KR20080061132A - Apparatus for forming organic layer - Google Patents

Apparatus for forming organic layer Download PDF

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KR20080061132A
KR20080061132A KR1020060136096A KR20060136096A KR20080061132A KR 20080061132 A KR20080061132 A KR 20080061132A KR 1020060136096 A KR1020060136096 A KR 1020060136096A KR 20060136096 A KR20060136096 A KR 20060136096A KR 20080061132 A KR20080061132 A KR 20080061132A
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shutter unit
unit
substrate
shutter
organic
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KR1020060136096A
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Korean (ko)
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양두석
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엘지디스플레이 주식회사
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Publication of KR20080061132A publication Critical patent/KR20080061132A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

An organic layer depositing apparatus is provided to prevent the droop of a shutter from generating and to control the thickness of an organic layer deposited on a substrate precisely. A deposition source(20) is arranged at the inner bottom surface of a chamber body(10) and receives organic materials. A substrate fixing unit(30) is arranged at the upper side of the chamber body and fixes a substrate. The organic material vaporized from the deposition source is deposited on the substrate. A shutter unit(50) is arranged between the organic materials receiving member and the substrate fixing unit and controls the deposition amount of the organic materials. A rotation shaft assembly(40) rotates the shutter unit and combined with the shutter unit eccentrically. A sag preventing member is formed at the shutter unit and prevents the sag of the shutter unit. THE shutter unit includes a sub shutter unit having the main shutter unit and the sub shutter unit.

Description

유기막 증착 장치{APPARATUS FOR FORMING ORGANIC LAYER}Organic film deposition apparatus {APPARATUS FOR FORMING ORGANIC LAYER}

도 1은 본 발명의 일실시예에 의한 유기막 증착 장치를 도시한 단면도이다.1 is a cross-sectional view showing an organic film deposition apparatus according to an embodiment of the present invention.

도 2는 도 1에 도시된 셔터 유닛의 하나인 메인 셔터 유닛을 도시한 사시도이다.FIG. 2 is a perspective view illustrating a main shutter unit which is one of the shutter units shown in FIG. 1.

도 3은 도 1의 처짐 방지부 부분의 확대도이다.3 is an enlarged view of a sag prevention part of FIG. 1.

도 4는 메인 셔터 유닛의 다른 실시예를 도시한 사시도이다.4 is a perspective view illustrating another embodiment of the main shutter unit.

도 5는 도 1에 도시된 셔터 유닛의 하나인 서브 셔터 유닛을 도시한 사시도이다.FIG. 5 is a perspective view illustrating a sub shutter unit which is one of the shutter units shown in FIG. 1.

본 발명은 유기막 증착 장치에 관한 것이다. 보다 구체적으로, 본 발명은 유기막의 두께를 결정하는 셔터 유닛의 처짐을 방지한 유기막 증착 장치에 관한 것이다.The present invention relates to an organic film deposition apparatus. More specifically, the present invention relates to an organic film deposition apparatus which prevents sagging of a shutter unit that determines the thickness of an organic film.

최근 들어, 방대한 데이터를 처리하는 정보처리장치 및 정보처리장치에서 처리된 정보를 표시하는 표시장치가 개발되고 있다.In recent years, information processing apparatuses for processing massive data and display apparatuses for displaying information processed by the information processing apparatuses have been developed.

대표적인 표시장치로는 액정표시장치, 유기 광 발생 장치 및 플라즈마 표시 패널 등을 들 수 있다.Representative display devices include liquid crystal displays, organic light generating devices, plasma display panels, and the like.

이들 중 액정표시장치는 액정을 이용하여 영상을 표시하고, 유기 광 발생 장치는 복수층의 유기막으로 이루어진 유기 발광층을 이용하여 영상을 표시하고, 플라즈마 표시 장치는 플라즈마를 이용하여 영상을 표시한다.Among them, a liquid crystal display device displays an image using liquid crystal, an organic light generating device displays an image using an organic light emitting layer composed of a plurality of organic layers, and a plasma display device displays an image using plasma.

이들 표시장치들 중 유기 광 발생 장치로부터 광을 발생하는 유기막은 주로 마스크를 사용하지 않기 위해 진공증착법이 사용되고 있다.Among these display devices, a vacuum deposition method is mainly used in order not to use a mask for the organic film that generates light from the organic light generating device.

진공증착법은 진공 챔버의 하부에 증착원과 그 상부에 성막용 기판인 피처리기판을 설치하여 박막을 형성한다.In the vacuum deposition method, a thin film is formed by installing a deposition source at a lower portion of a vacuum chamber and a substrate to be formed as a substrate for film formation thereon.

진공증착법을 이용한 유기막 증착 장치의 개략적인 구성을 살펴보면, 진공챔버에 연결된 진공 배기계를 이용하여 진공 챔버의 내부를 일정한 진공을 유지시킨 다.Looking at the schematic configuration of the organic film deposition apparatus using the vacuum deposition method, a constant vacuum is maintained inside the vacuum chamber by using a vacuum exhaust system connected to the vacuum chamber.

이어서, 진공 챔버의 하부에 배치된 적어도 유기막 소오스가 수납된 증착원으로부터 유기박막재료인 유기물을 증발 온도 이상으로 가열하여 증발시켜 기판에 유기막을 증착한다. 구체적으로, 증착원은 그 내부에 유기물이 수용되는 도가니(crucible)와 도가니의 주변에 감겨져 전기적으로 가열하는 가열장치를 포함하며, 가열장치의 온도가 상승함에 따라 상기 도가니도 함께 가열되어 일정온도가 되면 유기물이 증발되기 시작한다.Subsequently, an organic film, which is an organic thin film material, is heated and evaporated above the evaporation temperature from a deposition source in which at least the organic film source disposed under the vacuum chamber is accommodated to deposit an organic film on a substrate. Specifically, the deposition source includes a crucible (crucible) in which organic matter is contained therein and a heating device wound around the crucible and electrically heating the crucible, and as the temperature of the heating device rises, the crucible is also heated together with a predetermined temperature. Organics begin to evaporate.

도가니로부터 증발된 유기물은 상기 기판으로 이동되어 흡착, 증착, 재 증발 등의 연속적 과정을 거쳐 기판 위에 고체화되어 얇은 박막을 형성한다.The organic material evaporated from the crucible is transferred to the substrate and solidified on the substrate through a continuous process of adsorption, vapor deposition, and re-evaporation to form a thin film.

한편, 기판 위에 형성된 유기막의 두께를 조절하기 위해서 진공 챔버의 기판 및 증착원 사이에는 회전축에 연결된 셔터가 배치된다. 회전축의 회전에 의하여 셔터가 개방/폐쇠 됨에 따라 증착원으로부터 증발된 유기물이 기판에 부착되는 양이 변경되어 유기막의 두께를 조절할 수 있다.Meanwhile, in order to control the thickness of the organic film formed on the substrate, a shutter connected to the rotating shaft is disposed between the substrate and the deposition source of the vacuum chamber. As the shutter is opened / closed by the rotation of the rotating shaft, the amount of the organic material evaporated from the deposition source is attached to the substrate to change the thickness of the organic film.

그러나, 종래 유기막 증착 장치에서 셔터를 회전시키는 회전축은 셔터의 일측에 편심된 상태로 배치되기 때문에 회전축에 결합된 셔터 중 회전축으로부터 멀리 떨어진 셔터의 단부는 모멘트에 의하여 휨이 발생되고, 휨이 발생된 셔터로는 유기물의 증착량을 정밀하게 제어할 수 없는 문제점을 갖는다.However, in the conventional organic film deposition apparatus, since the rotating shaft for rotating the shutter is disposed eccentrically on one side of the shutter, the end of the shutter farther from the rotating shaft among the shutters coupled to the rotating shaft is warped by a moment, and warping occurs. The shutter has a problem that the deposition amount of the organic matter cannot be precisely controlled.

본 발명의 하나의 목적은 셔터의 처짐을 방지하여 기판에 증착되는 유기막의 두께를 정밀하게 제어할 수 있는 유기막 증착 장치를 제공한다.One object of the present invention is to provide an organic film deposition apparatus capable of precisely controlling the thickness of the organic film deposited on the substrate by preventing sagging of the shutter.

이와 같은 본 발명의 하나의 목적을 구현하기 위한 유기막 증착 장치는 챔버 몸체. 상기 챔버 몸체의 내측 바닥면에 배치되며 유기물을 수납하는 증착원, 상기 챔버 몸체의 상측에 배치되며 상기 증착원으로부터 증발된 상기 유기물이 증착되는 기판을 고정하는 기판 고정 유닛, 상기 유기물 수납부재 및 상기 기판 고정 유닛의 사이에 배치되어 상기 기판에 증착되는 상기 유기물의 증착량을 조절하기 위한 셔터 유닛 및 상기 셔터 유닛을 회전시키는 회전축 어셈블리를 포함하며, 셔터 유닛에는 상기 셔터 유닛의 처짐을 방지하는 처짐 방지부가 형성된 유기막 증착 장치를 포함한다.Such an organic film deposition apparatus for implementing one object of the present invention is a chamber body. A deposition source disposed on an inner bottom surface of the chamber body and containing an organic material, a substrate fixing unit disposed on an upper side of the chamber body and fixing a substrate on which the organic material evaporated from the deposition source is deposited, the organic material receiving member, and the A shutter unit for adjusting the deposition amount of the organic material deposited on the substrate and disposed between the substrate fixing units, and a rotating shaft assembly for rotating the shutter unit, wherein the shutter unit prevents sag to prevent sagging of the shutter unit. And additionally formed organic film deposition apparatus.

이하, 첨부된 도면들을 참조하여 본 발명의 실시예들에 따른 유기막 증착 장 치에 대하여 상세하게 설명하지만, 본 발명이 하기의 실시예들에 제한되는 것은 아니며, 해당 분야에서 통상의 지식을 가진 자라면 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 본 발명을 다양한 다른 형태로 구현할 수 있을 것이다.Hereinafter, an organic film deposition apparatus according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments, and has ordinary skill in the art. It will be apparent to those skilled in the art that the present invention may be embodied in various other forms without departing from the spirit of the invention.

도 1은 본 발명의 일실시예에 의한 유기막 증착 장치를 도시한 단면도이다.1 is a cross-sectional view showing an organic film deposition apparatus according to an embodiment of the present invention.

도 1을 참조하면, 유기막 증착 장치(100)는 챔버 몸체(10), 증착원(20), 기판 고정 유닛(30), 회전축 어셈블리(40) 및 셔터 유닛(50)을 포함한다.Referring to FIG. 1, the organic film deposition apparatus 100 includes a chamber body 10, a deposition source 20, a substrate fixing unit 30, a rotating shaft assembly 40, and a shutter unit 50.

챔버 몸체(10)는 기판(1)에 불순물이 포함되지 않은 유기막(2)을 형성하기에 적합한 공정 환경을 제공한다. 본 실시예에서, 챔버 몸체(10)는 돔 형상, 육면체 플레이트 형상 등 다양한 형상으로 형성될 수 있다.The chamber body 10 provides a process environment suitable for forming the organic film 2 containing no impurities in the substrate 1. In the present embodiment, the chamber body 10 may be formed in various shapes such as a dome shape, a hexahedral plate shape, and the like.

챔버 몸체(10)는 진공 펌프(15)를 더 포함할 수 있다. 진공 펌프(15)는 챔버 몸체(10)와 연결된 배관(12) 상에 연결되어 챔버 몸체(10) 내부를 초 진공압 상태로 만든다.The chamber body 10 may further comprise a vacuum pump 15. The vacuum pump 15 is connected on the pipe 12 connected to the chamber body 10 to make the inside of the chamber body 10 in an ultra vacuum state.

증착원(20)은 챔버 몸체(10)의 바닥에 배치될 수 있다. 증착원(20)은 기판(1) 상에 증착되는 유기막을 이루는 유기물이 수납된다.The deposition source 20 may be disposed at the bottom of the chamber body 10. The deposition source 20 contains organic materials constituting the organic film deposited on the substrate 1.

본 실시예에서, 증착원(20)에는 홀 수송층, 홀 주입층, 유기 발광층, 전자 수송층 및 전자 주입층을 형성하기 적합한 유기물들이 수납될 수 있다.In the present embodiment, the deposition source 20 may contain organic materials suitable for forming the hole transport layer, the hole injection layer, the organic light emitting layer, the electron transport layer, and the electron injection layer.

증착원(20)은 가열 유닛(미도시)을 더 포함할 수 있다. 가열 유닛은 증착원에 수납된 유기물이 증발 또는 승화되기에 적합한 온도로 가열한다.The deposition source 20 may further include a heating unit (not shown). The heating unit heats the organic matter contained in the deposition source to a temperature suitable for evaporation or sublimation.

기판 고정 유닛(30)은 챔버 몸체(10)의 상부에 배치된다. 기판 고정 유닛(30)은 증착원(20)으로부터 증발된 유기물이 부착되도록 증착원(20)과 마주하는 곳에 기판(1)을 고정한다. 기판 고정 유닛(30)은 기판(1)을 진공압에 의하여 고정하거나 기판(1)을 정전기 등을 이용하여 고정할 수 있다. 이외에도 다양한 방법에 의하여 기판 고정 유닛(30)은 기판(1)을 고정할 수 있다.The substrate fixing unit 30 is disposed above the chamber body 10. The substrate fixing unit 30 fixes the substrate 1 in a position facing the deposition source 20 so that the organic material evaporated from the deposition source 20 is attached. The substrate fixing unit 30 may fix the substrate 1 by vacuum pressure or fix the substrate 1 using static electricity or the like. In addition, the substrate fixing unit 30 may fix the substrate 1 by various methods.

회전축 어셈블리(40)는 제1 회전축(42) 및 제2 회전축(44)을 포함한다. 본 실시예에서, 제1 회전축(42)은 내경을 갖는 중공축일 수 있고, 제2 회전축(44)은 제1 회전축(42)의 내부에 배치된다.The rotary shaft assembly 40 includes a first rotary shaft 42 and a second rotary shaft 44. In this embodiment, the first rotation shaft 42 may be a hollow shaft having an inner diameter, and the second rotation shaft 44 is disposed inside the first rotation shaft 42.

본 실시예에서, 제1 회전축(42) 및 제2 회전축(44)은 서로 다른 회전 유닛(46)에 결합 될 수 있고, 제1 회전축(42)의 내부에 배치된 제2 회전축(44)은 제1 회전축(42)의 단부로부터 소정 길이 돌출된다.In the present embodiment, the first rotary shaft 42 and the second rotary shaft 44 may be coupled to different rotary units 46, and the second rotary shaft 44 disposed inside the first rotary shaft 42 may be A predetermined length protrudes from an end portion of the first rotation shaft 42.

도 2는 도 1에 도시된 셔터 유닛의 하나인 메인 셔터 유닛을 도시한 사시도이다. 도 3은 도 1의 처짐 방지부 부분의 확대도이다.FIG. 2 is a perspective view illustrating a main shutter unit which is one of the shutter units shown in FIG. 1. 3 is an enlarged view of a sag prevention part of FIG. 1.

도 2 및 도 3을 참조하면, 셔터 유닛(50)은 메인 셔터 유닛(56) 및 서브 셔터 유닛(58)를 포함한다.2 and 3, the shutter unit 50 includes a main shutter unit 56 and a sub shutter unit 58.

메인 셔터 유닛(56)은, 평면상에서 보았을 때, 초승달 형상을 갖는 메인 셔터 판(54) 및 메인 셔터 판(54) 상에 결합 되어 메인 셔터 판(54)을 지지하는 프레임(53)을 포함한다. 본 실시예에서, 메인 셔터 판(54)은 제1 면적을 갖는다.The main shutter unit 56 includes a main shutter plate 54 having a crescent shape when viewed in plan view, and a frame 53 coupled to the main shutter plate 54 to support the main shutter plate 54. . In the present embodiment, the main shutter plate 54 has a first area.

프레임(53)의 단부에는 제2 회전축(44)이 통과하는 제1 결합공(51) 및 회전축 어셈블리(40)의 제1 회전축(42)과 결합 되는 부싱(bushing;52) 및 프레임(53)의 처짐을 방지하는 처짐 방지부(55)를 포함한다.Bushing 52 and frame 53 coupled to the first coupling hole 51 through which the second rotary shaft 44 passes and the first rotary shaft 42 of the rotary shaft assembly 40 at the end of the frame 53. It includes a sag prevention portion 55 to prevent sagging.

처짐 방지부(55)는 부싱(52)의 표면으로부터 연장되어 프레임(53)의 에지를 따라 배치되어 프레임(53)이 처지는 것을 방지한다.The deflection prevention portion 55 extends from the surface of the bushing 52 and is disposed along the edge of the frame 53 to prevent the frame 53 from sagging.

본 실시예에서, 처짐 방지부(55)를 갖는 메인 셔터 유닛(52)의 프레임(53)은, 평면상에서 보았을 때, L자 형상으로 형성되는 것이 바람직하며, L 자 형상으로 처짐 방지부(55)를 형성함으로써 메인 셔터 판(54)의 처짐을 다시 방지할 수 있다.In the present embodiment, the frame 53 of the main shutter unit 52 having the deflection preventing portion 55 is preferably formed in an L shape when viewed in a plan view, and the deflection preventing portion 55 is formed in an L shape. ), The deflection of the main shutter plate 54 can be prevented again.

도 4는 메인 셔터 유닛의 다른 실시예를 도시한 사시도이다.4 is a perspective view illustrating another embodiment of the main shutter unit.

도 4를 참조하면, 메인 셔터 유닛(56)의 처짐을 방지하기 위하여, 평면상에서 보았을 때, L자 형상을 갖는 프레임(53)의 측면은 메인 셔터 유닛(56)의 처짐을 방지하기 위해 약 90°절곡하여 처짐 방지부(55a)를 형성 할 수 있다. 본 실시예에서, 프레임(53)의 절곡 각도는 90°보다 작게 형성되어도 무방하다.Referring to FIG. 4, in order to prevent sagging of the main shutter unit 56, when viewed in plan view, the side of the frame 53 having an L shape is about 90 to prevent sagging of the main shutter unit 56. It may be bent to form a deflection prevention portion 55a. In the present embodiment, the bending angle of the frame 53 may be formed smaller than 90 degrees.

도 5는 도 1에 도시된 셔터 유닛의 하나인 서브 셔터 유닛을 도시한 사시도이다.FIG. 5 is a perspective view illustrating a sub shutter unit which is one of the shutter units shown in FIG. 1.

도 5를 참조하면, 서브 셔터 유닛(58)은 초승달 형상을 갖는 메인 셔터 유닛(56)과 오버랩되고, 이로 인해 서브 셔터 유닛(58) 및 메인 셔터 유닛(56)은, 평면상에서 보았을 때, 원판 형상을 갖게 된다.Referring to FIG. 5, the sub shutter unit 58 overlaps the main shutter unit 56 having a crescent shape, whereby the sub shutter unit 58 and the main shutter unit 56 are viewed in plan view. It has a shape.

서브 셔터 유닛(58)은 제2 회전축(44)과 결합되는 제2 결합공(59a)을 갖는고, 서브 셔터 유닛(58)은 제2 회전축(44)에 의하여 회전된다. 서브 셔터 유닛(58)은 유기물이 제2 회전축(44) 부분에 증착되는 것을 방지하는 쉴드부(59)를 포함한다. 본 실시예에서, 서브 셔터 유닛(58)은 메인 셔터 유닛(56)의 제1 면적보다 작은 제2 면적을 갖는다.The sub shutter unit 58 has a second coupling hole 59a engaged with the second rotation shaft 44, and the sub shutter unit 58 is rotated by the second rotation shaft 44. The sub shutter unit 58 includes a shield portion 59 that prevents organic matter from being deposited on the second rotation shaft 44. In the present embodiment, the sub shutter unit 58 has a second area smaller than the first area of the main shutter unit 56.

본 실시예에서, 메인 셔터 유닛(56) 및 서브 셔터 유닛(58)은 서로 다른 높이로 배치되고, 서브 셔터 유닛(58)이 메인 셔터 유닛(56)과 오버랩되도록 회전됨으로써 메인 셔터 유닛(56) 및 서브 셔터 유닛(56)의 사이에는 개구가 형성되고, 서브 셔터 유닛(56)의 회전 각도에 대응하여 개구 면적이 변경됨으로써 기판(1)에 형성되는 유기막(2)의 두께를 정밀하게 제어할 수 있다.In the present embodiment, the main shutter unit 56 and the sub shutter unit 58 are arranged at different heights, and the main shutter unit 56 is rotated so that the sub shutter unit 58 overlaps with the main shutter unit 56. And an opening is formed between the sub shutter units 56, and the opening area is changed corresponding to the rotation angle of the sub shutter unit 56 to precisely control the thickness of the organic film 2 formed on the substrate 1. can do.

이상에서 상세하게 설명한 바에 의하면, 회전축에 결합되어 증발된 유기물의 증착량을 조절하는 메인 셔터 유닛 및 서브 셔터 유닛에 편심 결합된 회전축에 의하여 메인 셔터 유닛 및 서브 셔터 유닛의 처짐을 방지하여 유기막의 품질을 보다 향상시키는 효과를 갖는다.As described in detail above, the quality of the organic film is prevented by sagging of the main shutter unit and the sub-shutter unit by the rotational shaft eccentrically coupled to the main shutter unit and the sub-shutter unit which adjusts the deposition amount of the organic matter vaporized by the rotational axis. It has the effect of further improving.

앞서 설명한 본 발명의 상세한 설명에서는 본 발명의 실시예들을 참조하여 설명하였지만, 해당 기술분야의 숙련된 당업자 또는 해당 기술분야에 통상의 지식을 갖는 자라면 후술될 특허청구범위에 기재된 본 발명의 사상 및 기술 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.Although the detailed description of the present invention has been described with reference to the embodiments of the present invention, those skilled in the art or those skilled in the art will have the spirit and scope of the present invention as set forth in the claims below. It will be appreciated that various modifications and variations can be made in the present invention without departing from the scope of the art.

Claims (6)

챔버 몸체;Chamber body; 상기 챔버 몸체의 내측 바닥면에 배치되며 유기물을 수납하는 증착원;A deposition source disposed on an inner bottom surface of the chamber body and containing an organic material; 상기 챔버 몸체의 상측에 배치되며 상기 증착원으로부터 증발된 상기 유기물이 증착되는 기판을 고정하는 기판 고정 유닛;A substrate fixing unit disposed on an upper side of the chamber body and fixing a substrate on which the organic material evaporated from the deposition source is deposited; 상기 유기물 수납부재 및 상기 기판 고정 유닛의 사이에 배치되어 상기 기판에 증착되는 상기 유기물의 증착량을 조절하기 위한 셔터 유닛; 및A shutter unit disposed between the organic material receiving member and the substrate fixing unit to adjust a deposition amount of the organic material deposited on the substrate; And 상기 셔터 유닛을 회전시키며 상기 셔터 유닛과 편심 결합된 회전축 어셈블리를 포함하며,A rotating shaft assembly rotating the shutter unit and eccentrically coupled to the shutter unit, 상기 셔터 유닛에는 상기 셔터 유닛의 처짐을 방지하는 처짐 방지부가 형성된 유기막 증착 장치.The shutter unit is provided with a deflection preventing unit for preventing the deflection of the shutter unit. 제1항에 있어서, 상기 서텨 유닛은 제1 면적을 갖고 상기 회전축 어셈블리의 중공축과 결합되는 제1 결합공을 갖는 메인 셔터 유닛 및 상기 회전축 어셈블리의 중공축 내부에 배치된 회전축과 결합되는 제2 결합공을 갖고 상기 제1 면적보다 작은 제2 면적을 갖는 서브 셔터 유닛을 포함하는 것을 특징으로 하는 유기막 증착 장치.The second shutter unit of claim 1, wherein the surrender unit has a first area and a main shutter unit having a first coupling hole coupled to the hollow shaft of the rotating shaft assembly, and a second rotating shaft disposed inside the hollow shaft of the rotating shaft assembly. And a sub shutter unit having a joining hole and having a second area smaller than the first area. 제2항에 있어서, 상기 메인 셔터 유닛은 셔터판 및 셔터판에 부착된 L 자형 프레임을 포함하는 것을 특징으로 하는 유기막 증착 장치.The organic film deposition apparatus of claim 2, wherein the main shutter unit comprises a shutter plate and an L-shaped frame attached to the shutter plate. 제3항에 있어서, 상기 처짐 방지부는 상기 제1 결합공으로부터 돌출되며 상기 회전축에 끼워지는 부싱 및 상기 부싱으로부터 상기 L자형 프레임으로 연장된 처짐 방지편을 포함하는 것을 특징으로 하는 유기막 증착 장치.The organic film deposition apparatus of claim 3, wherein the deflection prevention part includes a bushing protruding from the first coupling hole and fitted into the rotation shaft, and a deflection prevention piece extending from the bushing to the L-shaped frame. 제2항에 있어서, 상기 서브 셔터 유닛은 상기 제2 결합공 주변에 형성되어 유기물이 증착되는 것을 방지하는 쉴드를 포함하는 것을 특징으로 하는 유기막 증착 장치.The organic film deposition apparatus of claim 2, wherein the sub shutter unit includes a shield formed around the second coupling hole to prevent organic material from being deposited. 제3 항에 있어서, 상기 L자형 프레임의 측면은 상기 메인 셔터 유닛의 처짐을 방지하기 위해 절곡된 것을 특징으로 하는 유기막 증착 장치.The organic film deposition apparatus of claim 3, wherein a side surface of the L-shaped frame is bent to prevent sagging of the main shutter unit.
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