KR20120053724A - Transparent conductive film and method thereof - Google Patents

Abstract

PURPOSE: A transparent conductive film and a manufacturing method thereof are provided to reduce production processes by providing a conductive pattern film without an additional process. CONSTITUTION: A transparent conductive film includes a substrate(10), a plurality of microscale transparent three-dimensional structures(20) prepared on the substrate, and an plurality of transparent conductive materials attached to a surface of each transparent three-dimensional structures. The substrate is made of either a transparent material transmitting light or an opaque material. The substrate is composed of either poly ethylene terephtalate or poly ethylene naphthalate. The three-dimensional structures are made of the transparent material transmitting the light like the substrate. The transparent conductive material attached to the surface of the three-dimensional structures forms a constant pattern on the substrate.

Description

Transparent conductive film and its manufacturing method {TRANSPARENT CONDUCTIVE FILM AND METHOD THEREOF}

TECHNICAL FIELD This invention relates to a transparent conductive film and its manufacturing method. More specifically, It is related with the transparent conductive film which can be used for an optical display apparatus, and its manufacturing method.

The development of flexible display, transparent electrode, transparent optical film, and touch sensor technology for touch panel has huge market potential and huge market potential worldwide. The flexible display is thinner and lighter than the existing glass-based display, which is strong in impact and easy to carry, and is relatively free from space and shape constraints to secure various applications. have. Accordingly, research on technologies of transparent electrodes and transparent conductive films as well as materials of the substrate of the flexible display is being actively conducted.

As the transparent conductive film, tin oxide (SnO 2) film doped with antimony or fluorine, zinc oxide (ZnO) film doped with potassium, indium oxide (In 2 O 3) doped with tin, and the like are widely used. In particular, tin-doped indium oxide films, that is, In2O3-Sn-based films are called ITO (Indium tin oxide) films and are widely used because low resistance films can be easily obtained. In the case of ITO, it has excellent physical properties and many experiences in the process input to date, but since indium oxide (In2O3) is produced as a by-product from zinc (Zn) mine, supply and demand is unstable, and ITO film is inflexible Flexible materials such as polymer substrates can not be used. In addition, it can be manufactured in a high temperature and high pressure environment, the production cost is high, and in order to obtain a flexible display, etc., the conductive polymer may be coated on the upper surface of the polymer substrate, but since the film is not electrically conductive or transparent, Its use is limited.

Recently, techniques for coating carbon nanotubes on top of various substrates have been widely studied in order to solve these problems. The carbon nanotubes have electrical conductivity comparable to that of metals with an electrical resistance of 10-4 Ωcm, and the surface area is more than 1000 times higher than that of bulk materials and is thousands of times longer than the outer diameter. Therefore, there is an advantage that can improve the binding force to the substrate through the surface functionalization. In particular, it is expected that the use of the flexible substrate can be infinite.

Meanwhile, a method of manufacturing a conductive transparent film using nanowires has also been actively studied. The nanowires not only have excellent optical properties such as electron transfer characteristics and polarization phenomena in a specific direction, but also are suitable for micro device applications due to their small size, so that when used as a material for optical display devices, the nanowires have excellent conductivity and performance. It has optical properties.

In the related art, in order to apply the transparent conductive film made of the transparent conductive material as described above to a touch screen panel or the like, the transparent conductive film is formed and then patterned with a laser. In addition to lasers, wet etching or plasma etching may be used. Such a patterning operation is performed by cutting or etching the completed transparent conductive film in a desired pattern shape, and the patterning operation of the transparent conductive film is not only an expensive process because it must be performed using an expensive laser equipment or undergoes an etching process. Since the conductive film is formed on the entire surface of the substrate and the method is removed, the ratio of the amount to be removed is higher than that of the transparent conductive material to be commercialized, resulting in a waste of expensive transparent conductive compositions.

The present invention has been conceived based on these points, and the problem to be solved by the present invention is to provide a transparent conductive film having a pattern formed without additional processes such as laser cutting.

Another problem to be solved by the present invention is to provide a method for producing a transparent conductive film to perform the patterning by converting to a micro-scale to facilitate the handling of the nano-scale transparent conductive material.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

The transparent conductive film according to an embodiment of the present invention for solving the above problems is a substrate, a plurality of micro-scale transparent three-dimensional structure provided on the substrate and a plurality of transparent conductive material attached to the surface of each transparent three-dimensional structure Include.

Method of manufacturing a transparent conductive film according to an embodiment of the present invention to prepare a plurality of micro-scale transparent three-dimensional structure, to coat the transparent conductive material on the transparent three-dimensional structure, to dry the coated transparent conductive material, Disposing a transparent conformation on the substrate.

Specific details of other embodiments are included in the detailed description and drawings.

According to embodiments of the present invention has at least the following effects.

Since it is possible to provide a conductive pattern film having a pattern formed without an additional process for forming a separate pattern, the production process is shortened and advantageous in terms of cost. In addition, since the non-pattern portion is cut and discarded from the finished conductive film because the pattern is directly formed, it is possible to provide a finished transparent conductive film with a higher yield than the coating composition.

In addition, it is possible to provide a transparent conductive film that is easily patterned by attaching and handling a nanoscale transparent conductive material that is difficult to handle to a microscale three-dimensional structure, and the transparent conductive material is uniformly coated on a substrate to provide uniform transparency and The transparent conductive film which shows electroconductivity can be provided.

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the present specification.

1 is a perspective view showing the structure of a transparent conductive film according to an embodiment of the present invention.
2 is a front view showing the structure of a transparent conductive film according to an embodiment of the present invention.
3 is a view showing a coupling structure of a transparent three-dimensional structure and a substrate of a transparent conductive film according to an embodiment of the present invention.
4 is a view showing a pattern structure of a transparent conductive film according to another embodiment of the present invention.
5 is a view showing in the shape of a transparent three-dimensional structure of a transparent conductive film according to another embodiment of the present invention.
6 is a plan view showing a pattern structure of a transparent conductive film according to another embodiment of the present invention.
7 is a flowchart illustrating a method of manufacturing a transparent conductive film according to an embodiment of the present invention.
8 is a view showing an example of the coating process of the transparent conductive material of the method for manufacturing a transparent conductive film according to an embodiment of the present invention.
9 and 10 are views illustrating an example of a process of disposing a transparent three-dimensional structure on a substrate of the method for manufacturing a transparent conductive film according to an embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims.

And / or includes each and all combinations of one or more of the items mentioned. The spatially relative terms below, beneath, lower, upper, upper, etc., as shown in the figures, correlate one component with another. Can be used to easily describe the relationship. Spatially relative terms are to be understood as including terms in different directions of components in use or operation in addition to the directions shown in the figures. For example, when inverting the components shown in the figures, components described below or below other components may be placed above other components. Thus, the exemplary term below may include both the direction below and above.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention.

1 and 2 are views showing the structure of a transparent conductive film according to an embodiment of the present invention, Figure 1 is a perspective view, Figure 2 is a front view.

First, referring to Figure 1, the transparent conductive film according to an embodiment of the present invention is a substrate 10, a micro-scale transparent three-dimensional structure 20 and each of the transparent three-dimensional structure provided on the substrate 10 And a plurality of transparent conductive materials 30 attached to the surface of the structure 20.

The substrate 10 may be a transparent material capable of transmitting light, that is, a transparent material such as glass or a transparent plastic film or sheet, and in some cases, may be an opaque material suitable for application. Specifically, the transparent plastic film is polycarbonate-based, poly sulfone-based, polyacrylate-based, polystyrene-based, polyvinyl chloride-based, polyvinyl It may include a material of the alcohol (poly vinyl alcohol), poly norbornene (poly norbornene), polyester (polyester) series. For example, the substrate 10 may be made of polyethylene terephtalate, polyethylene naphthalate, or the like. Meanwhile, the substrate 10 may be manufactured from a polycarbonate-based, polyethersulfone-based, or polyarylate-based material, which is a transparent and flexible material so as to be applicable to a flexible display device.

The three-dimensional structure 20, like the substrate, may be made of a transparent material that can transmit light, or may be made of a different material, and may be produced including one or more of the materials of the substrate 10 listed above. The three-dimensional structure 20 is attached to the substrate 10, the transparent conductive material 30 attached to the surface of the three-dimensional structure 20 according to the arrangement of the three-dimensional structure 20 to form a predetermined pattern on the substrate 10 As such, it is important how firmly the three-dimensional structure 20 is coupled to the substrate 10. Therefore, the material and the three-dimensional structure 20 of the substrate 10 may be made of substantially the same material to improve the bonding force and to maintain the bonded state stably.

The transparent conductive material 30 attached to the surface of the three-dimensional structure 20 may be CNT, nanowire, powder type metal such as silver powder, graphene, conductive polymer, and ITO. Or a metal oxide such as IZO. Hereinafter, for convenience of description, the case where the transparent conductive material 30 is made of CNT will be described as an example. However, this does not limit the scope of the transparent conductive material 30 of the embodiments of the present invention.

The CNT, which is a transparent conductive material 30, has a length of about 1 to 100 nm in the form of a tube, and there is no limitation on the type of the CNT 30. -Walled CNT) can be used in combination with one or more.

Since it is technically difficult to form patterns by directly handling nanoscale CNTs or nanowires and metal oxides, a transparent conductive film coated with the above-mentioned transparent conductive material on the entire substrate is first formed, and then laser cutting is performed in a post process. It is common to obtain the transparent conductive film of a desired pattern through the operation of. However, in the case of the conductive pattern film for touch panels, such a process cuts and discards many parts of the formed transparent conductive film. Therefore, there is a disadvantage in that consumption or waste of CNTs or nanowires, which are expensive transparent conductive materials, are larger than in finished products. In addition, since an additional process of cutting using a laser equipment or the like after forming the transparent conductive film is required, expensive laser equipment must be purchased, and a process time is increased.

Therefore, in order to solve such a problem, the transparent conductive film according to the exemplary embodiment of the present invention handles a micro-scale transparent three-dimensional structure 20 that is easier to handle than a nano-scale transparent conductive material, thereby forming a transparent conductive film pattern on a substrate. To form.

Specifically, the CNT 30 is arranged on the surface of the transparent three-dimensional structure 20 is attached to the substrate 10 in a desired pattern as shown in Figure 1 as a result to form a pattern of the desired CNT. There are various methods for attaching the CNT 30 to the transparent three-dimensional structure 20, such as spray coating, dip coating, and Langmuir-Blodgett technique (LB method). It will be described later in detail.

Next, referring to FIG. 3, a method of fixing the transparent three-dimensional structure 20 to the substrate 10 is illustrated. As shown in the figure, since the three-dimensional transparent three-dimensional structure 20 is highly mobile, a process of fixing it after placing it in a desired position is necessary. As described above, the transparent three-dimensional structure 20 and the substrate 10 may be made of the same material or may be made of different materials. For example, if the substrate 10 and the transparent three-dimensional structure 20 is made of the same material as PET, as shown in Figure 3 (a) by providing a PET resin to penetrate a portion of the transparent three-dimensional structure 20 By forming a support coating film 40 of the same material by the curing method, it can be supported on the surface of the substrate 10 by the support coating film (40).

As such, when the substrate 10, the transparent three-dimensional structure 20, and the support coating film 40 are formed of the same material, the substrate 10, the transparent three-dimensional structure 20, and the support coating film 40 are stable and have continuous adhesion. . In the structure for fixing the transparent three-dimensional structure 20 by forming the support coating film 40 as shown in Figure 3 (a), the substrate 10, the transparent three-dimensional structure 20 and the support coating film 40 must be formed of the same material It is not necessary and may be used as the support coating film 40 if the refractive index difference is small and transparent material. The support coating film 40 may be, for example, a thermosetting resin or an epoxy acrylate resin, a urethane acrylate resin, a silicone acrylate resin, an acrylic acrylate and an ester acrylate such as an acrylic resin, a urethane resin, a polyester resin, or the like. UV curable resins, such as the like.

In addition, as shown in Figure 3 (b), in addition to the support coating film 40, a separate adhesive layer 50 is interposed between the substrate 10 and the transparent three-dimensional structure 20 to fix the transparent three-dimensional structure 20 by CNT The pattern can be maintained. The adhesive layer 50 may be a monolayer of a certain thickness having a surface to which the actual adhesive is applied, or may collectively refer to the surface to which the adhesive is applied. Since the adhesive layer 50 is a denser medium than air, it may affect the refractive index of light transmitted from the optical display device. Therefore, the area of the adhesive layer 50 is minimized to be provided only in a partial region of the substrate 10 along the pattern shape in which the transparent three-dimensional structure 20 is to be formed, thereby reducing luminance due to refraction of light due to the adhesive layer 50. Distortion can be minimized. The material of the adhesive used for the adhesive layer 50 is not limited, and is preferably formed of a transparent material so that light can be transmitted as described above.

Referring next to FIG. 4, various patterned transparent conductive films are disclosed in (a) to (c). That is, according to another embodiment of the present invention, by attaching the nanoscale CNT 30, which is difficult to handle and difficult to directly arrange to form a pattern, is attached to the surface of the micro-scale transparent solid structure 20, the transparent solid structure 20 ) Can be arranged directly in a desired pattern to provide a transparent conductive film that does not require additional processing such as laser cutting for pattern formation. In particular, as shown in Fig. 4 (a) to (c) shows a complex pattern shape, the process time is sharply increased to cut it with a laser. In other words, the desired pattern is programmed in the laser equipment and executed to cut the pattern according to the desired pattern. As the pattern becomes more complicated, the program becomes more complicated and the process time increases rapidly, which is disadvantageous in terms of time and cost. However, the transparent conductive film patterned by arranging the transparent three-dimensional structure 20 of the micro scale according to another embodiment of the present invention does not need a separate cutting process, and arranges the transparent three-dimensional structure 20 in a desired pattern. Since it is easy, there is an advantageous effect in terms of time and cost.

Next, referring to FIG. 5, another shape of the transparent three-dimensional structure 20 according to another embodiment of the present invention is shown. That is, the case where the transparent three-dimensional structure 20 has a spherical shape has been described so far, but is not limited thereto. That is, the transparent three-dimensional structure 20 is attached to the surface of the CNT (30), it performs a function to facilitate the provision of a patterned transparent conductive film arranged in a desired pattern on the substrate 10, In addition to the shape may have a rectangular parallelepiped or a cube shape as shown in Figure 5 (a), as shown in Figure 5 (b) to facilitate the adhesion with the substrate 10 while the adhesive area of the CNT 30 is wide, such as a spherical shape It may have a hemispherical shape. In addition, although not shown, the transparent three-dimensional structure 20 may be formed of a triangular pyramid or a quadrangular pyramid so as to form a narrow CNT patterning width.

Next, referring to FIG. 6, a portion of a spherical transparent three-dimensional structure 20 disposed on the substrate 10 according to another embodiment of the present invention is shown. As described above, the transparent three-dimensional structure 20 may be arranged on the substrate 10 in a desired pattern to provide a patterned transparent conductive film, and the spherical transparent three-dimensional structure 20 may be empty as shown in FIG. 6 (a). Even when disposed adjacent to each other without a fine patterned transparent conductive film in the form of a dense checkerboard can be obtained. That is, even when the CNTs are evenly attached to the surface of the spherical transparent three-dimensional structure 20, the CNT 30 of the central portion of each transparent three-dimensional structure 20 protrudes highest on the plan view shown in FIG. And, the height of the CNT 30 of the other peripheral portion is formed low. That is, the central portion 21 of each spherical transparent three-dimensional structure 20 forms a new pattern. When such a configuration is used as a transparent conductive film such as a touch screen panel, more accurate coordinate detection is possible, thereby increasing the reliability of the operation. In addition, the inherent configuration of the present invention can be variously applied to other optical devices.

In the configuration in which the spherical transparent three-dimensional structure 20 is uniformly disposed on the substrate 10 as shown in FIG. 6 (a), when the radius of the transparent three-dimensional structure 20 is defined as r, the area of the substrate in the A region is (6r) 2. On the other hand, the occupied area of the transparent solid structure 20 in the area A on the plan view of FIG. Therefore, the ratio of the occupied area of the transparent three-dimensional structure 20 to the area of the substrate 10 in the region A is π / 4. Similarly in the region B, the ratio of the occupied area of the transparent three-dimensional structure 20 to the area of the substrate 10 is also π / 4.

On the other hand, when the transparent three-dimensional structure 20 is disposed so as to be an equilateral triangle when connecting the center points of the adjacent transparent three-dimensional structure 20 as shown in Figure 6 (b), the empty space between the transparent three-dimensional structure 20 is shown in Figure 6 (a) As a result, the ratio of the occupied area of the transparent three-dimensional structure 20 to the area of the substrate 10 in the region D is equal to π / 4. That is, the area D shown is the same area as the area A, but the occupied area of the entire transparent solid structure 20 in the area D is larger than the occupied area of the transparent solid structure 20 in the area A. . Therefore, when the occupied area of the transparent three-dimensional structure 20 as a whole over the area of the substrate 10 in the plan view of the substrate 10 is π / 4 or more, the center of each of the spherical transparent three-dimensional structures 20 as described above ( A transparent conductive film in which 21) forms a new pattern can be obtained. However, when the occupied area described above is π / 4 or more, as shown, the occupied area in the state where the transparent three-dimensional structure 20 is filled with no empty spaces is occupied, and the transparent three-dimensional structure 20 is excluded in some areas in the actual process. It can have a configured configuration. Thus, the occupancy area is not limited to π / 4, and may have an appropriate error. That is, for example, when the probability (defective rate) of the transparent three-dimensional structure 20 is not properly provided on the substrate 10 is 10%, the transparent three-dimensional structure compared to the area of the substrate 10 on the plan view of the substrate 10 The ratio of the occupied area of the entire structure 20 is (π / 4) (0.90). The difference between the actual measured value and the theoretical value is not limited to the ratio of the occupied area of the embodiments of the present invention, and it is apparent to those skilled in the art that some errors may occur based on the case where the occupied area is π / 4.

Referring again to FIG. 6 (a), in the region C in which the transparent three-dimensional structure 20 is arranged in two rows and two columns, an average value of the number of times that one transparent three-dimensional structure 20 is in contact with another adjacent transparent three-dimensional structure 20 is 2. Becomes In the patterns arranged adjacent to each other as shown in FIG. 6 (a), when the value is larger than 2 rows and 2 columns, the average value of the adjacent numbers is 2 or more, and as shown in FIG. Also, the average value of the number of times that the transparent three-dimensional structure 20 is adjacent to each other represents two or more. Therefore, when the average value of the number of times that the transparent three-dimensional structure 20 is adjacent to each other has a value of 2 or more, the transparent three-dimensional structure 20 can be used as a conductive transparent conductive film that is energized by the CNT 30 and patterned. .

As described so far, the transparent conductive film according to the embodiments of the present invention is a pattern is formed without an additional process for forming a separate pattern is shortened the production process and there is an advantageous effect in terms of cost. In addition, since the non-pattern portion is cut and discarded from the finished conductive film because the pattern is directly formed, it is possible to provide a finished transparent conductive film with a higher yield than the coating composition. In addition, by attaching and handling the difficult-to-handle nanoscale CNT 30 to the microscale three-dimensional structure 20, a transparent conductive film that is easily patterned can be provided, and the CNT is uniformly applied onto the substrate 10. This can provide a transparent conductive film exhibiting improved transparency and conductivity. As described above, the transparent conductive material 30 is not limited to CNTs, and may further include nanowires, conductive polymers, or metal oxides.

Hereinafter, a method of manufacturing the transparent conductive film as described above will be described with reference to FIGS. 7 to 10.

7 is a flowchart illustrating a method of manufacturing a transparent conductive film according to an embodiment of the present invention, the method of manufacturing a transparent conductive film according to an embodiment of the present invention to prepare a plurality of micro-scale transparent three-dimensional structure (S10 ), Coating a transparent conductive material on the transparent three-dimensional structure (S20), drying the coated transparent conductive material (S30), and placing the transparent three-dimensional structure on a substrate (S40).

There is no limitation in the method of manufacturing the micro-scale transparent three-dimensional structure 20, as described above, the transparent three-dimensional structure 20 is a polycarbonate (poly carbonate), poly sulfone (poly sulfone) series, polyacrylate ( poly acrylate, poly styrene, poly vinyl chloride, poly vinyl alcohol, poly norbornene, polyester It may be made, including, the shape may be manufactured in a variety of shapes other than hemispherical or hexahedral in addition to the sphere. Specifically, a general method such as a method of injecting a molten resin into a mold of a micro scale and drying the same may be used. In addition, the transparent three-dimensional structure 20 is made of the same material as the substrate 10 has a high bonding strength and can reduce the diffuse reflection or brightness reduction due to the difference in refractive index of light.

Next, the transparent conductive material 30 is coated on the surface of the manufactured transparent three-dimensional structure 20 (S20). In order to coat the transparent conductive material 30 on the transparent three-dimensional structure 20, first, a transparent conductive composition is prepared. When the transparent conductive material 30 is CNT, the transparent conductive composition may include a CNT and a dispersant solution including a dispersant and an organic solvent, water, or a mixture thereof. The type of CNT is not limited, and a transparent conductive composition may be prepared by mixing at least one of Single-Walled CNT (SWCNT), Double-Walled CNT (DWCNT), and Multi-Walled CNT (MWCNT).

The dispersant may be used as long as it can disperse CNT in a solvent such as water. Specific examples thereof include sodium dodecyl sulfate (SDS), triton X (Tigton X) (Sigma), and Tween20 (Polyoxyethyelene Sorbitan Monooleate). ) And CTAB (Cetyl Trimethyl Ammonium Bromide). And the content of the dispersant is preferably 0.005 to 1000 parts by weight based on 1 part by weight of CNT. If the content of the dispersing agent is less than the above range, the dispersibility of the transparent conductive composition is lowered, and if the content of the dispersing agent is exceeded, the relative content of the CNT in the transparent conductive composition is decreased, so that the CNT 30 coated on the transparent three-dimensional structure 20 It is not preferable because conductivity is lowered.

As the organic solvent, a conventional organic solvent may be used without limitation, and specifically, alcohols, ketones, glycols, glycol ethers, glycol ether acetates, acetates, terpineols, etc. may be used alone or in one kind. It can mix and use the above.

The transparent conductive composition thus prepared is coated on the surface of the transparent three-dimensional structure 20 by various methods as shown in FIG. As a method of coating and fixing the CNT 30 on the surface of the transparent three-dimensional structure 20, a spray coating method as shown in FIG. 8 (a) or a dip coating method as shown in FIG. 8 (b) or FIG. 8 ( The LB method as shown in c) can be used.

First, the spray coating method illustrated in FIG. 8 (a) is a method of spraying the transparent conductive composition, which is a liquid mixture, evenly on the surface of the transparent three-dimensional structure 20 to form a CNT 30 layer. In the case where the transparent three-dimensional structure 20 is in the form of a sphere, when sprayed in one direction, the sprayed transparent conductive composition does not reach the coated area, so that it is not evenly coated. Unlike shown in FIG. 8A, a transparent conductive composition may be sprayed on one side and a method of rotating the spherical transparent solid structure 20 to be evenly coated may be used. Some of the sprayed transparent conductive composition may be coated on the surface of the transparent three-dimensional structure 20, and the remaining uncoated may be recovered and recycled for cost reduction.

Next, the dip coating method illustrated in FIG. 8 (b) is a method of dipping a transparent three-dimensional structure 20 in a trough T filled with a transparent conductive composition for a predetermined time, and then drying and coating the transparent three-dimensional structure 20 in a short time. ) The CNT 30 can be evenly coated on the entire surface.

Next, the LB method shown in FIG. 8 (c) vaporizes the solvent in the trough T filled with the transparent conductive composition dispersed in the volatile organic solvent, and then pushes the barrier B to gradually decrease the surface area of the water to obtain CNT ( 30) forms CNT Langmuir films aligned in a predetermined direction on the interface, and CNT Langmuir films 30 aligned at the interface between water and air are brought into contact with the transparent three-dimensional structure 20 to form CNTs. It may be formed on the surface of the structure (20). For example, the CNT 30 may be better aligned at the interface between water and air, for example, by providing a hydrophilic group at one end of the CNT and a hydrophobic group at the other end so that the CNTs have amphiphilic properties. May be induced to align in a direction in the Langmuir membrane. According to this method, unlike the foregoing (a) and (b), there is an advantage in that the CNTs 30 aligned in a predetermined direction may be coated on the three-dimensional structure 20.

The method shown in Figs. 8A to 8C can be repeated several times. That is, a method of increasing the density of the CNTs 30 by first coating the CNTs on the transparent three-dimensional structure 20 and then drying the CNTs on the transparent three-dimensional structure 20 again. In addition, one or more of the above coating methods may be mixed and used. That is, after performing the dip coating, the CNT 30 may be coated on the transparent three-dimensional structure 20 through the drying process by performing the spray coating secondarily. Surface to create a functional group on the surface of the CNT 30 in order to improve the adhesion of the CNT 30 to the surface of the transparent three-dimensional structure 20 and to coat a material that can be combined with the functional group on the surface of the transparent three-dimensional structure 20 Processing may be preceded.

Other coating methods such as spin coating, roller coating, doctor bar coating, slot coating, gravure coating and the like are not shown in addition to the CNT coating method shown in FIGS. 8 (a) to 8 (c). The CNT 30 may be attached to the transparent three-dimensional structure 20 surface by using.

The transparent conductive composition applied as described above is dried to form the CNT 30 on the surface of the transparent three-dimensional structure 20 (S30). The drying process for forming the CNT 30 may be a general drying method by heat. In the method for manufacturing a transparent conductive film according to an embodiment of the present invention, the transparent three-dimensional structure 20 having the CNT 30 attached to the surface is performed by performing a drying process between 30 to 120 seconds between 80 to 120 ° C. It can manufacture. In addition, when the UV conductive material is included in the transparent conductive composition, a method of forming CNTs 30 by irradiating ultraviolet rays may also be used.

Next, the transparent three-dimensional structure 20 attached to the surface CNT 30 is disposed on the substrate 10 in a desired pattern form (S40). The method of disposing the transparent solid structure 20 on the substrate 10 is shown in FIGS. 9 and 10.

First, referring to FIG. 9, the spherical transparent three-dimensional structure 20 may be easily disposed by the groove 11 formed in the substrate 10. The grooves 11 may form concavities and convexities in the manufacturing of the substrate 10, and may also form the grooves 11 in a pattern of a desired shape by post-processing after manufacturing the substrate 10 having a flat plate shape. have. After fixing the transparent three-dimensional structure 20 by the groove 11 as described above with reference to Figure 3 to form a support coating film 40 or the transparent three-dimensional structure 20 through the adhesive layer 50 It is fixed. In addition to the spherical transparent three-dimensional structure 20, other forms of transparent three-dimensional structure 20, for example, low-mobility hemispherical three-dimensional structure 20, without a groove 11 on the substrate 10 without a support coating film ( 40 may be formed or fixed via the adhesive layer 50.

Next, FIG. 10 illustrates the addition of functional groups 31 and 31 'to the ends of the CNTs 30 to generate the bonding force between the CNTs 30 by the interaction of the functional groups 31 and 31'. Discloses a configuration in which) is arranged in a constant direction. In this case as well, in the case of the spherical transparent three-dimensional structure 20 can be used as a means for temporarily fixing until the intervening support coating film 40 or the adhesive layer 50, but the transparent three-dimensional shape other than the spherical shape inferior mobility In the case of the structure 20, the configuration of adding the functional groups 31 and 31 'may be excluded.

Transparent conductive film according to the embodiments of the present invention prepared by the manufacturing method as described above is a pattern is formed without an additional process for forming a separate pattern is shortened the production process and has an advantageous effect in terms of cost, the pattern is directly Since there is no non-pattern portion to be cut and discarded in the finished conductive film because it is formed, it is possible to provide a completed transparent conductive film with a higher yield than the coating composition. In addition, by attaching and handling the nanoscale transparent conductive material 30 which is difficult to handle to the microscale three-dimensional structure 20, a transparent conductive film that is easily patterned can be provided, and the transparent conductive material is uniformly provided on the substrate 10. It is possible to provide a transparent conductive film coated on the) to exhibit improved transparency and conductivity.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

10: Substrate
20: transparent three-dimensional structure
30: transparent conductive material

Claims (12)

Board;
A micro-scale transparent three-dimensional structure provided on the substrate; And
A transparent conductive film comprising a plurality of transparent conductive materials attached to the surface of each transparent three-dimensional structure. The method of claim 1,
The transparent three-dimensional structure is a transparent conductive film arranged to form a predetermined pattern. The method of claim 1,
The transparent three-dimensional structure is a transparent conductive film having a spherical shape. The method of claim 1,
And the substrate and the transparent solid structure are made of substantially the same material. The method of claim 1,
A transparent conductive film having an occupied area of the entire transparent three-dimensional structure relative to the area of the substrate on the plan view of the substrate, π / 4 or more. The method of claim 1,
The transparent conductive film of which the average value of the number of times each said transparent three-dimensional structure contact | connects another adjacent transparent three-dimensional structure is two or more. Preparing a plurality of micro-scale transparent three-dimensional structure,
Coating a transparent conductive material on the transparent three-dimensional structure,
Drying the coated transparent conductive material,
Method of manufacturing a transparent conductive film comprising disposing the transparent three-dimensional structure on a substrate. The method of claim 7, wherein
Coating the transparent conductive material comprises performing at least one of spray coating, dip coating, and Langmuir blowjet techniques with a transparent conductive composition. The method of claim 7, wherein
Fixing the transparent three-dimensional structure on a substrate comprises the alignment of the transparent three-dimensional structure to form a predetermined pattern. The method of claim 7, wherein
The manufacturing method of the transparent three-dimensional structure is made of a transparent conductive film made of substantially the same material as the substrate. The method of claim 7, wherein
The fixing of the transparent three-dimensional structure on the substrate comprises a method for occupying the area of the entire transparent three-dimensional structure on the plan view of the substrate to be π / 4 or more relative to the total area of the substrate. The method of claim 1,
Wherein said transparent conductive composition comprises at least one of CNTs, nanowires, and metal oxides.

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