KR20080003329U - A jig for memory-module test - Google Patents

A jig for memory-module test

Info

Publication number
KR20080003329U
KR20080003329U KR20-2008-0007783U KR20080007783U KR20080003329U KR 20080003329 U KR20080003329 U KR 20080003329U KR 20080007783 U KR20080007783 U KR 20080007783U KR 20080003329 U KR20080003329 U KR 20080003329U
Authority
KR
South Korea
Prior art keywords
jig
memory
module test
test
module
Prior art date
Application number
KR20-2008-0007783U
Other languages
Korean (ko)
Other versions
KR200444336Y1 (en
Inventor
류상지
채근영
Original Assignee
에이에스피 반도체(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이에스피 반도체(주) filed Critical 에이에스피 반도체(주)
Priority to KR2020080007783U priority Critical patent/KR200444336Y1/en
Publication of KR20080003329U publication Critical patent/KR20080003329U/en
Application granted granted Critical
Publication of KR200444336Y1 publication Critical patent/KR200444336Y1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR2020080007783U 2008-06-11 2008-06-11 A jig for memory-module test KR200444336Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020080007783U KR200444336Y1 (en) 2008-06-11 2008-06-11 A jig for memory-module test

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2020080007783U KR200444336Y1 (en) 2008-06-11 2008-06-11 A jig for memory-module test

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020060115105A Division KR20080045877A (en) 2006-11-21 2006-11-21 A jig for memory-module test

Publications (2)

Publication Number Publication Date
KR20080003329U true KR20080003329U (en) 2008-08-13
KR200444336Y1 KR200444336Y1 (en) 2009-05-07

Family

ID=41325644

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2020080007783U KR200444336Y1 (en) 2008-06-11 2008-06-11 A jig for memory-module test

Country Status (1)

Country Link
KR (1) KR200444336Y1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110036337A (en) * 2009-10-01 2011-04-07 (주)씨앤씨테크 Jig for memory module of notebook computer
KR101029122B1 (en) 2009-10-08 2011-04-13 (주)씨앤씨테크 Jig for memory module test
KR200460742Y1 (en) 2010-03-12 2012-06-08 (주)마이크로컨텍솔루션 Test board assembly structure of memory module test socket
KR101532758B1 (en) * 2013-11-07 2015-07-02 주식회사 오킨스전자 Latch and the socket for semiconductor package comprising the same
KR102048448B1 (en) * 2018-09-18 2019-11-25 주식회사 마이크로컨텍솔루션 Zig apparatus

Also Published As

Publication number Publication date
KR200444336Y1 (en) 2009-05-07

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