KR20040051464A - Chip on film by electroplating and its manufacturing method. - Google Patents

Abstract

PURPOSE: A chip on film by carrying out an electroplating process and a manufacturing method thereof are provided to be capable of precisely forming a pattern and economizing the materials. CONSTITUTION: A chip on film by carrying out an electroplating process is provided with an electrode base(21), a plurality of pin electrode bases(22) formed on the electrode base, and a foaming release agent(24) filled into the gaps between the pin electrode bases. A heat treatment is carried out on the resultant structure for swelling the foaming release agent of the resultant structure. A drying process is carried out on the swollen foaming release agent for hardening the shape of the swollen foaming release agent.

Description

Chip-on-film by Jeonju processing and its manufacturing method. {Omitted}

The present invention relates to a chip-on-film and a method of manufacturing the same, which are generally configured in various forms such as micro-current circuits, PCB boards, and lead frames that are commonly used in semiconductors and other electronic devices. Such a chip on film is used in various fields, and in the manufacture of a chip on film having an extremely fine shape, conventionally, these have been produced by etching techniques. In the present invention, these can be produced by electroplating. The present invention uses the Jeonju master to produce the Jeonju processed products in the production of these, by immersing the Jeonju Master in the Jeonju bath to form various types of Jeonju processed products through electrolysis, and then combine them with a thin base The chip on film of the invention is constituted.

Conventional processing methods by the etching method has a limitation of the precision due to the method by the corrosion of metal. Alternatively, the processing by the etching method inevitably disposes the material as much as it is corroded. The present invention is capable of forming a more precise pattern than the etching method by adopting the processing by the electric pole processing method, and since only the required material is constituted in the electric pole master, no material waste is required. . The product according to the present invention also enables the production of the product by a simpler process than the conventional technique by forming the product through the pole immediately in the electric bath, without undergoing the exposure and etching process for each product in the production process.

1, 2, and 3 are explanatory views for explaining a method for producing an electrode base having the same shape as the pattern.

4, 5, and 6 are explanatory views for explaining a production method for manufacturing a pole master, which enables pole poles such as lead frames to be tribute by pole pole machining.

7 is an explanatory diagram for explaining a state in which the electric pole is immersed in the electric bath tub of the electric pole master of the present invention.

8 is a state diagram showing the state when the electroformed workpiece is gradually filled and formed at the height of the pin part release material.

9 is an explanatory diagram for explaining a separation state of the electroformed workpiece deformed from the electric pole master.

FIG. 10A is an explanatory diagram of a pattern composed of various patterns and a base portion supporting the pattern around the pattern.

FIG. 10B is an explanatory diagram of the inversion pattern of FIG. 10A.

FIG. 11 is an explanatory diagram for fabricating a chip-on film by bonding a film in a state where an electroforming material is formed on a pole pole master.

FIG. 12 is an explanatory diagram illustrating a chip on film constructed in FIG. 11.

13 is an explanatory diagram for explaining a configuration of a chip-on film using thermoplastic resin.

FIG. 14 is an explanatory view for explaining the configuration of the chip-on film using the thermoplastic resin of FIG.

FIG. 15 is a state diagram in which the photosensitive agent 18 is uniformly applied to the electrode base 17 plate in order to fabricate the electroforming master forming the pin base electrode base.

FIG. 16 is a state diagram of the exposure unit 19 formed by exposing a pattern to the photosensitive agent of FIG.

FIG. 17 is an explanatory diagram for explaining that a portion of the photosensitive agent which is not exposed in FIG. 16 is constituted by the space portion 20.

FIG. 18 is an explanatory diagram for explaining the configuration of the electrode base 21 having the pin portion by performing electroplating by dipping the electrode base base material 17 of FIG.

19 is an explanatory diagram for explaining a state in which the electrode base 21 constituting the pin portion 22 of FIG. 18 is demolded from an electrode base base material on which an exposure layer is formed.

FIG. 20 is an explanatory diagram for explaining the filling of the release material 23 into the electrode base 21 including the pin electrode base 22 of FIG.

21 is an explanatory view of the foam release agent as an embodiment of the present invention.

FIG. 22 is an explanatory diagram for explaining the creation of a pole pole workpiece using the pole pole master on which the pin base electrode base of FIG. 20 is formed.

FIG. 23 is an explanatory diagram for explaining the fabrication of the electroplated workpiece of FIG. 22 with a chip on film.

24 is a state diagram of the chip-on film showing the state of the chip-on film in the state of demolding in FIG.

* Description of the symbols for the main parts of the drawings *

DESCRIPTION OF SYMBOLS 1: Electrode base base material 2: Photosensitive agent 3: Exposure part 4: Electrode base 5: Etching space part 6: Upper electrode base 7: Pin part release material 8: Root part release material 9: Base 10: Electrode processing

The present invention is a base for supporting the body and the root release member is formed on the base, and the pin portion release material and the electrode base is configured on the upper portion of the root release material, the pin portion release material is filled in the space portion of the electrode base It relates to a chip-on film and a manufacturing method using a Jeonju master characterized in that the paper is configured in the form. As the release material in the present invention, a foamable release material may be used, and silicone or foamable silicon may be used as an example of such a release material, and stainless steel may be used as an example of the electrode base. A major feature of the fabrication process of Jeonju Master of the present invention is a process of processing an electrode base by etching using an inversion pattern, and filling a release material between the base and the electrode base. It is characterized by forming. In another embodiment of the present invention, an electrode base having a certain level of strength at the bottom and configured as a conductive material is configured, and a fin part electrode base protruding to the upper part of the electrode base is configured. Between the electrode base is composed of the pole pole through the pole pole in the pole pole is filled with the release material, and forms a base on the surface of the pole pole workpiece.

Hereinafter, the present invention will be described in detail with reference to the drawings.

1, 2, and 3 are explanatory views for explaining a method for producing an electrode base having the same shape as the pattern. In general, the shape of the minute shape that is used in a variety of fields in the form of a minute conduction circuit, PCB board, lead frame, etc. that are commonly used in semiconductors and other electronic devices, etc. are defined as the word pattern. Patterns of various types of patterns that are generally present are mainly composed of a conductive material, as shown in Figure 10 (A). The pattern is composed of various patterns of patterns 12 and a base 13 supporting the pattern patterns around the pattern patterns. In order to form such a pattern, a pattern film is first formed by graphic processing of the pattern, and the pattern film is formed into a pattern by an etching method using a photosensitive agent. In a pattern film, a pattern film is usually formed in the shape of a transparent part and an opaque part. The concept of the pattern in the present invention is defined to be referred to as a pattern of everything that is composed of a particular shape or pattern. In general, patterns consist of extremely fine dimensions. As an example, the distance of the pattern's spacing in the pattern is precisely measured in units of only a few microns or depth microns. In addition, the present invention defines the term inversion pattern. The inversion pattern defines a pattern in which the transparent portion and the opacity portion of the pattern are replaced as the inversion pattern. The inversion pattern of FIG. 10A has the same shape as that of FIG. 10B.

FIG. 1 is an explanatory diagram for explaining a method of manufacturing an electrode base having a shape like a pattern, which is composed of a metal material which can be demoulded extremely easily as a conductive material. It is a state diagram which shows the state in which the photosensitive agent 2 was apply | coated to the electrode base base material 1 which consists of a plate-shaped metal material which has a property which can be demoulded extremely easily as a conductive material by predetermined thickness.

FIG. 2 is an explanatory view for explaining the exposure part 3 being formed by exposing a photosensitive agent using an inversion pattern film.

3 is an explanatory diagram for explaining a state where the etching space portion 5 is formed by etching the electrode base base material on which the exposure portion is formed. Through the above process, the electrode base base material on which the etching space 5 is formed has the same shape as the pattern. In the present invention, this is defined as an electrode base.

4 and 5 are explanatory views for explaining a manufacturing method of manufacturing an electric pole master, which enables the electric pole workpieces such as lead frames to be manufactured by the electric pole machining using the electrode base.

4 is an explanatory diagram for explaining a state in which two electrode bases are overlapped. The upper electrode base 6 and the lower electrode base 4 may be configured to have the same thickness, but of course the thickness of the upper electrode base can be adjusted in response to the thickness of the electroformed workpiece to be manufactured.

5 shows a plate-shaped base 9 portion below the two overlapping electrode bases at a predetermined interval, and a release material is filled between the base portion and the overlapped electrode base portion. After filling the release material, the release material is arranged based on the height of the upper electrode base. At this time, the release material filled in the etching space portion of the electrode base part is defined as the pin part release material 7, and the release material filled between the electrode base and the base is defined as the root release material 8.

FIG. 6 is a schematic diagram of the electric pole master, in which the upper electrode base is removed in FIG. That is, in the electric pole master of the present invention, the root release member 8 is configured on the base 9, and the pin release member 7 and the electrode base 4 are configured on the root release member. The pin part release material is filled in the space portion is to be configured in the form.

7 is an explanatory diagram for explaining a state in which the electric pole is immersed in the electric bath tub of the electric pole master of the present invention. When the cathode is connected to the electrode base 4 to start the electric pole processing in the electric pole, the molten metal begins to be bonded to the electrode base, thereby forming the electric pole workpiece 10. As the pole metal, a conductive metal such as nickel or copper is used. In the case of a lead frame composed of copper, the pole metal is copper.

8 is a state diagram showing the state when the electroformed workpiece 10 is gradually filled and formed at the height of the pin part release material.

FIG. 9 is an explanatory diagram for explaining a state in which the electroplated workpiece 10 is demolded and separated from the electroplated master when the height of the electroplated workpiece becomes the height of the pin release member as shown in FIG. This pole pole processed article will have the same shape as the pattern.

FIG. 11 is an explanatory diagram for fabricating a chip-on film by joining a thin base to a state in which a workpiece is formed on a pole pole. After the thin adhesive film 15 is coated on the surface of the electroformed workpiece 10 and the surface of the pinned mold release member, which are grown at almost the same height as the pin-shaped mold release material, the film and the electroplating material are demolded from the electroplating master. The chip on film can be obtained.

FIG. 12 is an explanatory diagram illustrating a chip on film constructed in FIG. 11. This is a form in which the electroformed workpiece 10 is adhered to the film 15. In the present invention, the release material and the thin adhesive film are configured to have components that do not bond with each other. As an example, when the release material is made of silicon and the pole is made of copper and bonded to the adhesive film, the silicon and the film are not bonded, and the copper and the film are bonded.

FIG. 13 is an explanatory diagram for explaining a configuration of a chip-on film forming a base part by using a thermoplastic resin. After the liquid thermoplastic resin is applied thinly and uniformly to the surface of the electroforming material 10 grown on the Jeonju master and the surface of the pin release member, the thermoplastic resin is dried and hardened and then demolded from the Jeonju master. Only workpieces and poles will be demoulded. As an embodiment of the present invention, when the thermoplastic resin is an epoxy resin, the electroforming material is copper, and the release material is silicon, the epoxy resin is not bonded to silicon, but is bonded to copper. When the thermoplastic resin is dried and solidified in the liquid phase, it supports the workpiece with solid bonding force.

FIG. 14 is an explanatory view for explaining the configuration of the chip-on film using the thermoplastic resin of FIG. The electroformed workpiece 10 having various materials and various shapes is firmly supported by the thermoplastic resin 16.

15 to 24 are explanatory views of a chip on film formed by a pole pole master on which a pin electrode base is formed as another embodiment of the present invention. The pin part electrode base is defined as an electrode base of the pin part which protrudes above the electrode base. The release material is filled to the four sides of the pin base electrode base.

FIG. 15 is a state diagram in which the photosensitive agent 18 is uniformly applied to the electrode base 17 plate in order to fabricate the electroforming master forming the pin base electrode base.

FIG. 16 is a state diagram of the exposure unit 19 formed by exposing a pattern to the photosensitive agent of FIG.

FIG. 17 is an explanatory diagram for explaining that a portion of the photosensitive agent which is not exposed in FIG. 16 is constituted by the space portion 20.

FIG. 18 is an explanatory diagram for explaining the configuration of the electrode base 21 having the pin portion by performing electroplating by dipping the electrode base base material 17 of FIG. That is, as the electroplating is carried out, the molten metal begins to grow from the space 2, and finally, the electroplating material is formed over the entire upper portion of the electrode base base material 17.

19 is an explanatory diagram for explaining a state in which the electrode base 21 constituting the pin portion 22 of FIG. 18 is demolded from an electrode base base material on which an exposure layer is formed.

FIG. 20 is an explanatory diagram for explaining the filling of the release material 23 into the electrode base 21 including the pin electrode base 22 of FIG. The release member 23 is filled in the upper portion of the electrode base 21 to the height of the pin electrode base 22. In the present invention, the resultant obtained through such a process is defined as a pole master formed with a pin electrode base. That is, in the present invention, an electrode base having a certain strength at the bottom of the electric pole master formed the pin electrode base is configured as a conductive material, and the pin electrode electrode base protruding from the electrode base is configured. , Between the pin portion of the electrode base is defined as the electric pole master is filled with a release material.

21 is an explanatory view of the foam release agent as an embodiment of the present invention.

The expandable release material is defined as a release material in which a release material is expanded and expanded by filling the release material, and then expands by expanding the physical environment such as a temperature change. FIG. 21 shows that the release member 24 is filled with a foamable release member 24 in the space between the electrode base 21 and the pin electrode base 22, and then the physical release member is foamed to have a smooth arc surface by applying a change in physical conditions. It is explanatory drawing explaining what made it change. As the most representative example, after filling the silicone mixed with the blowing agent, the temperature is increased to inflate the silicone, and then dried to harden the silicone.

FIG. 22 is an explanatory diagram for explaining the creation of a pole pole workpiece using the pole pole master on which the pin base electrode base of FIG. 20 is formed. When electric pole machining is performed on the electrode base 21 of the electric pole master, the molten metal begins to adhere to the protruding pointed pin electrode base 22 and the electric pole workpiece 25 starts to form. Of course, at this time, the lower portion of the electrode base is treated with a release material so that the electro-processed workpiece is not generated. The product is completed when demoulded from the Jeonju Master which formed the pin base electrode base.

FIG. 23 is an explanatory diagram for explaining the production of the electroplated workpiece of FIG. 22 into a chip-on film. It is important to form the base of the pole pole work because the pole pole is fine and difficult to maintain strength. In the chip-on film of the present invention, after the electroforming is performed on the electric pole master on which the pin electrode base is formed, the liquid thermoplastic resin is applied to the top with a uniform thickness and then dried to form a base portion 26 or thin. The film is coated to form the base 26.

24 is a state diagram of the chip-on film showing the state of the chip-on film in the state of demolding in FIG.

In the present invention, the base serves to support the electric pole master of the present invention to be durable. Of course, the electrode base and the release material in the present invention can be made of a variety of materials. In one embodiment of the electrode base and the release material in the present invention, the electrode base may be stainless steel.

This is because stainless steel is excellent in durability, and when demolding, electro-formed products such as copper are easily demolded. In the present invention, as the release material, silicon was used as an example. When silicone is used as a release material, the pin release material has elasticity, so even when demolding the electroformed workpiece, the pin release material is not damaged at all. In addition, the silicon is very easily separated from the electroformed workpiece. In another embodiment of the present invention, in the release material, it may be preferable that the release material constitutes a release material having foamability. The foamable release material means that the release material can be filled with foam after the filling of the release material by heat or other methods. As an embodiment, after filling the release material by mixing the foamed foam by heat into the silicone, when the heat is applied to the release material, the release material is swollen, and the foamed release material foamed in a gentle arc shape is the jeonju It will increase the efficiency.

In the above, the electric pole master of the present invention and a manufacturing method thereof have been described using a graphic drawn pattern and an inverted pattern opposite to the pattern.

Hereinafter, another embodiment of the present invention will be described using the concept of the present invention as it is. This is about Jeonju Master and its manufacturing method using the already manufactured products. This is a method in which an electrode base of an already manufactured product is separated without using an inverted pattern film by an etching method and used as the electrode base of the present invention. Parts other than the method of constructing the electrode base are treated in the same manner. In this case, since the material of the electrode base may be a material that is not easily demolded in the electroformed workpiece, in this case, it is inconvenient to start production after applying a release material to the electrode base during production.

Compared to the etching method of the present invention, the present invention can more easily manufacture a more precise and dense electroformed workpiece, and the method according to the present invention has no waste of material as compared to the etching method, If the release material is broken, there is an advantage that can be utilized to repair only that part. The product according to the present invention can also produce a more sophisticated product in a simpler process than the conventional technique by forming the product through the pole in the electric bath immediately without undergoing the exposure and etching process for each product in the production process. .

Claims (30)

In the chip-on film bonded to a thin base, the root release member, the electrode base formed on the upper portion of the root release material, and the pin portion release material formed by filling the release material in the space portion of the electrode base. Chip-on film, characterized in that by constructing the electric pole workpiece through the pole pole processing to the jeonju master to be made, by bonding a thin film on the surface of the pole pole workpiece. The chip on film according to claim 1, wherein the release material is silicone or blowing agent silicone. The chip-on film according to claim 1 or 2, wherein the electrode base is stainless steel. In the method for manufacturing a chip-on film bonded to a thin base portion, the root release member, the electrode base formed on the upper portion of the root release material and the space portion of the electrode base is filled with a release material is configured A method for producing a chip-on film, comprising: forming an electric pole workpiece through an electric pole machining on a pole pole master made of a pin release member, and bonding a thin film to the surface of the electric pole workpiece. The method of manufacturing a chip on film according to claim 4, wherein the release material is silicone or expandable silicone. The method of manufacturing a chip on film according to claim 4 or 5, wherein the electrode base is stainless steel. In the chip-on film bonded to a thin base, the root release member, the electrode base formed on the upper portion of the root release material, and the pin portion release material formed by filling the release material in the space portion of the electrode base. Chip-on film, characterized in that the jeonju master to constitute the jeonju processing through the jeonju processing, and is produced by applying a liquid thermoplastic resin on the surface of the jeonju processing and then dried. 8. The chip on film according to claim 7, wherein the release material is silicone or expandable silicone. The chip-on film according to claim 7 or 8, wherein the electrode base is stainless steel. 10. The chip on film according to claim 7 or 8 or 9, wherein the thermoplastic resin is an epoxy resin. In the method for manufacturing a chip-on film bonded to a thin base portion, the root release member, the electrode base formed on the upper portion of the root release material and the space portion of the electrode base is filled with a release material is configured A method of manufacturing a chip-on film, characterized in that the electro-formed workpiece is formed through a pole-casting operation on a pole-casting master composed of a pin-shaped release material, and is produced by applying a liquid thermoplastic resin to the surface of the pole-shaped workpiece and drying it. 12. The method of claim 11, wherein the release material is silicone or expandable silicone. The method of manufacturing a chip on film according to claim 11 or 12, wherein the electrode base is stainless steel. The method for producing a chip on film according to claim 11, 12 or 13, wherein the thermoplastic resin is an epoxy resin. In the chip-on film that is bonded to a thin base portion, an electrode base having a certain strength at the bottom portion and configured as a conductive material is constituted, and a pin portion electrode base protruding to the upper portion of the electrode base. Comprising, between the pin portion of the electrode base is composed of a pole pole through the pole pole in the pole pole to be filled with a release material, the chip-on film, characterized in that to form a base on the surface of the pole pole workpiece. The chip on film according to claim 15, wherein the release material is silicon. The chip on film according to claim 15, wherein the release material is a blowing agent release material. The chip on film according to claim 15, wherein the release material is a blowing agent silicone. The chip on film according to claim 15 or 16 or 17 or 18, wherein the electrode base is stainless steel. 19. The chip on film according to claim 15 or 16 or 17 or 18, wherein the base is a thermoplastic resin. 21. The chip on film as claimed in claim 20, wherein the thermoplastic resin is an epoxy resin. 19. A chip on film as claimed in claim 15 or 16 or 17 or 18, wherein the base is formed by film coating. In the method of manufacturing a chip-on film in which a pattern is bonded to a thin base portion, an electrode base having a certain strength at the bottom portion and configured as a conductive material is formed, and the pin portion electrode protruding on the electrode base is formed. A base is constructed, and a method of manufacturing a chip-on film, characterized in that a base is formed on the surface of the pole pole by forming a pole pole in the pole pole that is filled with a release material between the pin base electrode bases. . 24. The method of manufacturing a chip on film according to claim 23, wherein the release material is silicon. 24. The method of claim 23, wherein the release material is a blowing agent release material. 24. The method of claim 23, wherein the release material is a blowing agent silicone. 27. The method of claim 23, 24, 25, or 26, wherein the electrode base is stainless steel. 27. The method of claim 23, 24, 25, or 26, wherein the base is a thermoplastic resin. 29. The method of claim 28, wherein the thermoplastic resin is an epoxy resin. 27. The method of claim 23, 24, 25, or 26, wherein the base is formed by film coating.