KR200380753Y1 - Vertical Conductive Adhesive Tape - Google Patents
Vertical Conductive Adhesive Tape Download PDFInfo
- Publication number
- KR200380753Y1 KR200380753Y1 KR20-2005-0000049U KR20050000049U KR200380753Y1 KR 200380753 Y1 KR200380753 Y1 KR 200380753Y1 KR 20050000049 U KR20050000049 U KR 20050000049U KR 200380753 Y1 KR200380753 Y1 KR 200380753Y1
- Authority
- KR
- South Korea
- Prior art keywords
- conductive
- polymer film
- conductive adhesive
- adhesive tape
- conductive polymer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
Abstract
유연성이 우수하고 전기저항이 낮으며 절단면이 풀리지 않는 수직방향으로 도전성을 갖는 점착테이프가 개시된다. 복수개의 관통공들이 형성된 비도전성 폴리머 필름; 관통공들에 충진되도록 비도전성 폴리머 필름의 표면과 이면에 각각 코팅되는 도전성 점착제; 및 비도전성 폴리머 필름의 표면과 이면 중 어느 하나에 도전성 점착제에 의해 부착되는 금속박을 포함한다.Disclosed is a pressure-sensitive adhesive tape having excellent flexibility, low electrical resistance, and conductive in a vertical direction in which a cut surface is not loosened. A non-conductive polymer film having a plurality of through holes formed therein; Conductive adhesives coated on the front and back surfaces of the non-conductive polymer film so as to fill the through holes; And a metal foil attached to any one of the front and rear surfaces of the nonconductive polymer film by the conductive adhesive.
Description
본 고안은 수직 도전성 점착테이프(Vertical Conductive Adhesive Tape)에 관한 것으로, 보다 상세하게는 유연성이 우수하고 전기저항이 낮으며 절단면이 풀리지 않는 수직방향으로 도전성을 갖는 점착테이프에 관한 것이다.The present invention relates to a vertical conductive adhesive tape (Vertical Conductive Adhesive Tape), and more particularly to a pressure-sensitive adhesive tape having excellent flexibility, low electrical resistance, and conductive in the vertical direction does not loosen the cut surface.
전자통신 산업의 발전과 정보사회 구축에 따라 현대의 가전제품, 산업용 전자장치 및 정보통신 기기는 처리능력이 빠르며 소비전력이 낮아야 한다는 요구에 부응하여 기기 자체가 소형화되고 회로가 집적화됨으로써 좁은 공간에 더욱 많은 디바이스들이 설치되었다. 이에 따라 점차적으로 전자파 잡음(noise)과 열에 대한 영향을 받기 쉬운 환경에 놓이게 되었고 이를 해결하기 위한 여러 대책들이 강구되었다.With the development of the electronic communication industry and the establishment of the information society, modern home appliances, industrial electronic devices, and information and communication devices meet the demand for faster processing power and lower power consumption, resulting in smaller devices and integrated circuits. Many devices have been installed. As a result, it was gradually placed in an environment susceptible to electromagnetic noise and heat, and various measures were taken to solve the problem.
이 중에서 수직방향으로 대향하는 대상물 사이에 위치하여 전기적 평형을 위한 전기 접지선의 역할과 전자파 차폐를 위하여 수직방향으로 도전성을 갖는 점착테이프가 제안되고 있다. Among them, adhesive tapes having electrical conductivity in the vertical direction have been proposed to serve as electrical ground wires for electrical equilibrium and to be disposed between objects facing in the vertical direction.
예를 들어, 금속박의 어느 한 면에 도전성 점착제를 코팅한 도전성 점착테이프나 도전성 섬유의 한 면에 도전성 점착제를 코팅한 도전성 점착테이프를 들 수 있다.For example, the conductive adhesive tape which coated the conductive adhesive on one side of the metal foil, or the conductive adhesive tape which coated the conductive adhesive on one side of the conductive fiber is mentioned.
전자의 경우, 금속박 성분과 도전성 점착제의 특성만을 갖고 있기 때문에 금속박의 두께가 두꺼우면 유연성이 떨어지고, 금속박의 두께가 얇으면 찢어지기 쉽다는 단점이 있다. 또한, 유연성이 떨어지기 때문에 한 번 사용하면 구겨져서 다시 사용할 수 없으며, 특히 가장자리가 날카로워 손을 베기 쉽다는 문제점이 있다.In the former case, since only the metal foil component and the conductive adhesive have characteristics, the thickness of the metal foil is low, and the flexibility of the metal foil is low. In addition, since the flexibility is poor, once used, it is not wrinkled and cannot be used again. In particular, there is a problem that the edge is sharp and easy to cut.
한편, 후자의 경우, 도전성 섬유의 가격이 고가이므로 제작되는 점착테이프의 가격도 고가라는 단점이 있고, 섬유라는 특성상 절단면이 풀리기 쉽다. 또한, 표면 전기저항이 순수 금속박보다 커서 전기 접지 성능 및 전자파 차폐능력이 떨어진다는 단점이 있다.On the other hand, in the latter case, the price of the conductive tape is expensive because the price of the conductive fiber is expensive, and the cut surface is easy to be released due to the nature of the fiber. In addition, since the surface electrical resistance is greater than that of pure metal foil, there is a disadvantage in that electrical grounding performance and electromagnetic shielding ability are poor.
따라서, 본 고안의 목적은 유연성이 우수하고 전기저항이 낮으며 절단면이 풀리지 않고 제조원가가 저렴한 수직방향 도전성 점착테이프를 제공하는 것이다. Accordingly, an object of the present invention is to provide a vertically conductive adhesive tape having excellent flexibility, low electrical resistance, low cutting cost, and low manufacturing cost.
본 고안의 다른 목적과 특징들은 이하에 서술되는 실시예로부터 보다 명확하게 이해될 것이다. Other objects and features of the present invention will be more clearly understood from the embodiments described below.
본 고안에 따르면, 복수개의 관통공들이 형성된 비도전성 폴리머 필름; 관통공들에 충진되도록 비도전성 폴리머 필름의 표면과 이면에 각각 코팅되는 도전성 점착제; 및 비도전성 폴리머 필름의 표면과 이면 중 어느 하나에 도전성 점착제에 의해 부착되는 금속박을 포함하는 수직방향 도전성 점착테이프이 개시된다.According to the present invention, a non-conductive polymer film formed with a plurality of through holes; Conductive adhesives coated on the front and back surfaces of the non-conductive polymer film so as to fill the through holes; And a metal foil attached to one of the front and back surfaces of the non-conductive polymer film by a conductive adhesive.
바람직하게, 비도전성 폴리머 필름의 표면과 이면에 도전성 증착층이 형성된 후, 관통공들이 형성된다.Preferably, after the conductive deposition layer is formed on the front surface and the back surface of the non-conductive polymer film, the through holes are formed.
또한, 비도전성 폴리머 필름으로 제조 중 1축 또는 2축 연신된 필름이 적용된다.Also applied are uniaxial or biaxially stretched films during manufacture of the non-conductive polymer film.
또한, 비도전성 폴리머 필름은 비도전성 폴리에스터와 셀룰로이드 필름을 포함하고, 도전성 점착제는 핫 멜트와 압력점착제를 포함한다.The nonconductive polymer film also includes a nonconductive polyester and a celluloid film, and the conductive adhesive includes a hot melt and a pressure adhesive.
이하, 첨부된 도면을 참조하여 본 고안의 실시예들을 상세하게 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 고안의 일 실시예에 따른 도전성 점착테이프를 보여주는 단면도이고, 도 2는 도 1의 비도전성 폴리머 필름을 확대한 사시도이다.1 is a cross-sectional view showing a conductive adhesive tape according to an embodiment of the present invention, Figure 2 is an enlarged perspective view of the non-conductive polymer film of FIG.
도 1을 참조하면, 복수개의 관통공들(22)이 형성된 비도전성 폴리머 필름(20)의 양면에 도전성 점착제(10, 30)가 코팅되고, 도전성 점착제(10, 30) 중 어느 하나 위에는 금속박(40)이 라미네이팅 방식으로 부착된다. Referring to FIG. 1, conductive adhesives 10 and 30 are coated on both surfaces of a non-conductive polymer film 20 having a plurality of through holes 22 formed thereon, and a metal foil may be formed on any one of the conductive adhesives 10 and 30. 40) is attached in a laminating manner.
이때, 복수개의 관통공들(22)에는 코팅된 도전성 점착제(10, 30)가 흘러들어 충진됨으로써 상하의 도전성 점착제(10, 30)가 전기적으로 연결된다.In this case, the conductive conductive adhesives 10 and 30 coated in the plurality of through-holes 22 flow into the upper and lower conductive adhesives 10 and 30 to be electrically connected to each other.
금속박(40)은 약 8 내지 20미크론 정도의 두께로 형성되며, 구리 또는 알루미늄 재질로 이루어진다. 바람직하게, 산화 방지를 위하여 금속박 위에 도전성의 산화막이 형성될 수 있다.The metal foil 40 is formed to a thickness of about 8 to 20 microns, and is made of copper or aluminum. Preferably, a conductive oxide film may be formed on the metal foil to prevent oxidation.
도전성 점착제(10, 30)는 아크릴 등의 비도전성 폴리머 점착제에 니켈, 구리 등의 금속 파우더를 균일하게 분산하여 제조하며, 상기한 바와 같이, 비도전성 폴리머 필름의 표면과 이면에 대략 10 내지 30미크론 정도의 두께로 코팅된다. 일 예로, 도전성 점착제는 핫 멜트이거나 압력 점착제(Pressure Sensitive Adhesive; PSA)일 수 있다.The conductive adhesives 10 and 30 are prepared by uniformly dispersing metal powders such as nickel and copper in non-conductive polymer adhesives such as acrylic, and as described above, approximately 10 to 30 microns on the front and rear surfaces of the non-conductive polymer film. Coated to a thickness of about. For example, the conductive adhesive may be a hot melt or a pressure sensitive adhesive (PSA).
비도전성 폴리머 필름(20)은 대략 8 내지 20미크론 정도의 두께를 가지며, 비도전성 폴리에스터(PET) 또는 셀룰로이드 필름이 이용될 수 있다. The non-conductive polymer film 20 has a thickness of about 8 to 20 microns, and non-conductive polyester (PET) or celluloid film may be used.
도 2를 참조하면, 비도전성 폴리머 필름(20)에는 0.5 내지 3.0밀리미터 정도의 직경을 갖는 복수개의 관통공들(22)이 형성된다. 바람직하게, 관통공들(22)은 수평 절단강도를 강하게 하기 위하여 비도전성 폴리머 필름(20)의 표면 위에 사선방향으로 일정하게 배열될 수 있다.Referring to FIG. 2, a plurality of through holes 22 having a diameter of about 0.5 to 3.0 millimeters is formed in the non-conductive polymer film 20. Preferably, the through holes 22 may be uniformly arranged diagonally on the surface of the non-conductive polymer film 20 in order to strengthen the horizontal cutting strength.
상기한 바와 같이, 비도전성 폴리머 필름(20)의 표면과 이면에 액상의 도전성 점착제(10, 30)를 코팅하면, 이 관통공들(22)로 도전성 점착제가 흘러들어 충진되고, 이에 따라 이면에 코팅된 도전성 점착제(10)와 표면에 코팅된 도전성 점착제(30)는 전기적으로 연결된다.As described above, when the liquid conductive adhesives 10 and 30 are coated on the surface and the rear surface of the non-conductive polymer film 20, the conductive adhesive flows into and fills the through holes 22. The coated conductive adhesive 10 and the conductive adhesive 30 coated on the surface are electrically connected.
비도전성 폴리머 필름(20)은 제조 중에 1축 또는 2축 연신된 필름이 적용되며, 이에 따라 관통공이 형성되어 있어도 연신된 방향으로 찢어지기 어렵다.In the non-conductive polymer film 20, a uniaxial or biaxially stretched film is applied during manufacturing, and thus, even though a through hole is formed, it is difficult to tear in the stretched direction.
이와 같은 구조를 갖는 도전성 점착테이프를 제조하는 과정을 설명하면 다음과 같다.Referring to the process of manufacturing a conductive adhesive tape having such a structure as follows.
비도전성 폴리머 필름(20)의 표면에 액상의 도전성 점착제(30)를 코팅하면, 이때, 코팅된 도전성 점착제(30)의 일부는 관통공(22)을 따라 흘러 들어간다. When the liquid conductive adhesive 30 is coated on the surface of the non-conductive polymer film 20, at this time, a portion of the coated conductive adhesive 30 flows along the through hole 22.
이어 금속박(10)을 상기 코팅된 도전성 점착제(30)를 개재하여 비도전성 폴리머 필름(20)에 부착하고, 코팅된 액상의 도전성 점착제(30)를 경화한다.Subsequently, the metal foil 10 is attached to the non-conductive polymer film 20 via the coated conductive adhesive 30, and the coated liquid conductive adhesive 30 is cured.
이같이 비도전성 폴리머 필름(20)과 금속박(40)이 도전성 점착제(30)에 의해 부착된 후, 비도전성 폴리머 필름(20)의 이면에 코팅방식으로 액상의 도전성 점착제(10)를 코팅하며, 이때, 코팅된 도전성 점착제(10)의 일부는 관통공(22)을 따라 흘러 들어간다. After the non-conductive polymer film 20 and the metal foil 40 are attached by the conductive adhesive 30, the liquid conductive adhesive 10 is coated on the back surface of the non-conductive polymer film 20 by a coating method. A portion of the coated conductive adhesive 10 flows along the through hole 22.
이때 관통공(22)의 일부는 도전성 점착제(30)에 의해 충진된 상태에서 나머지 부분은 도전성 점착제(10)로 충진된다.At this time, a part of the through hole 22 is filled with the conductive adhesive 30 and the other part is filled with the conductive adhesive 10.
이후, 코팅된 액상의 도전성 점착제(10)를 경화하여 최종적으로 도전성 점착테이프를 완성한다.Thereafter, the coated liquid conductive adhesive 10 is cured to finally complete the conductive adhesive tape.
상기한 실시예에 따른 도전성 점착테이프를 대향하는 대상물 사이에 끼우게 되면, 금속박(40) - 도전성 점착제(30) - 관통공(22)내에 충진된 도전성 점착제 - 도전성 점착제(10)로 이루어지는 도전경로가 형성되어 전기저항이 낮아지게 된다.When the conductive adhesive tape according to the above embodiment is sandwiched between the opposing objects, the conductive path filled with the metal foil 40-the conductive adhesive 30-the conductive adhesive filled in the through-hole 22-the conductive adhesive 10 Is formed to lower the electrical resistance.
또한, 비도전성 폴리머 필름(20)에 의해 금속박(40)의 두께를 얇게 해도 찢어지기 어려우며, 우수한 유연성을 갖는다.Moreover, even if the thickness of the metal foil 40 is made thin by the nonelectroconductive polymer film 20, it is hard to tear and has the outstanding flexibility.
특히, 제조원가가 저렴하며, 절단면이 풀리는 일은 발생하지 않는다.In particular, the manufacturing cost is inexpensive, and the cutting surface is not loosened.
도 3은 본 고안의 다른 실시예에 따른 도전성 점착테이프를 보여주는 단면도이다.3 is a cross-sectional view showing a conductive adhesive tape according to another embodiment of the present invention.
상기한 일 실시예와 달리 이 실시예에서는 비도전성 폴리머 필름(20)의 표면과 이면에 도전물질을 진공 증착하여 두께 3미크론 이내의 도전성 증착층(15, 25)을 형성한 후, 관통공들(22)을 형성한다.Unlike the above-described embodiment, in this embodiment, the conductive materials are vacuum deposited on the surface and the back of the non-conductive polymer film 20 to form the conductive deposition layers 15 and 25 within a thickness of 3 microns. To form (22).
따라서, 도전성 점착제에 의해 수직방향의 도전성을 갖는 외에 도전성 증착층(15, 25)을 통하여 수평방향으로 도전성을 가질 수 있다는 특징이 있다.Therefore, the conductive adhesive has the characteristic of having conductivity in the vertical direction and having conductivity in the horizontal direction through the conductive deposition layers 15 and 25.
이상에서는 본 고안의 바람직한 실시예를 중심으로 설명하였지만 당업자의 수준에서 다양하게 변경할 수 있다. 예를 들어, 금속박과 비도전성 폴리머 필름의 의 재질, 관통공의 형상이나 배열 그리고 도전성 점착제의 코팅방법 등에 있어서는 여러 가지의 변형된 방법의 적용이 가능하다.In the above described with reference to a preferred embodiment of the present invention, it can be variously changed at the level of those skilled in the art. For example, various modified methods can be applied to the material of the metal foil and the non-conductive polymer film, the shape and arrangement of the through holes, and the coating method of the conductive adhesive.
따라서, 이와 같은 변형과 변경을 고려한다면, 본 고안의 권리범위는 상기한 실시예에 한정되어서는 안되며 이하에 기재되는 실용신안등록청구범위에 의해 판단되어야 한다. Therefore, in consideration of such modifications and variations, the scope of the present invention should not be limited to the above-described embodiments, but should be determined by the utility model registration claims described below.
이상에서 설명한 바와 같이, 본 고안에 따르면 금속박과 도전성 점착제로 이루어지는 도전경로를 통하기 때문에 전기저항이 낮다는 이점이 있다.As described above, according to the present invention, there is an advantage that the electrical resistance is low because it passes through the conductive path made of the metal foil and the conductive adhesive.
또한, 비도전성 폴리머 필름에 의해 금속박의 두께를 얇게 해도 찢어지기 어려우며, 금속박의 두께를 얇게 함으로써 오히려 유연성이 우수하다는 이점이 있다.Further, even if the thickness of the metal foil is reduced by the non-conductive polymer film, it is difficult to be torn, and there is an advantage in that the flexibility is rather excellent by reducing the thickness of the metal foil.
특히, 제조원가가 저렴하며, 절단면이 풀리는 일은 발생하지 않는다.In particular, the manufacturing cost is inexpensive, and the cutting surface is not loosened.
도 1은 본 고안의 일 실시예에 따른 도전성 점착테이프를 보여주는 단면도이다.1 is a cross-sectional view showing a conductive adhesive tape according to an embodiment of the present invention.
도 2는 도 1의 비도전성 폴리머 필름을 확대한 사시도이다.FIG. 2 is an enlarged perspective view of the non-conductive polymer film of FIG. 1. FIG.
도 3은 본 고안의 다른 실시예에 따른 도전성 점착테이프를 보여주는 단면도이다.3 is a cross-sectional view showing a conductive adhesive tape according to another embodiment of the present invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2005-0000049U KR200380753Y1 (en) | 2005-01-03 | 2005-01-03 | Vertical Conductive Adhesive Tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20-2005-0000049U KR200380753Y1 (en) | 2005-01-03 | 2005-01-03 | Vertical Conductive Adhesive Tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200380753Y1 true KR200380753Y1 (en) | 2005-04-07 |
Family
ID=43682363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR20-2005-0000049U KR200380753Y1 (en) | 2005-01-03 | 2005-01-03 | Vertical Conductive Adhesive Tape |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200380753Y1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100956432B1 (en) | 2009-04-23 | 2010-05-06 | 두성산업 주식회사 | A conductive adhesive tape and a method for production of the same |
| KR101088891B1 (en) | 2009-10-09 | 2011-12-07 | 조인셋 주식회사 | Electric Conductive Sheet |
| US8465834B2 (en) | 2007-01-17 | 2013-06-18 | Joinset Co., Ltd. | Conductive pressure sensitive adhesive tape |
-
2005
- 2005-01-03 KR KR20-2005-0000049U patent/KR200380753Y1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8465834B2 (en) | 2007-01-17 | 2013-06-18 | Joinset Co., Ltd. | Conductive pressure sensitive adhesive tape |
| KR100956432B1 (en) | 2009-04-23 | 2010-05-06 | 두성산업 주식회사 | A conductive adhesive tape and a method for production of the same |
| KR101088891B1 (en) | 2009-10-09 | 2011-12-07 | 조인셋 주식회사 | Electric Conductive Sheet |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102298791B1 (en) | Electromagnetic shielding film, circuit board and manufacturing method of electromagnetic shielding film | |
| JP5026486B2 (en) | Mounting structure of touch input device with pressure sensitive sensor | |
| KR200479189Y1 (en) | Touch screen and manufacturing method of the same | |
| JP6435540B2 (en) | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof | |
| CN102286254A (en) | High-peeling-strength conductive adhesive film with through holes and preparation method thereof | |
| JP2019145845A (en) | Electromagnetic wave shield film | |
| JP2009099498A (en) | Touch panel and its manufacturing method | |
| CN108447842A (en) | A kind of encapsulating structure and packaging method of fingerprint chip | |
| CN202030694U (en) | High peel strength conductive glue film with through holes | |
| KR200380753Y1 (en) | Vertical Conductive Adhesive Tape | |
| JP2013018956A (en) | Conductive tape and method for producing the same | |
| JP4830881B2 (en) | Circuit board for molding and three-dimensional circuit board obtained by molding the same | |
| JP2012148554A (en) | Method of manufacturing ic tag-integrated molding | |
| KR200371726Y1 (en) | Multi-purpose adhesive tape capable of adhering on both sides | |
| TW200803661A (en) | Circuit substrate and method of manufacture | |
| CN208256659U (en) | A kind of encapsulating structure of fingerprint chip | |
| KR100435034B1 (en) | Anisotropic conductive film | |
| EP1125289A1 (en) | Liquid crystal polymer disk drive suspension assembly | |
| TW201943054A (en) | Electromagnetic wave shielding film, shielding printed circuit board and method for manufacturing shielding printed circuit capable of exhibiting high adhesive strength when an adhered member such as a reinforced plate is adhered to the isolation layer | |
| JP2000151061A (en) | Electronic circuit, board therefor and manufacture thereof | |
| CN214627496U (en) | Buried resistance metal foil and printed board | |
| JP4945829B2 (en) | Flexible printed wiring board and manufacturing method thereof | |
| JP2019016782A (en) | Electromagnetic wave shielding film and method of producing the same, and printed wiring board with electromagnetic wave shielding film and method of manufacturing the same | |
| JP4849776B2 (en) | Light transmission type static elimination structure and manufacturing method thereof | |
| CN212894568U (en) | Conductive non-woven fabric |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REGI | Registration of establishment | ||
| T201 | Request for technology evaluation of utility model | ||
| T701 | Written decision to grant on technology evaluation | ||
| FPAY | Annual fee payment |
Payment date: 20130305 Year of fee payment: 9 |
|
| FPAY | Annual fee payment |
Payment date: 20140304 Year of fee payment: 10 |
|
| EXPY | Expiration of term |