KR20120035673A - Package substrate - Google Patents

Package substrate Download PDF

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Publication number
KR20120035673A
KR20120035673A KR1020100097343A KR20100097343A KR20120035673A KR 20120035673 A KR20120035673 A KR 20120035673A KR 1020100097343 A KR1020100097343 A KR 1020100097343A KR 20100097343 A KR20100097343 A KR 20100097343A KR 20120035673 A KR20120035673 A KR 20120035673A
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KR
South Korea
Prior art keywords
circuit board
printed circuit
package substrate
component
connection terminal
Prior art date
Application number
KR1020100097343A
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Korean (ko)
Inventor
이동욱
노승현
Original Assignee
삼성전기주식회사
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Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020100097343A priority Critical patent/KR20120035673A/en
Priority to US13/252,717 priority patent/US20120087098A1/en
Publication of KR20120035673A publication Critical patent/KR20120035673A/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/164—Material
    • H01L2924/1659—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof

Abstract

PURPOSE: A package substrate is provided to secure reliability from external impact by combining a metal cap on the upper end of a wall printed circuit board which is combined with a printed circuit board. CONSTITUTION: A part is mounted on a connection terminal. A wire(230) is combined with the part. A wall printed circuit board(240) is combined with a conductive adhesive layer. The wall printed circuit board covers the part. A metal cap(250) is combined with the upper part of the wall printed circuit board in order to cover the part.

Description

패키지기판{Package substrate}Package substrate

본 발명은 패키지기판에 관한 것이다.
The present invention relates to a package substrate.

종래기술에 따른 마이크로폰 패키지는 주위의 다른 부품에서 발생하는 전자파로 인해 오작동되거나 노이즈가 발생된다. 그리고 이를 해소하기 위해 인쇄회로기판에 부품을 실장한 후 금속재질로 실링하여 전자파를 차단한다.The microphone package according to the prior art malfunctions or generates noise due to electromagnetic waves generated from other components around it. In order to solve this problem, the components are mounted on a printed circuit board and then sealed with a metal material to block electromagnetic waves.

그러나, 종래기술에 따른 마이크로폰 패키지의 경우 금속재질의 캡과 인쇄회로기판의 결합력 부족으로 불량이 발생된다.However, in the case of the microphone package according to the prior art, a defect occurs due to a lack of coupling force between the cap of the metal material and the printed circuit board.

보다 구체적으로, 도 1은 종래기술에 따른 패키지기판을 개략적으로 나타낸 단면도이다. 도시한 바와 같이, 상기 패키지기판(100)은 인쇄회로기판(110), 부품(120), 와이어(130) 및 금속캡(140)을 포함한다.More specifically, Figure 1 is a cross-sectional view schematically showing a package substrate according to the prior art. As shown, the package substrate 100 includes a printed circuit board 110, a component 120, a wire 130, and a metal cap 140.

그리고 상기 인쇄회로기판(110)은 베이스보드(111)와, 상기 베이스보드(111) 상에 결합된 접속단자(112)를 포함한다. 그리고 상기 접속단자(112)에 하나 이상의 부품(120)이 실장되고, 상기 와이어(130)를 통해 부품(120)은 접속단자에 와이어 본딩된다. 그리고 상기 금속캡(140)은 부품이 커버되도록 인쇄회로기판(110)에 결합된다. The printed circuit board 110 includes a base board 111 and a connection terminal 112 coupled to the base board 111. At least one component 120 is mounted on the connection terminal 112, and the component 120 is wire-bonded to the connection terminal through the wire 130. The metal cap 140 is coupled to the printed circuit board 110 to cover the component.

종래기술에 따른 패키지기판은 상기한 바와 같이 이루어짐에 따라, 금속캡(140)과 인쇄회로기판(110)은 결합력이 부족하고, 금속캡(140)이 고중량으로 구현됨에 따라, 외부에서 충격이 가해질 경우, 금속캡(140)과 인쇄회로기판(110)이 분리되는 문제점을 지니고 있다.
As the package substrate according to the prior art is made as described above, the metal cap 140 and the printed circuit board 110 lacks a bonding force, and as the metal cap 140 is implemented with a high weight, the impact is applied from the outside. In this case, the metal cap 140 and the printed circuit board 110 are separated.

본 발명의 목적은 상기와 같은 문제점을 해결하기 위한 것으로, 인쇄회로기판에 월 인쇄회로기판(Wall PCB)를 결합시키고, 상기 월 인쇄회로기판의 상단에 금속캡을 결합시킴에 따라, 견고성이 확보되어 외부의 충격에도 신뢰성을 확보할 수 있는 패키지기판을 제공하기 위한 것이다.
An object of the present invention is to solve the above problems, by combining the wall printed circuit board (Wall PCB) to the printed circuit board, and by combining the metal cap on the upper end of the wall printed circuit board, secured robustness It is to provide a package substrate that can ensure the reliability even from external impact.

상술한 본 발명의 목적을 달성하기 위하여 본 발명에 따른 패키지기판은 접속단자 및 도전성 접착층이 형성된 인쇄회로기판과, 상기 접속단자에 실장된 부품과, 상기 부품에 결합된 와이어와, 상기 도전성 접착층에 결합되고 상기 부품을 커버하는 월 인쇄회로기판과, 상기 부품을 커버하도록 월 인쇄회로기판의 상부에 결합된 금속캡을 포함한다. In order to achieve the above object of the present invention, a package substrate according to the present invention includes a printed circuit board on which a connection terminal and a conductive adhesive layer are formed, a component mounted on the connection terminal, a wire bonded to the component, and a conductive adhesive layer. And a wall printed circuit board coupled and covering the component, and a metal cap coupled to an upper portion of the wall printed circuit board to cover the component.

그리고 상기 인쇄회로기판은 부품실장용 접속단자와 와이어 본딩용 접속단자를 포함하고, 테두리부에 도전성 접착층이 형성된다.The printed circuit board includes a component mounting connection terminal and a wire bonding connection terminal, and a conductive adhesive layer is formed on the edge portion.

또한, 상기 인쇄회로기판은 마더보드에 실장하기 위한 접속단자를 더 포함한다.In addition, the printed circuit board further includes a connection terminal for mounting on the motherboard.

그리고, 상기 월 인쇄회로기판은 사각 프레임으로 형성된다. The wall printed circuit board is formed in a rectangular frame.

또한, 상기 금속캡은 판 형으로 이루어진다. In addition, the metal cap is made of a plate shape.

그리고 본 발명에 따른 패키지기판이 마이크로폰용 패키지기판으로 구현될 경우, 상기 인쇄회로기판은 마이크로폰 용 인쇄회로기판이고, 상기 부품은 마이크로폰 부품이다.
When the package substrate according to the present invention is implemented as a package substrate for a microphone, the printed circuit board is a printed circuit board for a microphone, and the component is a microphone component.

본 발명의 특징 및 이점들은 첨부도면에 의거한 다음의 상세한 설명으로부터 더욱 명백해질 것이다. The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 통상적이고 사전적인 의미로 해석되어서는 아니 되며, 발명자가 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합되는 의미와 개념으로 해석되어야만 한다.
Prior to this, the terms or words used in this specification and claims should not be interpreted in a conventional and dictionary sense, and the inventors will be required to properly define the concepts of terms in order to best describe their invention. On the basis of the principle that it can be interpreted as meaning and concept corresponding to the technical idea of the present invention.

본 발명에 의하면, 인쇄회로기판에 월 인쇄회로기판(Wall PCB)를 결합시키고, 상기 월 인쇄회로기판의 상단에 금속캡을 결합시킴에 따라, 견고성이 확보되어 외부의 충격에도 신뢰성을 확보할 수 있는 패키지기판을 제공하는 효과를 갖는다.
According to the present invention, by combining the wall printed circuit board (Wall PCB) to the printed circuit board, and by combining the metal cap on the upper end of the wall printed circuit board, the robustness is secured to ensure reliability even from external impact Has the effect of providing a package substrate.

도 1은 종래기술에 따른 패키지기판을 개략적으로 나타낸 단면도.
도 2는 본 발명에 따른 패키지기판을 개략적으로 나타낸 단면도.
도 3은 도 2에 나타낸 패키지기판의 부분 평면도.
1 is a cross-sectional view schematically showing a package substrate according to the prior art.
2 is a cross-sectional view schematically showing a package substrate according to the present invention.
3 is a partial plan view of the package substrate shown in FIG.

본 발명의 목적, 특정한 장점들 및 신규한 특징들은 첨부된 도면들과 연관되어지는 이하의 상세한 설명과 바람직한 실시예들로부터 더욱 명백해질 것이다. 본 명세서에서 각 도면의 구성요소들에 참조번호를 부가함에 있어서, 동일한 구성 요소들에 한해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 번호를 가지도록 하고 있음에 유의하여야 한다. 또한, 본 발명을 설명함에 있어서, 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명은 생략한다.
The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail.

이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예에 따른 패키지기판에 대하여 상세하게 설명한다.
Hereinafter, a package substrate according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in detail.

도 2는 본 발명에 따른 패키지기판을 개략적으로 나타낸 단면도이고, 도 3은 도 2에 나타낸 패키지기판에 있어서, 금속캡이 제거된 부분 평면도이다. 도시한 바와 같이, 상기 패키지기판(200)은 인쇄회로기판(210), 부품(220), 와이어(230), 월 인쇄회로기판(240) 및 금속캡(250)을 포함한다.2 is a cross-sectional view schematically showing a package substrate according to the present invention, Figure 3 is a plan view of a portion of the package substrate shown in Figure 2, the metal cap is removed. As shown, the package substrate 200 includes a printed circuit board 210, a component 220, a wire 230, a wall printed circuit board 240, and a metal cap 250.

상기 인쇄회로기판(210)은 베이스보드(211), 접속단자(212) 및 도전성 접착부(213)를 포함한다.The printed circuit board 210 includes a base board 211, a connection terminal 212, and a conductive adhesive part 213.

그리고 상기 접속단자(212)에 하나 이상의 부품(220)이 실장되고, 상기 와이어(230)를 통해 부품(220)은 인쇄회로기판의 접속단자에 와이어 본딩된다. 그리고 상기 인쇄회로기판은 마더보드에 실장되기 위한 접속단자를 더 포함한다. At least one component 220 is mounted on the connection terminal 212, and the component 220 is wire-bonded to the connection terminal of the printed circuit board through the wire 230. The printed circuit board further includes a connection terminal for mounting on the motherboard.

또한, 상기 월 인쇄회로기판(240)은 도 3에 도시한 바와 같이, 사각 프레임으로 형성되고, 인쇄회로기판의 도전성 접착부(213)에 접착 및 고정된다. In addition, the wall printed circuit board 240 is formed as a rectangular frame, as shown in Figure 3, is bonded and fixed to the conductive adhesive portion 213 of the printed circuit board.

그리고 상기 금속캡(250)은 판 형으로 이루어지고, 부품이 커버되도록 월 인쇄회로기판(240)의 상단부에 결합된다.The metal cap 250 is formed in a plate shape, and is coupled to an upper end of the wall printed circuit board 240 so that a part is covered.

이와 같이 이루어짐에 따라, 본 발명에 따른 패키지기판(200)은 도전성 접착부(213)에 의해 인쇄회로기판(210)과 월 인쇄회로기판(240)의 결합력이 향상되고, 금속캡(250)이 판 형으로 이루어짐에 따라, 도 1에 도시한 종래기술에 따른 패키지기판의 금속캡(140)에 비하여 적은 중량으로 이루어져 외부충격에 대하여 견고성 및 신뢰성이 향상된다.
As such, the package substrate 200 according to the present invention is improved by the conductive adhesive portion 213 the bonding force of the printed circuit board 210 and the wall printed circuit board 240 is improved, the metal cap 250 is plate As it is made of a type, made of less weight than the metal cap 140 of the package substrate according to the prior art shown in Figure 1 improves the robustness and reliability against external impact.

그리고 본 발명에 따른 패키지기판의 제조방법은 다음과 같다. And the manufacturing method of the package substrate which concerns on this invention is as follows.

인쇄회로기판 및 월 인쇄회로기판을 각각 마련하고, 상기 인쇄회로기판에 부품 실장 후 와이어 본딩하고, 상기 인쇄회로기판의 도전성 접착부에 월 인쇄회로기판을 결합시키고, 상기 월 인쇄회로기판의 상단부에 금속캡을 결합시킨다. A printed circuit board and a wall printed circuit board are respectively provided, the components are mounted on the printed circuit board and wire-bonded to each other. Join the cap.

또한, 본 발명에 따른 패키지기판은 마이크로폰 용 패키지로 구현될 수 있고, 이 경우 상기 인쇄회로기판은 마이크로폰 용 인쇄회로기판이고, 상기 부품은 마이크로폰 부품이다. 그리고 이 경우, 상기 월 인쇄회로기판의 높이는 700 미크론으로 형성되는 것이 바람직하다.
In addition, the package substrate according to the present invention may be implemented as a package for a microphone, in which case the printed circuit board is a microphone printed circuit board, the component is a microphone component. In this case, the height of the wall printed circuit board is preferably formed to 700 microns.

이상 본 발명을 구체적인 실시예를 통하여 상세히 설명하였으나, 이는 본 발명을 구체적으로 설명하기 위한 것으로, 본 발명에 따른 패키지기판은 이에 한정되지 않으며, 본 발명의 기술적 사상 내에서 당해 분야의 통상의 지식을 가진 자에 의해 그 변형이나 개량이 가능함은 명백하다고 할 것이다. Although the present invention has been described in detail through specific embodiments, this is for explaining the present invention in detail, and the package substrate according to the present invention is not limited thereto, and the general knowledge of the art within the technical spirit of the present invention is provided. It is obvious that modifications and improvements are possible by those who have them.

본 발명의 단순한 변형 내지 변경은 모두 본 발명의 영역에 속하는 것으로 본 발명의 구체적인 보호 범위는 첨부된 특허청구범위에 의하여 명확해질 것이다.
All simple modifications and variations of the present invention fall within the scope of the present invention, and the specific scope of protection of the present invention will be apparent from the appended claims.

100: 패키지 기판 110: 인쇄회로기판
120: 부품 130: 와이어
140: 금속캡 200: 패키지기판
210: 인쇄회로기판 220: 부품
230: 와이어 240: 월 인쇄회로기판
250: 금속캡100: package substrate 110: printed circuit board
120: part 130: wire
140: metal cap 200: package substrate
210: printed circuit board 220: components
230: wire 240: wall printed circuit board
250: metal cap

Claims (6)

접속단자 및 도전성 접착층이 형성된 인쇄회로기판;
상기 접속단자에 실장된 부품;
상기 부품에 결합된 와이어;
상기 도전성 접착층에 결합되고 상기 부품을 커버하는 월 인쇄회로기판; 및
상기 부품을 커버하도록 월 인쇄회로기판의 상부에 결합된 금속캡을 포함하는 것을 특징으로 하는 패키지기판.
A printed circuit board having a connection terminal and a conductive adhesive layer formed thereon;
A component mounted on the connection terminal;
A wire coupled to the component;
A wall printed circuit board coupled to the conductive adhesive layer and covering the component; And
And a metal cap coupled to an upper portion of the wall printed circuit board to cover the component.
청구항 1에 있어서,
상기 인쇄회로기판은 부품실장용 접속단자와 와이어 본딩용 접속단자를 포함하고, 테두리부에 도전성 접착층이 형성된 것을 특징으로 하는 패키지기판.
The method according to claim 1,
The printed circuit board includes a component mounting connection terminal and a wire bonding connection terminal, the package substrate, characterized in that the conductive adhesive layer formed on the edge portion.
청구항 2에 있어서,
상기 인쇄회로기판은 마더보드에 실장하기 위한 접속단자를 더 포함하는 것을 특징으로 하는 패키지기판.
The method according to claim 2,
The printed circuit board further comprises a connection terminal for mounting on the motherboard.
청구항 1에 있어서,
상기 월 인쇄회로기판은 사각 프레임으로 형성된 것을 특징으로 하는 패키지기판.
The method according to claim 1,
The wall printed circuit board is a package substrate, characterized in that formed in a square frame.
청구항 1에 있어서,
상기 금속캡은 판 형으로 이루어진 것을 특징으로 하는 패키지기판.
The method according to claim 1,
The metal cap is a package substrate, characterized in that consisting of a plate.
청구항 1에 있어서,
상기 인쇄회로기판은 마이크로폰 용 인쇄회로기판이고, 상기 부품은 마이크로폰 부품인 것을 특징으로 하는 패키지기판. The method according to claim 1,
The printed circuit board is a printed circuit board for a microphone, the component is a package substrate, characterized in that the microphone component.
KR1020100097343A 2010-10-06 2010-10-06 Package substrate KR20120035673A (en)

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US9613933B2 (en) 2014-03-05 2017-04-04 Intel Corporation Package structure to enhance yield of TMI interconnections
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US4372037A (en) * 1975-03-03 1983-02-08 Hughes Aircraft Company Large area hybrid microcircuit assembly
JP2541487B2 (en) * 1993-11-29 1996-10-09 日本電気株式会社 Semiconductor device package
US5767447A (en) * 1995-12-05 1998-06-16 Lucent Technologies Inc. Electronic device package enclosed by pliant medium laterally confined by a plastic rim member
US5949654A (en) * 1996-07-03 1999-09-07 Kabushiki Kaisha Toshiba Multi-chip module, an electronic device, and production method thereof
EP0961404B1 (en) * 1998-05-29 2008-07-02 Fujitsu Limited Surface-acoustic-wave filter having an improved suppression outside a pass-band
US7813145B2 (en) * 2004-06-30 2010-10-12 Endwave Corporation Circuit structure with multifunction circuit cover
EP1897425A1 (en) * 2005-06-30 2008-03-12 Siemens Aktiengesellschaft Hardware protection system for sensitive electronic-data modules protecting against external manipulations
TWI393511B (en) * 2007-05-29 2013-04-11 Panasonic Corp Dimensional printed wiring board and manufacturing method thereof

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