KR20110059028A - Pressure sensor module and the packaging method using the semiconductor strain gage - Google Patents

Abstract

PURPOSE: A semiconductor strain gauge type pressure sensor module and a manufacturing method thereof are provided to prevent inflow of foreign materials by wire connection. CONSTITUTION: A manufacturing method of a semiconductor strain gauge type pressure sensor module is as follows. A pressure sensor hole(210) is constituted in a diaphragm(200). A semiconductor type strain gage(300) having first conductive pad(310) is prepared. The insulating material with cohesive property spreads on the side opposing of the pressure sensor hole of diaphragm. A strain gage is attached to a surface covered with an insulating material. A solder bumper is formed on the first conductive pad. The first conductive pad of a semiconductor type strain gauge and the second conductive pad of a circuit board are fused each other by using flip chip mounting technique.

Description

Pressure Sensor Module And The Packaging Method Using The Semiconductor Strain Gage

The present invention relates to a pressure sensor module using a metal diaphragm and a method of manufacturing the same. More specifically, the present invention includes a diaphragm having a pressure sensor hole and a semiconductor strain disposed on an opposing surface of the pressure sensor hole of the diaphragm. It consists of a circuit board unit for receiving and connecting a gauge and the input and output of the strain gauge, the connection of the circuit board unit and the strain gauge is characterized in that it is directly connected by flip chip mounting technology without using a wire.

According to the present invention, as the strain gage and the circuit board part are directly connected, the size of the pressure sensor module can be miniaturized, the manufacturing process is simple, productivity is improved, and there is no fear of breaking the wire, thereby increasing durability. In addition, there is an advantage that can prevent the introduction of foreign substances due to the wire connection.

The pressure sensor is a device that measures pressure in the system, and is widely used for various purposes such as industrial measurement, automatic control, medical care, automotive engineers, environmental control, and electrical appliances. The measuring principle of the pressure sensor has been practically used in many kinds by using displacement, deformation, and the like. In recent years, due to the development of semiconductor technology and the development of micromachining technology, it has been miniaturized and complexed, and the market continues to demand miniaturization and durability of pressure sensors in order to be used in medical devices and small composite devices.

Types of pressure sensors include mechanical pressure sensors using bullodon tubes or bellows, piezoresistive electronic pressure sensors using strain gauges, or capacitive electronic pressure sensors that measure displacement of capacitance between two objects. In particular, piezoresistive sensors using strain gauges are the most used in terms of performance and price.

Strain is a term used to describe strain or strain, which is the ratio of the length of a body that is stretched or shortened from its original length when it is subjected to tension or compression.It is a structure or machine such as civil engineering, mechanical engineering, aeronautical engineering, or electronic engineering In the field dealing with the analysis of elements, a term used when a structure or mechanical element is deformed due to external force, and a strain gauge is attached to the surface of the structure to measure the state and amount of deformation of the structure by such strain. As gauges, there are an electric strain gauge for measuring the amount of deformation of the structure by changing the resistance and a mechanical strain gauge for measuring the distance change of the structure to be deformed.

The device of the electric strain gauge uses a metal with a large resistance change or a semiconductor. When using a metal with a large resistance change, the resistance is measured by forming a resistance wire in the form of a wire or foil on the insulator, while the semiconductor strain The gauge is made of a single crystal of silicon.

The sensitivity of the strain gauge is expressed by gage rate (G), and G = (ΔR / R) / (Δl / l), where the resistance change rate of the gauge is ΔR / R, strain rate Δl / It is indicated by l. The higher the gauge rate, the higher the sensitivity of the gauge. The smaller the rate of change of the strain, the higher the rate of change of resistance.

Compared with other types of strain gauges, semiconductor strain gauges have advantages of high gauge rate (G), high sensitivity, excellent stability, and easy downsizing.

In order to compose the pressure sensor module using strain gauge, the output of strain gauge, reference voltage and power should be connected to strain gauge. In this case, the strain gauge is connected to the external circuit board using wire bonding technique. .

1 shows a pressure sensor module using wire bonding, which is a manufacturing method of a conventional pressure sensor module, wherein the diaphragm 200 and the pressure transfer hole 210 of the diaphragm convert the external pressure into stress 220. Strain gauge (300) attached to the circuit board, a circuit board (400) for transmitting power and a reference voltage and an output signal to connect to an external board on which the pressure sensor module is mounted, and a wire for connecting the strain gauge and the circuit board. Indicates.

As a result of the conventional pressure sensor module as shown in Figure 1 to take a connection structure using a wire bonding technique using a wire, the wire can be easily damaged due to tensile stress and vibration when an external pressure is applied, wire There is a problem that it is difficult to miniaturize due to the connection work, the resistance component and inductance component is inherent in the wire itself, and the resistance component and inductance component inherent in the wire are different as the length of the wire is long and short in the produced pressure sensor module. In addition, depending on the product specification of the wire, the difference between the resistance and inductance components may cause errors in the pressure measurement of each of the produced pressure sensor modules. There is a problem that the durability is reduced.

An object of the present invention is to solve this problem, to provide a pressure sensor module that the production process is simple, excellent durability, uniform pressure sensitivity and miniaturization.

Another object of the present invention is to provide a method of manufacturing a pressure sensor module that is simple in production process, excellent in durability, uniform in pressure sensitivity, and miniaturized.

This object of the present invention is a pressure sensor module for measuring the external pressure,

'D'-shaped diaphragm having a recess for receiving external pressure (hereinafter referred to as a' pressure transfer hole ') and a conductive pad disposed at a position opposite to the pressure transfer hole in the diaphragm to allow electrical contact A semiconductor strain gage capable of inputting and outputting an electrical signal, and having a first surface and a second surface opposite to the first surface, wherein the first surface corresponds to the first conductive pad. One or more conductive pads (hereinafter referred to as 'second conductive pads') disposed at positions including a circuit board portion electrically connecting the input / output signals of the strain gauge are soldered to the first conductive pads of the circuit board portion. The bumps are seated and the second conductive pads of the first surface are welded to the first conductive pads so as to deposit the circuit board and the strain. It is not achieved by the electrical pressure sensor module is connected to.

The object of the present invention is to provide a semiconductor strain gage 300 having a first step and a conductive pad (hereinafter referred to as a 'first conductive pad') to have a metal diaphragm having a 'c' shaped pressure sensor hole. The strain gauge prepared in the second step is prepared on the second step of the preparation and the third step of applying the insulating material having an adhesive on the opposing surface of the pressure sensor hole of the diaphragm and the surface on which the insulating material is applied in the third step. And a fourth step of attaching the first surface and a second surface facing the first surface, wherein the first surface has a conductive pad disposed at a position corresponding to the first conductive pad (hereinafter referred to as 'second conductive pad'). A step of preparing a circuit board and forming a solder bumper on the first conductive pad, and using a flip chip mounting technique, a semiconductor strip prepared in the fourth step. It is achieved a method for manufacturing a pressure sensor module comprising a sixth step of contact with engagement of the first and that the conductive pad prepared circuit welding a second conductive pad of the substrate in the step 5.

In the semiconductor strain gauge type pressure sensor module and a method of manufacturing the same according to the present invention, since the strain gauge and the circuit board are directly fused to the circuit board and the strain gauge by a flip chip bonding method, the durability is superior to the conventional wire bonding technique. In addition, it is not necessary to consider this connection, and it can be manufactured in close contact, and it can be miniaturized, and it is not necessary to consider the resistance component by the wire, so that the sensitivity can be maintained uniformly, and it can provide stability by not being exposed to humidity or foreign substances. There is an advantage.

Therefore, in the background art, various problems caused by the use of wire bonding when connecting the strain gauge and the circuit board can be solved.

The above objects, features, and advantages will become more apparent from the following detailed description with reference to the accompanying drawings, and as such, those skilled in the art to which the present invention pertains may share the spirit of the present invention. It will be easy to implement. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a pressure sensor module showing an embodiment of the present invention. According to FIG. 2, the pressure sensor module is connected to the strain gauge and the semiconductor strain gauge 300 attached to a surface of the 'c'-shaped diaphragm 200, which faces the pressure sensor hole 210 of the diaphragm. It consists of a circuit board 400 used to be connected to the board on which the sensor module is mounted. Let's take a closer look at each of the components.

The diaphragm 200 according to FIG. 2 is a metal type diaphragm and may be formed of a strained steel diaphragm. The diaphragm has a 'c' shape and has a pressure sensor hole 210 capable of receiving external pressure, and an external pressure is received in the pressure sensor hole 210 according to the external pressure. The diaphragm is deformed in appearance, and the deformation of the diaphragm is such that the resistance of the strain gauge 300 is changed to sense the pressure.

The strain gauge 300 according to FIG. 2 is a semiconductor strain gauge, and FIG. 7 shows an example of a semiconductor strain gauge. The semiconductor strain gage is made of a silicon single crystal, and according to the change of the external shape of the diaphragm 200, the change in the resistance of the semiconductor strain gage and the change in the output value thereof are generated. The semiconductor strain gage of FIG. 7 has a width of about 0.8 mm, a height of 1.8 mm, and a thickness of about 10 um to 50 um. The method for configuring the strain gauge includes an input power source (VIN: 310), a reference power source (GND: 320), and an output power source (VOut: 330) as shown in FIG. 7, and the input power source, the reference power source and the output power source are as shown in FIG. When the relationship between is constructed by a circuit, the circuit of the left figure of FIG. According to the example of FIG. 7, VIN and GND are inputs to be applied from an external circuit, a board, or the like from the viewpoint of strain gauges, and VOUT, which changes according to the change of the resistance of the strain gauges, is configured as an output. As shown in FIG. 7, the VIN, VOUT, and GND signals may form a conductive pad (hereinafter, referred to as a “first conductive pad”) at the ends of the VIN, VOUT, and GND signals for connection with the outside. In addition to the embodiment shown in FIG. 7, the strain gage may be configured to have a Wheatstone bridge type circuit to secure stable output sensitivity, and may include one or more VOUT signals. Of course, even if the strain gauges to be used are not one but several, the input / output pads may be configured in the same way as the number of VOUT signals is one.

The semiconductor strain gauge 300 is located on the surface 220 opposite the pressure sensor hole 210 of the diaphragm 200. In order to arrange the semiconductor strain gauge on the diaphragm 200, the semiconductor strain gauge 300 may be insulative and adherent. The semiconductor strain gage 300 may be attached to the diaphragm 200 using an adhesive.

The circuit board unit 400 according to FIG. 2 is connected to an external board on which the pressure sensor module is mounted, including VIN, GND, and VOUT, which are inputs and outputs of the semiconductor strain gauge 300. Referring to FIG. 2, the conductive circuit pad 420 (hereinafter referred to as a “second conductive pad”) is attached to the circuit board 400 at a position corresponding to the first conductive pad 310 of the strain gauge 300 to flip chip bonding. The second type of conductive pad 420 is connected to the semiconductor strain gauge, and the second conductive pad 420 is connected to another external board on which the pressure sensor module of the present invention is mounted via a connection line on a circuit board. (Hereinafter, referred to as "external input / output pad") (only one external input / output pad is shown in FIG. 2). The circuit board 400 is configured by using a flexible PCB, which is a flexible PCB material. When the shape of the diaphragm changes according to the pressure input from the diaphragm 200, the flexible PCB also changes flexibly with the change of the diaphragm, thereby The circuit board part 400 that can withstand excessive pressure may be configured. In addition, the circuit board unit 400 may further configure an amplifier circuit for amplifying the output signal of the strain gauge. The amplifier circuit may be configured as a resistor-inductor-capacitor (RLC) circuit including an op amp, and the amplifier circuit may be disposed on one surface 440 or two surfaces 450 of the circuit board unit.

In the pressure sensor module according to FIG. 2, the semiconductor strain gage 300 and the circuit board unit 400 are connected by using a flip chip bonding technique. The flip chip bonding technique is a technique of forming a fine solder bumper on a chip on which an element is formed, and bonding and mounting a circuit board on a surface on which the solder bumper is formed. A first conductive pad 310 for using a flip chip bonding technique is used. The second conductive pads 420 are generally made of aluminum alloy, but other conductive pads may be used. By using the flip chip bonding technique, the size of the pressure sensor module can be reduced, the process can be simplified, and compared with the conventional wire technique, the resistance is more stable with the reduction of the resistance component, and the problems caused by the wire damage can be prevented. have. In order to use the flip chip bonding technique, a solder bumper is formed on the first conductive pad 310, which is an input / output pad of the semiconductor strain gage 300 having the diaphragm 200, and corresponds to the first conductive pad 310. The second conductive pads 420 are bonded to each other, and a metal layer may be added to both pads in order to increase connectivity between the first conductive pads 310, the second conductive pads 420, and the solder bumper. have.

Various forms of the circuit board unit 400 according to FIG. 2 are shown in plan view in FIG. 8. Although three types are shown as examples in FIG. 8, the circuit board unit may be implemented in various forms in addition to the example illustrated in FIG. 8. Referring to FIG. 8, the circuit board 400 includes a second conductive pad 420 and an external input / output pad 410. The second conductive pad 420 is welded to the first conductive pad 310 of the strain gauge 300 to be electrically connected to the strain gauge, and the external input / output pad 410 is configured to externally output a signal of the second conductive pad. It is a pad configured to connect with the board. In particular, the external I / O pad 410 may increase or change the type of the pad in consideration of the manufacturing process of the external board on which the pressure sensor module is to be mounted, and according to the manufacturing process of the external board, The external I / O pad can be configured to be located. FIG. 8A shows the circuit board portion 400 of the 'H' type, where the second conductive pad 420 is positioned on the first surface of the circuit board portion 400 of the 'H' type central portion. The external input / output pads 410 are formed on the second surface of the circuit board part 400, and the upper and lower parts of the center part are cut and configured to have no circuit board. 8B illustrates a circuit board part 400 of a 'ㅏ' type. Referring to FIG. 8B, the second conductive pad 420 is disposed on the first surface of the circuit board 400, and the external I / O pad 410 is disposed on the second surface of the circuit board 400. When the number of input / output pads in the conductive pad is small, the size of the circuit board may be reduced as shown in FIG. 8B. FIG. 8C illustrates a plan view of another embodiment of the circuit board unit 400. According to FIG. 8C, the second conductive pad 420 and the circuit board unit 400 are formed on the first surface of the rectangular circuit board unit 400. The external input / output pad 410 is located on the second surface of the (). Unlike the example of FIG. 8, in the circuit board unit 400 according to the above example, the position of the external input / output pad 410 may be disposed on the first surface to which the strain gauge 300 is attached. The circuit board may be made of phenol, epoxy, or a flexible material.

3 is a view showing another embodiment of the pressure sensor module. The pressure sensor module according to FIG. 3 is a semiconductor strain gauge attached to the diaphragm 200 having a 'c' shape and an insulating material attached to an opposing surface 220 of the pressure sensor hole 210 of the diaphragm 200 ( 300 and a circuit board unit 400 connected by the semiconductor strain gage and flip chip bonding technology. Except for the parts common to those mentioned in FIG. 2, the following description will focus on the respective features of FIG. 3.

The circuit board part 400 according to FIG. 3 illustrates a circuit board part having a shape 420 in which a portion to which the semiconductor strain gage 300 is attached is etched. In order to configure the circuit board unit 400 to be in close contact with the semiconductor strain gauge, the circuit board unit 400 may be configured to etch the circuit board. By etching the circuit board in this way, the strain gauge can be in close contact with the circuit board, thereby forming a pressure sensor module more stable to external shock. Etching may be performed according to the etching method, and the circuit board may be configured using a multilayer board as well as a double-sided board. Various forms of the circuit board unit 400 according to FIG. 3 are shown in plan view in FIG. 8. According to FIG. 8, the circuit board part may have an 'H' shape (FIG. 8A), a 'ㅏ' shape (FIG. 8B), and a rectangular shape (FIG. 8C). In the case of etching the circuit board part according to FIG. 3. In the example of FIG. 8, the position where the second conductive pad 420 is located is etched. Thus, by etching only in the region where the second conductive pad 420 is located, the diaphragm on which the circuit board 400 and the strain gauge 300 are mounted may be in close contact with each other.

Referring to the case of etching the circuit board according to FIG. 3, as mentioned in FIG. 2, the thickness of the semiconductor strain gage is about 10 to 50 μm, in addition, the thickness of the solder bumper and the first conductivity. The thickness of the pad 310 and the second conductive pad 420 should be considered together, and the first surface of the circuit board 400 may be larger than the width and height of the semiconductor strain gauge 300 attached to the diaphragm 200. 440). 3, the second conductive pad 420 is attached to the etched surface. By using the flip chip bonding method on the circuit board etched according to FIG. 3, the diaphragm 200 and the circuit board part 400 can be configured to be in close contact, which, when not etched, flips from a sudden external impact. There is a risk that the chip bonding portion may be broken, which has the advantage of mitigating such breakage.

Figure 4 shows the form of another pressure sensor module, the pressure sensor module according to Figure 4 is a semiconductor strain gauge attached to the diaphragm 200 and the opposite surface 220 of the pressure sensor hole 210 of the diaphragm ( 300) and the circuit board part 400, which is electrically connected to the semiconductor strain gage, and may be electrically connected to an external board, and protects the diaphragm, the strain gauge and the circuit board part to prevent damage or impact due to external exposure. It consists of a housing (100) which can be protected from and a protective member (230) configured to protect the pressure sensor hole of the diaphragm and to apply external pressure uniformly. The embodiment according to FIG. 4 will also be described with reference to the housing 100 and the protective material 220 which are the features of FIG. 4.

The housing 100 according to FIG. 4 may vary depending on the shape of the diaphragm 200 and the circuit board unit 400. For example, the shape may vary depending on the environment in which the pressure sensor module of the present invention is used, such as a cylindrical or cuboid type. The housing serves to protect the diaphragm 200, the circuit board 400, and the semiconductor strain gauge 300 from the outside, and may be treated to be waterproof depending on the intended use. The material of the housing may use an insulating material to prevent problems caused by external and conductive, and may be configured in the form of applying a non-conductive material to the conductive material, if necessary. The method of joining the housing and the components protected by the housing may be combined using an adhesive or the like, or may be a fitting groove or a screw.

The protective member 230 according to FIG. 4 is located inside the pressure sensor hole 210 of the diaphragm 200. When the pressure applied along the pressure sensor hole is a mechanical pressure, the corresponding mechanical pressure is a part of the pressure sensor hole. The pressure is applied only to the part, and a protective material may be used to prevent the pressure sensitivity of the pressure sensor module from being measured irregularly. By using a protective material, the mechanical external pressure can be evenly distributed to the receiving surface of the pressure sensor hole, and has the advantage of preventing the pressure from leaking to the outside. The protective material is made of a relatively hard material and an insulating material, and the pressure applied to the pressure sensor hole is applied only to a part of the receiving surface of the pressure sensor hole 210 of the diaphragm 200, thereby causing the pressure to be biased. It can prevent more stable pressure reception.

The manufacturing method of the pressure sensor module will be described with reference to FIGS. 5 and 6.

The pressure sensor module manufacturing method according to FIG. 5 includes a first step (S110) and a conductive pad 310 (hereinafter referred to as 'first conductivity') in which the metal diaphragm 200 includes a 'c' shaped pressure sensor hole 210. A second step (S120) of preparing a semiconductor strain gage 300 having a pad type and a third step (S130) of applying an adhesive insulating material to an opposing surface of the pressure sensor hole of the diaphragm (S130) and the third step. On the surface coated with the insulating material in the step, the step 4 attached to the strain gauge prepared in the second step (S140) and the first surface and the second surface opposite to the first surface and the first surface Step 5 of preparing a circuit board having at least one conductive pad (420, hereinafter referred to as a second conductive pad) disposed at a position corresponding to the conductive pad (S150) and a solder bumper on the first conductive pad And flip chip mounting technology Used in, it comprises a first step 6 (S160) to contact welding by the semiconductor-type strain to whether the first conductive pad and the second conductive pads 420 of the circuit board prepared in the above step 5, prepared in the fourth step.

6 relates to a method of manufacturing another pressure sensor module. The manufacturing method of the pressure sensor module according to FIG. 6 includes a first step S210 and a conductive pad 310 to form a metal diaphragm 200 having a 'c' shaped pressure sensor hole 210. A second step (S220) of preparing a semiconductor strain gage 300 having a conductive pad ", and a third step (S230) of applying an adhesive insulating material to an opposite surface of the pressure sensor hole of the diaphragm; On the surface coated with the insulating material in the third step, the fourth step (S240) for attaching the strain gauge prepared in the second step and the first surface and the second surface facing the first surface and the first surface One or more conductive pads 420 (hereinafter referred to as 'second conductive pads') disposed at positions corresponding to the first conductive pads are disposed, and have a first surface and a second surface facing the first surface. The first side is etched toward the second side A fifth step (S250) of preparing a circuit board on which a conductive pad (hereinafter referred to as a “second conductive pad”) disposed at a position corresponding to the first conductive pad is prepared, and a solder bumper is prepared on the first conductive pad. A sixth step of welding and contacting the first conductive pad of the semiconductor strain gauge prepared in the fourth step and the second conductive pad 420 of the circuit board prepared in the fifth step by using a flip chip mounting technique. S260).

The pressure sensor module manufactured according to FIG. 6 may be configured such that the strain gauge and the circuit board are in close contact with each other, so that the pressure sensor module may be more stably coped with from external shocks, and may be miniaturized using flip chip mounting technology.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. The present invention is not limited to the drawings.

1 is a cross-sectional view showing an embodiment of a conventional pressure sensor module.

2 is a cross-sectional view showing an embodiment of a pressure sensor module constructed using a flip chip bonding technique.

3 is a cross-sectional view illustrating an embodiment of a pressure sensor module configured by etching a circuit board together with a flip chip bonding technique.

4 is a cross-sectional view showing an embodiment of the pressure sensor module configured using the housing 100 and the protective material 230.

5 is a flowchart illustrating an example of a pressure sensor module manufacturing method.

6 is a flowchart representing another example of a method of manufacturing a pressure sensor module.

7 is a plan view illustrating an example of a strain gauge.

8 (8A, 8B, 8C) are plan views showing examples of embodiments of the circuit board portion.

-Description of the major reference numerals

100: housing

200: diaphragm

210: pressure sensor hole

220: strain gage attachment surface

230: protective material

300: strain gauge

310: first conductive pad

400: circuit board

410: external input and output pad

420: second conductive pad

440: first page

450: second page

Claims (9)

Pressure sensor module to measure the external pressure, 'C'-shaped diaphragm having a recess for receiving external pressure (hereinafter referred to as a' pressure transfer hole '), A semiconductor strain gauge which is disposed at a position opposite to the pressure transfer hole in the diaphragm and has an electrically conductive pad (hereinafter referred to as a 'first conductive pad') capable of inputting and outputting an electrical signal; One or more conductive pads (hereinafter referred to as 'second conductive pads') having a first surface and a second surface opposed to the first surface, wherein the at least one conductive pad is disposed at a position corresponding to the first conductive pad. A circuit board positioned to electrically connect an input / output signal of the strain gauge, Solder bumps are seated on the first conductive pads of the circuit board part, and the second sensor pads of the first surface are welded to the first conductive pads to electrically connect the circuit boards and the strain gauges. The method according to claim 1, The circuit board unit is a pressure sensor module, characterized in that the flexible PCB (Flexible PCB). The method according to claim 1, The circuit board unit may include one or more external input / output pads (hereinafter referred to as “external input / output pads”) capable of making electrical contact with the first surface or the second surface for electrical connection with an external board on which the pressure sensor module is to be mounted. More pressure sensor module The method of claim 3, The first or second surface of the pressure sensor module, characterized in that it further comprises an amplifier circuit for receiving the output signal of the strain gauge and amplify it The method of claim 3, The circuit board unit is a pressure sensor module, characterized in that the first surface is etched toward the second surface. The method according to claim 1, The pressure sensor module The pressure sensor module further includes a housing for accommodating the diaphragm, the strain gauge, and the circuit board part to protect against external exposure and impact. The method according to claim 6, Pressure sensor module characterized in that the protective material is applied to the pressure transfer hole of the diaphragm in order to reduce the pressure deviation of the pressure sensor hole of the diaphragm. In the manufacturing method of the pressure sensor module using a semiconductor strain gauge, The first step of having the metal diaphragm with a 'c' shaped pressure sensor hole,  A second step of preparing a semiconductor strain gauge 300 having a conductive pad (hereinafter referred to as a 'first conductive pad'), A third step of applying an adhesive insulating material to an opposing surface of the pressure sensor hole of the diaphragm, A fourth step of attaching the strain gauge prepared in the second step to the surface coated with the insulating material in the third step, A circuit having a first surface and a second surface opposed to the first surface and having a conductive pad (hereinafter referred to as a “second conductive pad”) disposed at a position corresponding to the first conductive pad on the first surface. 5 steps to prepare the substrate, A solder bumper is formed on the first conductive pad, and the first conductive pad of the semiconductor strain gauge prepared in the fourth step and the second conductive pad of the circuit board prepared in the fifth step are prepared using flip chip mounting technology. Method of manufacturing a pressure sensor module comprising a sixth step of welding and close In the manufacturing method of the pressure sensor module using a semiconductor strain gauge, The first step of having the metal diaphragm with a 'c' shaped pressure sensor hole,  A second step of preparing a semiconductor strain gauge 300 having a conductive pad (hereinafter referred to as a 'first conductive pad'), A third step of applying an adhesive insulating material to an opposing surface of the pressure sensor hole of the diaphragm, A fourth step of attaching the strain gauge prepared in the second step to the surface coated with the insulating material in the third step, It has a first surface and a second surface opposed to the first surface, the first surface is etched toward the second surface by a portion to accommodate the semiconductor strain gage 300 and corresponds to the first conductive pad A fifth step of preparing a circuit board on which conductive pads (hereinafter referred to as 'second conductive pads') disposed at positions of  The solder bumper is prepared on the first conductive pad, and the first conductive pad of the semiconductor strain gauge prepared in the fourth step and the second conductive pad of the circuit board prepared in the fifth step are prepared using flip chip mounting technology. Method of manufacturing a pressure sensor module comprising a sixth step of welding and close

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