KR20070076326A - Hinge apparatus and semiconductor manufacturing equipment having the same - Google Patents

Abstract

A hinge apparatus is provided to induce a lid to move down even when the lid is temporarily lifted up by the inner pressure difference of a chamber by making a turning member and a connection axis coupled to the turning member move vertically by a predetermined interval while the turning member and the connection axis are inserted into a connection hole of a fixing member. A fixing member(130) is composed of first and second bodies that are separated from each other by a predetermined interval. A turning member(110) is interposed between the first and the second bodies. The fixing member is connected to the turning member by a connection axis(150) that continuously penetrates the fixing member and the turning member. A bearing is interposed between the outer circumferential surface of the connection axis and the inner circumferential surface of the turning member into which the connection axis is inserted so that the turning member can turn with respect to the connection axis. The turning angle of the turning member having turned with respect to the connection axis is maintained by a rotation angle maintaining unit. Connection holes are formed in the first and the second bodies so that one and the other ends of the connection axis are inserted into the connection holes. The connection hole has greater thickness and height than those of the connection axis so that the connection axis can move vertically by a predetermined interval while the connection axis is inserted into the first and the second bodies.

Description

Hinge apparatus and semiconductor manufacturing equipment having the same

1 is a perspective view showing an embodiment of a semiconductor manufacturing apparatus according to the present invention.

FIG. 2 is an exploded perspective view showing the hinge device of the semiconductor manufacturing equipment shown in FIG.

3 is a partial cutaway cross-sectional view of the hinge device shown in FIG.

4 is a rear perspective view for explaining the coupling relationship of the hinge device shown in FIG.

** Description of the symbols for the main parts of the drawings **

80: lead

90: chamber

100: hinge device

110: rotating member

130: fixing member

150: connecting shaft

160: rotation angle maintenance unit

190: semiconductor manufacturing equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for manufacturing a semiconductor device. More particularly, the present invention relates to a hinge device and a semiconductor manufacturing device having the same.

The semiconductor device manufacturing process includes a plurality of unit processes such as a photo process, a thin film deposition process, an ion implantation process, and an etching process.

In addition, most of these processes proceed at a pressure different from atmospheric pressure for various purposes, such as to cause a specific reaction to occur or to prevent particles from being introduced.

In particular, in the case of the thin film deposition process, most of the processes are performed at a pressure lower than atmospheric pressure, that is, at a low pressure. For example, in the case of the BPSG (BoroPhospho Silicate Glass) process, which is one of the thin film deposition processes, the process is performed at a pressure of about 150 to 50 Torr.

On the other hand, in the case of the thin film deposition equipment performing the thin film deposition process is installed so that such a low pressure state is well maintained during the process. For example, in the case of the conventional thin film deposition equipment, an O-ring or the like is installed between the chamber in which the process is performed and the lid coupled to the chamber via a hinge device to selectively open and close the chamber. It is designed to maintain the low pressure state well in progress.

However, in the case of the conventional thin film deposition equipment, no problem occurs within the pressure change value of about 150 to 50 Torr as described above, but when there is a difference over the pressure change value, various problems occur due to the internal pressure difference. do.

For example, in the case of the High Temperature-Undoped Silicate Glass (HT-USG) process, which is one of the thin film deposition processes, the pressure change value is about 600 to 5 Torr. When proceeding, the lead of the conventional thin film deposition equipment is instantaneously heard by the internal pressure difference of the chamber. In the case of the hinge device which makes the lead of the conventional thin film deposition equipment rotatable, the hinge function is destroyed by this instantaneous sound. A problem arises in which part of the lid is down to the chamber side. Therefore, in the case of the conventional thin film deposition equipment, there is a problem that the gas outside the chamber is introduced into the chamber due to the problem that a part of this lead is not down to the chamber side, which leads to the generation of powder and particles in the chamber As a result, a quality loss is caused.

Accordingly, the present invention has been made in view of the above problems, and the technical problem to be achieved by the present invention is a hinge device in which the hinge function is not destroyed even when a phenomenon in which a lead is momentarily heard by an internal differential pressure of a chamber occurs. And to provide a semiconductor manufacturing equipment having the same.

In addition, another technical problem to be achieved by the present invention is to provide a hinge device and a semiconductor manufacturing apparatus having the same so that the lead can be down again even when a phenomenon in which the lead is temporarily lifted by the internal differential pressure of the chamber occurs. .

According to the first aspect of the present invention for implementing such a technical problem, a hinge device is provided. The hinge device includes a fixing member comprising a first body and a second body spaced apart from each other by a predetermined distance, a rotating member interposed between the first body and the second body, and the fixing member and the rotating member continuously. A bearing for penetrating the connecting member and the rotating member and interposed between an outer circumferential surface of the connecting shaft and an inner circumferential surface of the rotating member in which the connecting shaft is fitted; And a rotation angle maintaining unit for maintaining a rotation angle of the rotation member rotated from the connecting shaft.

At this time, the rotation angle maintaining unit is a fitting hole extending from one side of the first body facing the rotating member to the other side of the first body, and a portion of the first body through the fitting hole An anti-rotation pin protruding a predetermined length to the other side, an elastic spring for elastically supporting the anti-rotation pin to move the anti-rotation pin to the rotating member, and one end of the anti-rotation pin moved by the elastic spring. It may include a locking hole formed in one side of the rotating member to be fitted.

In addition, a connection hole may be formed in the first body and the second body so that one end and the other end of the connection shaft are fitted. In this case, the connecting hole may be formed larger than the thickness and height of the connecting shaft so that the connecting shaft can flow up and down a predetermined distance in the state fitted to the first body and the second body.

On the other hand, according to the second aspect of the present invention for implementing the above technical problem, a semiconductor manufacturing apparatus is provided. The semiconductor manufacturing apparatus includes a chamber in which a process is performed, a lid rotated at a predetermined angle from the chamber to open and close one side of the chamber, and a hinge device to pivot the lead from the chamber, wherein the hinge device is mutually predetermined. A fixed member configured to be spaced apart from the first body and the second body and coupled to the chamber, interposed between the first body and the second body, and a rotation member coupled to the lead; A pivot connected between the fixed member and the pivot member through the pivot member continuously and interposed between an outer circumferential surface of the link shaft and an inner circumferential surface of the pivot member in which the link shaft is fitted to pivot the pivot member from the link shaft. And a rotation angle maintaining unit for maintaining a rotation angle of the pivot member pivoted from the connecting shaft. It is.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the scope of the invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

1 is a perspective view showing an embodiment of a semiconductor manufacturing equipment according to the present invention, Figure 2 is an exploded perspective view showing a hinge device of the semiconductor manufacturing equipment shown in Figure 1, Figure 3 is a hinge shown in FIG. Sectional section view of the device. 4 is a rear perspective view for explaining a coupling relationship of the hinge device shown in FIG.

First, referring to FIG. 1, a semiconductor manufacturing apparatus 190 according to an embodiment of the present invention is rotated a predetermined angle from a chamber 90 where a process is performed and the chamber 90, and an upper side of the chamber 90. A lid 80 for opening and closing the lid, a hinge device 100 for rotating the lid 80 from the chamber 90, and a gas supply device for supplying a process gas into the chamber 90. And a vacuum holding device (not shown) for changing and maintaining the inside of the chamber 90 at a pressure required for process progress.

Specifically, the chamber 90 is a space where a predetermined process is performed on a wafer (not shown). Accordingly, a gate door (not shown) is formed at one side of the chamber 90 to allow the wafer to pass in and out of the chamber 90, and a wafer transferred through the gate door in the chamber 90. A wafer chuck (not shown) is provided to allow the to be seated. In addition, an opening (not shown) of a predetermined size is provided in an upper portion of the chamber 90. Accordingly, cleaning in the chamber 90 or preventive maintenance in the chamber 90 may be performed through the opening.

The lid 80 opens and closes the opening provided in the upper portion of the chamber 90. Therefore, when the process proceeds, the lid 80 seals the opening, and when the cleaning or preventive maintenance is performed in the chamber 90, the opening is opened. In this case, a sealing ring (not shown) such as an O-ring may be installed around a portion where the lid 80 contacts the chamber 90, that is, around the opening of the chamber 90 that contacts the lid 80. . In this case, since the sealing between the lid 80 and the chamber 90 is made more robust due to the sealing ring, the vacuum holding device can maintain the pressure inside the chamber 90 better. .

On the other hand, the hinge device 100 is a fixing member 130 composed of the first body 131 and the second body 132 spaced apart from each other by a predetermined interval, the first body 131 and the second body 132 ) Between the rotating member 110, the connecting shaft 150 for connecting the fixing member 130 and the rotating member 110, and the connecting shaft 150 and the rotating member 110 Interposed between the bearing 180 to rotate the rotating member 110 from the connecting shaft 150 and to maintain the rotation angle of the rotating member 110 rotated from the connecting shaft 150 Rotation angle holding unit 160 is included.

In more detail, the fixing member 130 is coupled to one side of the chamber 90 by the fixing bolt 135 or the like, around the opening formed in the upper portion of the chamber 90. That is, the fixing member 130 is composed of the first body 131 and the second body 132, the first body 131 and the second body 132 are spaced apart from each other by a predetermined interval Is coupled to the top of the chamber 90. In addition, connection holes 137 are formed in the first body 131 and the second body 132 such that one end and the other end of the connection shaft 150 are fitted. Therefore, the connecting shaft 150 is inserted through the connecting holes 137 to connect the fixing member 130 and the rotation member 110 to each other. In this case, the connection hole 137 is formed larger than the thickness and height of the connection shaft 150. Therefore, the connecting shaft 150 inserted into the bodies 131 and 132 through the connecting holes 137 may flow up and down a predetermined distance in a state of being fitted into the first body 131 and the second body 132. do. In addition, the longitudinal cross section of the connecting shaft 150 and the longitudinal cross section of the connecting hole 137 into which the connecting shaft 150 is fitted are formed in a rectangular shape having a long length in the vertical direction or the like. Accordingly, a rotational motion is not generated between the connecting shaft 150 and the bodies 131 and 132 to which the connecting shaft 150 is fitted, but only the mutual flow as described above.

In addition, the coupling holes 150 may be coupled to the bodies 131 and 132 on the rear surfaces of the first body 131 and the second body 132, respectively. 139) is formed. Therefore, the connection shaft 150 fitted into the connection hole 137 is coupled to the bodies 131 and 132 by a fixing bolt 133 inserted into the coupling hole 139. In this case, the coupling hole 139 is formed in a rectangular shape or a similar shape having a long length in the vertical direction, such as the longitudinal section of the connection hole 137. Therefore, the fixing bolt 133 or the like that couples the connecting shaft 150 to the bodies 131 and 132 when the connecting shaft 150 flows up and down along the connecting hole 137 is also connected to the connecting shaft 150. ) Up and down a predetermined distance.

The rotation member 110 is coupled to the lead 80 by a fixing bolt 113 or the like while being interposed between the first body 131 and the second body 132 of the fixing member 130. Therefore, the lid 80 is rotatable by the rotation member 110 at a predetermined angle from the chamber 90.

The connecting shaft 150 continuously penetrates the fixing member 130 and the rotating member 110 including the first body 131 and the second body 132 and the rotating member 110 and the rotating member. Connect 110. At this time, the end surface of the connecting shaft 150 is formed to be different from the portion fitted to the fixing member 130 and the portion fitted to the rotation member 110. In one embodiment, the longitudinal cross-sectional shape of the connecting shaft 150 to be fitted to the fixing member 130 is formed in a rectangular shape or a similar shape long in the vertical direction as described above. In addition, the longitudinal cross-sectional shape of the connection shaft 150 fitted to the pivot member 110 is formed in a circular shape. In addition, a fastening hole 155 is formed at both ends of the connection shaft 150, that is, at the rear surface of the connection shaft 150 fitted to the bodies 131 and 132 to fasten the fixing bolt 133 described above. . Therefore, the above-mentioned fixing bolt 133 is coupled to the coupling hole 155 of the connecting shaft 150 through the coupling hole 139 to couple the connecting shaft 150 to the bodies 131 and 132. do.

As described above, the bearing 180 serves to rotate the pivot member 110 from the connecting shaft 150. Therefore, the bearing 180 is interposed between the outer circumferential surface of the connecting shaft 150 and the inner circumferential surface of the pivot member 110 to which the connecting shaft 150 is fitted. In this case, at least two bearings 180 may be interposed inside the rotating member 110 to facilitate the rotation of the rotating member 110. In one embodiment, the bearing 180 may be interposed on one side and the other side of the rotating member 110, respectively.

The rotation angle maintaining unit 160 is a fitting hole 134 extending from one side of the first body 131 facing the rotating member 110 to the other side of the first body 131, and the The anti-rotation pin 162 and a part of the anti-rotation pin 162 protruding a predetermined length to the other side surface of the first body 131 through the fitting hole 134, and moves the anti-rotation pin 162 toward the rotation member 110 side. One of the rotating member 110 so that one end of the elastic spring 164 to elastically support the anti-rotation pin 162 and one end of the anti-rotation pin 162 moved by the elastic spring 164 is fitted. It includes a locking hole 169 formed on the side.

Specifically, the fitting hole 134 is not formed with the same diameter as a whole, but is formed on one side of the first body 131 facing the pivot member 110 and the other side of the first body 131. They are formed differently. In one embodiment, the fitting hole 134 has one side surface of the first body 131 is formed larger than the other side surface of the first body 131. Therefore, the above-described elastic spring 164 elastically supports the anti-rotation pin 162 using a portion having a smaller diameter as a supporting point.

The anti-rotation pin 162 may be detachably coupled to one end of the rod-type body 161 fitted to the fitting hole 134 and one end of the body 161, but somewhat larger than the diameter of the fitting hole 134. Cap (163) formed in the size, and is formed integrally with the other end side of the body 161 is composed of a spring support 165 formed to a size smaller than the diameter of the fitting hole 134. Therefore, the anti-rotation pin 162 is fitted in the direction of the other side of the fitting hole 134 from one side of the fitting hole 134 in a state where the cap 163 is separated, and after the cap 163 is to be combined.

The elastic spring 164 is implemented as a coil spring that is fitted to the body 161 of the anti-rotation pin 162. Therefore, when the anti-rotation pin 162 is fitted into the fitting hole 134, the elastic spring 164 is fitted into the fitting hole 134 while being fitted to the body 161 of the anti-rotation pin 162. You lose.

The locking hole 169 is formed on one side of the pivot member 110 opposite to the first body 131, and is formed in plural numbers. Specifically, the position where the locking hole 169 is formed is a portion facing the fitting hole 134 when the rotation member 110 is rotated by about 45 ° and 90 ° with respect to the first body 131. Is preferred. Therefore, the anti-rotation pin 162 is the fitting hole by the elastic support of the elastic spring 164 when the rotating member 110 is rotated about 45 ° and 90 ° with respect to the first body 131 One end is inserted into the engaging hole 169 opposite to the 134 to maintain the rotation angle of the rotation member 110.

Hereinafter, the assembly method and the effect of the semiconductor manufacturing equipment 190 configured as described above will be described in detail.

First, the user assembles the hinge device 100 by coupling the fixing member 130 and the rotation member 110 to each other by using the connection shaft 150 and the bearing 180.

Then, when the assembly is completed, the user is to fix the fixing member 130 of the hinge device 100 to the chamber 90 using a fixing bolt 135 or the like.

Thereafter, when the fixing member 130 of the hinge apparatus 100 is fixed, the user uses another fixing bolt 115 or the like to rotate the rotating member 110 of the hinge apparatus 100 to the lead 80. It is fixed, thereby completing the assembly of the semiconductor manufacturing equipment 190.

On the other hand, according to the semiconductor manufacturing equipment 190 of the present invention, it is possible to move up and down a predetermined distance even when the rotating member 110 and the coupling shaft 150 coupled thereto are fitted in the connection hole 137 of the fixing member 130. Therefore, when opening the lid 80, there is an effect that can open the lid 80 without damaging the sealing ring installed on the chamber 90 as well as by the internal differential pressure of the chamber 90 Even when a phenomenon in which the lead 80 is heard momentarily occurs, there is an effect of inducing down of the lead 80 without destroying the hinge function.

As mentioned above, although the present invention has been described with reference to the illustrated embodiments, it is only an example, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

As described above, according to the semiconductor manufacturing equipment of the present invention, since the rotation member and the connecting shaft coupled thereto are movable up and down a predetermined distance even when they are fitted in the connection hole of the fixing member, the lead is placed on the chamber. Not only can the lid be opened without damaging the installed sealing ring, but the lead can be pulled down without destroying the hinge function even when the lead is temporarily lifted by the internal differential pressure of the chamber. Will be.

Claims (6)

A fixing member comprising a first body and a second body spaced apart from each other by a predetermined distance; A rotation member interposed between the first body and the second body; A connecting shaft connecting the fixing member and the rotating member through the fixing member and the rotating member continuously; A bearing interposed between an outer circumferential surface of the connecting shaft and an inner circumferential surface of the rotating member in which the connecting shaft is fitted to enable the rotating member to be rotatable from the connecting shaft; And, And a rotation angle maintaining unit for maintaining a rotation angle of the rotation member rotated from the connecting shaft. The method of claim 1, The rotation angle maintaining unit A fitting hole extending from one side of the first body opposite to the rotating member to the other side of the first body, and a portion of the fitting hole extending through the fitting hole to a predetermined length toward the other side of the first body; One side of the pivot member such that the prevention pin, an elastic spring elastically supporting the rotation prevention pin to move the rotation prevention pin to the rotation member side, and one end of the rotation prevention pin moved by the elastic spring are fitted. Hinge device comprising a locking hole formed in the. The method of claim 1, Connection holes are formed in the first body and the second body so that one end and the other end of the connection shaft are fitted, respectively. The connecting hole is a hinge device, characterized in that formed larger than the thickness and height of the connecting shaft so that the connecting shaft can flow up and down a predetermined distance in the state fitted to the first body and the second body. A chamber in which the process proceeds; A lid rotated by a predetermined angle from the chamber to open and close one side of the chamber; And, A hinge device pivotally rotatable from the chamber, The hinge device A fixing member having a first body and a second body spaced apart from each other by a predetermined distance and coupled to the chamber; A rotation member interposed between the first body and the second body and coupled to the lead; A connecting shaft connecting the fixing member and the rotating member through the fixing member and the rotating member continuously; A bearing interposed between an outer circumferential surface of the connecting shaft and an inner circumferential surface of the rotating member in which the connecting shaft is fitted to enable the rotating member to be rotatable from the connecting shaft; And, And a rotation angle maintaining unit for maintaining a rotation angle of the rotation member rotated from the connecting shaft. The method of claim 4, wherein The rotation angle maintaining unit A fitting hole extending from one side of the first body opposite to the rotating member to the other side of the first body, and a portion of the fitting hole extending through the fitting hole to a predetermined length toward the other side of the first body; One side of the pivot member such that the prevention pin, an elastic spring elastically supporting the rotation prevention pin to move the rotation prevention pin to the rotation member side, and one end of the rotation prevention pin moved by the elastic spring are fitted. Semiconductor manufacturing equipment comprising a locking hole formed in the. The method of claim 4, wherein Connection holes are formed in the first body and the second body so that one end and the other end of the connection shaft are fitted, respectively. The connecting hole is a semiconductor manufacturing equipment, characterized in that formed larger than the thickness and height of the connecting shaft so that the connecting shaft can flow up and down a predetermined distance in the state fitted to the first body and the second body.

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