KR20130015656A - Led lighting device with structure of heat sink having high heat disspation - Google Patents

Abstract

PURPOSE: An LED lighting device having a heat radiation performance maximization heatsink structure is provided to improve effect of heat radiation by maximizing contact area with air by arranging the maximum number of multiple curved shape heat radiation pins in the minimum space. CONSTITUTION: An LED device is formed in an LED lighting main body(10). The LED device is connected with a PCB substrate. A main heat radiation unit(30) surrounds the outside of the light-emitting direction of the LED device. The main heat radiation unit includes a plurality of heat radiation pins(P2). The plurality of heat radiation pins are formed among protruded wave patterns on the outer surface.

Description

Maximizing Heat Dissipation Performance LED lighting device with structure of heat sink having high heat disspation

The present invention relates to an LED lighting device having a heat sink maximizing heat dissipation performance. More specifically, the heat dissipation effect by maximizing the contact area with air by arranging the maximum number of curved heat dissipation fins in a minimum space. It relates to an LED lighting device having a maximized heat sink structure for improving the.

In general, cooling of high power light sources, for example high power light sources including light emitting diodes (LEDs) assembled in a small area and having a high power density is desirable, but such cooling is difficult to achieve.

Moreover, when the effective area is small, it is necessary to efficiently use the effective space between other functional parts of the lighting apparatus, for example, other functional parts such as a housing, an optical element, a driver substrate, and the like.

In addition, user-friendly thermal management is required with respect to noise or the flow of hot air.

In order to achieve these contradictory goals, LED lighting devices utilize heat sinks that arrange LEDs in a relatively large area and simultaneously perform heat dissipation.

Heat sinks are divided into passive and active. Passives typically provide relatively wide spaced cooling fins that are arranged around or under the light source and form airflow channels extending from the bottom to the top to allow for natural convection. Thus, typically, the exhaust port of hot air is placed around the fins such that the tail of the exhausted hot air is directed in the opposite direction to the direction of gravity.

In the case of the active type, it means a method of forcing air flow through a submount substrate to the heat sink side that is thermally connected to a high temperature light source.

In the case of both active and passive types, there is a continuous demand for technology development for more efficient heat dissipation through the structural design of the heat sink.

[Related Technical Literature]

1. Lighting system with heat sink and heat sink (Patent application number: 10-2007-0098010)

2. Heat sink and heat sink formation method (Patent Application No .: 10-2010-7016840)

3. Cooling device for LED lighting fixture equipped with heat pipe and heat sink (patent application number: 10-2010-0004734)

In order to solve this problem, the present invention provides a LED lighting apparatus having a heat sink structure for maximizing heat dissipation to improve heat dissipation effect by maximizing the contact area with air by arranging the maximum number of curved heat dissipation fins in a minimum space. It is to provide.

In addition, the present invention is to provide an LED lighting device having a heat dissipation performance maximizing heat sink structure to perform stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit, auxiliary heat dissipation unit, main heat dissipation extension unit.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention includes: an LED lighting body mounted with an LED element connected to a PCB substrate; And a main heat dissipation unit extending to surround the outer edge of the light emitting direction of the LED device and having a plurality of heat dissipation fins P2 formed between the wave patterns protruding on the outer circumferential surface of the outer envelope.

Each of the heat radiation fins P2 is preferably formed in a zigzag into the curved portion of the wave pattern.

The main heat dissipation unit is preferably formed in a radial structure in the light emitting direction of the LED element.

Each of the heat dissipation fins P2 is preferably spaced apart from each other at equal intervals on the outer circumferential surface.

The heat dissipation fins P2 may include round fins P2c formed in an oval cylindrical shape on an outer circumferential surface of the radial front end; And by including a straight fin (P2s) formed in an elliptic stick shape, it provides the effect of configuring the maximum number of heat radiation fins in the minimum space.

In addition, the round pin (P2c) is characterized in that the oval cylindrical shape is cut from the upward direction to the downward direction (B) at a predetermined angle from the radial outer circumferential surface toward the outside in the horizontal direction to the reference direction. .

In addition, the straight pin (P2s) is formed by cutting in the direction (B), can be cut at an angle different from the angle at which the round pin (P2c) is cut.

The cut surfaces of the round fins P2c and the straight fins P2s provide a wider heat dissipation area.

In addition, the round fins P2c and the straight fins P2s may be alternately formed up and down of the outer circumferential surface of the main heat dissipating portion alternately into the curved interior of the wave pattern.

In addition, the round fins P2c are formed below the outer circumferential surface of the main heat dissipation unit, and the straight fins P2s are preferably formed above the outer circumferential surface of the main heat dissipation column.

In addition, it is preferable that the wave fins P2w of the wave pattern are formed between the round fins P2c and the straight fins P2s that are alternately formed on the outer circumferential surface of the main heat dissipation unit.

In addition, the wave fin (P2w) is connected in a repetitive pattern in which two curves having curvature_1 meet toward the outer edge C3, and two curves having curvature_2 meet toward the central edge C4. Can be formed.

In addition, curvatures of the curved portions of the outer edge C3 and the central edge C4 may be the same or different.

The LED lighting apparatus having the heat dissipation performance maximizing heat sink structure may further include an auxiliary heat dissipation unit formed between the LED light main body and the main heat dissipation unit.

Here, the auxiliary radiator is preferably formed in a cylindrical shape extending from the LED lighting body.

In addition, the auxiliary radiator is characterized in that formed on the upper end of the step of the main radiator.

The auxiliary heat dissipation unit may include a plurality of heat dissipation fins P1 disposed on the outer circumferential surface of the cylindrical shape and spaced apart from each other.

In addition, each of the heat radiation fins (P1) is a straight fin (P1s) of the elliptical stick shape; And by including a round fin (P1c) of the oval cylindrical shape surrounding the straight fin (P1s), it provides the effect of configuring the maximum number of heat radiation fins in the minimum space.

In addition, the round fin (P1c) is preferably formed by cutting from the outer peripheral surface of the auxiliary heat dissipating portion in the direction (A) from upward to downward at a predetermined angle with respect to the reference direction toward the outside in the horizontal direction.

In the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to another embodiment of the present invention, the straight pin (P1s) is formed by cutting in the direction (A), the round fin (P1c) is cut Can be cut at different angles.

In the LED lighting device having a heat sink maximizing heat dissipation performance according to another embodiment of the present invention, the round fin (P1c), the outer edge (C1) and the two curves having curvature_3 and curvature_4 It is characterized by being formed at the central end (C2).

LED lighting device having a heat sink maximizing heat dissipation structure according to another embodiment of the present invention, the main heat dissipation extension is formed symmetrically with respect to the main heat dissipation unit and the vertical plane; As shown in FIG.

In addition, the main heat dissipation extension is formed symmetrically with respect to the vertical plane, the portion corresponding to the wave fin (P2w) formed between the straight pin (P2s) and the two straight pins (P2s) of the symmetrical shape is It is preferable that it is a cut shape.

The straight fins P2s and the wave fins P2w also provide the effect of providing a larger heat dissipation area through the cut surface, such as the round fins P2c and the straight fins P2s.

In addition, the material of the round pin (P2c) and the straight pin (P2s) is preferably formed differently.

In addition, the material of the round pin (P1c) and the straight pin (P1s) is preferably formed differently.

In addition, the auxiliary radiator is preferably in contact with the PCB substrate.

In addition, the LED lighting body is formed in a shape that increases as the diameter of the cylindrical or cylindrical toward the bottom, it is preferable that the corner of the top is formed in a curve.

LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention, by maximizing the contact area with the air by maximizing the number of curved plurality of heat radiation fins in a minimum space to maximize the heat dissipation effect Provide the effect of improving.

In addition, the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to another embodiment of the present invention, the heat dissipation performance of maximizing the heat dissipation performance by performing a stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit, auxiliary heat dissipation unit, main heat dissipation extension unit To provide.

1 is a plan view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 2 is a perspective view showing an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 3 is a front view of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 4 is a rear view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
5 is a left side view (a) and a right side view (b) of the LED lighting apparatus having a heat sink maximizing heat sink structure according to an embodiment of the present invention.
Figure 6 is a bottom view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
7 is a view showing a heat radiation performance simulation results for the LED lighting device having a heat sink maximizing heat sink structure according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is a plan view of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. Figure 2 is a perspective view showing an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. 3 is a front view of an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. Figure 4 is a rear view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. 5 is a left side view (a) and a right side view (b) of the LED lighting apparatus having a heat sink maximizing heat sink structure according to an embodiment of the present invention. 6 is a bottom view of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.

1 to 6, the LED lighting apparatus having a heat sink maximizing heat dissipation performance is the LED lighting body 10, the auxiliary heat dissipation unit 20, the main heat dissipation unit 30, and the main heat dissipation extension unit 40. Including. The auxiliary heat dissipation unit 20, the main heat dissipation unit 30, and the main heat dissipation extension unit 40 form a heat sink structure.

The LED lighting body 10 is formed in a shape in which the diameter of the cylindrical or cylindrical increases toward the front end, the PCB substrate 11, and the LED element 12 connected to the PCB substrate 11 is mounted in the housing.

As shown in the LED lighting body 10, the upper edge is formed in a curved line.

More specifically, the LED lighting body 10 is a heat generating part, similar to a bell shape, and forms at least one curvature part in a direction from the center to the outside.

The auxiliary heat dissipation unit 20 is formed in a cylindrical shape extending from the LED light main body 10 at the front end of the LED light main body 10 and is configured to partially dissipate heat transferred to the main heat dissipation unit 30 to the outside. do.

The auxiliary heat dissipation part 20 includes a first heat dissipation fin part 21 formed by gathering a plurality of first heat dissipation fins P1 arranged on the outer circumferential surface of the cylindrical shape.

More specifically, the first heat dissipation fin part 21 is formed on the upper end of the step 31 of the main heat dissipation part 30. The step 31 is formed in a planar shape on the upper surface of the main heat dissipation unit 30 at the point where the auxiliary heat dissipation unit 20 and the main heat dissipation unit 30 meet.

Each of the first heat dissipation fins P1 constituting the first heat dissipation fin unit 21 includes a first round fin P1c and a first straight fin P1s, and includes a first straight fin P1s and a first round fin ( P1c) may use other materials.

The first round pin P1c surrounds the first straight pin P1s, and has an oval tube shape at a predetermined angle from a reference line S1 (refer to FIG. 2) facing outward from the outer circumferential surface of the first heat dissipation fin part 21. It is formed by cutting in the upward direction downward (A, see Fig. 2).

More specifically, referring to the above-mentioned direction A, the first heating fin P1 has a first outer edge C1 having two curves having a first curvature Curvature1 having a second curvature Curvature2. And meet at the central end (C2).

On the other hand, in another embodiment of the present invention, the center end (C2) may be formed in a structure that is coupled to the outer peripheral surface of the cylindrical shape of the first heat dissipation fin portion 21, in this case, the end of the center end (C2) is formed separately Need not be.

The first straight pin P1s is positioned at the center of the first round pin P1c and is formed in an elliptic stick shape cut in the direction A described above.

The main heat dissipation unit 30 is formed to extend at the front end of the auxiliary heat dissipation unit 20 and has a radial structure in which the diameter increases with the extension length.

The main heat dissipation unit 30 is formed to maximize the discharge of residual heat in the state partially radiated primarily from the auxiliary heat dissipation unit 20 to the outside.

The main heat dissipation part 30 includes a second heat dissipation fin part 32 formed by gathering a plurality of second heat dissipation fins P2 arranged on the outer circumferential surface of the radial structure.

Each of the second heat dissipation fins P2 constituting the second heat dissipation fin portion 32 includes a second round fin P2c, a second straight fin P2s, and a wave fin P2w, and a second straight fin P2s. The second round fin P2c may improve the time and efficiency of heat dissipation by using different materials.

A plurality of second round fins P2c are formed on the outer circumferential surface of the front end of the second heat dissipation fin unit 32 so as to be spaced apart from each other, and the upper end of the second round fin P2c is directed toward the outside from the outer circumferential surface of the second heat dissipation fin unit 32. It is formed by cutting in a downward direction (B, see Fig. 2) from the upper side of the elliptical tubular shape at a predetermined angle.

More specifically, the second round pin P2c is formed adjacent to the inner circumferential surface where two curves having the third curvature Curvature3 meet at the second outer edge C3 having the fourth curvature4. Here, two curves having a third curvature (Curvature3) are spaced apart along the outer circumferential surface of the second heat dissipation fin part 32, and a plurality of curves are formed.

The second straight pin P2s is formed adjacent to the inner circumferential surface where the two curved lines having the fifth curvature Curvature5 meet at the second central end C4 having the sixth curvature Curvature6. Here, two curves having a fifth curvature (Curvature5) are formed along the outer circumferential surface of the second heat dissipation fin part 32, and a plurality of curves are formed.

In addition, the second straight pins P2s are formed in an elliptic stick shape cut in the direction B described above.

Here, one of the two curves having the fifth curvature Curvature5 is a curve extending from one of the two curves having the third curvature Curvature3.

Also, the other one of the two curves having the fifth curvature Curvature5 has the third curvature Curvature3 formed in the opposite direction, so that the curve of one of the two curves having the fifth curvature5 is symmetric to Formed curve.

Here, in the second round fin P2c and the second straight fin P2s constituting the second heat dissipation fin P2, the second round fin P2c is the second heat dissipation fin part 32 based on the direction B. Is formed on the outer side of the outer peripheral surface.

In addition, the second straight fins P2s are formed inside the outer circumferential surface of the second heat dissipation fin unit 32 with respect to the direction B, and the second round fins P2c and the second straight fins P2c are the second. On the outer circumferential surface of the heat dissipation fin portion 32 are alternately formed in a zigzag.

The wave fins P2w are formed between the second round fins P2c and the second straight fins P2s that are alternately formed in zigzag.

More specifically, the wave fin P2w has a shape where two curves having a third curvature Curvature3 meet at a second outer edge C3 having a fourth curvature4 and a fifth curvature5. The shapes where the two curves meet at the second center end C2 having the sixth curvature Curvature6 are combined to form a continuous wave shape.

The main heat dissipation extension part 40 is formed symmetrically on a vertical plane with the second round fin P2c of the main heat dissipation part 30.

More specifically, the main heat dissipation extension part 40 is formed between the wave fins P2w of the main heat dissipation part 30 and the second straight fins P2s and the second round fins P2c are vertically symmetrically formed, The upper end of the portion corresponding to the wave fin P2w formed between the second straight pin P2s and the two second straight pins P2s among the symmetrical shapes is formed in the cut shape.

7 is a view showing a heat radiation performance simulation results for the LED lighting device having a heat sink maximizing heat sink structure according to an embodiment of the present invention.

Maximizing the heat dissipation performance including the auxiliary heat dissipation unit 20, the main heat dissipation unit 30, and the main heat dissipation extension unit 40. In order to confirm only the heat dissipation performance of the heat sink, all unnecessary mechanisms were removed and simulation was performed. Table 1 was set.

Interpretation condition Outside temperature 20 degrees Solve area 216m Heat Source 120 W Outdoor conditions None (natural convection) Heatsink material ALDC12 Heatsink weight 2 kg

The results for this are shown in Table 2 below.

Simulation result PCB Board (11) 62 degrees Heat sink top temperature (power supply): auxiliary heat sink (20) 56 degrees Lowest temperature in heat sink 53 degrees Temperature difference of heat sink 9 degrees

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: LED lighting body 20: auxiliary radiator
21: first heat dissipation fin P1: first heat dissipation fin
P1c: first round pin P1s: first straight pin
30: main heat dissipation part 31: step
32: second heat dissipation fin part P2: second heat dissipation fin
P2c: second round pin P2s: second straight pin
P2w: Wave fin 40: Main heat dissipation extension

Claims (26)

LED lighting body mounted with the LED element connected to the PCB substrate; And
A main heat dissipation unit which extends to surround the outer side of the light emitting direction of the LED element, wherein a plurality of heat dissipation fins P2 are formed between the protruding wave patterns on the outer circumferential surface surrounding the outer side; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it comprises a.
The method according to claim 1, The heat radiation fin (P2),
Each of the LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed in a zigzag into the interior of the curved portion of the wave pattern.
The method according to claim 1, wherein the main heat dissipation unit,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed in a radial structure in the light emitting direction of the LED element.
The heat dissipation fin (P2) of claim 3,
Each of the LED lighting device having a heat sink maximizing heat sink structure, characterized in that arranged on the outer peripheral surface spaced apart from each other at equal intervals.
The method according to claim 4, The heat radiation fin (P2),
Round pins (P2c) formed in an oval cylindrical shape on the outer peripheral surface of the radial front end; And
Straight pins (P2s) formed in the shape of an elliptic stick; LED lighting device having a heat sink maximizing heat dissipation performance, comprising a.
The method according to claim 5, The round pin (P2c),
LED having a heat dissipation performance maximizing heat sink structure, characterized in that the elliptical cylindrical shape is cut from the upward direction to the downward direction (B) at a predetermined angle from the radial outer circumferential surface toward the outside in a horizontal direction as a starting point. Lighting equipment.
The method according to claim 6, wherein the straight pin (P2s),
Is formed by cutting in the direction (B), LED lighting device having a heat sink maximizing heat sink structure, characterized in that the round fin (P2c) is cut at an angle different from the cutting angle.
The method of claim 7,
The round fins (P2c) and the straight fins (P2s), LED illumination having a heat dissipation performance maximizing heat sink structure, characterized in that alternately formed up and down the outer circumferential surface of the main heat dissipation portion to the curved inside of the wave pattern Device.
The method according to claim 8,
The round fin P2c is formed below the outer circumferential surface of the main heat dissipation unit,
The straight fin (P2s) is a LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed on the top of the outer peripheral surface of the main heat dissipation.
The method according to claim 8,
Wave heat wave fins (P2w) of the wave pattern is formed between the round fins (P2c) and the straight fins (P2s) are formed up and down the outer circumferential surface of the main heat dissipation portion has a heat sink maximizing heat sink structure LED lighting.
The method according to claim 10, wherein the wave fin (P2w),
Two curves with curvature_1 meet toward the outer edge C3,
LED lighting device having a heat sink structure maximizing heat dissipation, characterized in that the two curves having curvature_2 is formed toward the center end (C4) is connected in a repetitive pattern.
The method of claim 11,
Curvature of the curved portion of the outer end (C3) and the center end (C4) is the same or different from each other LED lighting device having a heat sink maximizing heat sink structure.
The method according to claim 1,
An auxiliary heat dissipation unit formed between the LED lighting body and the main heat dissipation unit; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it further comprises.
The method according to claim 13, wherein the auxiliary heat dissipation unit,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed in a cylindrical shape extending from the LED lighting body.
The method according to claim 14, The auxiliary heat dissipation unit,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed on the upper end of the step of the main heat dissipation portion formed at the point that is joined to the main heat dissipation portion.
The method according to claim 14, The auxiliary heat dissipation unit,
LED lighting device having a heat dissipation performance maximizing heat sink structure, characterized in that it is disposed on the outer peripheral surface of the cylindrical shape spaced apart from each other, each of the plurality of heat radiation fins (P1) having a projection pattern.
The method according to claim 16, The heat radiation fin (P1),
Straight pins P1s each having an elliptic stick shape; And
Round pin (P1c) of the oval cylindrical shape surrounding the straight pin (P1s); LED lighting device having a heat sink maximizing heat dissipation performance, comprising a.
The method of claim 17, wherein the round pin (P1c),
LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed by cutting in a direction (A) from the upper direction to a downward direction at a predetermined angle from the outer circumferential surface of the auxiliary heat dissipation unit in a horizontal direction.
The method according to claim 18, wherein the straight pin (P1s),
Is formed by cutting in the direction (A), LED lighting device having a heat sink maximizing heat sink structure, characterized in that the round fin (P1c) is cut at an angle different from the cutting angle.
The method of claim 17, wherein the round pin (P1c),
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the two curves having a curvature_3 is formed by meeting at the outer edge (C1) and the central end (C2) having a curvature_4.
The method of claim 10,
A main heat dissipation extension formed symmetrically with respect to the main heat dissipation unit and a vertical plane; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it further comprises.
The method according to claim 21, wherein the main heat dissipation extension,
Is formed symmetrically with respect to the vertical plane, the portion corresponding to the straight pin (P2s) and the wave pin (P2w) formed between the two straight pins (P2s) of the symmetrical shape is a cut shape LED lighting device with heat sink structure to maximize heat dissipation performance.
The method according to claim 5,
LED material having a heat sink maximizing heat sink structure, characterized in that the material of the round fin (P2c) and the straight pin (P2s) is formed differently.
18. The method of claim 17,
The round fin (P1c) and the material of the straight pin (P1s) LED lighting device having a heat sink maximizing heat sink structure, characterized in that formed differently.
The method according to claim 15, wherein the auxiliary heat dissipation unit,
LED lighting device having a heat sink maximizing heat dissipation, characterized in that in contact with the PCB substrate.
The method according to claim 1, wherein the LED lighting body,
The diameter of the cylindrical or cylindrical is formed in a shape that increases toward the bottom, LED lighting device having a heat sink maximizing heat sink structure, characterized in that the upper edge is formed in a curve.

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