KR20120128944A - Lighting apparatus having optic-semiconductor - Google Patents

Abstract

PURPOSE: An optical semiconductor lighting device is provided to efficiently remove dust from the upper side of the outside of a reflector by equally arranging the upper side of the reflector and the upper side of the lateral side of a heat sink. CONSTITUTION: One side of a housing is open. An optical source module(500) is arranged in the housing and includes an optical semiconductor device. A fan(400) is arranged near the optical source module and inputs air to the optical source module. A reflector(700) determines the radiation angel of light by reflecting the light from the optical source module. The lower side of the housing is separated from a part of the outside of the reflector or the shape of the lower side of the housing is changed to discharge air from the fan to the outside of the reflector.

Description

LIGHTING APPARATUS HAVING OPTIC-SEMICONDUCTOR}

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus disposed in a workplace such as a factory to generate light.

Generally, incandescent lamps, fluorescent lamps, and the like are used as light sources used in lighting devices, but recently, LED devices such as light emitting diodes (LEDs) are employed. The LED device has a number of advantages such as high luminous efficiency, low power consumption and environmentally friendly, the trend of increasing the technical field using the LED device.

The lighting device having the LED element may be used as a room light in a home or an office, but may also be used as a factory in a workshop where automobile assembly, steelmaking work, and sewing work are performed. However, there may be dust such as dust, foreign matters, etc. in the workplace, and these dusts may penetrate into the lighting device, causing failure of the lighting device, or lowering luminous efficiency and heat radiation efficiency. In particular, when the dust adheres to the surface of the reflector of the lighting device, the reflection efficiency and heat dissipation efficiency of the reflector may be lowered or the beauty of the appearance may be damaged.

Therefore, the present invention is to solve the above problems, an object of the present invention is to provide an optical semiconductor lighting apparatus that can effectively remove the dust attached to the outer surface of the reflector.

An optical semiconductor lighting device according to an embodiment of the present invention is a housing having one side open (open), a light source module disposed in the housing and including at least one optical semiconductor element, disposed adjacent to the light source module and the light source module A fan for introducing air to the furnace (fan), and reflecting the light generated from the light source module reflector to determine the irradiation range of the light. In this case, the lower end of the housing is disposed to be spaced apart from at least a portion of the outer side of the reflecting shade so that air introduced by the fan flows out to the outer side of the reflecting shade, or the shape of the lower end of the housing is deformed. .

The lower end of the housing may have a shape disposed to be spaced apart from at least a portion of the outer surface of the reflecting shade. Alternatively, the lower end of the housing may have a shape capable of concentrating the air introduced by the fan to the outer surface of the reflector to discharge at a strong pressure. In this case, the lower end of the housing may have a shape in which an inner portion facing the reflecting shade is concave round in a state overlapping with a portion of the upper end of the reflecting shade. Alternatively, the lower end portion of the housing overlaps with at least a portion of the reflection shade, and the interval with the outer surface of the reflection shade may have a shape narrowing toward the lower direction of the reflection shade.

The optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electro-luminescence device (EL).

A movement path may be formed in the housing to allow at least some of the air introduced by the fan to flow out through the light source module.

The optical semiconductor lighting apparatus may further include a heat dissipation unit for dissipating heat generated from the light source module. In this case, the heat dissipation unit may include at least one of a heat sink, a heat pipe, and a heat spreading member.

The heat dissipation unit may include a heat sink having a heat sink body disposed adjacent to the light source module to absorb and release heat generated from the light source module. The heat sink body may be provided with a heat sink vent for passing at least a portion of the air moved to the heat sink by the fan, the light source module moves the air passing through the heat sink vent to the lower portion of the light source module. The light source vent may be formed, and the movement path may be formed by the heat sink vent and the light source vent.

The reflection shade may be combined with the heat sink body such that an upper end of the reflection shade coincides with an upper end of the side surface of the heat sink body. In this case, the heat sink body may include a base plate and a plurality of heat dissipation protrusions. The base plate is disposed adjacent to the light source module, and is coupled to the reflection shade so that an upper end of the side surface coincides with an upper end of the reflection shade. The heat dissipation protrusions are formed on one surface of the base plate opposite to the light source module.

A plurality of edge vents may be formed at an edge of the heat sink body to move some of the air introduced by the fan to an inner side surface of the reflection shade.

The housing may include a case body and an upper cover. The case body has an upper and lower parts open, and accommodates the fan and the light source module therein, and a lower end portion is spaced apart from at least a portion of an outer surface of the reflecting shade or the lower end portion is deformed. The upper cover is coupled to the case body to cover the upper portion of the case body.

The upper cover may be formed with an air inlet for moving outside air into the housing. In addition, the upper cover may be disposed to be spaced apart from the upper end of the case body, so as to form a side inlet port so that the outside air is moved into the housing.

The optical semiconductor lighting apparatus may further include a dust collecting module disposed on an outer surface of the reflecting shade to collect dust in the air flowing out through the outer vent. The dust collecting module may be height-adjustable according to the shape of the lower end of the housing or the position of the vent formed in the lower end of the housing.

According to such an optical semiconductor lighting apparatus, as the lower end portion of the housing is spaced apart from at least a portion of the outer surface of the reflector or a portion of the shape is deformed to form an outer vent, the air introduced into the housing by the fan is transferred to the outer side. It can move along the outer surface of the reflector when it is discharged through the vent, thereby effectively removing dust attached to the outer surface of the reflector.

In addition, as the upper end of the reflecting shade is arranged to coincide with the upper end of the side of the heat sink, the air flowing out through the outer vent can move from the upper side to the lower side of the outer side of the reflecting shade, so that the outside of the reflecting shade Dust attached to the upper part of the side can be effectively removed.

1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention.
FIG. 2 is an exploded perspective view showing the optical semiconductor lighting device of FIG.
3 is a cross-sectional view illustrating one end surface of the optical semiconductor lighting apparatus of FIG. 1.
4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.
5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.
6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.
7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention.
8 and 9 are plan views illustrating the arrangement of the heat dissipation protrusions of the heat sink of FIG. 7.
FIG. 10 is an enlarged cross-sectional view of part A of FIG. 7.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text.

It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms “comprise,” “have,” “comprise,” and the like are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification. It should be understood that no other features or numbers, steps, actions, components, parts, or combinations thereof are excluded in advance. In addition, the word "A is formed on B" means "A can be formed anywhere above B" and is not interpreted to be limited to only "A is formed only on the surface of B".

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings.

≪ Example 1 >

1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention, Figure 2 is an exploded perspective view showing an exploded optical semiconductor lighting apparatus of Figure 1, Figure 3 is an optical semiconductor lighting of Figure 1 It is sectional drawing which shows one end surface of an apparatus.

1, 2 and 3, the optical semiconductor lighting apparatus 1000 according to the present embodiment is a housing (HS), heat sink 300, fan (fan, 400), light source module 500, diffusion The plate 600, the sealing member 610, the plate fixing unit 620 and the reflection shade 700 is included.

The housing HS has an inner space capable of accommodating the fan 400 and the like. At this time, the lower portion of the housing (HS) is open (open), the upper portion of the housing (HS) is formed with an air inlet 210 for moving the outside air into the inner space.

Specifically, for example, the housing HS may include a case body 100 in which the internal space is formed and an upper cover 200 coupled to the case body 100. The upper and lower portions of the case body 100 are open, and the upper cover 200 is coupled to the case body 100 to cover the upper portion of the case body 100. The case body 100 may be formed in a cylindrical shape, as shown in FIG. The case body 100 may be formed of a synthetic resin, and the upper cover 200 may be formed of a synthetic resin or a metal material, for example, an aluminum alloy.

The upper cover 200 is formed with the air inlet 210 through which the outside air passes. The air inlet 210 includes first inlet holes 212 having a shape extending from the center of the upper cover 200 to the outside, and second inlet holes 214 having a circular or polygonal shape. can do. The first and second inlet holes 212 and 214 may be spaced apart from each other in a radial shape with respect to the center of the upper cover 200. In addition, the first and second inlet holes 212 and 214 may be formed in a spiral shape corresponding to the rotation direction of the fan 400 to be described later.

An outer vent 110 is formed between the lower end portion 100a of the case body 100 and the reflection shade 700 to be described later. Specifically, the lower end portion 100a of the case body 100 is disposed to be spaced apart from each other so as to overlap at least a portion of the outer surface of the reflection shade 700 to form the outer vent 110. On the other hand, the lower end portion 100a of the case body 100 may be further formed with a plurality of lower support portions 120 protruding downward to be spaced apart from each other.

The heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100. For example, the heat sink 300 may be fixed to the bottom support parts 120 of the case body 100. The heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated from the light source module 500 to be described later to be released to the outside, for example, aluminum or magnesium. In addition, the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside. Specifically, the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.

The base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500. At this time, the edge portion of the base plate 310 may be coupled to the lower support portions 120 of the case body 100 to be fixed.

The base plate 310 is provided with a heat sink vent 312 for moving the air present in the inner space to the lower portion of the heat sink 300. The heat sink vent 312 may include a central vent 312a formed at the center of the base plate 310 and a plurality of outer vents 312b formed at the edge of the base plate 310. In this case, the outer vent holes 312b may be formed to be spaced apart from each other along the edge of the base plate 310. Meanwhile, as shown in FIG. 3, both the outer vent holes 312b and the central vent hole 312a may be formed, but only one of them may be formed.

The heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100 and are disposed in the inner space, and receive heat from the base plate 310 to be discharged to the outside. Can be. The heat dissipation protrusions 320 may have various structures and arrangements having excellent heat dissipation efficiency. For example, the heat dissipation protrusions 320 may correspond to the first and second air inlet holes 212 and 214 of the upper cover 200. It may have a layout. Specifically, the heat dissipation protrusions 320 are radially and helically shaped to correspond to the first and second air inlet holes 212 and 214 and spaced apart from each other based on the center of the base plate 310. Can be deployed. That is, the heat dissipation protrusions 320 may be radially and spirally formed to be spaced apart from each other to correspond to the rotation direction of the fan 400 about the central vent hole 312a.

The outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310. As a result, a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330. On the other hand, the central protrusion wall 340 is formed to protrude from the lower surface of the base plate 330, is formed along the edge of the central vent (312a). Therefore, when the central vent 312a is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.

Meanwhile, in addition to the heat sink 300, another heat dissipation part may be disposed inside or outside the housing HS. For example, the heat dissipation unit may be configured to include at least one of a heat pipe and a heat spreading member, in addition to or separately from the heat sink 300.

The fan 400 is disposed in the inner space of the case body 100 to move external air provided through the air inlet 210 to the heat sink 300 to cool the heat flowing from the heat sink. In charge of. The fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis. In this case, the central axis is preferably coincident with the center of the heat sink 300 and the center of the upper cover 200. On the other hand, the inner surface of the case body 100 may be formed with a fan mounting portion 130 for coupling with the fan case. The fan mounting unit 130 may be a stepped portion formed on the inner surface of the case body 100 as shown in FIG. 3 and coupled to the edge of the fan case. Alternatively, the fan mounting unit 130 may protrude from the inner surface of the case body 100. It may be a support protrusion (not shown) that can be coupled to the heat dissipation case while supporting the edge of the fan case.

The light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is disposed adjacent to the bottom surface of the base plate 310. Light is generated in a downward direction with respect to the base plate 310.

The light source module 500 includes at least one optical semiconductor element 520 capable of generating light. For example, the optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electroluminescent device (EL). . Specifically, for example, the light source module 500 may further include a printed circuit board 510 and optical cover units 530 in addition to the optical semiconductor elements 520.

The printed circuit board 510 is disposed adjacent to the bottom surface of the base plate 310. For example, the printed circuit board 510 is disposed in direct contact with the bottom surface of the base plate 310, or a separate thermal conductive pad (not illustrated) is disposed between the printed circuit board 510 and the base plate 310. Si) is interposed, the printed circuit board 510 may be disposed in close contact with the lower surface of the base plate (310). The printed circuit board 510 is provided with a light source vent 512 corresponding to the heat sink vent 312 formed in the base plate 310. In this case, the light source vent 512 includes substrate central vents 512b formed at positions corresponding to the central vent 312a and substrate vents 512b formed at positions corresponding to the outer vents 312b, respectively. It may include. The printed circuit board 510 may be disposed to be adjacent to the bottom surface of the base plate 310 with the central vent hole 512a inserted into the central protrusion wall 340.

The optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510. Each of the optical semiconductor elements 520 may include at least one light emitting diode (LED) for generating light, and the light emitting diode may generate light having various wavelengths according to its purpose, for example, red It can generate light in the yellow, blue or ultraviolet wavelength band.

The optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light. For example, the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.

The diffusion plate 600 is disposed below the printed circuit board 510 and diffuses light generated by the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332. The diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510. In this case, the plate vent 600 is a plate central vent 602a formed at a position corresponding to the substrate central vent 512a and the plate outer vents 602b respectively formed at positions corresponding to the substrate outer vents 512b. It may include. Meanwhile, the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.

The sealing member 610 is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 to prevent external moisture and foreign matters. It can be prevented from being applied to the light source module 500 side. Specifically, the sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 is interposed between the outer sealing ring 612, and the diffusion plate 600 and the central protrusion wall 340. May include a central sealing ring 614. In this case, the outer sealing ring 612 and the central sealing ring 614 may be, for example, a rubber ring.

The plate fixing unit 620 is disposed along the edge of the diffuser plate 600 at the lower portion of the diffuser plate 600 to surround the diffuser plate 600 with a plurality of coupling screws (not shown). It is fixed to the lower side wall (330). That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit 620 and the diffusion plate 600, the edge of the diffusion plate 600 to the outer lower side wall Can be strongly fixed to the (330). Meanwhile, the central portion of the diffusion plate 600 may be strongly fixed to the central protrusion wall 340 by separate coupling screws. That is, as each of the separate coupling screws penetrates through the diffusion plate 600 and then is coupled to the central protrusion wall 340, the central portion of the diffusion plate 600 is strongly attached to the central protrusion wall 340. Can be fixed

The reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light. The reflection shade 700 may be fixed to the side of the heat sink 300, for example, the side of the base plate 310. In this case, an upper end of the reflection shade 700 may be disposed to coincide with an upper end of the side surface of the base plate 310.

The reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside. A dust prevention film (not shown) may be formed on the surface of the reflection shade 700 to prevent dust or foreign matter from sticking well. For example, the anti-dust coating may be an antifouling coating film such as a nano-green coating film. In addition, a plurality of concave-convex shapes may be formed on the surface of the reflection shade 700 to increase the surface area to effectively release the heat absorbed from the light source module 500.

On the other hand, the lower end portion (100a) of the case body 100 is disposed spaced apart so as to overlap (overlap) with at least a portion of the outer surface of the reflection shade 700. For example, the lower end portion 100a of the case body 100 may be covered to a 1/3 or 1/2 position from the upper end of the outer surface of the reflection shade 700, or unlike the reflection shade 700 unlike FIG. 3. It can cover all of the sides. In addition, the lower end portion 100a of the case body 100 may be formed to have an inclination substantially the same as that of the outer surface of the reflection shade 700 or may be formed to have a slightly larger or smaller inclination.

Referring to FIG. 3 again, the flow of air when the fan 400 rotates in the forward direction will be briefly described.

First, air introduced into the inner space through the air inlet 210 of the upper cover 200 is blown to the heat sink 300 by the fan 400. At this time, the heat sink 300 absorbs heat generated from the light source module 500, and the air blown into the heat sink 300 receives heat from the heat sink 300 to receive the heat sink ( 300) can be reduced.

A portion of the air blown into the heat sink 300 by the fan 400 is provided to the outer side of the reflector 700 again through the outer vent 110, and is provided on the outer side of the reflector 700. It is possible to remove the dust, ie, dust and foreign matter. Specifically, as the lower end portion 100a of the case body 100 is disposed to be spaced apart from each other so as to overlap with at least a portion of the outer surface of the reflection shade 700, the outer vent 110 is formed, the fan ( A portion of the air blown into the heat sink 300 by 400 may move along the outer surface of the reflector 700 as it exits through the outer vent 110, and consequently of the reflector 700 Dust attached to the outer side can be effectively removed.

In addition, as the upper end of the reflector 700 is arranged to match the upper end of the side of the base plate 310 of the heat sink 300, the air flowing out to the outside through the outer vent 110, the reflector 700 It can move to the bottom via the top of the outer surface of the). As a result, the dust attached to the upper end portion of the outer surface of the reflection shade 700 adjacent to the side of the base plate 310 can be more effectively removed.

In the housing HS, a movement path for moving air blown into the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed. May be formed by the heat sink vent 312, the light source vent 512, and the plate vent 602. In detail, the movement path includes a first movement path formed by the central vent hole 312a, the substrate center vent hole 512a, and the plate central vent hole 602a, and the outer vent holes 312b and the substrate outer vent hole. And a second movement path formed by the plate 512b and the plate outer vents 602b.

As such, the air moving to the lower portion of the center of the light source module 500 through the first movement path moves the dust moving from the lower portion of the lighting device 1000 to the light source module 500 to the lower portion again. The dust may be prevented from sticking to the reflection shade 700 or the like. In addition, the air moving to the lower portion of the edge of the light source module 500 through the second movement path is moved directly to the inner surface of the reflecting shade 700 to effectively prevent dust stuck to the inner surface of the reflecting shade 700. Can be removed.

4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.

3 and 4, the optical semiconductor lighting apparatus 1000 may further include a power supply module 810, an lighting controller 820, and a temperature sensor 830.

The power supply module 810 generates and provides driving power for the fan 400 and the light source module 500. Although not shown in the drawing, the lighting controller 820 and the temperature sensor 830 may be generated and provided. The power supply module 810 may be disposed outside or inside the housing HS. However, when the power supply module 810 is disposed inside the housing HS, the power supply module 810 is disposed in a space between the upper cover 200 and the fan 400. It is preferable to be.

The lighting controller 820 may be electrically connected to the fan 400 and the light source module 500 to control driving of the fan 400 and the light source module 500, respectively. The lighting controller 820 may be disposed on the bottom surface of the printed circuit board 510 in the same manner as the optical semiconductor elements 520, but may be disposed anywhere inside or outside the housing HS. .

If the lighting controller 820 determines that the fan 400 has failed because the fan 400 is not properly driven even though power is supplied to the fan 400, the lighting controller 820 may notify the fan 400 of the failure. The light source module 500 may be controlled to generate light of a color, for example, red. For example, the lighting controller 820 receives the fan rotation speed information from the fan 400 and the fan 400 is broken when the fan 400 does not rotate or rotates at a speed lower than a reference value. You can judge. On the other hand, the operator can determine the failure of the fan 400 through the lighting color of the lighting device 1000 to repair and repair the lighting device 1000.

The lighting control unit 820 may remove the dust or foreign matter accumulated around the air inlet 210 of the upper cover 200 at any time, for example, every six hours for 10 minutes. The fan 400 may be controlled to rotate in the reverse direction.

On the other hand, the temperature sensor 830 is disposed in the interior space of the housing (HS) to sense the temperature of the interior space. In this case, the lighting controller 820 may control the rotation speed of the fan 400 according to the temperature value applied from the temperature sensor 830. That is, when the temperature value detected by the temperature sensor 830 is higher than the reference value, the rotation speed of the fan 400 is increased, and when the temperature value detected by the temperature sensor 830 is lower than the reference value, Reduce the rotational speed of the fan 400.

In addition, a dust measuring unit (not shown) is further disposed in the housing HS to provide the amount of dust in the housing HS to the lighting control unit 820 in real time or intermittently, and the lighting control unit 820 The rotation speed of the fan 400 may be controlled according to the amount of dust measured by the dust measuring unit.

According to the present embodiment as described above, the air moved by the fan 400 primarily absorbs heat of the heat sink 300 and cools the heat sink 300, and a part of the outer vent 110. The dust is provided to the outer surface of the reflecting shade 700 to adhere to the outer surface of the reflecting shade 700, and the other part of the lighting device 1000 through the first and second movement paths The dust may be moved downward to move the dust moving toward the light source module 500 back to the lower portion or to remove dust stuck to the inner surface of the reflector 700. On the other hand, as the fan 400 is rotated in the reverse direction itself every predetermined time, it is possible to remove the dust and foreign matter stuck to the air inlet hole 210 itself.

As such, the optical semiconductor lighting apparatus 1000 of the present invention has a self-clearing function, thereby preventing a failure of the lighting apparatus 1000 or deteriorating luminous efficiency and heat radiation efficiency due to dust or foreign matter. The maintenance cost may be reduced as the maintenance period is increased, and the reflection efficiency and the heat radiation efficiency of the reflection shade may be prevented from being lowered by the dust and foreign matter.

In addition, the operator can easily determine the failure of the fan 400 through the color of the light generated by the lighting device 1000, it is possible to repair, repair and replace the fan 400 in a short time. In addition, by measuring the temperature of the interior space of the housing (HS) in real time, and determine the rotational speed of the fan 400 according to the measured temperature value, the heat generated from the light source module 500 It can be removed efficiently.

<Example 2>

5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.

The optical semiconductor illuminating device shown in FIG. 5 is substantially the same as the illuminating device of the first embodiment described with reference to FIGS. 1 to 4 except for the lower end portion 100a of the housing 100, and thus the same as that of the first embodiment. Detailed description of the components will be omitted, and the same reference numerals as in the first embodiment will be given.

2 and 5, the lower end portion 100a of the housing 100 is concentrated by the outside of the reflection shade 700 and the air flowing into and discharged by the fan 400 moves to a strong pressure. Some shape is deformed to make it possible.

Specifically, for example, the lower end portion 100a of the housing 100 is an inner portion facing the upper end of the reflecting shade, ie, the heat sink, in a state overlapping with a portion of the upper portion of the reflecting shade 700. A portion facing the edge of the 300 may have a concave rounded shape. That is, the lower end portion 100a of the housing 100 is concentrated by the concave rounded portion of the air introduced by the fan 400 and discharged to the outside and discharged at a strong pressure.

Alternatively, the lower end portion 100a of the housing 100 overlaps with at least a portion of the reflection shade 700 as shown in FIG. 3, and a distance from the outer surface of the reflection shade 700 is the reflection shade 700. It may be deformed into a shape that narrows toward the lower direction of the. That is, as the interval between the lower end portion 100a of the housing 100 and the outer surface of the reflection shade 700 becomes narrower toward the lower side of the reflection shade 700, the fan 400 is introduced into the outside. The air released can be discharged at high pressure.

As described above, according to the present exemplary embodiment, a portion of the lower end portion 100a of the housing 100 is deformed so that a portion of the lower end portion 100a may move at a high pressure along the outer surface of the reflection shade 700, and thus, the portion may be disposed at the high pressure. Dust accumulated on the outer surface of the reflector 700 may be effectively removed by the air.

<Example 3>

6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.

The optical semiconductor lighting apparatus shown in FIG. 6 is substantially the same as the lighting apparatus of the first embodiment described with reference to FIGS. 1 to 4 except for a part of the heat sink 300, the printed circuit board 514, and the diffusion plate 600. Since the same elements as in the first embodiment will not be described in detail, the same reference numerals as in the first embodiment will be omitted.

2 and 6, a plurality of edge vents 312c are provided at an edge of the heat sink 300 to directly move air moved by the fan 400 to an inner side surface of the reflection shade 700. Are spaced apart from each other.

Specifically, each of the edge vents 312c is formed to penetrate the base plate 310 and the outer lower side wall 330, and the air moved by the fan 400 is directed to the inner surface of the reflector 700. It may be formed into a shape that can be directly guided. For example, the edge vents 312c may be formed at an inclined angle to the base plate 310 and the outer lower side wall 330 corresponding to the position of the inner side of the reflector 700 as shown in FIG. 5. Can be. In this case, the inclined angles of the edge vents 312c may be equal to or slightly smaller than the inclined angle of the reflection shade 700.

Meanwhile, the outer vent 312b, the substrate outer vents 512b, and the plate outer vents 602b shown in FIG. 3 are not shown in FIG. 5, but may be formed in some cases. In addition, the diffusion plate 600 is disposed on the outer lower side wall 330 so as not to cover the edge vents 312c.

As such, according to the present exemplary embodiment, as the edge vents 312c are formed at the edge of the heat sink 300, only the heat sink 300 effectively removes dust accumulated on the inner surface of the reflection shade 700. You can.

<Example 4>

7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention, Figures 8 and 9 are plan views for explaining the arrangement of the heat radiation projections of the heat sink of Figure 7, Figure 10 is a view It is sectional drawing which expands the part A of 7.

7 to 10, the optical semiconductor lighting apparatus 1000 according to the present embodiment includes a housing HS, a heat sink 300, a fan 400, a light source module 500, and a diffusion plate 600. ), A sealing member, a plate fixing unit, a reflection shade 700 and a dust collecting module 900.

The housing HS includes at least a case body 100 having an inner space therein, an upper cover 250 disposed on the case body 100, and an upper cover 250 coupled to the case body 100. One cover coupling portion 260 may be included.

The upper and lower portions of the case body 100 are open and accommodate the fan 400 and the like. The case body 100 may be formed in a cylindrical shape or a polygonal shape such as a square cylinder, a hexagonal cylinder, or the like. The case body 100 may be formed of a synthetic resin.

An outer vent 110 is formed between the lower end portion 100a of the case body 100 and the reflection shade 700 to be described later. Specifically, the lower end portion 100a of the case body 100 is disposed to be spaced apart from each other so as to overlap with at least a portion of the outer surface of the reflection shade 700, or as shown in Figure 5 of the case body 100 A portion of the lower end portion 100a is deformed to form the outer vent 110. In addition, a plurality of inner support parts disposed on the inner surface of the case body 100 to be spaced apart from each other so as to be coupled to the fan mounting part 132 to be described later and the heat sink 300 to be described later. Field 140 is formed.

The outer surface of the case body 100 may be formed with a plurality of stripe grooves 150 spaced apart from each other in the upper and lower portions of the case body 100. In this case, a plurality of stripe protrusions (not shown) may be formed on the outer surface of the case body 100 instead of the stripe grooves 150. As such, the stripe grooves 150 or the stripe protrusions may increase a frictional force with the hand of the worker so that the worker does not drop and damage the lighting device 1000 during transportation.

The upper cover 250 is disposed to be spaced apart from an upper end of the case body 100 to cover the upper portion of the case body 100. As a result, side inlets 252 are formed between the upper cover 250 and the upper end of the case body 100 to allow the outside air to move into the case body 100. As such, as the side inlet 252 is formed between the upper cover 250 and the upper end of the case body 100, external dust may be accumulated to prevent the side inlet 252 from being blocked.

An installation ring 254 may be formed on the upper side of the upper cover 250 so that the lighting device 1000 may be installed on a ceiling of a factory or a workshop, and at this time, the installation ring 254 may be formed at a portion of the upper cover 250. Certain grooves may be formed. On the other hand, the upper cover 200 may be formed of a synthetic resin or a metal material, for example, aluminum alloy.

The cover coupling part 260 is disposed between the upper cover 250 and the case body 100 to fix the upper cover 250 to the case body 100. For example, the plurality of cover coupling parts 260 may be spaced apart from each other between the lower surface of the upper cover 250 and the upper surface of the fan mounting portion 132 formed on the case body 100. 250 may be fixed to the case body 100. Here, the cover coupling portion 260 may be formed to be separated from the inner surface of the upper cover 250 or the case body 100, as shown in the drawing, otherwise, the upper cover 250 or the case body ( It may be formed integrally with the inner surface of the 100).

The heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100. For example, the heat sink 300 may be coupled to and fixed to the inner support parts 140 of the case body 100. The heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated from the light source module 500 to be described later to be released to the outside, for example, aluminum or magnesium. In addition, the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside. Specifically, the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.

The base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500. The base plate 310 may be provided with a heat sink vent 312 for moving the air present in the housing (HS) to the lower portion of the heat sink 300, wherein the heat sink vent 312 is It may be formed in the center of the base plate 310.

The heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100, are disposed in the housing HS, and receive heat from the base plate 310 to the outside. Can be released. Here, some of the heat dissipation protrusions 320 are coupled to the lower ends of the inner support parts 140 formed on the inner side surface of the case body 100, thereby connecting the heat sink 300 to the case body 100. Can be fixed Specifically, for example, the inner support parts 140 protrude toward some of the heat dissipation protrusions 320, and a protrusion for being coupled to the inner support parts 140 to some of the heat dissipation protrusions 320. Steps 322 may be formed, respectively. On the other hand, the heat sink 300 may be coupled to the case body 100 by a portion other than the heat dissipation protrusions 320.

The heat dissipation protrusions 320 may have various structures and arrangements with excellent heat dissipation efficiency. For example, the heat dissipation protrusions 320 may have radial and spiral shapes with respect to the center of the base plate 310 and may be spaced apart from each other. Specifically, the heat dissipation protrusions 320 may be disposed to be spaced apart from each other in a radial and helical shape corresponding to the rotation direction of the fan 400 around the heat sink vent 312 as shown in FIG. 10. have.

Alternatively, the heat dissipation protrusions 320 may include first protrusions 320a and second protrusions 320b as shown in FIG. 10. The first protrusions 320a have radial and helical shapes with respect to the heat sink vent 312 and are spaced apart from each other. The second protrusions 320b have radial and spiral shapes with respect to the heat sink vent 312, and are disposed between the first protrusions 320a on the outer side of the first protrusions 320a. .

The outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310. As a result, a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330. Meanwhile, the central protrusion wall 340 protrudes from the bottom surface of the base plate 330 and is formed along an edge of the heat sink vent 312. Therefore, when the heat sink vent 312 is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.

The fan 400 is disposed in the inner space of the case body 100 to move external air provided through the side inlet 252 to the heat sink 300 to cool the heat flowing from the heat sink. In charge of. The fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis. In this case, the central axis is preferably coincident with the center of the heat sink 300 and the center of the upper cover 250. On the other hand, the fan case may be mounted and fixed to the fan mounting portion 132 formed on the inner surface of the case body 100.

The light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is disposed adjacent to the bottom surface of the base plate 310. Light is generated in a downward direction with respect to the base plate 310. In detail, the light source module 500 may include a printed circuit board 510, a plurality of optical semiconductor elements 520, and optical cover units 530.

The printed circuit board 510 is disposed adjacent to the bottom surface of the base plate 310. For example, the printed circuit board 510 is disposed in direct contact with the bottom surface of the base plate 310, or a separate thermal conductive pad (not illustrated) is disposed between the printed circuit board 510 and the base plate 310. Si) is interposed, the printed circuit board 510 may be disposed in close contact with the lower surface of the base plate (310). The printed circuit board 510 is provided with a light source vent corresponding to the heat sink vent 312 formed in the base plate 310. In this case, the light source vent may be formed at the center of the printed circuit board 510 corresponding to the heat sink vent 312. The printed circuit board 510 may be disposed adjacent to the bottom surface of the base plate 310 while the light source vent is inserted into the central protrusion wall 340.

The optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510. Each of the optical semiconductor elements 520 includes at least one light emitting device (LED) for generating light. In addition, the light emitting diode may generate light in various wavelength bands according to its use, for example, light in red, yellow, blue or ultraviolet light bands.

The optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light. For example, the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.

The diffusion plate 600 is disposed below the printed circuit board 510 and diffuses light generated by the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332. The diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510. In this case, the plate vent 602 is formed in the center of the diffusion plate 600 to correspond to the light source vent 512. Meanwhile, the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.

The sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 so that external moisture, foreign matter, etc. are stored in the light source module ( 500) can be prevented from being applied to the side. In detail, the sealing member includes an outer sealing ring interposed between the diffusion plate 600 and the outer lower side wall 330, and a central sealing interposed between the diffusion plate 600 and the central protrusion wall 340. It may include a ring. In this case, the outer sealing ring and the central sealing ring may be, for example, a rubber ring.

The plate fixing unit is disposed along the edge of the diffusion plate 600 at the bottom of the diffusion plate 600 to fix the diffusion plate 600 to the outer lower side wall 330 through a plurality of coupling screws. . That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit and the diffusion plate 600, the edge of the diffusion plate 600 is the outer lower side wall 330 Strongly fixed to

The reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light. The reflection shade 700 may be fixed to the side of the heat sink 300, for example, the side of the base plate 310. In this case, an upper end of the reflection shade 700 may be disposed to coincide with an upper end of the side surface of the base plate 310. Meanwhile, a dust collecting module support part 710 for supporting the dust collecting module 900 to be described later may be formed at a lower end of the reflecting shade 700.

The reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside. In addition, a dust prevention film (not shown) may be formed on the surface of the reflection shade 700 in order to prevent dust or foreign matter from sticking well. For example, the anti-dust coating may be an antifouling coating film such as a nano-green coating film.

Meanwhile, the lower end portion 100a of the case body 100 may be spaced apart from each other so as to overlap at least a portion of an outer surface of the reflection shade 700. For example, the lower end portion 100a of the case body 100 may be covered to a 1/3 or 1/2 position from the upper end of the outer surface of the reflection shade 700, or unlike the reflection shade 700 unlike FIG. 7. It can cover all of the sides.

The dust collecting module 900 is disposed on the outer surface of the reflection shade 700 so as to correspond to the outer vent 110, and serves to filter out dust contained in the air. In this case, the dust collecting module 900 may be disposed and fixed on the dust collecting module support 710. Specifically, for example, the dust collecting module 900 is a dust filter 910 for filtering and collecting the dust contained in the air, and the filter fixing unit for fixing the dust filter 910 on the dust collecting module support 710 920 may be included. The filter fixing unit 920 may be formed, for example, in a c-shaped cross section for accommodating the dust filter 910, and spaced apart from each other to allow air passing through the dust filter 910 to pass therethrough. It may have a plurality of filter ventilation holes 922 formed.

The dust collecting module 900 may be formed on the inner side of the reflector 700 as well as the outer surface of the reflector 700 to filter and collect dust contained in the air in the inner side of the half gas chamber 700. In addition, the dust collecting module 900 may extend up and down based on the reflection shade 700 or may have a shape bent in the L-shape at the lower end of the reflection shade 700. In addition, the dust collecting module 900 may be capable of height adjustment according to the shape of the lower end portion (100a) of the housing 100 or the position of the outer vent (110).

On the other hand, it will be briefly described the flow of air when the fan 400 rotates in the forward direction.

First, air introduced into the case body 100 through the side inlet 252 formed between the upper cover 250 and the upper end of the case body 100 is transferred to the heat sink by the fan 400. Blowing). At this time, the heat sink 300 absorbs heat generated from the light source module 500, and the air blown into the heat sink 300 receives heat from the heat sink 300 to receive the heat sink ( 300) can be reduced.

A part of the air blown into the heat sink 300 by the fan 400 is provided to the outer surface of the reflection shade 700 through the outer vent 110 again and passes through the dust collecting module 900. As a result, dust included in the air or stuck to the outer surface of the reflector 700, that is, dust and foreign matters, may be collected and removed by the dust collecting module 900. As such, the dust collecting module 900 may purify the air in the factory or the workplace by removing dust contained in the air.

Meanwhile, a movement path for moving a part of the air blown to the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed in the housing HS. In this case, the movement path may be formed by the heat sink vent 312, the light source vent 512, and the plate vent. As such, the air moving to the lower part of the light source module 500 through the movement path moves the dust moving from the lower part of the lighting device 1000 to the light source module 500 to the lower part again, so that the dust It can be prevented from sticking to the outer surface of the reflection shade 700.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1000: Optical semiconductor lighting device HS: Housing
100: case body 100a: lower end of the case body
110: outer vent 120: lower support
130, 132: fan mounting portion 140: inner support portion
150: stripe groove 200, 250: top cover
210: air inlet 252: side inlet
260: cover coupling portion 300: heat sink
310: base plate 312: heat sink vent
312a: central vent 312b: outer vent
312c: edge vent 320: heat dissipation protrusion
322: protrusion step 330: outer lower side wall
332: light source receiving groove 340: central protrusion wall
350: outer upper side wall 400: fan
500: light source module 510: printed circuit board
512: light source vent 512a: substrate central vent
512b: Ventilation holes outside the substrate 520: Optical semiconductor device
530: optical cover unit 600: diffuser plate
602: plate vent 602a: plate center vent
602b: plate outer vent 610: sealing member
620: plate fixing unit 700: reflection shade
810: power supply module 820: lighting control unit
830: temperature sensor 900: dust collecting module
910: dust filter 920: filter fixing unit

Claims (19)

One side open housing
A light source module disposed in the housing and including at least one optical semiconductor element
A fan disposed adjacent to the light source module and configured to introduce air into the light source module; And
It includes a reflector for reflecting the light generated by the light source module to determine the irradiation range of the light,
A shape of the lower end of the housing is spaced apart from at least a portion of the outer surface of the reflecting shade so that air introduced by the fan flows out to the outer surface of the reflecting shade, or the shape of the lower portion of the housing is deformed. Optical semiconductor lighting device. According to claim 1, wherein the lower end of the housing
Optical semiconductor lighting apparatus having a shape disposed so as to be spaced apart so as to overlap at least a portion of the outer surface of the reflecting shade. According to claim 1, wherein the lower end of the housing
Optical semiconductor lighting device, characterized in that the air introduced by the fan has a shape that can be discharged at a strong pressure by concentrating on the outer surface of the reflecting shade. According to claim 3, wherein the lower end of the housing
And an inner portion facing the reflection shade in a concave round shape in a state overlapping with a portion of an upper end of the reflection shade. According to claim 3, wherein the lower end of the housing
And an overlapping portion with at least a portion of the reflecting shade and having a shape in which a distance from an outer surface of the reflecting shade narrows toward the lower side of the reflecting shade. The method of claim 1, wherein the optical semiconductor device
An optical semiconductor lighting device comprising at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electroluminescent device (EL). The optical semiconductor lighting apparatus of claim 1, wherein a movement path is formed in the housing to allow at least some of the air introduced by the fan to flow out through the light source module. The optical semiconductor lighting apparatus of claim 7, further comprising a heat dissipation unit for dissipating heat generated by the light source module. The method of claim 8, wherein the heat dissipation unit
An optical semiconductor lighting apparatus comprising at least one of a heat sink, a heat pipe, and a heat spreading member. The method of claim 8, wherein the heat dissipation unit
And a heat sink having a heat sink body disposed adjacent to the light source module to absorb and release heat generated from the light source module. The heat sink body of claim 10, wherein the heat sink body is provided with a heat sink vent for passing at least a portion of the air moved to the heat sink by the fan,
The light source module is formed with a light source vent for moving the air passing through the heat sink vent to the lower portion of the light source module,
The movement path is an optical semiconductor lighting device, characterized in that formed by the heat sink vent and the light source vent. The method of claim 10, wherein the reflection shade
And an upper surface of the reflecting shade coupled with the heat sink body so as to coincide with an upper side surface of the heat sink body. The method of claim 12, wherein the heat sink body is
A base plate disposed adjacent to the light source module and coupled to the reflection shade such that an upper end of the side surface coincides with an upper end of the reflection shade;
And a plurality of heat dissipation protrusions formed on one surface of the base plate opposite to the light source module. The method of claim 10, wherein the edge of the heat sink body
And a plurality of edge vents for moving a part of the air introduced by the fan to an inner side surface of the reflector. 2. The apparatus of claim 1, wherein the housing
A case body having an upper and lower parts open and accommodating the fan and the light source module therein, and having a lower end spaced apart from at least a portion of an outer surface of the reflection shade or a shape of the lower end portion deformed;
And an upper cover coupled to the case body to cover an upper portion of the case body. The method of claim 15, wherein the upper cover
The optical semiconductor lighting device, characterized in that the air inlet for the outside air is moved into the housing is formed. The method of claim 15, wherein the top cover
And a side inlet formed to be spaced apart from an upper end of the case body to allow outside air to move into the housing. The optical semiconductor lighting apparatus of claim 1, further comprising a dust collecting module disposed on an outer surface of the reflecting shade and collecting dust in the air flowing out through the outer vent. The method of claim 18, wherein the dust collecting module
Optical semiconductor lighting apparatus, characterized in that the height can be adjusted according to the shape of the lower end of the housing or the position of the vent formed in the lower end of the housing.

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