first wiring layer(L1). An insulating layer is formed on the first wiring layer. A second wiring layer(L3) comprises a pad comprising the multiple light emitting diodes.

Description

LIGHT EMITTING MODULE AND LIGHT UNIT HAVING THE SAME}

The embodiment relates to a light emitting module and a light unit having the same.

As information processing technology develops, display devices such as LCD, PDP and AMOLED are widely used. Among such display devices, an LCD requires a backlight unit capable of generating light in order to display an image.

The light emitting module mounts a plurality of light emitting diodes on a substrate and supplies external power through a connector to control driving of the plurality of light emitting diodes.

The embodiment provides a new light emitting module.

The embodiment provides a light emitting module and a light unit having the same, in which a wiring layer of a module substrate is disposed on a floor to connect a light emitting diode on the module substrate to a circuit.

The light emitting module according to the embodiment may include a module substrate having a plurality of electrode patterns on a bottom thereof; And a plurality of light emitting diodes mounted on the module substrate, wherein the module substrate comprises: a first wiring layer on which the electrode pattern is disposed; An insulating layer on the first wiring layer; And a second wiring layer having pads on which the plurality of light emitting diodes are mounted.

According to an exemplary embodiment, a light unit includes: a module substrate having a plurality of electrode patterns on a bottom thereof; A plurality of light emitting diodes mounted on the module substrate; A metal plate under the module substrate; And an adhesive member between the module substrate and the metal plate, the module substrate comprising: a first wiring layer on which the plurality of electrode patterns are disposed; An insulating layer on the first wiring layer; And a second wiring layer having pads on which the plurality of light emitting diodes are mounted.

The embodiment may provide a thin thickness of the module substrate.

The embodiment can provide a thin thickness of the light emitting module.

The embodiment can reduce the thickness of a light emitting module having a light emitting diode and a display device having the same.

1 is an exploded perspective view of a display device according to an exemplary embodiment.
FIG. 2 is a detailed perspective view illustrating the light emitting module of FIG. 1.
3 is a cross-sectional view of the coupling side of the light emitting module according to the embodiment.
4 is a rear view of the light emitting module of FIG. 2.
5 is a rear view illustrating another example of the light emitting module of FIG. 2.
6 is a rear view illustrating another example of the light emitting module of FIG. 2.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

1 is an exploded perspective view illustrating a display device according to an exemplary embodiment.

Referring to FIG. 1, the display device 100 includes a display panel 10 on which an image is displayed, and a backlight unit 20 that provides light to the display panel 10.

The backlight unit 20 may include a light guide plate 70 that provides a surface light source to the display panel 10, a reflective sheet 45 that reflects leakage light, and light in an edge region of the light guide plate 70. A light emitting module 30 and a bottom cover 40 forming a lower exterior of the display device 100 are included.

Although not illustrated, the display device 100 includes a panel supporter for supporting the display panel 10 from a lower side, and a top that forms a rim of the display device 100 and surrounds the circumference of the display panel 10. It may include a cover.

Although not shown in detail, the display panel 10 may include a lower substrate and an upper substrate coupled to each other to maintain a uniform cell gap, and a liquid crystal layer (not shown) interposed between the two substrates. . A plurality of gate lines and a plurality of data lines intersecting the plurality of gate lines may be formed on the lower substrate, and a thin film transistor (TFT) may be formed at an intersection of the gate line and the data line. Color filters may be formed on the upper substrate. The structure of the display panel 10 is not limited thereto, and the display panel 10 may have various structures. For example, the lower substrate may include a color filter as well as a thin film transistor. In addition, the display panel 10 may be formed in various shapes according to a method of driving the liquid crystal layer.

Although not shown, a gate driving printed circuit board (PCB) for supplying a scan signal to a gate line and a data driving printed circuit board (PCB) for supplying a data signal to a data line are provided at edges of the display panel 10. ) May be provided.

A polarizing film (not shown) may be disposed on at least one of the top and bottom of the display panel 10. An optical sheet 60 may be disposed below the display panel 10, and the optical sheet 60 may be included in the backlight unit 20, and may include at least one prism sheet or / and a diffusion sheet. have. The optical sheet 60 may be removed but is not limited thereto.

The diffusion sheet evenly spreads the incident light, and the diffused light may be focused onto the display panel by the prism sheet. Here, the prism sheet may be selectively configured using a horizontal or / and vertical prism sheet, one or more roughness reinforcing sheets, and the like. Type or number of the optical sheet 60 may be added or deleted within the technical scope of the embodiment, but is not limited thereto.

The light emitting module 30 may be disposed on at least one side of the inner side of the bottom cover 40. The light emitting module 30 may be disposed on both side surfaces or all side surfaces of the bottom cover 40, but is not limited thereto. In addition, the light emitting module 30 may be disposed on the bottom of the bottom cover 40 to provide light in a direct manner. In this case, the configuration of an optical member such as a light guide plate or an optical sheet may vary.

As shown in FIG. 2, the light emitting module 30 includes a module substrate 32 and a plurality of light emitting diodes 34 arranged on one surface of the module substrate 32.

The plurality of light emitting diodes 34 are arranged at a predetermined pitch, and at least one of the plurality of light emitting diodes 34 emits at least one of at least one color, for example, white, red, green, and blue. The embodiment may use a light emitting diode that emits light of at least one color or a combination of light emitting diodes that emit a plurality of colors.

The light emitting diode 34 may include an LED chip using a group III-V compound semiconductor and a molding member for protecting the LED chip. At least one kind of phosphor may be added to the molding member, but is not limited thereto. The LED chip may emit light in a visible light band or emit light in an ultraviolet band.

The light emitting diodes 34 may be arranged in at least one column, but are not limited thereto. The light emitting diodes 34 mounted on the module substrate 32 may be arranged at regular intervals or at irregular intervals.

The module substrate 32 may be coupled in a direction perpendicular to the bottom of the bottom cover 40 or may be disposed in a direction parallel to the bottom of the bottom cover 40, but is not limited thereto. The light emitting diodes 34 are disposed on the front surface (or top surface) of the module substrate 32.

The module substrate 32 is adhered to the bottom cover 40 or the heat dissipation plate by an adhesive member 50, and the adhesive member 50 includes an insulating tape.

The plurality of light emitting diodes 34 are disposed to face at least one side of the light guide plate 70, and light generated from the plurality of light emitting diodes 34 is incident. The light guide plate 70 may be formed in a polygonal shape including an upper surface at which a surface light source is generated, a lower surface opposite to the upper surface, and at least four side surfaces. The light guide plate 70 is made of a transparent material, and may include, for example, one of an acrylic resin series such as polymethyl metaacrylate (PMMA), polyethylene terephthlate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN) resin. Can be. The light guide plate 70 may be formed by an extrusion molding method, but is not limited thereto.

A reflective pattern (not shown) may be formed on the top or / and bottom of the light guide plate 70. The reflection pattern is formed of a predetermined pattern, for example, a reflection pattern and / or a prism pattern, thereby reflecting or / and diffusely reflecting light, so that the light may be uniformly irradiated through the entire surface of the light guide plate 70. The lower surface of the light guide plate 70 may be formed in a reflective pattern, and the upper surface may be formed in a prism pattern. A scattering agent may be added to the inside of the light guide plate 70, but is not limited thereto.

The reflective sheet 45 may be provided under the light guide plate 70. The reflective sheet 45 reflects light traveling toward the lower portion of the light guide plate 70 toward the display panel. The reflective sheet 45 re-injects the light leaked to the lower portion of the light guide plate 70 into the light guide plate 70, thereby preventing problems such as a decrease in light efficiency, a decrease in optical properties, and dark areas. The reflective sheet 45 may be formed of, for example, PET, PC, PVC resin, but is not limited thereto. The reflective sheet 45 may be an upper surface of the bottom cover 40, but is not limited thereto.

The bottom cover 40 includes an accommodating portion 41 having an open top, and the accommodating portion 41 includes a light emitting module 30, an optical sheet 60, a light guide plate 70, and a reflecting sheet 45. Can be stored. The bottom cover 40 may be formed of a material having a high heat dissipation efficiency, such as a stainless material, but is not limited thereto.

The reflective sheet 45, the light guide plate 70, and the optical sheet 60 may be sequentially stacked on the accommodating portion 41 of the bottom cover 40, and the light emitting module 30 may include the bottom cover 40. The side of the light guide plate 70 is disposed to correspond to the side. At least one light emitting module 30 may be disposed in the bottom cover 40, but is not limited thereto.

As shown in FIG. 2, the module substrate 32 may be formed in a bar shape, and the light emitting diodes 34 may be disposed in one or two rows on the module substrate 32. I do not. The module substrate 32 may include a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, and an FR-4 substrate. The module substrate 32 may include a printed circuit board having a metal layer therein.

Referring to FIGS. 3 and 4, the module substrate 32 may include a first wiring layer L1, an insulating layer L2 on the first wiring layer L1, and a second wiring layer L3 on the insulating layer L2. ), And a protective layer (L4) on the second wiring layer (L3).

The first wiring layer L1 includes at least one of Al, Cu, and Fe, and is formed in a circuit pattern on the entire lower surface of the module substrate 32 to function as a heat dissipation plate. As the first wiring layer L1, for example, an Al plate having good heat dissipation efficiency may be used. The first wiring layer L1 includes an insulating portion 131A between the plurality of electrode patterns 131, 132, 133, and the plurality of electrode patterns 131, 132, 133. The first electrode pattern 131 of the plurality of electrode patterns 131, 132, 133 is connected to the first light emitting diode of the plurality of light emitting diodes 34, and the second electrode pattern 132 connects the adjacent light emitting diodes. The third electrode pattern 133 is connected to the last light emitting diode. The insulating portion 131A insulates the plurality of electrode patterns 131, 132, and 133 from each other.

Widths T2 and T3 of the first and second electrode patterns 131 and 132 may be wider than widths of the light emitting diodes 34. The first and second electrode patterns 131 and 132 may connect the light emitting diodes 34 to each other through the via holes 135 and 136. Since the widths T2 and T3 of the first and second electrode patterns 131 and 132 are wider than the area of the light emitting diodes 34, the heat conducted through the via holes 135 and 136 may be effectively radiated.

Alternatively, the widths T2 and T3 of the first and second electrode patterns 131 and 132 may be wider than the widths of the pads of the second wiring layer L3, so that the heat generated from the light emitting diodes 34 may be increased. The heat dissipation may be effectively performed by the first and second electrode patterns 131 and 132 rather than the heat dissipation by the wiring layer L3. In addition, the widths T2 and T3 of the first and second electrode patterns 131 and 132 may be smaller than the gap T1 between the light emitting diodes. Widths T2 and T3 of the first and second electrode patterns 131 and 132 may be different or the same, but are not limited thereto. The first electrode pattern 131 may be exposed to the first side surface S1 of the module substrate 32, but is not limited thereto. The interval T4 between the second electrode patterns 132 may be spaced apart by a narrower interval than the width T1 between the light emitting diodes 34, and the interval T4 may vary depending on the position of the via hole.

The third electrode pattern 133 is spaced apart from the second side surface S2 of the module substrate 32, and a portion 133A is disposed on the first side surface S1 rather than the second side surface S2 of the module substrate 32. Are placed closer to). A portion 133A of the third electrode pattern 133 may be exposed to the first side surface S1 of the module substrate 32, but is not limited thereto.

The first electrode pattern 131 and the part 133A of the third electrode pattern 133 of the module substrate 32 are supplied with power through a connector to be transferred to the plurality of light emitting diodes 34.

An insulating layer L2 is disposed on the first wiring layer L1, and the insulating layer L2 may include prepregregulated materials, and may include an epoxy resin, a phenol resin, an unsaturated polyester resin, and the like. have. The insulating layer L2 and the insulating portion 131A of the first wiring layer L1 may be formed of the same material, but are not limited thereto.

A second wiring layer L3 is disposed on the insulating layer L2, and the second wiring layer L3 includes a circuit pattern and includes at least one of Cu, Au, Al, and Ag, and may use, for example, Cu. have.

The second wiring layer L3 includes a plurality of pads 137 and 138, and the plurality of pads 137 and 138 are arranged to correspond to areas below the light emitting diodes 34, respectively. The pads 137 and 138 may be bonded to the light emitting diodes 34 by soldering.

The second wiring layer L3 and the first wiring layer L1 are connected to the plurality of via holes 135 and 136. The plurality of via holes 135 and 136 are formed through the second wiring layer L3 to the first wiring layer L1, and selectively connect the second wiring layer L3 and the first wiring layer L1. Can be. For example, the first via hole 135 connects the first pad 137 of the second wiring layer L3 and the first electrode pattern 131 or the second electrode pattern 132 of the first wiring layer L1 to each other. The second via hole 136 connects the second pad 138 of the second wiring layer L3 and the second electrode pattern 132 or the third electrode pattern 133 of the first wiring layer L1 to each other. . The second pad 138 disposed under the last light emitting diode is connected to each other by the third electrode pattern 133 and the second via hole 136 of the first wiring layer L1.

The plurality of via holes 135 and 136, the pads 137 and 138, and the first to third electrode patterns 131, 132, and 133 connect the plurality of light emitting diodes 34 in series.

A protective layer L4 is disposed on the second wiring layer L3, the protective layer L4 includes a solder resist, and the protective layer L4 is an area other than a pad on the upper surface of the module substrate 32. To protect.

The thickness of the first wiring layer (L1) is formed thicker than other layers for heat radiation efficiency, for example, is formed of a thickness of 0.8 ~ 1.5mm, the insulating layer (L2) may be formed of a thickness of 85 ~ 100㎛. The second wiring layer L3 may be formed to a thickness of less than 70 μm, for example, 15 to 60 μm, and the protective layer L4 may be formed to a thickness of 15 to 30 μm. The via holes 135 and 136 may have a diameter of 0.3 mm ± 0.1.

The first wiring layer L1 may be formed to a thickness to prevent the module substrate 32 from warping. The second wiring layer L3 may be formed to a thickness for plating the via holes 135 and 136, and the pad 137 138 may function as the via holes 135 and 136. The second wiring layer L3 may be thinly formed to have a thickness at which the light emitting diode 34, which is not a circuit pattern, may be solder bonded to the via holes 135 and 136. The first wiring layer L1 is formed to a thickness thicker than the thickness of the second wiring layer L3.

The module substrate 32 may be thinner than the module substrate in which the wiring layer and the heat dissipation layer are separately disposed by disposing an electrode pattern on the bottom and performing a function as a circuit and a heat dissipation plate.

In addition, the electrode patterns 131, 132, 133 at the bottom of the module substrate 32 directly radiate heat generated from the light emitting diodes 34, thereby effectively radiating heat.

The first wiring layer L1 of the module substrate 32 is bonded to the first side portion 42 of the bottom cover 40, that is, the metal plate by the adhesive member 50, to the plurality of light emitting diodes 34. While supplying power, heat generated from the plurality of light emitting diodes 34 is radiated through a metal plate such as the bottom cover 40 or the heat dissipation plate.

5 is a rear view illustrating another example of the light emitting module of FIG. 2.

Referring to FIG. 5, the wiring layer L1 disposed on the bottom of the module substrate 32 includes the second electrode pattern 132 having the protrusion P1. The protrusion P1 of the second electrode pattern 132 may protrude to one side of the electrode pattern disposed in one of the adjacent electrode patterns. By protruding the protrusion P1 of the second electrode pattern 132 to one side of the other electrode pattern, the adhesion between the electrode patterns 131, 132, and 133 and the insulating part 131A may be enhanced. In addition, the length T31 of the protrusion P1 of the second electrode pattern 132 is spaced between the adjacent first electrode pattern 131 and the second electrode pattern 132 and between the second electrode pattern 132. It may protrude longer than T4, and may protrude shorter than the distance T1 between the light emitting diodes 34.

In addition, the protrusion P3 of the third electrode pattern 133 extends in the direction of the last second electrode pattern 132 and is disposed closer to the last second electrode pattern 132 than the third electrode pattern 133. Can be.

6 is a rear view illustrating another example of the light emitting module of FIG. 2.

Referring to FIG. 6, the second electrode patterns 132 of the module substrate 32 may include first patterns 132A and second patterns 132B having different sizes and alternately disposed. In the first pattern 132A, the width T32 of the upper portion closer to the fourth side surface S4 is wider than the width T31 of the lower portion than the third side surface S3. An upper portion of the first pattern 132A includes first and second protrusions P1 and P2 on both sides thereof, and the first protrusion P1 and the second protrusion P2 are disposed in opposite directions. Each side of the pattern protrudes. In the second pattern 132B, the width T33 of the upper portion closer to the fourth side S4 is narrower than the width T31 of the lower portion of the second pattern 132B. The second electrode pattern 132 of the light emitting module 32 may have different sizes of the first pattern 132A and the second pattern 132B, thereby improving coupling force with the insulating portion 131A in the wiring layer L1. According to an embodiment, a protrusion may be disposed on at least one of the first to third electrode patterns to protrude to one side or both sides of another electrode pattern.

The light emitting module according to the embodiment may be applied not only to a backlight unit such as a portable terminal, a computer, but also to a lighting device such as a lighting lamp, a traffic light, a vehicle headlight, an electric sign, a street lamp, and the like, but is not limited thereto. In addition, the light guide plate may not be disposed in the direct type light emitting module, but is not limited thereto. In addition, a light transmitting material such as a lens or glass may be disposed on the light emitting module, but is not limited thereto.

It is not intended to be limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, it will be apparent to those skilled in the art that various forms of substitution, modification, and alteration are possible without departing from the technical spirit of the present invention described in the claims, and the appended claims. Will belong to the technical spirit described in.

Reference Signs List 100: display device, 10: display panel, 20: backlight unit, 30: light emitting module, 32: module substrate, 34: light emitting diode, 45: reflective sheet, 60: optical sheet, 70: light guide plate, 131,132,133: electrode pattern, 135,136 : Via hole, 137,138: Pad, L1: First wiring layer, L2: Insulation layer, L3: Second wiring layer, L4: Protective layer

Claims (15)

A module substrate having a plurality of electrode patterns on the bottom; And
A plurality of light emitting diodes disposed on the module substrate;
The module substrate may include a first wiring layer on which the plurality of electrode patterns are disposed; An insulating layer on the first wiring layer; And a second wiring layer having a pad on which the plurality of light emitting diodes are disposed on the insulating layer. The light emitting module of claim 1, wherein the module substrate comprises a plurality of via holes connecting the electrode pattern of the first wiring layer and the pad of the second wiring layer to each other. The light emitting module of claim 1, wherein the plurality of light emitting diodes are connected in series. The electrode pattern of claim 2, wherein the electrode pattern of the first wiring layer comprises: first and third electrode patterns for supplying power; And a second electrode pattern connected to each of the plurality of via holes to connect adjacent light emitting diodes. The light emitting module of claim 4, wherein at least one of the first to third electrode patterns has a width wider than that of the pad. The light emitting module of claim 4, wherein the first wiring layer of the module substrate has a thickness thicker than the thickness of the second wiring layer. The light emitting module of claim 4, wherein the first wiring layer of the module substrate further includes an insulating part between a plurality of electrode patterns. 8. The light emitting module of claim 4, wherein the first wiring layer comprises an aluminum material. The light emitting module of claim 4, further comprising a protective layer on the second wiring layer. The light emitting module of claim 4, wherein at least one of the first to third electrode patterns includes a protrusion protruding to one side of the other electrode pattern. A module substrate having a plurality of electrode patterns on the bottom;
A plurality of light emitting diodes disposed on the module substrate;
A metal plate under the module substrate; And
An adhesive member between the module substrate and the metal plate,
The module substrate may include a first wiring layer on which the plurality of electrode patterns are disposed; An insulating layer on the first wiring layer; And a second wiring layer having a pad on which the plurality of light emitting diodes are mounted on the insulating layer. The light unit of claim 11, comprising a bottom cover having the metal plate. The light unit of claim 11, further comprising a protective layer on the second wiring layer. The light unit of claim 12, further comprising a light guide plate corresponding to the plurality of light emitting diodes on the bottom cover. The method of claim 11, wherein the module substrate includes a plurality of via holes connecting the electrode pattern of the first wiring layer and the pad of the second wiring layer to each other.
The electrode patterns of the first wiring layer may include first and third electrode patterns for supplying power; And a second electrode pattern connected to the plurality of via holes, respectively, to connect adjacent light emitting diodes.

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