KR200462252Y1 - Protecing film binding device - Google Patents

Protecing film binding device Download PDF

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Publication number
KR200462252Y1
KR200462252Y1 KR2020110001763U KR20110001763U KR200462252Y1 KR 200462252 Y1 KR200462252 Y1 KR 200462252Y1 KR 2020110001763 U KR2020110001763 U KR 2020110001763U KR 20110001763 U KR20110001763 U KR 20110001763U KR 200462252 Y1 KR200462252 Y1 KR 200462252Y1
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South Korea
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protective film
cover
adhesive surface
opening
electronic device
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KR2020110001763U
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Korean (ko)
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김광수
노종현
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노종현
김광수
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Textile Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

본 고안은 각종 전자기기의 액정, 또는 케이스의 표면에, 보호필름을 간편하고 안정되게 접합하는 액정 보호필름 접합구에 관한 것으로, 본 발명에서는 개구부가 형성된 수용공간을 갖는 함체와; 상기 개구부를 통해 수용공간으로 진입하여 개구부를 폐쇄하며, 저면에 접착면이 형성된 커버; 및 상기 커버의 접착면에 접착되어 전자기기의 보호필름 접착면에 전사하여 접착되는 보호필름을 포함하여 구성되어, 상기 함체의 수용공간에 전자기기를 수용시킨 다음 커버를 수용공간 내로 진입시키면, 커버의 접착면에 접착된 보호필름은 개구부를 통해 노출된 보호필름 접착면에 밀착되고, 이후 커버의 표면을 문지르면 커버의 접착면에 접착된 보호필름은 전자기기의 보호필름 접착면에 전사하여 접착되도록 구성한 것을 특징으로 하고 있다.The present invention relates to a liquid crystal protective film bonding tool for easily and stably bonding a protective film on the surface of a liquid crystal or a case of various electronic devices, the present invention comprises: an enclosure having a receiving space having an opening; A cover which enters a receiving space through the opening and closes the opening and has an adhesive surface formed on a bottom surface thereof; And a protective film adhered to the adhesive surface of the cover and transferred to and adhered to the protective film adhesive surface of the electronic device, the electronic film is accommodated in the accommodation space of the enclosure and the cover enters the accommodation space. The protective film adhered to the adhesive surface of the adhesive film is adhered to the protective film adhesive surface exposed through the opening, and then rub the surface of the cover so that the protective film adhered to the adhesive surface of the cover is transferred to the adhesive film adhesive surface of the electronic device so as to be bonded. It is characterized by the configuration.

Description

보호필름 접합구{Protecing film binding device}Protective film bonding device {Protecing film binding device}

본 고안은 보호필름 접합구에 관한 것으로, 더욱 상세하게는 각종 전자기기의 액정, 또는 케이스의 표면에, 보호필름을 간편하고 안정되게 접합하는 보호필름 접합구에 관한 것이다.The present invention relates to a protective film bonding, and more particularly to a protective film bonding for bonding the protective film to the surface of the liquid crystal or case of various electronic devices simply and stably.

일반적으로 휴대폰, 스마트폰, PDA, 타블렛 PC, PMP 등 각종 소형의 전자기기가 출시되고 있으며, 이러한 소형의 전자기기에는 터치패드가 형성된 액정 패널이 형성된다.In general, various small electronic devices such as mobile phones, smart phones, PDAs, tablet PCs, and PMPs have been released, and liquid crystal panels having touch pads are formed on such small electronic devices.

그리고, 사용자들은 상기 전자기기에 형성된 액정 패널에 각종 보호필름을 부착하여, 반복적인 터치에 의한 액정 패널의 손상을 예방하고, 또 눈부심이나 지문 등에 의해 시인성이 낮아지는 것을 예방하고 있으며, 최근에는 전자기기 케이스의 표면을 보호하기 위한 케이스 보호필름 등도 등장하고 있다.In addition, users attach various protective films to the liquid crystal panel formed on the electronic device to prevent damage to the liquid crystal panel by repeated touches, and to prevent visibility from being lowered due to glare or fingerprints. Case protective film for protecting the surface of the device case is also appearing.

그런데, 상기 보호필름은 전자기기에 형성된 액정 패널이나 케이스의 표면에 전사를 통해 접합되는 관계로, 사용자가 보호필름의 접합위치를 잘못 설정하여 반복적으로 붙였다가 떼는 과정을 반복하면, 보호필름 자체의 전사력이 약화될 뿐 아니라 국부적인 인장이 발생된다.However, since the protective film is bonded to the surface of the liquid crystal panel or case formed on the electronic device through transfer, when the user repeatedly sets the bonding position of the protective film incorrectly and repeatedly attaches and detaches the protective film, Not only is the transfer force weakened, but also local tension occurs.

특히, 보호필름의 접합에 따른 숙련도가 떨어지는 통상의 사용자가, 전자기기에 보호필름을 붙이면, 보호필름이 정위치에 붙여지지 아니하고, 또 반복적으로 붙였다가 떼는 과정에 의해 전자기기에 접합된 보호필름에는 기포나 이물질 등이 다량 잔류하게 되는 문제점이 발생된다.In particular, when a user who is poor in proficiency due to bonding of a protective film attaches a protective film to an electronic device, the protective film is not attached to the protective film, and the protective film is bonded to the electronic device by repeatedly attaching and detaching the protective film. There is a problem that a large amount of bubbles or foreign matter remains.

따라서, 당 분야에서는 각종 전자기기의 표면에 보호필름을 정밀하고 간편하게 접착할 수 있는 보호필름 접합구의 개발 및 보급이 요구되고 있는 실정이다.Therefore, in this field, the development and dissemination of protective film joints capable of precisely and easily bonding protective films to the surfaces of various electronic devices are required.

상기한 요구에 의해 안출된 본 고안의 목적은, 각종 전자기기의 액정, 또는 케이스의 표면에, 기포나 이물질의 유입 없이 보호필름을 정 위치에 간편하고 접합하는 보호필름 접합구를 제공함에 있다.An object of the present invention devised by the above-described demands is to provide a protective film bonding device for easily bonding a protective film to a proper position without inflow of bubbles or foreign substances on the surface of liquid crystals or cases of various electronic devices.

상기한 목적은, 본 고안에서 제공되는 하기 구성에 의해 달성된다.The above object is achieved by the following configuration provided in the present invention.

본 고안에 따른 보호필름 접합구는,
개구부가 형성된 수용공간을 갖는 함체와; 상기 개구부를 통해 수용공간으로 진입하여 개구부를 폐쇄하며, 저면에 접착면이 형성된 커버; 및 상기 커버의 접착면에 접착되어 전자기기의 보호필름 접착면에 전사하여 접착되는 보호필름을 포함하여 구성되어,
상기 함체의 수용공간에 전자기기를 수용시킨 다음 커버를 수용공간 내로 진입시키면, 커버의 접착면에 접착된 보호필름은 개구부를 통해 노출된 보호필름 접착면에 밀착되고, 이 상태에서 커버의 표면을 문지르면 커버의 접착면에 접착된 보호필름은 전자기기의 보호필름 접착면에 전사하여 접착되도록 구성한 것을 특징으로 한다.
바람직하게는, 상기 커버의 일 가장자리는 함체에 절첩부를 통해 연결되어, 커버는 절첩부의 절첩을 통해 함체의 상부에 안착되어 수용공간의 개구부를 폐쇄하도록 구성된다.
보다 바람직하게는, 상기 수용공간의 상부 외측과 커버의 저면에는 압입홈과 압입돌기가 대응되게 형성되어, 상기 함체의 상부에 안착된 커버는 압입홈과 압입돌기의 규합을 통해 함체의 상부에 위치 고정된 상태로 수용공간의 개구부를 폐쇄하도록 구성된다.Protective film joint according to the present invention,
An enclosure having an accommodation space in which an opening is formed; A cover which enters a receiving space through the opening and closes the opening and has an adhesive surface formed on a bottom surface thereof; And a protective film adhered to the adhesive surface of the cover and transferred to and adhered to the protective film adhesive surface of the electronic device.
When the electronic device is accommodated in the accommodation space of the enclosure and the cover is entered into the accommodation space, the protective film adhered to the adhesive surface of the cover is in close contact with the protective film adhesive surface exposed through the opening, and the surface of the cover is in this state. When rubbed, the protective film bonded to the adhesive surface of the cover is characterized in that the transfer film is bonded to the protective film adhesive surface of the electronic device is configured to be bonded.
Preferably, one edge of the cover is connected to the enclosure via a fold, so that the cover is seated on the top of the enclosure through the folding of the fold to close the opening of the receiving space.
More preferably, the upper outer side of the receiving space and the bottom of the cover is formed to correspond to the indentation groove and the indentation projection, the cover seated on the upper portion of the housing through the engagement of the indentation groove and the indentation protrusion is located in the upper portion of the enclosure It is configured to close the opening of the accommodation space in a fixed state.

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전술한 바와 같이 본 고안에 따른 보호필름 접합구는, 전자기기를 함체의 수용공간에 수용하고 커버를 통해 수용공간의 개구부를 폐쇄한 다음, 커버에 접합된 보호필름이 전자기기의 보호필름 접착면에 전사하여 접합되도록 하고 있다.As described above, in the protective film joint according to the present invention, the electronic film is accommodated in the accommodation space of the enclosure, the opening of the accommodation space is closed through the cover, and the protective film bonded to the cover is attached to the protective film adhesive surface of the electronic device. It is transferred and joined.

이에 따라, 상기 보호필름의 접합과정에 전자기기의 보호필름 접착면과 보호필름 사이에 먼지 등의 이물질이 유입되는 현상이 예방되고, 또 상기 보호필름은 유연성을 갖는 커버에 접합된 상태로 전자기기의 보호필름 접착면에 전사하여 접합되므로, 접합과정에 보호필름이 국부적으로 연신되거나 구겨지는 현상이 방지될 수 있다.Accordingly, a phenomenon in which foreign matter such as dust is introduced between the protective film adhesive surface of the electronic device and the protective film in the bonding process of the protective film is prevented, and the protective film is bonded to the cover having flexibility. Since the transfer film is bonded to the protective film of the bonding, the phenomenon that the protective film is locally stretched or wrinkled in the bonding process can be prevented.

그리하여, 보호필름의 전사를 통한 접합과정에 국부적인 연신이나 구김에 의해 전자기기의 보호필름 접착면과 보호필름 사이에 기포가 생성되는 현상이 억제되므로, 결과적으로 이물질의 유입이나 기포의 생성 없이 전자기기에 보호필름을 간편하게 접합할 수 있다.Therefore, the phenomenon that bubbles are generated between the protective film adhesive surface of the electronic device and the protective film by local stretching or wrinkling in the bonding process through the transfer of the protective film is suppressed, and as a result, electrons are introduced without inflow of foreign substances or generation of bubbles. The protective film can be easily bonded to the device.

또한, 본 고안에서는 커버와 함체가 상호 규합하여 위치 고정되도록 하고 있으며, 이에 따라 항시 커버에 접착된 보호필름은 함체 수용공간의 정위치에 위치된 전자기기의 보호필름 접착면의 정위치에 밀착된 상태로 전사하여 접합되므로, 사용자가 반복적인 시행착오를 통해 보호필름의 접합 위치를 교정하는 번거로움이 해소될 수 있다.In addition, in the present invention, the cover and the housing are assembled to each other so that the position is fixed. Accordingly, the protective film always adhered to the cover is in close contact with the protective film adhesive surface of the electronic device located at the correct position of the housing space. Since the transfer in the state is bonded, the user can eliminate the hassle of correcting the bonding position of the protective film through repeated trial and error.

도 1과 도 2는 본 고안에서 바람직한 실시예로 제안하고 있는 보호필름 접합구의 전체 구성을 보여주는 것으로, 도 1은 함체와 커버가 절첩부를 통해 연결하여 제작된 형태를 보여주는 것이고, 도 2는 함체와 커버가 분리 제작된 형태를 보여주는 것이며,
도 3 내지 도 5는, 상기 도 1과 도 2에 도시된 보호필름 접합구를 통한 보호필름의 접착상태를 보여주는 작용 상태도이다.Figure 1 and Figure 2 shows the overall configuration of the protective film joints proposed as a preferred embodiment in the present invention, Figure 1 shows the form produced by connecting the enclosure and the cover through the folded portion, Figure 2 The cover and cover are shown separately made,
3 to 5 is a state diagram showing the adhesion state of the protective film through the protective film bonding port shown in FIG. 1 and FIG.

이하, 첨부된 도면을 참조하여 본 고안에서 바람직한 실시예로 제안하고 있는 보호필름 접합구를 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the protective film bonding sphere proposed as a preferred embodiment in the present invention.

도 1과 도 2는 본 고안에서 바람직한 실시예로 제안하고 있는 보호필름 접합구의 전체 구성을 보여주는 것으로, 도 1은 함체와 커버가 절첩부를 통해 연결하여 제작된 형태를 보여주는 것이고, 도 2는 함체와 커버가 분리 제작된 형태를 보여주는 것이며, 도 3 내지 도 5는, 상기 도 1과 도 2에 도시된 보호필름 접합구를 통한 보호필름의 접착상태를 보여주는 작용 상태도이다.Figure 1 and Figure 2 shows the overall configuration of the protective film joints proposed as a preferred embodiment in the present invention, Figure 1 shows the form produced by connecting the enclosure and the cover through the folded portion, Figure 2 3 and 5 show a state in which the cover is separated and manufactured, and FIG. 3 to FIG. 5 are functional state diagrams illustrating an adhesive state of the protective film through the protective film joint shown in FIGS. 1 and 2.

본 고안에서 제안하고 있는 보호필름 접합구(1, 1')는, 휴대폰, PDA, 타블렛 PC, PMP 등 각종 소형의 전자기기(100)의 액정 또는 케이스 등의 보호필름 접착면(110)에 보호필름(40)을 간편하게 접착시키는 것이다.The protective film bonding ports 1 and 1 'proposed in the present invention protect the protective film adhesive surface 110 such as a liquid crystal or a case of various small electronic devices 100 such as a mobile phone, a PDA, a tablet PC, and a PMP. The film 40 is simply adhered.

상기 보호필름 접합구(1, 1')는, 도 1 내지 도 4에서 보는 바와 같이 개구부(11a)가 형성된 수용공간(11)을 갖는 함체(10)와; 상기 함체(10)의 상부에 안착되어 수용공간(11)의 개구부(11a)를 폐쇄하는 커버(20)를 포함하여 구성되며, 이들 함체(10)와 커버(20, 30)는, 종이 합성수지 등 다양한 재질로 제작 가능하다. The protective film bonding holes (1, 1 '), the housing 10 having a receiving space 11 is formed with an opening (11a) as shown in Figures 1 to 4; It includes a cover 20 seated on the upper portion of the housing 10 to close the opening (11a) of the receiving space 11, these housings 10 and the cover (20, 30), such as paper synthetic resin Can be manufactured in various materials.

다만, 본 고안에서는 일 예로 합성수지 재질로 제작된 투명의 필름지를 통해 함체(10)와 커버(20, 30)를 제작하고 있다.However, in the present invention, for example, the housing 10 and the covers 20 and 30 are manufactured by using a transparent film made of a synthetic resin material.

도면을 보면 상기 함체(10)에 요입되게 형성된 수용공간(11)은, 전자기기(100)의 저면과 외측면을 각각 감싸 정 위치에 위치 고정한다.Referring to the drawings, the accommodation space 11 formed to be recessed in the enclosure 10 is wrapped around the bottom and the outer surface of the electronic device 100 and fixed in position.

따라서, 도 3a와 도 4a와 같이 상기 함체(10)의 수용공간(11)에 전자기기(100)를 수용하면 전자기기(100)는 수용공간(11)의 정 위치에 위치 고정되며, 이때 전자기기(100)의 보호필름 접착면(110)은 개구부(11a)를 통해 노출된다.Accordingly, when the electronic device 100 is accommodated in the accommodation space 11 of the enclosure 10 as shown in FIGS. 3A and 4A, the electronic device 100 is fixed in position at the accommodation space 11. The protective film adhesive surface 110 of the device 100 is exposed through the opening 11a.

그리고, 상기 커버(20, 30)는 저면에 접착면(21, 31)이 형성된 유연성 재질로 제작되며, 이들 접착면(21, 31)에는 수용공간(11)의 개구부(11a)를 통해 노출되는 전자기기(100)의 보호필름 접착면(110)에 전사하여 접합되는 보호필름(40)이 접합된다.The covers 20 and 30 are made of a flexible material having adhesive surfaces 21 and 31 formed on the bottom thereof, and the adhesive surfaces 21 and 31 are exposed through the opening 11a of the accommodation space 11. The protective film 40, which is transferred and bonded to the protective film adhesive surface 110 of the electronic device 100, is bonded.

상기 보호필름(40)은, 표면에 커버(20, 30)의 접착면(21, 31)과 접합되는 가접면이 형성되고, 저면에는 전자기기(100)의 보호필름 접착면(110)에 접합되는 전사 접합면이 형성된 형태로 구성된다.The protective film 40, the temporary surface is bonded to the adhesive surface 21, 31 of the cover 20, 30 is formed on the surface, the bottom surface is bonded to the protective film adhesive surface 110 of the electronic device 100 It is composed of a form in which a transfer bonding surface is formed.

본 실시예에서는 커버(20, 30)의 저면에 접착면(21, 31)을 하향 돌출되게 형성하여, 수용공간(11)이 형성된 함체(10)에 커버(20, 30)가 안착되면 커버(20, 30)에 형성된 접착면(21, 31)은 수용공간(11)의 개구부(11a)에 진입하여 수용공간(11)에 수용된 전자기기(100)의 보호필름 접착면(110)에 긴밀히 밀착되도록 한다.In the present embodiment, the adhesive surfaces 21 and 31 are formed to protrude downward on the bottom surfaces of the covers 20 and 30, and when the covers 20 and 30 are seated in the enclosure 10 in which the accommodation space 11 is formed, the cover ( The adhesive surfaces 21 and 31 formed in the 20 and 30 enter the opening 11a of the accommodation space 11 to closely adhere to the protective film adhesive surface 110 of the electronic device 100 accommodated in the accommodation space 11. Be sure to

이에 따라, 사용자가 도 3a와 도 4a와 같이 함체(10)의 수용공간(11)에 전자기기(100)를 수용하여 정 위치시키고 도 3b와 도 4b와 같이 커버(20, 30)를 안착시켜 수용공간(11)의 개구부(11a)를 폐쇄시킨 다음, 도 3b와 도 4b 및 도 5와 같이 커버(20, 30)의 표면을 스크래퍼(50) 등으로 문지르면 커버(20, 30)의 저면에 접합된 보호필름(40)은 전자기기(100)의 보호필름 접착면(110)에 전사하여 접합된다.Accordingly, the user receives the electronic device 100 in the accommodation space 11 of the housing 10 as shown in FIGS. 3A and 4A and positions the electronic device 100 in position, and seats the covers 20 and 30 as shown in FIGS. 3B and 4B. After closing the opening 11a of the accommodation space 11 and rubbing the surface of the covers 20 and 30 with a scraper 50 or the like as shown in FIGS. 3B, 4B and 5, the bottom surfaces of the covers 20 and 30 are closed. The bonded protective film 40 is transferred to and bonded to the protective film adhesive surface 110 of the electronic device 100.

이때, 상기 보호필름(40)이 접합된 커버(20, 30)는 전자기기(100)를 수용한 함체(10)의 수용공간(11)을 밀폐시키며, 이에 따라 상기 보호필름(40)의 접합과정에 전자기기의 보호필름 접착면(110)과 보호필름(40) 사이에 먼지 등의 이물질이 유입되는 현상이 예방된다.At this time, the cover 20, 30 to which the protective film 40 is bonded seals the receiving space 11 of the housing 10 containing the electronic device 100, thereby bonding the protective film 40 The phenomenon in which foreign matter such as dust is introduced between the protective film adhesive surface 110 and the protective film 40 of the electronic device is prevented in the process.

그리고, 상기 보호필름(40)은 유연성을 갖는 커버(20, 30)에 접합된 상태로 전자기기(100)의 보호필름 접착면(110)에 전사하여 접합되므로, 접합과정에 보호필름(20, 30)이 국부적으로 연신되거나 구겨지는 현상이 방지된다.In addition, the protective film 40 is transferred to the protective film adhesive surface 110 of the electronic device 100 in a state of being bonded to the cover 20 and 30 having flexibility, and thus, the protective film 20 in the bonding process. 30) local stretching or wrinkling is prevented.

따라서, 상기 보호필름(40)의 국부적인 연신이나 구김에 의해 전자기기의 보호필름 접착면과 보호필름 사이에 기포가 생성되는 현상이 억제되므로, 본 실시예에 따른 보호필름 접합구(1, 1')는 이물질의 유입이나 기포의 생성 없이 전자기기(100)에 보호필름(40)을 간편하게 접합할 수 있다.Therefore, the phenomenon that bubbles are generated between the protective film adhesive surface of the electronic device and the protective film by local stretching or wrinkling of the protective film 40 is suppressed, so that the protective film bonding holes 1 and 1 according to the present embodiment. ') Can easily bond the protective film 40 to the electronic device 100 without the inflow of foreign matter or generation of bubbles.

한편, 본 실시예에 따른 보호필름 접합구(1, 1')를 구성하는 함체(10)와 커버(20, 30)는, 도 1과 도 3에서 보는 바와 같이 커버(20)의 일 가장자리가 함체(10)의 일 가장자리에 절첩부(23)를 통해 연결된 형태로도 제작될 수도 있고, 도 2와 도 4에서 보는 바와 같이 분리하여 제작될 수도 있다.On the other hand, the housing 10 and the cover 20, 30 constituting the protective film bonding holes (1, 1 ') according to this embodiment, one edge of the cover 20 as shown in FIG. It may also be manufactured in the form of being connected through the folded portion 23 to one edge of the enclosure 10, or may be produced separately as shown in Figs.

그리고, 도 1과 도 3과 같이 절첩부(23)를 통해 커버(20)가 절첩되어 수용공간(11)의 개구부(11a)를 폐쇄하도록 구성하면, 절첩에 의해 커버(20)는 전자기기(100)를 정 위치에 수용한 함체(10) 상부의 정 위치에 위치될 수 있다.1 and 3, when the cover 20 is folded through the folding part 23 to close the opening 11a of the accommodation space 11, the cover 20 is folded by the electronic device ( It may be located at the top position of the upper housing 10 accommodated in the 100 position.

또한, 본 실시예에서는 상기 함체(10)에 형성된 수용공간(11) 외측과 커버(20, 30)의 저면에 압입홈(12)과 압입돌기(22, 32)를 대응되게 형성하여, 수용공간(11)의 개구부(11a)를 폐쇄하는 커버(20, 30)가 압입홈(12)과 압입돌기(22, 32)를 통해 함체(10)와 규합하여 정 위치에 위치 고정되도록 하고 있다.In addition, in the present embodiment, the indentation grooves 12 and the indentation protrusions 22 and 32 are formed on the outer sides of the accommodating space 11 formed in the housing 10 and the bottoms of the covers 20 and 30 to accommodate the accommodating spaces. Covers 20 and 30 closing the openings 11a of 11 are engaged with the enclosure 10 through the press-in grooves 12 and the press-in protrusions 22 and 32 so as to be fixed in position.

이와 같이 구성하면, 상기 커버(20, 30)에 접합된 보호필름(40)은 도 3과 도 4와 같이 함체(10)의 수용공간(11)에 정 위치된 전자기기(100)의 보호필름 접착면(110)에 정 위치된 상태로 밀착되며, 결과적으로 사용자가 임의로 커버(20, 30)의 위치를 변경시켜 보호필름(40)의 접합 위치를 정렬하는 과정 없이 불필요하다.In this configuration, the protective film 40 bonded to the covers 20 and 30 is the protective film of the electronic device 100 positioned in the accommodation space 11 of the enclosure 10 as shown in FIGS. 3 and 4. It is in close contact with the adhesive surface 110 in a fixed position, and as a result, it is unnecessary without the user having to align the bonding position of the protective film 40 by arbitrarily changing the positions of the covers 20 and 30.

그리하여, 본 실시예에 따른 보호필름 접합구(1, 1')는, 함체(10)와 커버(20, 30)의 결합을 통해, 전자기기(100)의 보호필름 접착면(110)에 보호필름(40)을 간편하고 정밀하게 접합하는 것이 가능하다.Thus, the protective film bonding holes 1 and 1 ′ according to the present embodiment are protected by the protective film adhesive surface 110 of the electronic device 100 through the combination of the housing 10 and the covers 20 and 30. It is possible to bond the film 40 simply and precisely.

1, 1'. 보호필름 접합구
10. 함체 11. 수용공간
11a. 개구부 12. 압입홈
20. 커버 21. 접착면
22. 압입돌기 23. 절첩부
30. 커버 31. 접착면
32. 압입돌기
40. 보호필름 50. 스크래퍼
100. 전자기기 110. 보호필름 접착면1, 1 '. Protective Film Splicer
10. Enclosure 11.Receiving space
11a. Opening 12. Indentation Groove
20. Cover 21. Adhesive Side
22. Indentation protrusion 23. Folding part
30. Cover 31. Adhesive Side
32. Indentation protrusion
40. Protective film 50. Scraper
100. Electronic Devices 110. Protective Film Adhesive Surface

Claims (3)

개구부가 형성된 수용공간을 갖는 함체와; 상기 개구부를 통해 수용공간으로 진입하여 개구부를 폐쇄하며, 저면에 접착면이 형성된 커버; 및 상기 커버의 접착면에 접착되어 전자기기의 보호필름 접착면에 전사하여 접착되는 보호필름을 포함하여 구성되어,
상기 함체의 수용공간에 전자기기를 수용시킨 다음 커버를 수용공간 내로 진입시키면, 커버의 접착면에 접착된 보호필름은 개구부를 통해 노출된 보호필름 접착면에 밀착되고, 이후 커버의 표면을 문지르면 커버의 접착면에 접착된 보호필름은 전자기기의 보호필름 접착면에 전사하여 접착되도록 구성한 것을 특징으로 하는 보호필름 접합구.An enclosure having an accommodation space in which an opening is formed; A cover which enters a receiving space through the opening and closes the opening and has an adhesive surface formed on a bottom surface thereof; And a protective film adhered to the adhesive surface of the cover and transferred to and adhered to the protective film adhesive surface of the electronic device.
When the electronic device is accommodated in the accommodation space of the enclosure and the cover enters the accommodation space, the protective film adhered to the adhesive surface of the cover is in close contact with the protective film adhesive surface exposed through the opening, and then the surface of the cover is rubbed. The protective film bonded to the adhesive surface of the protective film bonding, characterized in that configured to be transferred to the protective film adhesive surface of the electronic device to be bonded. 제 1항에 있어서, 상기 커버의 일 가장자리는 함체에 절첩부를 통해 연결되어, 커버는 절첩부의 절첩을 통해 함체의 상부에 안착되어 수용공간의 개구부를 폐쇄하도록 구성된 것을 특징으로 하는 보호필름 접합구.The method according to claim 1, wherein one edge of the cover is connected to the enclosure through a fold, the cover is seated on the upper portion of the enclosure through the folding of the protective film bonding, characterized in that configured to close the opening of the receiving space phrase. 제 1항에 있어서, 상기 수용공간의 상부 외측과 커버의 저면에는 압입홈과 압입돌기가 대응되게 형성되어, 상기 함체의 상부에 안착된 커버는 압입홈과 압입돌기의 규합을 통해 함체의 상부에 위치 고정된 상태로 수용공간의 개구부를 폐쇄하도록 구성된 것을 특징으로 하는 보호필름 접합구.According to claim 1, wherein the upper outer side of the receiving space and the bottom surface of the cover is formed to correspond to the indentation groove and the indentation projection, the cover seated on the upper portion of the housing through the engagement of the indentation groove and the indentation protrusion on the upper portion of the enclosure The protective film splice, characterized in that configured to close the opening of the accommodation space in a fixed position.
KR2020110001763U 2011-03-03 2011-03-03 Protecing film binding device KR200462252Y1 (en)

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KR200475420Y1 (en) * 2014-08-20 2014-12-02 서경림 Liding type display protection film attatching case for mobile terminal
WO2017126796A1 (en) * 2016-01-21 2017-07-27 주식회사 크레용인터네셔널 Protective film attaching instrument
CN106985487A (en) * 2016-01-21 2017-07-28 股份公司卡拉永国际 Diaphragm attachment arrangement
US9918418B2 (en) 2011-02-18 2018-03-13 Superior Communications, Inc. Protective material applicator device
KR101838482B1 (en) * 2016-09-07 2018-03-14 김지안 A touch screen protection film attaching guide jig set for mobile electronic products with curved display panel and protection film attaching method using the same
US9931823B2 (en) 2011-02-18 2018-04-03 Superior Communications, Inc. Protective material applicator device
US20180145715A1 (en) * 2016-08-30 2018-05-24 Microstrate Inc. Tool for applying protective films to mobile communications devices
US10021818B2 (en) 2011-02-18 2018-07-10 Superior Communications, Inc. Protective material applicator device
KR200488417Y1 (en) * 2018-01-17 2019-02-11 에프엠크리에이티브 주식회사 Liquid crystal protection film set
KR20190118367A (en) * 2018-04-10 2019-10-18 (주)화이트스톤 Display protector adhering apparatus using a weight for a smart device and its adhering method
JP2020197691A (en) * 2019-06-01 2020-12-10 深▲せん▼市旭芸光電科技有限公司 Film sticking auxiliary tool kit
US11007763B1 (en) * 2015-11-18 2021-05-18 Alpha Comm Enterprises, Llc Film laminator for cell phones

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US10555445B2 (en) 2011-02-18 2020-02-04 Superior Communications, Inc. Protective material applicator device
US9918418B2 (en) 2011-02-18 2018-03-13 Superior Communications, Inc. Protective material applicator device
US9931823B2 (en) 2011-02-18 2018-04-03 Superior Communications, Inc. Protective material applicator device
US10021818B2 (en) 2011-02-18 2018-07-10 Superior Communications, Inc. Protective material applicator device
US11357143B2 (en) 2011-02-18 2022-06-07 Superior Communications, Inc. Protective material applicator device
US11155067B2 (en) 2011-02-18 2021-10-26 Superior Communications, Inc. Protective material applicator device
KR200475420Y1 (en) * 2014-08-20 2014-12-02 서경림 Liding type display protection film attatching case for mobile terminal
US11007763B1 (en) * 2015-11-18 2021-05-18 Alpha Comm Enterprises, Llc Film laminator for cell phones
WO2017126796A1 (en) * 2016-01-21 2017-07-27 주식회사 크레용인터네셔널 Protective film attaching instrument
CN106985487A (en) * 2016-01-21 2017-07-28 股份公司卡拉永国际 Diaphragm attachment arrangement
CN106985487B (en) * 2016-01-21 2019-12-10 股份公司卡拉永国际 protective film attachment device
US20180145715A1 (en) * 2016-08-30 2018-05-24 Microstrate Inc. Tool for applying protective films to mobile communications devices
KR101838482B1 (en) * 2016-09-07 2018-03-14 김지안 A touch screen protection film attaching guide jig set for mobile electronic products with curved display panel and protection film attaching method using the same
KR200488417Y1 (en) * 2018-01-17 2019-02-11 에프엠크리에이티브 주식회사 Liquid crystal protection film set
KR102035054B1 (en) 2018-04-10 2019-11-08 (주)화이트스톤 Display protector adhering apparatus using a weight for a smart device and its adhering method
KR20190118367A (en) * 2018-04-10 2019-10-18 (주)화이트스톤 Display protector adhering apparatus using a weight for a smart device and its adhering method
JP2020197691A (en) * 2019-06-01 2020-12-10 深▲せん▼市旭芸光電科技有限公司 Film sticking auxiliary tool kit

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