KR200485269Y1 - Heat conduction and radiation assembly structure of detachable module - Google Patents

Abstract

The heat sink assembly of the present invention includes a module housing, a first module, and a second module, the module housing including two module side plates installed on both sides, the first module including a CPU main board , The CPU main board is provided with a first processor and a heat radiating fan on the first processor, and a heat conducting member is installed on the heat radiating fan; Wherein the second module includes an optical fiber main board, a second processor is disposed on the optical fiber main board, a radiation member is provided on the second processor, and the radiation member contacts the second processor A heat dissipation base; The heat conduction member is in contact with the module side plate and the heat dissipation base contacts the module side plate to rapidly conduct and dissipate heat.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat conduction and radiation assembly structure for a detachable module,

The present invention relates to a network module, and more particularly, to a heat radiating and assembling structure of a removable module having improved practical use of a network module, and having excellent practicality.

The network modules used for conventional network transmission are typically assembled into a type of single detachable module. Currently, the industry's single detachment module can be divided into two types depending on the function: a fiber detachment module and a CPU plate detachment module, but due to the space limitations, the current single detachment module can be divided into two types of functions At the same time. That is, the single desorption module is used only as an optical fiber desorption module or as a CPU plate desorption module. The conventional network attach / detachment module is assembled in a case of 2U (U is an industrial computer case height unit, 1U is 44.5mm) standard of the industry standard. In general, the case has four optical fiber detachable modules installed on the upper side, Four CPU plate desorption modules are installed, and each optical fiber desorption module is connected to the CPU plate desorption module so that the network transmission is proceeded.

In the above-described conventional network desorption / reception module technology, since only four groups of corresponding optical fiber desorption modules and CPU plate desorption modules can be installed, the system operation efficiency is considerably limited. Therefore, Applicant overcame obstacles of space limitation through active research and development. In other words, the number of modules was doubled by simultaneously installing 8 optical fiber detachable modules and 8 CPU plate detachable modules in the same space. In this way, in the conventional network desorption module technology, the number of the optical fiber desorption module and the CPU plate desorption module is extended to effectively improve the system operation efficiency in the network module application field.

However, if the space inside the detachable module is limited, the chip heat dissipation module can use the chip heat dissipation module or the customized heat dissipation fin module to heat the chip itself, It is impossible to design a sufficient heat dissipation space. In this case, the heat dissipation effect of the heat dissipation module is not clear, and the operation efficiency of the device can not reach the predetermined target, so it is necessary to further improve and break it down. Accordingly, it is an important task for the industry to solve the defects caused by the space limit in the heat conduction technology of the conventional network desorption module.

For this reason, the inventor of the present invention has studied a solution to solve the problem of using the heat conduction technique of the conventional network detachment module and the non-ideal in structure design, and has found that the heat radiating effect is good, the system operation efficiency is improved, , And developed a heat dissipation assembly structure of a removable module with a built-in heat exchanger, thereby contributing to the society and promoting the development of the industry.

The object of the present invention is to provide a heat radiating and assembling structure of a removable module that improves the operating efficiency of the system by breaking the limit of the conventional heat conduction technology.

It is another object of the present invention to provide a heat dissipation module for a heat dissipation module which is capable of preventing the heat on a chip To provide a detachable module heat conduction assembly structure that achieves optimum effects of chip heat dissipation.

It is another object of the present invention to provide a detachable module heat dissipating and assembling structure that increases the assembly accuracy, convenience, and efficiency by enabling the desorption module to be slid and fixed through the left and right aluminum plates.

In order to achieve the above object, the present invention provides a module comprising a module housing, a first module, and a second module, wherein the module housing includes two module side plates installed on both sides and a front end panel, A module accommodation space is formed between the side plates; Wherein the first module is fixedly coupled to the module accommodation space, the first module includes a CPU main board, the first processor and the heat radiating fan on the first processor are installed on the CPU main board, A heat conduction member is provided, and a first connection connector is installed on the CPU main board; Wherein the second module is fixedly coupled to the module accommodation space, the second module includes an optical fiber main board, an optical fiber box is installed at one end of the optical fiber main board, Two processors are installed in parallel, a heat radiating member is provided on the second processor, and the heat radiating member includes a heat radiating base contacted with the second processor. Wherein the first module and the second module form a concave-convex connection, the first connection connector and the second connection connector form a communication connection, the heat conduction member is brought into contact with the module side plate, So as to rapidly conduct and dissipate heat.

The present invention has been made to overcome the limitations of the conventional heat conduction technology by improving the operating efficiency of the system and by eliminating the need to make any changes to the conventional case specifications, Through the combination of the heat dissipation module and the left and right aluminum plates on both sides of the detachable module, the heat on the chip is conducted by the good heat conduction characteristics of the aluminum plate to obtain the optimum effect of chip heat dissipation. The present design also allows the desorption module to be slid and fixed through the aluminum plates on both sides, increasing assembly accuracy, convenience and efficiency.

Fig. 1 is a stereoscopic application diagram of the present invention. Fig.
2 is an exploded schematic view of the present invention.
Fig. 3 is a schematic cross-sectional view taken along line CC of the present invention.
4 is a combination stereoscopic schematic view of the present invention.
5 is a schematic cross-sectional view taken along line AA of FIG.
6 is a schematic cross-sectional view taken along line BB in Fig.

In order to better understand the technical features of the present invention and the effect to be achieved, preferred embodiments and drawings will be described in detail as follows.

1 and 2, the thermally conductive assembly structure of the removable module of the present invention includes a network module 1, which includes a module housing 10, a first module 20, A second module (30); The module housing 10 is a housing used for a single module and includes module side plates 11 on both sides and an end side base plate 13 on the front end. The module side plate 11 is a heat- A module accommodating space 12 is formed between the two module side plates 11 and a sliding groove 111 is provided on the outer side of the module side plate 11 and a plurality of lower The position fixing base 115 is provided with a position fixing screw base 113, at least one position fixing base 115 and a plurality of position fixing screw bases 114 on the upper side, A plurality of position fixing screw holes 116 are provided thereon, and a plurality of panel screw holes 112 are provided at the front end of the module side plate 11. The end face base plate 13 is provided with side position fixing plates 131 extending in the direction of the module accommodation space 12 on both sides thereof and a plurality of position fixing screw holes 132 Is screwed to the position fixing screw hole 132 and the panel screw hole 112 through the screw member 136 so that the end face base plate 13 is fixedly coupled to the front end of the module side plate 11 do. An upper window 133 and a plurality of lower heat dissipating holes 134 are formed in the end face base plate 13 and a plurality of position fixing screw holes 135 are provided on both sides of the end face base plate 13; A panel 14 may be further provided in front of the end surface base plate 13 and two upper optical fiber windows 141 and a plurality of lower heat dissipating holes 142 may be provided in the panel 14, A plurality of position fixing screw holes 143 and at least one spring screw 144 are provided on both sides of the panel 14 and the position fixing screw holes 143, 135 so that the panel 14 is fixedly coupled to the front end of the end surface base plate 13. The window 133, the optical fiber window 141 and the plurality of heat dissipating holes 134 and the heat dissipating holes 142 are provided in correspondence with each other and the spring screws 144 are fixed in combination with the case 100 . The first bottom plate 15 and the second bottom plate 16 are provided on the module side plate 11 and the first bottom plate 15 and the second bottom plate 16 are provided with a plurality of corresponding position fixing holes 151 And a position fixing column nut 161 are respectively installed and screwed to the position fixing hole 151 and the position fixing column nut 161 by a screw member 163 so that the first bottom plate 15, So that the two bottom plates 16 are fixedly coupled to each other. The first bottom plate 15 and the second bottom plate 16 are provided with a plurality of position fixing screw holes 152 and position fixing screw holes 162 respectively corresponding to both sides, The first bottom plate 15 and the second bottom plate 16 are screwed to the position fixing screw hole 152, the position fixing screw hole 162 and the position fixing screw hole 116 so that the first bottom plate 15 and the second bottom plate 16 are fixed to the module side plate 11 To be fixedly coupled to the position fixing base 115.

The first module 20 may be a CPU module and the first module 20 may include a CPU main board 21 and the CPU main board 21 may be a motherboard, A first processor (CPU / not shown) and a heat radiating fan 22 on the first processor are provided on the main board 21 and a heat conductive member 23 is provided on the heat radiating fan 22, 23 includes a heat conduction base 231 and a plurality of heat dissipating fins 232 stretched from the heat conduction base 231. A first connection connector 24 and various electronic elements 25 of a general motherboard are installed on the CPU main board 21 and a position fixing screw hole 26 is provided in the periphery of the CPU main board 21 And a plurality of connection terminals (gold finger / not shown) are separately provided on the CPU main board 21 to connect the system terminals to each other. This will not be described because it is a conventional technology. Since the region of the heat radiation fan 22 and the heat conduction member 23 of the first module 20 (CPU module) is relatively protruded on the CPU main board 21, the first module 20 The heat radiating fan 22 and the heat conductive member 23 adjacent to the heat sink 22 have a concave space for facilitating the connection with the second module 30.

The second module 30 may be an optical fiber module and the second module 30 may include an optical fiber main board 31. The optical fiber main board 31 may be a circuit board and the optical fiber main board 31 ) Is provided at the lower side of the optical fiber box 32, and the optical fiber box 32 is used to install the related optical fiber module parts. One end of the optical fiber box 32 is provided with a protruded optical fiber socket 33. The related optical fiber module electronic device 36 is installed on the optical fiber main board 31. A connection terminal A second connecting connector 34 and a second processor 35 (CPU) are provided on the optical fiber main board 31. The second connecting connector 34 and the second connecting connector 34 are provided on the optical fiber main board 31, And a radiating member 37 is provided on the second processor 35. The radiating member 37 includes a radiating base 371 and a plurality of radiating fins 372 on the radiating base 371 And the heat dissipation base 371 is in contact with the second processor 35 to conduct thermal conduction and heat dissipation. The heat dissipation base 371 is extended from the heat dissipation guide plate 373, and in a preferred embodiment, The heat dissipation guide plate 373 has a curved plate shape The heat dissipation guide plate 373 is provided with a guide connection plate 374 at the other end corresponding to the heat dissipation base 371 and the guide connection plate 374 is connected to the module side plate 11 And a position fixing hole 38 is provided in the periphery of the main board 31. The optical fiber box 32 of the second module 30 (optical fiber module) The area adjacent to the optical fiber box 32 of the second module 30 (optical fiber module) (the area of the second processor 35) is relatively protruded on the board 31, The heat radiating fan 22 and the heat conduction member 23 of the plate module.

3 to 6, in the combination of the heat-radiating assembly structure of the detachable module of the present invention, the first module 20 (CPU plate module) is inserted into the module accommodation space 12 of the module housing 10, As shown in Fig. Is fixed to the position fixing screw base 113 of the module side plate 11 through a position fixing screw hole 26 of the CPU main board 21 by a screw member (not shown) 30 (optical fiber module) is fixed to the upper side of the module accommodation space 12 of the module housing 10. That is, the screw member 39 is locked to the position fixing screw base 114 of the module side plate 11 through the position fixing hole of the optical fiber main board 31. Thus, the first module 20 (CPU module) forms a concave / convex coupling with the second module 30 (optical fiber module), and the first connection connector 24 and the second connection connector (34) are connected to each other for communication transmission between them. In other embodiments, the communication transfer connection of the first connection connector 24 and the second connection connector 24 is connected through a connection plate 40 (see FIG. 5). That is, the connection plate 40 is inserted between the first connection connector 24 and the second connection connector 34.

3, the heat conduction base 231 (the heat conduction member 23) of the first module 20 (CPU module) contacts the module side plate 11 (aluminum plate) , The heat generated by the first processor acts to dissipate heat and heat through the heat conduction member 23 and the module side plate 11 (aluminum plate). The heat conduction base 231 (the heat conduction member 23) is at least one end contacted with the module side plate 11 (aluminum plate), or both ends are simultaneously connected to the module side plate 11 (aluminum plate) . As shown in FIG. 5, the heat dissipation base 371 of the second module 30 (optical fiber module) is in contact with the module side plate 11 (aluminum plate). That is, the guide plate 374 comes in contact with the module side plate 11 (aluminum plate) so that the heat generated by the second processor 35 is transferred to the heat dissipation base 371, the guide connection plate 374, And acts to rapidly conduct heat and heat through the side plate 11 (aluminum plate). 4 and 6, the optical fiber socket 33 of the optical fiber module 30 protrudes from the window 133 of the module housing 10, the optical fiber window 141, and is connected to the outside . Also, the first module 20 (CPU module) may be equipped with a multicore CPU, for example, a TILE-GX 100 core processor provided by Tilera, and the second module 30 (optical fiber module) Lt; / RTI >

Fig. 1 illustrates the application of the heat-radiating assembly structure of the removable module of the present invention, which is described in the 2U case, which is a standard specification of the industry. The case 100 includes four upper module spaces 100A and a lower four module spaces 100B and the eight module spaces 100A and the module spaces 100B are formed by assembling the network module 1 It is for. The protruded rail member 101 is installed on both sides of each module space 100B so that the network module 1 is slid on the protruding rail member 101 through the sliding groove 111, ). The network module 1 is fixed to the screw coupling hole 102 of the case 100 by a spring screw 144 on the panel 14 so that the network module 1 can be easily attached and detached, Thereby forming a detachable type network module. Since the network module 1 includes the first module 20 (CPU module) and the second module 30 (optical fiber module), the eight optical fiber modules and the eight CPU module modules can be simultaneously And is in contact with the module side plate 11 (aluminum plate) by using the heat conduction base 231 (heat conduction member 23) of the first module 20 (CPU plate module) (Aluminum plate) by using the heat dissipating base 371 and the guide connecting plate 374 of the optical module 30 (optical fiber module) to overcome the problem of the space being reduced, Heat dissipation effect.

The radiating and discharging assembly structure of the detachable module according to the present invention can overcome the limitations of the conventional radiating technology by improving the operating efficiency of the system and eliminating the need to make any changes to the conventional case specifications , The heat on the chip is conducted by the good heat conduction characteristics of the aluminum plate through the combination of the heat dissipation module on the chip and the left and right aluminum plates on both sides of the detachment module to obtain the optimum effect of chip heat dissipation. The present design also allows the desorption module to be slid and fixed through the aluminum plates on both sides, increasing assembly accuracy, convenience and efficiency.

It is to be understood that both the foregoing general description and the following detailed description of the presently preferred embodiments are exemplary and explanatory and are intended to be exemplary and explanatory and are intended to provide further explanation of the invention as claimed. And should be included within the scope of the present invention.

1: Network module
10: Module housings
11: Module shroud
100: Case
12: Module accommodation space
13: End face plate
14: Panel
15: first bottom plate
16: second bottom plate
20: First module
21: CPU main board
22: Thermal fan
23: heat conduction member
24: first connection connector
25: Electronic device
26: Position fixing screw hole
30: Second module
31: Fiber optic main board
32: Optical fiber box
33: Fiber Optic Socket
34: second connection connector
35: second processor
36: Electronic device
37:
38: Position fixing hole
39: screw member
40: connection plate
100A: Module space
100B: Module space
101: protruding rail member
102: Screw connection hole
111: Sliding groove
112: Panel screw hole
113: Position fixing screw base
114: Position fixing screw base
115: Position fixing base
116: Position fixing screw hole
131: Side position fixing plate
132: Position fixing screw hole
133: Window
134: Heat dissipation hole
135: Position fixing screw hole
136: screw member
141: Optical fiber window
142: Heat dissipation hole
143: Position fixing screw hole
144: Spring screw
145: screw member
151: Position fixing hole
152: Position fixing screw hole
161: Locating pin nut
162: Position fixing screw hole
163: screw member
164: screw member
231: Heat conduction base
232: heat sink fin
371: Heat dissipation base
372: heat sink fin
373: Heat radiating guide plate
374: Guide connection plate

Claims (10)

A module housing, a first module, and a second module,
The module housing includes two module side plates and a front end panel installed on both sides of the module housing, and a module accommodation space is formed between the two module side plates;
Wherein the first module is fixedly coupled to the module accommodating space, the first module includes a CPU main board, the first processor and the heat radiating fan on the first processor are installed on the CPU main board, A heat conduction member is provided, and a first connection connector is installed on the CPU main board;
Wherein the second module is fixedly coupled to the module accommodation space, the second module includes an optical fiber main board, an optical fiber box is installed at one end of the optical fiber main board, a second connection connector A second processor is installed in parallel, a heat radiating member is provided on the second processor, and the heat radiating member includes a heat radiating base contacted with the second processor;
Wherein the first module and the second module are concave and convex, the first connection connector and the second connection connector form a communication connection, the heat conduction member is in contact with the module side plate, Which is in contact with the module side plate and acts to rapidly conduct and dissipate heat;
A thermally conductive assembly structure of a removable module. The method according to claim 1,
Wherein the module side plate is an aluminum plate and a sliding groove is provided on an outer side of the module side plate. The method according to claim 1,
Wherein the first connection connector and the second connection connector are connected to make communication transmission through the connection plate. The method according to claim 1,
A plurality of position fixing screw bases provided on the lower side of the module side plate, at least one position fixing base and a plurality of position fixing screw bases on the upper side, and a plurality of position fixing screw holes are provided on the position fixing base And a lateral position fixing plate protruding from both sides of the end face base plate is extended, and the side position fixing plate is provided between the module side plate and the panel A thermally conductive assembly of a removable module that is fixedly coupled. 5. The method of claim 4,
Wherein at least a bottom plate is fixedly coupled to the position fixing base on the lower side of the module side plate. The method according to claim 1,
Wherein the first module is a CPU plate module. The method according to claim 1,
Wherein the second module is an optical fiber module. The method according to claim 1,
Wherein the thermally conductive member comprises a heat conduction base and a plurality of heat dissipating fins stretched on the heat conduction base. The method according to claim 1,
Wherein a plurality of radiating fins are provided on the radiating base, a radiating guide plate is extended to the radiating base, and a guide connecting plate is provided on the radiating guide plate at the other end corresponding to the radiating base Heat conduction assembly structure. 3. The method of claim 2,
Wherein the case has a plurality of module spaces, and protruding rail members corresponding to the sliding grooves are provided on both sides of the module space, respectively.

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